CN214845608U - Semiconductor device testing device - Google Patents
Semiconductor device testing device Download PDFInfo
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- CN214845608U CN214845608U CN202120694960.8U CN202120694960U CN214845608U CN 214845608 U CN214845608 U CN 214845608U CN 202120694960 U CN202120694960 U CN 202120694960U CN 214845608 U CN214845608 U CN 214845608U
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Abstract
The utility model discloses a semiconductor device testing device, which comprises a mounting substrate with a hollow part; the testing mechanism is erected above the mounting substrate and corresponds to the hollow part; and a conveying mechanism; the conveying mechanism includes: a heating assembly on the mounting substrate; the movement mechanism is used for driving the heating assembly to transversely move on the mounting substrate; the jacking mechanism is used for driving the heating assembly to lift; the heating assembly is configured to carry a product and comprises a contact part which is in contact with the bottom of the product and can preheat the product; under the driving of the jacking mechanism, the heating assembly ascends to enable the product to be in contact with the testing mechanism and to be tested. An object of the utility model is to provide a semiconductor device testing arrangement can effectively increase the product preheating time, improves the measuring accuracy, and convenient change to heating element.
Description
Technical Field
The utility model relates to a semiconductor test technical field. And more particularly, to a semiconductor device testing apparatus.
Background
An igbt (insulated Gate Bipolar transistor), also called an insulated Gate Bipolar transistor, is a semiconductor power device. During the production process of the IGBT, it is usually necessary to test the high-temperature performance of the IGBT by using a test device. In the prior art, an IGBT is usually placed in an oven to be heated, and when the IGBT reaches a test temperature, the IGBT is taken out of the oven and placed on a test device to be tested. However, this kind of detection method not only has a complicated operation process, but also has heat loss during the IGBT taking and placing and detection process, which causes the temperature of the IGBT to decrease and affects the test accuracy. The prior art provides a testing arrangement of a form, this testing arrangement utilizes manual work or mechanical hand (hold) product to put on the product support plate, and final controlling element carries the support plate to heating element top position again, and heating element rises under climbing mechanism's effect and docks the product and heat the product, and climbing mechanism continues to rise afterwards and promotes heating element and product and contact with the probe of accredited testing organization in the lump and test, and the defect of this kind of mode lies in can appearing the product preheating time not enough, influences test effect.
Therefore, a new semiconductor device testing apparatus is needed to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
In view of the above problems, an object of the present invention is to provide a semiconductor device testing apparatus, which can effectively increase the preheating time of the product, improve the testing precision, and facilitate the replacement of the heating assembly.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides a semiconductor device testing arrangement, include:
a mounting substrate having a hollow portion;
the testing mechanism is erected above the mounting substrate and corresponds to the hollow part; and
a conveying mechanism;
the conveying mechanism includes:
a heating assembly on the mounting substrate;
the movement mechanism is used for driving the heating assembly to transversely move on the mounting substrate; and
the jacking mechanism is used for driving the heating assembly to lift;
the heating assembly is configured to carry a product and comprises a contact part which is in contact with the bottom of the product and can preheat the product; under the driving of the jacking mechanism, the heating assembly ascends to enable the product to be in contact with the testing mechanism and to be tested.
In addition, it is preferable that the moving mechanism includes a stage plate, and a supporting plate which is located on the stage plate and forms a relative fixation with the heating assembly, and the stage plate is movably disposed on the mounting substrate; the supporting plate can be lifted relative to the platform plate;
the jacking mechanism is positioned below the mounting substrate and corresponds to the hollow part;
the platform plate is provided with a first hollow hole, and the driving end of the jacking mechanism can penetrate through the hollow part of the mounting substrate and the first hollow hole to drive the heating assembly to ascend.
In addition, preferably, the supporting plate comprises a second hollow hole which is configured corresponding to the first hollow hole, and the heating component comprises a fixed part which is relatively fixed with the moving mechanism; the fixing part is positioned between the edge of the first hollow hole on the platform plate and the edge of the second hollow hole on the supporting plate;
the contact part of the heating component is exposed out of the second hollow hole.
In addition, preferably, the first hollowed-out hole and the second hollowed-out hole respectively penetrate through the edges of the platform plate and the same side of the supporting plate;
the fixing part of the heating component can be inserted into the space between the platform plate and the supporting plate from the outer side of the moving mechanism for fixing.
