CN214820455U - High-efficient nose is with first injection mold - Google Patents

Abstract

The utility model relates to the technical field of injection molds, and discloses a high-efficiency nose injection mold, which comprises an upper mold base, an upper mold, a lower mold base and a lower mold which are sequentially connected, wherein the upper mold is embedded on the lower surface of the upper mold base, the lower mold is embedded on the upper surface of the lower mold base, heating and refrigerating adjusting devices are respectively arranged between the upper mold base and the upper mold and between the lower mold base and the lower mold, the upper mold and the lower mold can be respectively heated or refrigerated in the injection molding process through the heating and refrigerating adjusting devices, so that plastic melts entering the upper mold and the lower mold are properly heated after entering a main runner and a branch runner to ensure the melting state of the plastic melts, the plastic melts can fully enter each cavity, after entering the cavity, the heating and refrigerating adjusting devices start to refrigerate the upper mold and the lower mold, so that the plastic melts in the cavity are cooled and molded, and the cold and hot switching of the heating and refrigerating adjusting devices, effectively improves the work efficiency and the product quality of injection molding, and has the advantages of energy saving, environmental protection and low cost.

Description

High-efficient nose is with first injection mold

Technical Field

The utility model relates to an injection mold technical field, in particular to high-efficient nose is with first injection mold.

Background

The working principle of injection molding is that the plasticized plastic in a molten state (i.e. viscous state) is injected into a closed mold cavity by means of the thrust of a screw (or a plunger), and a product is obtained after solidification and shaping, namely: the injection molding machine is characterized in that a plastic melt injected from a nozzle of the injection molding machine enters a mold cavity through a main runner arranged in a sprue bush and then enters the mold cavity through a sub-runner and a sprue, and after the mold cavity is filled with the melt and subjected to pressure maintaining, feeding, cooling and shaping, a mold closing system drives a movable mold to be withdrawn and reset, so that the movable mold and a fixed mold are separated from a parting surface. When the movable mould is withdrawn to a certain position, the ejection demoulding mechanism arranged in the movable mould moves relative to other parts of the movable mould under the ejection action of the ejector rod of the injection moulding machine, so that the product, the pouring gate and the congealed materials in the runner are ejected out and fall off from the movable mould and the sub-runner on one side of the driven mould by the ejection demoulding mechanism, and the one-time injection moulding process is completed.

The nose head, namely the nose sprayer nozzle, is used for spraying liquid in a sprayer bottle body into a nasal cavity, so as to realize the effect of flushing the nasal cavity, and is a universal personal medical and sanitary appliance, the existing universal nasal cavity sprayer nozzle is generally formed by injection molding of an injection molding machine, in order to improve the production efficiency, a plurality of products are generally formed at one time, so that an injection mold for producing the nose head is generally provided with a plurality of cavities, because the nose head has a complex structure and small volume, plastic melt enters a main runner and then enters each cavity through a plurality of communicated branch runners, each runner is long and thin and has more branches, the temperature is lower when the plastic melt enters the main runner or the branch runners at the farther from a nozzle, and the plastic melt in the runner at the farther from the nozzle is not solidified when the plastic melt enters the cavity, thereby causing clogging or seriously affecting the quality of the product.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a high-efficient nose is with first injection mold has injection moulding work efficiency height, and product processing quality is high, simple structure, and energy-concerving and environment-protective, effect with low costs.

The above technical purpose of the present invention can be achieved by the following technical solutions:

the utility model provides a high-efficient nose is with first injection mold, is from last to including consecutive upper die base, last mould, die holder and lower mould down, go up the mould and inlay the lower surface of locating the upper die base, the lower mould inlays the upper surface of establishing with the die holder, the lower surface of upper die base and last mould is all on the coplanar, the upper surface of die holder and lower mould is all on the coplanar, all be equipped with heating refrigeration adjusting device between upper die base and the last mould, between die holder and the lower mould, the inside of upper die base and die holder is equipped with a plurality of rivers passageways with the relative position of heating refrigeration adjusting device, the water inlet and the water intaking valve intercommunication of rivers passageway, the delivery port and the outlet valve intercommunication of rivers passageway, the water intaking valve is connected with the cold water storage cistern, the outlet valve is connected with the hot-water tank.

