CN214848677U - LED packaging device integrating double colors on same path - Google Patents
LED packaging device integrating double colors on same path Download PDFInfo
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- CN214848677U CN214848677U CN202121132146.3U CN202121132146U CN214848677U CN 214848677 U CN214848677 U CN 214848677U CN 202121132146 U CN202121132146 U CN 202121132146U CN 214848677 U CN214848677 U CN 214848677U
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- fluorescent glue
- bowl cup
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Abstract
The utility model discloses a double-colored integrative LED encapsulation device on same way, which comprises a bracket, be provided with the bowl cup that is used for installing two LED chips on the support, wherein, the electric property opposite direction of two LED chips weld firmly in the bowl cup, the bottom of bowl cup is provided with stair structure's heat dissipation chassis, first LED chip in two LED chips weld firmly in on the high-order face on heat dissipation chassis, second LED chip weld firmly in on the low-order face on heat dissipation chassis. The utility model discloses not only realized that positive and negative circular telegram chip lights respectively on same circuit, can save the design of a circuit, realized that same bowl cup is double-colored luminous moreover, can promote lamp pearl power to within 1.5W.
Description
Technical Field
The utility model relates to a LED encapsulates device technical field, in particular to LED encapsulates device of double-colored an organic whole on same way.
Background
LEDs are widely used as fourth generation green illumination sources. The need for a lamp with two colors is constantly increasing as the people in the lighting industry have moved from single color lighting to dual or multi-color lighting.
At present, the double-color lamp beads used in the market adopt a double-circuit double-bowl structure, and because the circuits are of a separated double-circuit structure, two circuit routes need to be designed when the finished lamp is used, so that the cost is increased. The pad area design of its two bowls of double-colored lamp in limited area receives the restriction whole little, has influenced the promotion of heat dispersion and lamp pearl power.
Therefore, how to provide a two-color LED package device with simple circuit structure and high power is a problem that needs to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a heat dispersion is good, the integrative LED encapsulation device of double-colored on the same way of simple structure and high power.
In order to realize the above-mentioned purpose, the utility model provides a double-colored integrative LED encapsulation device on same way, which comprises a bracket, be provided with the bowl cup that is used for installing two LED chips on the support, wherein, the electric property opposite direction of two LED chips weld admittedly in the bowl cup, the bottom of bowl cup is provided with stair structure's heat dissipation chassis, first LED chip in two LED chips weld admittedly in on the high-order face on heat dissipation chassis, second LED chip weld admittedly in on the low-order face on heat dissipation chassis.
The further technical proposal of the utility model is that the height of the step is 0.3-0.4 mm.
The further technical proposal of the utility model is that the power of the two chips is 1.5W.
The further technical proposal of the utility model is that the two chips are respectively and fixedly welded in the bowl cup through the bonding wires.
The utility model discloses a further technical scheme is, first LED chip coats outward has first fluorescent glue, the gluey face of first fluorescent glue with the high order face on heat dissipation chassis flushes, second LED chip coats outward has second fluorescent glue, the light that first LED chip sent passes form the light of low colour temperature behind first fluorescent glue and the second fluorescent glue, the light that second LED chip sent passes form the light of high colour temperature behind the second fluorescent glue.
The utility model discloses a beneficial effect with integrative LED encapsulation device of double-colored on road is, the utility model discloses an above-mentioned technical scheme, which comprises a bracket, be provided with the bowl cup that is used for installing two LED chips on the support, wherein, the electric property opposite direction of two LED chips weld firmly in the bowl cup, the bottom of bowl cup is provided with stair structure's heat dissipation chassis, first LED chip in two LED chips weld firmly in on the high-order face on heat dissipation chassis, the second LED chip weld firmly in on the low-order face on heat dissipation chassis, not only realized that positive and negative circular telegram chip lights respectively on same circuit, can save the design of a circuit, realized that same bowl cup is double-colored luminous moreover, can promote lamp pearl power to within 1.5W.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a top view of a preferred embodiment of the same-way dual-color integrated LED package device of the present invention;
FIG. 2 is a side view of a preferred embodiment of the one-way, two-color, integrated LED package device of the present invention;
FIG. 3 is a front view of a preferred embodiment of the same-way dual-color integrated LED package device of the present invention;
FIG. 4 is a schematic circuit diagram of a preferred embodiment of the same-way dual-color integrated LED package device of the present invention;
fig. 5 is a schematic diagram of a back structure of a preferred embodiment of the same-path dual-color integrated LED package device of the present invention.