In addition, the preferred scheme is that, the motion mechanism still is including being vertical direction setting guide post on the platform board to and combine to fix bearing housing on the layer board, bearing housing slidable cover is established on the guide post.
In addition, preferably, the heating assembly comprises a carrier plate positioned at the bottom, and a heating plate positioned on the carrier plate and used for providing heat for the product;
the support plate is combined and fixed on the support plate.
In addition, preferably, the heating assembly comprises a carrier plate positioned at the bottom, and a heating plate positioned on the carrier plate and used for providing heat for the product; the edge of the carrier plate forms the fixing part.
In addition, it is preferable that the test mechanism is mounted on the mounting substrate via a support frame; the testing mechanism is detachably connected with the supporting frame.
In addition, preferably, the testing mechanism comprises a testing component for testing the product and a mounting plate connected to the testing component, and the mounting plate is slidably assembled on the supporting frame.
In addition, preferably, the testing device further comprises a testing case, the testing mechanism is installed in place from one side of the installation substrate in a sliding mode, and the testing mechanism and the testing case are in butt joint conduction through a connector to realize electric connection.
The utility model has the advantages as follows:
the utility model provides a semiconductor device testing arrangement, heating element sets up on motion with liftable, at the test procedure initial stage, the product put on the shelf after before being connected with accredited testing organization and detecting, can preheat the product in advance, it carries out middle transportation, the station butt joint in-process usable carries out the process loss of preheating to the product to have reduced conveying mechanism, heating time between heating element and the product is longer, calorific loss still less, improve test accuracy and work efficiency. The utility model provides a semiconductor device testing arrangement, cooperation through heating element and accredited testing organization can enough carry out the constant temperature heating to the product, can detect the product again to need not to place the product in the thermostat before the test and heat up, avoided the product to take out the calorific loss in-process and the testing process from the thermostat, simplified operating procedure, be favorable to making the product keep test temperature, improve the measuring accuracy. For the other advantages of the present invention compared with the prior art, the following detailed description will be directed to various technical features.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Fig. 1 shows an overall structure diagram of the semiconductor device testing apparatus provided by the present invention.
Fig. 2 shows a cross-sectional view of the overall structure of the semiconductor device testing apparatus provided by the present invention.
Fig. 3 shows a schematic structural diagram of the semiconductor device testing apparatus provided by the present invention in a state without a testing mechanism and a heating assembly.
Fig. 4 shows a schematic partial structure diagram of the semiconductor device testing apparatus provided by the present invention.
Fig. 5 shows a schematic structural diagram of a heating assembly in the semiconductor device testing apparatus provided by the present invention.
Fig. 6 shows an assembly view of the heating assembly shown in fig. 5.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be considered a part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
An embodiment of the utility model provides a semiconductor device testing arrangement 100 for carry out relevant high temperature capability test to semiconductor devices such as IGBT, combine fig. 1 to 5 to show, specifically, testing arrangement 100 includes: a mounting substrate 110 having a hollow portion 111; a testing mechanism 120 and a conveying mechanism 130 which are erected at positions above the mounting substrate 110 and correspond to the hollowed-out portions 111. In one embodiment, the testing apparatus further comprises a testing cabinet, and the testing cabinet provides a signal source for testing. The testing mechanism 120 is installed in place by one side of the installation substrate 110 in a sliding manner, the rear part of the testing mechanism 120 is connected to the testing case, and the testing mechanism 120 is in butt joint with the testing case through a connector to realize electric connection. Wherein, conveying mechanism 130 includes: a heating member 140 on the mounting substrate 110; a moving mechanism 150 for moving the heating element 140 laterally on the mounting substrate 110; and a lifting mechanism 160 for driving the heating assembly 140 to lift. The heating assembly 140 is configured to carry a product, and the heating assembly 140 comprises a contact part which is in contact with the bottom of the product and can preheat the product; the heating assembly 140 is raised to bring the product into contact with the testing mechanism 130 and perform testing, driven by the jacking mechanism 160.