By adopting the technical scheme, between upper die base and last mould, set up between lower die base and the lower mould and heat refrigeration adjusting device and can heat or refrigerate last mould and lower mould respectively in the injection moulding course of working, make the plastics fuse-element that gets into in last mould and lower mould by suitable heating after getting into sprue and subchannel, in order to guarantee its molten condition, thereby be convenient for the plastics fuse-element fully to get into each die cavity, after the plastics fuse-element gets into the die cavity, heating refrigeration adjusting device begins to refrigerate last mould and lower mould, make the plastics fuse-element in the die cavity cooled down the shaping, heating refrigeration adjusting device's cold and hot switching, on the one hand, injection moulding's work efficiency has been improved, on the other hand has improved product processingquality, and simple structure, and is with low costs.

The utility model discloses a further set up to: the heating and refrigerating adjusting device is a semiconductor refrigerating sheet, two end faces of the semiconductor refrigerating sheet between the upper die base and the upper die are tightly attached to the upper die base and the upper die respectively, and two end faces of the semiconductor refrigerating sheet between the lower die base and the lower die are tightly attached to the lower die base and the lower die respectively.

Through adopting above-mentioned technical scheme, two terminal surfaces of semiconductor refrigeration piece are the refrigeration end and the end of heating respectively, the refrigeration end can interconversion with the end of heating when the direction of current changes, thereby realize heating or cooling last mould and lower mould, semiconductor refrigeration piece during operation does not need any refrigerant or medium, but continuous operation, no pollution source, do not have rotary part, can not produce the gyration effect, do not have sliding part, the during operation does not have vibrations, the noise, long service life, heating and refrigeration effect have simultaneously, small, easy installation.

The utility model discloses a further set up to: and water pumps are arranged between the water inlet valve and the cold water tank and between the water outlet valve and the hot water tank.

By adopting the technical scheme, the water pumps are arranged between the water inlet valve and the cold water tank and between the water outlet valve and the hot water tank alternately, so that the exchange of water in the hot water tank and water in the cold water tank can be realized, when the semiconductor refrigerating sheet heats the upper die and the lower die, the refrigerating end of the semiconductor refrigerating sheet is opposite to the upper die holder and the lower die holder, so that the temperatures of the upper die holder and the lower die can be reduced, in order to prevent the upper die holder and the lower die holder from taking away the temperatures of the upper die and the lower die, the water pump between the water outlet valve and the hot water tank is started, hot water in the hot water tank can flow into the cold water tank from the water flow channel, the water exchanges heat with the upper die holder and the lower die holder in the flowing process, so that the temperatures of the upper die holder and the lower die holder are increased, and similarly, when the semiconductor refrigerating sheet cools the upper die and the lower die, the refrigerating end of the semiconductor refrigerating sheet is opposite to the upper die holder and the lower die holder, so that the temperatures of the upper die holder and the lower die holder can be increased, in order to prevent high temperature on the upper die base and the lower die base from being transmitted to the upper die and the lower die and prolong the cooling forming time, a water pump between a water inlet valve and a cold water tank is started, cold water in the cold water tank can flow into a hot water tank from a water flow channel, and the water exchanges heat with the upper die base 1 and the lower die base 3 in the flowing process, so that the temperatures of the upper die base and the lower die base are reduced.

The utility model discloses a further set up to: the semiconductor refrigerating sheet is connected with the current direction control circuit.

By adopting the technical scheme, the current direction control circuit controls the direction of the electrifying current of the semiconductor refrigerating sheet, so that the switching between the refrigerating end and the heating end of the refrigerating sheet is effectively controlled, the switching process is simple, and the automation degree is high.

The utility model discloses a further set up to: each water flow channel is parallel to each other, a heat conduction copper sheet is embedded between every two adjacent water flow channels, and one end of each heat conduction copper sheet is in contact with the end face of the semiconductor refrigeration sheet.

Through adopting above-mentioned technical scheme, the setting of heat conduction copper sheet has further improved the heat exchange efficiency of upper die base and die holder and semiconductor refrigeration piece to further improve the efficiency of heat exchange between semiconductor refrigeration piece and the rivers passageway, make the semiconductor refrigeration piece better to the temperature regulation effect of mould.