The reference numbers illustrate:
| code | Name (R) | Code | Name (R) |
| 1 | |
5 | First |
| 2 | |
6 | Second |
| 3 | |
7 | Bottom pad |
| 4 | Heat dissipation chassis |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Please refer to fig. 1 to 5, the present invention provides a dual-color integrated LED package device, which comprises a support, wherein a bowl cup for installing two LED chips is provided on the support, and the two LED chips are welded in the bowl cup in opposite directions.
As shown in fig. 4, when current is input from the port a, the second chip 2 is energized to emit light, and the first chip 1 is not energized due to the opposite polarity, and when current is input from the port B, the first chip 1 is energized to emit light, and the second chip 2 is not energized due to the opposite polarity. Therefore, the positive and negative power-on chips can be respectively lightened on the same circuit, and the design of one circuit is saved.
In specific implementation, two LED chips are fixedly welded in the bowl cup through the bonding wires 3.
The bottom of the bowl cup is provided with a heat dissipation chassis 4 with a step structure, a first LED chip of the two LED chips is fixedly welded on the high-order surface of the heat dissipation chassis 4, and a second LED chip is fixedly welded on the low-order surface of the heat dissipation chassis 4.
Specifically, the range of the height drop (i.e. the step structure) formed at the die bonding position on the support position is 0.3-0.4mm, so that the double-color light emission of the same bowl cup can be realized, and the power of the lamp bead can be increased to within 1.5W by sharing the heat dissipation chassis 4.
More specifically, in this embodiment, the first LED chip covers has first fluorescent glue 5 outward, the gluey face of first fluorescent glue 5 flushes with the high-order face of heat dissipation chassis 4, the second LED chip covers has second fluorescent glue 6 outward, the light that the first LED chip sent forms the light of low colour temperature after passing first fluorescent glue 5 and second fluorescent glue 6, the light that the second LED chip sent forms the light of high colour temperature after passing second fluorescent glue 6.
The following explains the manufacturing process of the present invention.
The first step, die bonding: two chips are fixed at the designated positions through the die bonding primer, and the polarities of the two chips need to be placed in a reverse direction, so that a foundation is provided for same-path two-color. Because the die bonding chassis of the two chips is shared, the heat dissipation effect can be improved, and the power of the lamp beads can be improved to be within 1.5W;
the second step, baking: placing the support with the two chips fixed in the constant-temperature oven, baking for 120-140 minutes at 165 +/-5 ℃ to solidify the primer and fix the chips on the support;
step three, wire welding: connecting the positive and negative electrodes of the two chips with the support through a bonding wire 3 according to a drawing, lighting one chip when the positive direction is electrified, and lighting the other chip when the negative direction is electrified, so that the circuit sharing is realized, and the circuit design cost is saved, wherein a bottom bonding pad 7 is arranged at the bottom of the support;
step four, dispensing of the first layer: injecting first fluorescent glue 5 into the low-order surface, wherein the glue surface is flush with the high-order surface, and the height of the drop between the low-order surface and the high-order surface is 0.3mm-0.4mm, so that the first chip 1 is covered by the first fluorescent glue 5;
a fifth step of baking: placing the bracket with the front face facing upwards in a material box, then placing the bracket in a constant-temperature oven for baking at two temperatures, wherein the first section is baked at 85 +/-5 ℃ for 60-70 minutes, and the second section is baked at 150 +/-5 ℃ for 30-40 minutes, so that the first fluorescent glue 5 is initially cured, the color temperature parameter tends to be in a stable state, and the change is not generated along with the increase of time, and the secondary glue injection is convenient;
sixth step, dispensing for the second time: according to the figure 2, the second fluorescent glue 6 is injected into the whole bowl, the second chip 2 emits light which penetrates through the second fluorescent glue 6 to form high color temperature, and the first chip 1 emits light which penetrates through the first fluorescent glue 5 and the second fluorescent glue 6 to form low color temperature. The method realizes the double-color luminescence of the same bowl cup. The first fluorescent glue 5 and the second fluorescent glue 6 cannot interfere with each other when the two chips emit light due to the step height difference, so that the color consistency is ensured;
a seventh step of baking: the bracket is placed in a material box with the right side facing upwards and is placed in a constant temperature oven for baking at two temperatures, wherein the first section is baked at 85 +/-5 ℃ for 60-70 minutes, and the second section is baked at 150 +/-5 ℃ for 240-. Completely curing the first fluorescent glue 5 and the second fluorescent glue 6;
an eighth step, stripping: stripping the finished lamp beads from the bracket die by a stripping machine;
ninth, light splitting and braiding: the finished lamp beads are subjected to parameter division such as voltage, color area and brightness through a light splitting machine and a braiding machine, defective products such as dead lamps and electric leakage are clamped out, and then good products are braided in a uniform direction and are wound by a reel.