In this embodiment, the heating assembly 140 is disposed on the moving mechanism 150 of the conveying mechanism 130 and can be lifted by the jacking mechanism 160, so as to interface the product with the testing mechanism 130, so that the testing mechanism 130 can detect the product. At the initial stage of the testing process, the product is put on shelf and then directly placed on the heating assembly 140, before the product is connected with the testing mechanism 130 and is detected, the heating assembly 140 can preheat the product in advance, the process loss of preheating the product, which can be fully utilized in the processes of intermediate transfer of the product by the conveying mechanism, station butt joint and the like, is reduced, the product is put on shelf and is in contact with the heating assembly 140 at the initial stage, the heating assembly 140 has longer heating time of the product, the heat loss is less, the heat loss of the product before testing is reduced, the product is beneficial to keeping the testing temperature, the operation process is simplified, and the testing precision and the working efficiency are fully improved.
As shown in fig. 1 to 4, in one embodiment, the moving mechanism 150 includes a stage plate 151 and a supporting plate 152 fixed to the stage plate 151 with respect to the heating assembly 140, the stage plate 151 being movably disposed on the mounting substrate 110; the pallet 152 is movable in a horizontal direction on the mounting substrate 110 with the stage plate 151, and the pallet 152 is configured to be liftable and lowerable with respect to the stage plate 151 by the driving of the jacking mechanism 160.
In this embodiment, the jacking mechanism 160 is located below the mounting substrate 110 and corresponds to the hollow portion 111; the platform plate 151 includes a first hollow hole 1511, and the driving end of the lift mechanism 160 can pass through the hollow portion 111 of the mounting substrate 110 and the first hollow hole 1511 to drive the heating element 140 to ascend. Since the product is placed and fixed on the heating assembly 140 at the initial stage of the loading, the heating assembly 140 is located on the stage plate 151 and can move to the position below the testing mechanism 120 along the horizontal direction along with the stage plate 151 on the mounting substrate 110, and the product moves along with the rising of the heating assembly 140 under the driving of the jacking mechanism 160, and the product contacts with the testing mechanism 120 to realize the detection of the product.
Alternatively, as shown in fig. 1 and fig. 3, the semiconductor device testing apparatus 100 provided in this embodiment includes a driving mechanism 170, the driving mechanism 170 is disposed on the mounting substrate 110, and a driving end of the driving mechanism 170 is connected to the moving mechanism 150 to drive the moving mechanism 150 to move laterally on the mounting substrate 110. Further, the driving end of the driving mechanism 170 is connected to the stage plate 151 through the connecting plate 171, and the driving mechanism 170 includes, but is not limited to, a linear module.
The semiconductor device testing apparatus 100 provided in this embodiment includes a sliding mechanism 180, the stage plate 151 is mounted on the mounting substrate 110 through the sliding mechanism 180, the sliding mechanism 180 includes a sliding rail 181 and a slider 182, the sliding rail 181 is located on the mounting substrate 110 and passes through the lower portion of the testing mechanism 120, and the stage plate 151 is fixed on the slider 182. Through the cooperation of the sliding rail 181 and the sliding block 182, the moving stability and smoothness of the moving mechanism 150 can be ensured. In addition, the slide rail 181 penetrates through the lower part of the testing mechanism 120, and the material loading and unloading can be performed from the two ends of the slide rail 181, optionally, one end of the slide rail 181 is a manual material loading and unloading position, and the other end of the slide rail 181 is an automatic material loading and unloading position, so that the manual material loading and unloading and the automatic material loading and unloading are not interfered with each other.
Referring to fig. 1 and fig. 3 to fig. 6, in one embodiment, the supporting plate 152 includes a second hollow hole 1521 corresponding to the first hollow hole 1511, and the heating element 140 includes a fixing portion fixed relative to the moving mechanism 150; the fixing portion is located between an edge of the first hollow 1511 on the platen 151 and an edge 1521 of the second hollow on the supporting board 152. The contact portion of the heating element 140 is exposed by the second hollow hole 1521. In the structure of the semiconductor device testing apparatus 100 provided in this embodiment, the heating element 140 includes a carrier plate 141 located at the bottom, and a heating plate 142 located on the carrier plate 141 for providing heat to the product; the edge of the carrier 141 forms a fixing portion. In the actual working process, in order to achieve quick replacement of the heating assembly by a person in a more convenient manner, more specifically, the first hollowed-out hole 1511 and the second hollowed-out hole 1521 respectively penetrate through the edge of the same side of the platform plate 151 and the supporting plate 152. The fixing portion of the heating element 140 may be inserted between the stage plate 151 and the supporting plate 152 from the outside of the moving mechanism 150 to be fixed. Optionally, the carrier 141 of the heating element 140 includes a protruding electrical connection portion 1411 for electrically connecting to an external power source to achieve electrical heating, and meanwhile, the heating element 140 is conveniently taken and placed manually or by a robot. It should be noted that, as shown in the structure, when the product is driven by the moving mechanism 150 to move to the position below the testing mechanism 120, and the driving end of the jacking mechanism 160 is acting, the driving end of the jacking mechanism 160 passes through the hollow-out portion 111, the first hollow-out hole 1511 and the second hollow-out hole 1521 of the mounting substrate 110 to act on the bottom surface of the carrier plate 141 of the heating element 140, at this time, the edge of the carrier plate 141 of the heating element 140 forms the fixing portion 1412, the upward movement trend of the fixing portion 1412 is blocked by the edge of the second hollow-out hole 1521 of the supporting plate 152, and at this time, the supporting plate 152 is lifted along with the rising of the heating element 140.