The utility model has the advantages that:

1. the utility model discloses an between the upper die base and last mould, set up heating refrigeration adjusting device between die holder and the lower mould, can heat or refrigerate last mould and lower mould respectively in the injection moulding process, make the plastics fuse-element that gets into in last mould and the lower mould by suitable heating after getting into sprue and subchannel, in order to guarantee its molten state, thereby be convenient for the plastics fuse-element fully gets into each die cavity, after the plastics fuse-element gets into the die cavity, heating refrigeration adjusting device begins to refrigerate last mould and lower mould, make the plastics fuse-element in the die cavity cooling shaping, heating refrigeration adjusting device's cold and hot switch, injection moulding's work efficiency has been improved on the one hand, on the other hand has improved product processingquality, and simple structure, and is with low costs.

2. The utility model provides a heating refrigeration adjusting device does not need any refrigerant or medium for the semiconductor refrigeration piece, but continuous operation, does not have the pollution source, does not have rotary part, can not produce the gyration effect, does not have sliding part, and the during operation does not have vibrations, noise, longe-lived, has heating and refrigeration effect simultaneously, and is small, and the installation is easy, can reduce the volume of mould greatly, improves the quality of product.

3. The utility model discloses an all set up the water pump between water intaking valve and cold water storage cistern and outlet valve and hot-water tank, alternate use through two water pumps, can realize exchanging of the water in hot-water storage cistern and the cold water storage cistern, the water cycle in cold water storage cistern and the hot-water storage cistern uses, neither waste water resource, heat energy is not wasted again, energy-concerving and environment-protective, and carry out temperature regulation at the continuous upper die base of the in-process that the water of hot-water storage cistern and cold water storage cistern flows each other and the die holder, reduce the upper die base and the die holder and go up the mould and the lower mould difference in temperature, thereby improve the temperature regulation effect of semiconductor refrigeration piece to the mould.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is an explosion diagram of the high-efficiency nose injection mold of the present invention.

Fig. 2 is a schematic sectional view of the assembled high-efficiency nasal head injection mold of the present invention.

Fig. 3 is a structural schematic diagram of a current direction control circuit connected with a semiconductor refrigeration piece in a high-efficiency nasal head injection mold.

In the figure, 1, an upper die base; 2. an upper die; 3. a lower die holder; 4. a lower die; 5. a heating and cooling adjusting device; 6. a water flow channel; 7. a water inlet valve; 8. a water outlet valve; 9. a thermally conductive copper sheet.

Detailed Description

The technical solution of the present invention will be clearly and completely described below with reference to the specific embodiments. It is obvious that the described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 and 2, the high-efficiency nasal tip injection mold comprises an upper mold base 1, an upper mold 2, a lower mold base 3 and a lower mold 4 which are sequentially connected from top to bottom, wherein the upper mold 2 is embedded in the lower surface of the upper mold base 1, the lower mold 4 is embedded in the upper surface of the lower mold base 3, the lower surfaces of the upper mold base 1 and the upper mold 2 are on the same plane, the upper surfaces of the lower mold base 3 and the lower mold 4 are on the same plane, heating and refrigerating adjusting devices 5 are respectively arranged between the upper mold base 1 and the upper mold 2 and between the lower mold base 3 and the lower mold 4, a plurality of water flow channels 6 are arranged in the positions, corresponding to the heating and refrigerating adjusting devices 5, in the upper mold base 1 and the lower mold base 3, water inlets of the water flow channels 6 are communicated with a water inlet valve 7, water outlets of the water flow channels 6 are communicated with a water outlet valve 8, the water inlet valve 7 is connected with a cold water tank, and the water outlet valve 8 is connected with a hot water tank, can heat or refrigerate last mould 2 and lower mould 4 respectively through setting up heating refrigeration adjusting device 5 in the processing procedure of moulding plastics, make the plastics fuse-element that gets into in last mould 2 and lower mould 4 suitably heat after getting into sprue and subchannel, in order to guarantee its molten state, thereby be convenient for the plastics fuse-element fully gets into in each die cavity, after the plastics fuse-element got into the die cavity, heating refrigeration adjusting device 5 began to refrigerate last mould 2 and lower mould 4, make the plastics fuse-element in the die cavity cooled off the shaping, heating refrigeration adjusting device 5's cold and hot switching, on the one hand, injection moulding's work efficiency has been improved, on the other hand has improved product processingquality, and simple structure, low cost.