The utility model discloses a beneficial effect with integrative LED encapsulation device of double-colored on road is, the utility model discloses an above-mentioned technical scheme, which comprises a bracket, be provided with the bowl cup that is used for installing two LED chips on the support, wherein, the electric property opposite direction of two LED chips weld firmly in the bowl cup, the bottom of bowl cup is provided with stair structure's heat dissipation chassis, first LED chip in two LED chips weld firmly in on the high-order face on heat dissipation chassis, the second LED chip weld firmly in on the low-order face on heat dissipation chassis, not only realized that positive and negative circular telegram chip lights respectively on same circuit, can save the design of a circuit, realized that same bowl cup is double-colored luminous moreover, can promote lamp pearl power to within 1.5W.
The above only is the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all under the concept of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.
Claims (5)
1. The utility model provides a double-colored integrative LED encapsulation device on same way, its characterized in that, includes the support, be provided with the bowl cup that is used for installing two LED chips on the support, wherein, the electric property opposite direction of two LED chips weld firmly in the bowl cup, the bottom of bowl cup is provided with stair structure's heat dissipation chassis, first LED chip in two LED chips weld firmly in on the high-order face on heat dissipation chassis, second LED chip weld firmly in on the low-order face on heat dissipation chassis.
2. The one-way two-color integrated LED package device according to claim 1, wherein the height of the step is 0.3-0.4 mm.
3. The one-way two-color integrated LED package device according to claim 1, wherein the power of the two chips is 1.5W.
4. The one-way two-color integrated LED package device according to claim 1, wherein the two chips are respectively fixedly welded in the bowl-shaped cup through bonding wires.
5. The on-road two-color integrated LED package device according to claim 1, wherein a first fluorescent glue covers the first LED chip, a glue surface of the first fluorescent glue is flush with a high-order surface of the heat dissipation chassis, a second fluorescent glue covers the second LED chip, light emitted by the first LED chip passes through the first fluorescent glue and the second fluorescent glue to form light with a low color temperature, and light emitted by the second LED chip passes through the second fluorescent glue to form light with a high color temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121132146.3U CN214848677U (en) | 2021-05-25 | 2021-05-25 | LED packaging device integrating double colors on same path |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121132146.3U CN214848677U (en) | 2021-05-25 | 2021-05-25 | LED packaging device integrating double colors on same path |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214848677U true CN214848677U (en) | 2021-11-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121132146.3U Active CN214848677U (en) | 2021-05-25 | 2021-05-25 | LED packaging device integrating double colors on same path |
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| Country | Link |
|---|---|
| CN (1) | CN214848677U (en) |
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2021
- 2021-05-25 CN CN202121132146.3U patent/CN214848677U/en active Active
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Address after: 518000 floor 5, building B and floor 6, building B, No. 1 new plant, No. 3 industrial zone, Luozu community, Shiyan street, Bao'an District, Shenzhen, Guangdong Patentee after: Shenzhen Liangan Technology Co.,Ltd. Address before: 518000 floor 5, building B and floor 6, building B, No. 1 new plant, No. 3 industrial zone, Luozu community, Shiyan street, Bao'an District, Shenzhen, Guangdong Patentee before: SHENZHEN LIANGAN PHOTOELECTRICITY TECHNOLOGY CO.,LTD. |