Referring to fig. 3, in the present embodiment, the moving mechanism 150 includes a guide post 153 vertically disposed on the platform plate 151, and a bearing sleeve 154 combined and fixed on the supporting plate 152, wherein the bearing sleeve 154 slidably fits over the guide post 153. The top of the guiding column 153 includes a detachable blocking piece 155, the elastic member 156 is sleeved on the guiding column 153, and the elastic member 156 is located between the bearing sleeve 154 and the blocking piece 155. The guide posts 153 and the bearing sleeves 154 are matched to ensure the accuracy of the lifting path of the supporting plate 152 and the heating assembly 140 and the stability of the lifting. Alternatively, the number of the guide posts 153 is plural, and the bearing sleeves 154 are provided in one-to-one correspondence with the guide posts 153. Specifically, in the present embodiment, the number of the guide posts 153 is four, and four guide posts 153 are respectively provided at four corners of the deck plate 151. Bearing housing 154 includes, but is not limited to, a linear bearing. The supporting plate 152 and the carrier plate 141 of the heating assembly 140 can be reset under the action of the elastic member 156, and the elastic member 156 can also play a role of buffering, so that the jacking mechanism 160 can be more stable when the supporting plate 152 and the carrier plate 141 are driven to move upwards.
Different from the above-mentioned matching method between the heating element and the moving mechanism as shown in the figure, in an embodiment, the matching method between the heating element and the moving mechanism may also be that the support plate of the heating element is fixed on the support plate, specifically, the support plate is fixed on the top surface of the support plate, in this case, the second hollow hole is not required to be arranged on the support plate, and different from the structure shown in the above-mentioned embodiment, the driving end of the jacking mechanism directly acts on the bottom surface of the support plate, and the support plate drives the heating element to ascend together. Optionally, the support plate and the support plate are of a detachable connection structure, so that the heating assembly is convenient to replace.
In another embodiment, the carrier plate and the supporting plate are an integral component, but this structure is disadvantageous in that the replacement of the heating assembly is complicated, and when the heating assembly is replaced, the supporting plate and the supporting plate as the integral component are required to be detached from the platform plate, which requires the separation blade, the elastic member and even the bearing sleeve to be detached respectively, the operation process is complicated, the labor time is wasted, but this embodiment does not affect the specific implementation of this technical solution, and to those skilled in the art, the structure belongs to the obvious change or variation of the technical solution of the present invention.
Referring to fig. 2, in this embodiment, the jacking mechanism 160 includes a jacking cylinder 161, a bearing 162, a guide shaft 163, a support base 164, a jacking plate 165 and a cylinder fixing plate 166, a cylinder rod of the jacking cylinder 161 forms a driving end of the jacking mechanism 160, the jacking cylinder 161 is fixedly connected to the bottom surface of the mounting substrate 110 through the support base 164 and the cylinder fixing plate 166, the jacking plate 165 is fixedly connected to an end of the cylinder rod of the jacking cylinder 161, and the jacking plate 165 acts on the heating assembly 140 to provide power for the lifting of the product through the cylinder rod of the jacking cylinder 161. The jacking cylinder 161 is connected with the cylinder fixing plate 166, the bearing 162 is connected on the cylinder fixing plate 166, the guide shaft 163 is arranged in the bearing 162 in a penetrating way, and when the cylinder rod of the jacking cylinder 161 extends out, the jacking plate 165 and the guide shaft 163 can be driven to ascend together. The cooperation of the guide shaft 163 and the bearing 162 provides a stable guiding function for the rod action of the jacking cylinder 161.