Furthermore, the heating and refrigerating adjusting device 5 is a semiconductor refrigerating sheet, two end faces of the semiconductor refrigerating sheet between the upper die base 1 and the upper die 2 are respectively tightly attached to the upper die base 1 and the upper die 2, two end faces of the semiconductor refrigerating sheet between the lower die base 3 and the lower die 4 are respectively tightly attached to the lower die base 3 and the lower die 4, two end faces of the semiconductor refrigerating sheet are respectively a refrigerating end and a heating end, when the current direction changes, the refrigerating end and the heating end can be mutually converted, so that the upper die 2 and the lower die 4 can be heated or cooled, the semiconductor refrigerating sheet does not need any refrigerant or medium when working, can continuously work, has no pollution source, does not have a rotating part, does not have a sliding part, does not have vibration, noise and long service life when working, has heating and refrigerating effects, and is small in size, the installation is easy.

Furthermore, water pumps are arranged between the water inlet valve 7 and the cold water tank and between the water outlet valve 8 and the hot water tank, and the water pumps arranged between the water inlet valve 7 and the cold water tank and between the water outlet valve 8 and the hot water tank are alternately used, so that the exchange of water in the hot water tank and water in the cold water tank can be realized, when the semiconductor refrigeration sheet heats the upper die 2 and the lower die 4, the refrigeration end of the semiconductor refrigeration sheet is opposite to the upper die base 1 and the lower die base 3, so that the temperature of the upper die base 1 and the temperature of the lower die base 3 can be reduced, in order to prevent the upper die base 1 and the lower die base 3 from taking away the temperature of the upper die 2 and the lower die 4, the water pump between the water outlet valve 8 and the hot water tank is started, so that hot water in the hot water tank can flow into the cold water tank from the water flow channel 6, the water exchanges heat with the upper die base 1 and the lower die base 3 in the flowing process, so that the temperature of the upper die base 1 and the lower die base 3 is increased, similarly, when the semiconductor refrigerating sheet cools the upper die 2 and the lower die 4, the heating end of the semiconductor refrigerating sheet is opposite to the upper die base 1 and the lower die base 3, so that the temperature of the upper die base 1 and the temperature of the lower die base 3 can be increased, in order to prevent high temperature on the upper die base 1 and the lower die base 3 from being transmitted to the upper die 2 and the lower die 4, the cooling forming time is prolonged, the water pump between the water inlet valve 7 and the cold water tank is started, cold water in the cold water tank can flow into the hot water tank from the water flow channel, heat exchange is carried out between the water and the upper die base 1 and the lower die base 3 in the flowing process, the temperature of the upper die base 1 and the temperature of the lower die base 3 are reduced, in the continuous production process, the process is carried out in a reciprocating and circulating mode, water in the cold water tank and the hot water tank is recycled, water resources are not wasted, heat energy is not wasted, energy is saved, environment friendliness is achieved, and the temperature adjusting effect of the semiconductor refrigerating sheet on the die can be improved.

Further, the semiconductor chilling plate is connected with a current direction control circuit, the current direction control circuit connection can be a circuit diagram in fig. 3, the current direction control circuit controls the direction of the current applied to the semiconductor chilling plate, and if the current direction control circuit adopts the circuit diagram in fig. 3, the control distance is as follows: when the switches S1 and S4 are closed, the switches S2 and S3 are opened, the current direction of the semiconductor chilling plate is along the direction from left to right, when the switches S1 and S4 are opened, the switches S2 and S3 are closed, the current direction of the semiconductor chilling plate is along the direction from right to left, the switching of the chilling end and the heating end of the chilling plate is controlled through the change of the current direction, the switching process is simple, and the automation degree is high.

Further, each rivers passageway 6 is parallel to each other, all inlays between the adjacent rivers passageway 6 and is equipped with heat conduction copper sheet 9, the one end of heat conduction copper sheet 9 and the terminal surface contact of semiconductor refrigeration piece have further improved the heat exchange efficiency of upper die base 1 and die holder 3 with the semiconductor refrigeration piece to further improve the efficiency of heat exchange between semiconductor refrigeration piece and rivers passageway 6, make the semiconductor refrigeration piece better to the temperature regulation effect of mould.

The utility model discloses a theory of operation: the electrifying direction of the semiconductor chilling plate is adjusted through the current direction control circuit, so that the end face of the semiconductor chilling plate, which is contacted with the upper die 2 or the lower die 4, is a heating end, the plastic melt entering the upper die 2 and the lower die 4 is properly heated after entering the main flow passage and the sub flow passage, so as to ensure the melting state of the plastic melt, and the end face of the semiconductor chilling plate, which is contacted with the upper die base 1 or the lower die base 3, is a chilling end, so that the temperature of the upper die base 1 or the lower die base 3 can be reduced, in order to prevent the upper die base 1 and the lower die base 3 from taking away the temperature on the upper die 2 and the lower die 4 and influencing the state of the plastic melt, a water pump between a water outlet valve 8 and a hot water tank is started, so that the hot water in the hot water tank can flow into a cold water tank from a water flow passage 6, and the water exchanges heat with the upper die base 1 and the lower die base 3 in the flowing process, the temperature of the upper die holder 1 and the lower die holder 3 is raised, and the plastic melt in the upper die 2 and the lower die 4 is ensured to be kept in a molten state.

After the plastic melt enters the cavity, the electrifying direction of the semiconductor refrigerating sheet is adjusted through the current direction control circuit, the end face of the semiconductor refrigerating sheet, which is in contact with the upper die 2 or the lower die 4, is a refrigerating end, so that the semiconductor refrigerating sheet starts to refrigerate the upper die 2 and the lower die 4, the plastic melt in the cavity is cooled and formed, the end face of the semiconductor refrigerating sheet, which is in contact with the upper die base 1 or the lower die base 3, is a heating end, so that the temperature of the upper die base 1 or the lower die base 3 can rise, in order to prevent the upper die base 1 and the lower die base 3 from being in contact with the upper die 2 and the lower die 4 to generate heat exchange, so that the cooling efficiency of the plastic melt is reduced, the water pump between the water inlet valve 7 and the cold water tank is started, cold water in the cold water tank can flow into the hot water tank from the water channel 6, and the water exchanges heat with the upper die base 1 and the lower die base 3 in the flowing process, make the temperature of upper die base 1 and die holder 3 descend, guarantee that the plastics fuse-element in mould 2 and the lower mould 4 can cool off fast, the utility model discloses well heating refrigeration adjusting device 5 utilizes the semiconductor refrigeration piece to carry out cold and hot switching, has improved injection moulding's work efficiency on the one hand, and on the other hand has improved product processingquality, and simple structure, and is with low costs, and the water circulation in cold water tank and the hot-water tank is used simultaneously, neither wastes water resource, does not waste heat energy again, and is energy-concerving and environment-protective, can also improve the temperature regulation effect of semiconductor refrigeration piece to the mould simultaneously.

Claims (5)

1. The utility model provides a high-efficient nose is with first injection mold, from last to including consecutive upper die base (1), last mould (2), die holder (3) and lower mould (4) down, go up mould (2) and inlay the lower surface of locating upper die base (1), lower mould (4) inlay the upper surface of establishing with die holder (3), the lower surface of upper die base (1) and last mould (2) all is on the coplanar, the upper surface of die holder (3) and lower mould (4) all is on the coplanar, its characterized in that: heating and refrigerating adjusting devices (5) are arranged between the upper die base (1) and the upper die (2) and between the lower die base (3) and the lower die (4), a plurality of water flow channels (6) are arranged at positions, opposite to the heating and refrigerating adjusting devices (5), in the upper die base (1) and the lower die base (3), water inlets of the water flow channels (6) are communicated with a water inlet valve (7), water outlets of the water flow channels (6) are communicated with a water outlet valve (8), the water inlet valve (7) is connected with a cold water tank, and the water outlet valve (8) is connected with a hot water tank.

2. The high efficiency nasal head injection mold of claim 1, wherein: the heating and refrigerating adjusting device (5) is a semiconductor refrigerating sheet, two end faces of the semiconductor refrigerating sheet between the upper die base (1) and the upper die (2) are tightly attached to the upper die base (1) and the upper die (2) respectively, and two end faces of the semiconductor refrigerating sheet between the lower die base (3) and the lower die (4) are tightly attached to the lower die base (3) and the lower die (4) respectively.

3. The high efficiency nasal head injection mold of claim 1, wherein: and water pumps are arranged between the water inlet valve (7) and the cold water tank and between the water outlet valve (8) and the hot water tank.

4. The high efficiency nasal head injection mold of claim 2, wherein: the semiconductor refrigerating sheet is connected with the current direction control circuit.

5. The high efficiency nasal head injection mold of claim 1, wherein: the water flow channels (6) are parallel to each other, heat conduction copper sheets (9) are embedded between every two adjacent water flow channels (6), and one ends of the heat conduction copper sheets (9) are in contact with the end faces of the semiconductor refrigeration sheets.

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