As shown in fig. 5 and 6, the heating assembly 140 includes a heating shield 143 disposed on the carrier plate 141, and the heating shield 143 surrounds the heating plate 142 along a circumferential direction. The heating shield 143 may prevent heat generated by the heating plate 142 from being diffused and lost all around, and preferably, an insulation plate 144 is included between the carrier plate 141 and the heating plate 142, the insulation plate 144 is located on a plate surface of the carrier plate 141, and a position below the heating plate 142 is used for preventing heat from being lost from a direction of the carrier plate 141, so that heat generated by the heating plate 142 can be maximally applied to the product. In one embodiment, the side of the heating plate 142 facing away from the carrier plate 141 includes a conformal plate 145, the conformal plate 145 forms a contact portion of the heating assembly 140 contacting with the bottom of the product, and in combination with the structure shown in the figure, the conformal plate 145 includes a positioning column 1451 for positioning the product. The follower plate 145 can contact the product. The follower plate 145 is heated by the heater plate 142 and then the follower plate 145 is used to contact and heat the product to bring the product to the test temperature. Preferably, the follower plate 145 is made of an aluminum material or a copper material so that heat of the follower plate 145 can be better transferred to the product. Optionally, a fitting groove 1452 is included on the conformal plate 145, and the fitting groove 1452 is adapted to the shape of the bottom of the product, so that the groove wall of the fitting groove 1452 can fit the bottom of the product. By providing the attaching groove 1452, not only the heat of the conformal plate 145 can be rapidly transferred to the product, but also the product can be heated more uniformly. The setting along with the template is convenient for product location on the one hand, and on the other hand still can be according to the different along with templates of changing the matching pattern of product bottom shape, and application scope is wide.
In order to solve the above problems, as shown in fig. 1, in one embodiment, the testing mechanism 120 is erected on the mounting substrate 110 through a supporting frame 190; the testing mechanism 120 includes a mounting plate 121 and a testing component coupled to the mounting plate 121. The supporting frame 190 comprises two oppositely arranged side walls, and the inner side edges of the tops of the two side walls comprise transversely arranged sliding grooves; the sliding groove comprises a notch penetrating through one end of the side wall; the two opposite edges of the mounting plate 121 can be fitted in the sliding groove by the notches in a sliding fit manner. Through sliding fit, can make things convenient for the dismantlement of accredited testing organization to the accredited testing organization of different patterns is switched according to the product difference, convenient operation. Optionally, the supporting frame 190 and the mounting plate 121 may be inserted and positioned by a positioning pin to improve the working efficiency. According to the technical scheme, the connector corresponding to the testing machine case is arranged at the rear of the testing mechanism, and after the testing mechanism slides in place, the connector on the testing mechanism is in butt joint with the connector on the testing machine case, so that the purpose of quick assembly and conduction is achieved.
As shown in fig. 1, in one embodiment, a test assembly comprises: a fixing plate 122 combined and fixed on the mounting plate 121; a PCB interposer 123 on the fixing plate 122; a probe fixing plate 124 on the fixing plate 122; and a probe 125 on the probe fixing plate 124. The probes 125 are used for butt joint of a jacked product to be tested, the probes 125 are fixed on the probe fixing plate 124, the tail ends of all the probes 125 are connected with the PCB adapter plate 123, and the PCB adapter plate 123 is plugged by a quick-plugging plug so as to facilitate later maintenance. In an optional embodiment, the testing assembly further includes a positioning pin 126 located on the probe fixing plate 124, and a positioning block 126, the positioning pin 126 is used to ensure the confirmation of the contact positioning accuracy between the probe 125 and the product, and the positioning block 127 is used to correspondingly cooperate with a lifting plate 165 located at the end of the cylinder rod of the lifting cylinder 161 to limit the stroke of the probe 125, so as to prevent the probe from being damaged due to the overload of the probe stroke.
The utility model provides a semiconductor device testing arrangement, cooperation through heating element 140 and accredited testing organization 120 can enough carry out the constant temperature heating to the product, can detect the product again to need not to place the product in the thermostat before the test and heat up, avoided the product to take out the calorific loss in-process and the testing process from the thermostat, simplified operation, be favorable to making the product keep test temperature, improve the measuring accuracy. In addition, the testing mechanism is fixed in a sliding assembly mode, is convenient to disassemble, replace and conduct with the testing machine case, and improves testing efficiency.
Obviously, the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it is obvious for those skilled in the art to make other variations or changes based on the above descriptions, and all the embodiments cannot be exhausted here, and all the obvious variations or changes that belong to the technical solutions of the present invention are still in the protection scope of the present invention.
Claims (10)
1. A semiconductor device testing apparatus, comprising:
a mounting substrate having a hollow portion;
the testing mechanism is erected above the mounting substrate and corresponds to the hollow part; and
a conveying mechanism;
the conveying mechanism includes:
a heating assembly on the mounting substrate;
the movement mechanism is used for driving the heating assembly to transversely move on the mounting substrate; and
the jacking mechanism is used for driving the heating assembly to lift;
the heating assembly is configured to carry a product and comprises a contact part which is in contact with the bottom of the product and can preheat the product; under the driving of the jacking mechanism, the heating assembly ascends to enable the product to be in contact with the testing mechanism and to be tested.
2. The semiconductor device testing apparatus of claim 1, wherein the movement mechanism comprises a stage plate movably disposed on the mounting substrate, and a support plate on the stage plate fixed relative to the heater assembly; the supporting plate can be lifted relative to the platform plate;
the jacking mechanism is positioned below the mounting substrate and corresponds to the hollow part;
the platform plate is provided with a first hollow hole, and the driving end of the jacking mechanism can penetrate through the hollow part of the mounting substrate and the first hollow hole to drive the heating assembly to ascend.
3. The semiconductor device testing apparatus of claim 2, wherein the supporting plate includes a second opening corresponding to the first opening, and the heating element includes a fixing portion fixed relative to the moving mechanism; the fixing part is positioned between the edge of the first hollow hole on the platform plate and the edge of the second hollow hole on the supporting plate;
the contact part of the heating component is exposed out of the second hollow hole.
4. The semiconductor device testing apparatus of claim 3, wherein the first and second holes respectively penetrate through edges of the same side of the platen and the supporting plate;
the fixing part of the heating component can be inserted into the space between the platform plate and the supporting plate from the outer side of the moving mechanism for fixing.
5. The semiconductor device testing apparatus of claim 2, wherein the moving mechanism further comprises a guide post vertically disposed on the platform plate, and a bearing housing coupled and fixed to the supporting plate, the bearing housing slidably fitted over the guide post.
6. The semiconductor device testing apparatus of claim 2, wherein the heating assembly comprises a carrier plate at a bottom, and a heating plate on the carrier plate for providing heat to the product;
the support plate is combined and fixed on the support plate.
7. The semiconductor device testing apparatus of claim 3, wherein the heating assembly comprises a carrier plate at a bottom, and a heating plate on the carrier plate for providing heat to the product; the edge of the carrier plate forms the fixing part.
8. The semiconductor device testing apparatus according to claim 1, wherein the testing mechanism is erected on the mounting substrate by a support frame; the testing mechanism is detachably connected with the supporting frame.
9. The semiconductor device testing apparatus of claim 8, wherein the testing mechanism comprises a testing assembly for testing the product and a mounting plate connected to the testing assembly, the mounting plate being slidably mounted on the support frame.
10. The semiconductor device testing apparatus of claim 9, further comprising a testing cabinet, wherein the testing mechanism is slidably mounted in place from one side of the mounting substrate, and the testing mechanism and the testing cabinet are electrically connected by being in butt-joint conduction through a connector.
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| CN202120694960.8U CN214845608U (en) | 2021-04-06 | 2021-04-06 | Semiconductor device testing device |
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| CN202120694960.8U CN214845608U (en) | 2021-04-06 | 2021-04-06 | Semiconductor device testing device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116382242A (en) * | 2023-04-23 | 2023-07-04 | 佛山市通宝华龙控制器有限公司 | Service life test equipment and detection method for kick type temperature controller |
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2021
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116382242A (en) * | 2023-04-23 | 2023-07-04 | 佛山市通宝华龙控制器有限公司 | Service life test equipment and detection method for kick type temperature controller |
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