CN214799876U

CN214799876U - Novel packaging structure of silicon microphone

Info

Publication number: CN214799876U
Application number: CN202120799304.4U
Authority: CN
Inventors: 艾育林
Original assignee: Jiangxi Wannianxin Microelectronics Co Ltd
Current assignee: Jiangxi Wannianxin Microelectronics Co Ltd
Priority date: 2021-04-19
Filing date: 2021-04-19
Publication date: 2021-11-19
Anticipated expiration: 2031-04-19

Abstract

The utility model belongs to the technical field of the silicon microphone technique and specifically relates to a novel packaging structure of silicon microphone, including end box, the top of end box is provided with the connection lid, the top of connecting the lid is provided with sealing mechanism, the corresponding IC chip and MEMS chip that are provided with in inside of end box, the top of end box is provided with connecting portion, the corresponding setting of the internal structure size of connection lid and the external structure size of connecting portion, sealing mechanism includes first sealed lid, second sealed lid, first sound hole, second sound hole and spacing groove, the corresponding first sealed lid that is provided with in top of connection lid, first sound hole has been seted up to the upper surface of first sealed lid correspondingly, the spacing groove has been seted up correspondingly to the corner of first sealed lid upper surface, compares with the packaging structure of current silicon microphone, the utility model discloses a design can improve the whole leakproofness of packaging structure of silicon microphone, Protection and practicality.

Description

Novel packaging structure of silicon microphone

Technical Field

The utility model relates to a silicon microphone technical field specifically is a novel packaging structure of silicon microphone.

Background

Along with the general promotion of current living condition, the application of silicon microphone in the life is comparatively general, wherein the silicon microphone can use packaging structure to seal it when using and protect, current packaging structure design structure is too simple, the protecting effect is relatively poor when sealing and protecting the silicon microphone, and the leakproofness is relatively poor, inside is stained with a large amount of dusts easily in long-term use, influence the normal use of silicon microphone, greatly reduced silicon microphone's whole life, whole leakproofness, protectiveness and practicality are higher, consequently, to the packaging structure's of current silica gel microphone improvement, design a novel silicon microphone's packaging structure in order to change above-mentioned technical defect, improve whole silicon microphone's packaging structure's practicality, seem to be particularly important.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a novel packaging structure of silicon microphone to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a novel packaging structure of silicon microphone, includes end box, the top of end box is provided with connects the lid, the top of connecting the lid is provided with sealing mechanism, sealing mechanism includes first sealed lid, the sealed lid of second, first sound hole, second sound hole and spacing groove, the corresponding first sealed lid that is provided with in top of connecting the lid, first sound hole has been seted up to the upper surface correspondence of first sealed lid, the inside homogeneous phase correspondence in first sound hole and second sound hole is provided with the dust screen, just first sound hole and second sound hole are the structural design that staggers each other, first sound hole is the state design that communicates each other with the second sound hole

As the utility model discloses preferred scheme, the inside of end box is corresponding to be provided with IC chip and MEMS chip, the top of end box is provided with connecting portion, the corresponding setting of the inner structure size of connecting the lid and the outer structure size of connecting portion.

As the utility model discloses preferred scheme, the corresponding spacing groove of having seted up of corner of first sealed upper surface, the top of first sealed lid is provided with the sealed lid of second, the second sound hole has been seted up to the upper surface of the sealed lid of second.

As the utility model discloses preferred scheme, the position department of the bottom of the sealed lid of second and corresponding spacing groove is provided with the stopper, the external structure size of stopper and the corresponding setting of the internal structure size of spacing groove, first sealed lid is integral type structural design with connecting the lid.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses in, through sealing mechanism's design, the structural design that staggers in first sound hole and second sound hole, can effectually avoid external dust to enter into seal structure's inside, the inside in first sound hole and second sound hole all is provided with the dust screen simultaneously, greatly increased sealing mechanism's dust proofness for the operational environment of inside IC chip and MEMS chip is better, and whole leakproofness, protectiveness and practicality are higher.

Drawings

FIG. 1 is a schematic view of the overall three-dimensional structure of the present invention;

fig. 2 is a schematic perspective view of a first sealing cover of the present invention;

fig. 3 is a schematic view of the internal three-dimensional structure of the bottom case of the present invention.

In the figure: 1-bottom box, 101-IC chip, 102-MEMS chip, 103-connecting part, 2-connecting cover, 3-sealing mechanism, 301-first sealing cover, 302-second sealing cover, 303-first sound hole, 304-second sound hole and 305-limiting groove.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the scope of the present invention based on the embodiments of the present invention.

In order to facilitate understanding of the invention, the invention will be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the invention are shown, but which can be embodied in many different forms and are not limited to the embodiments described herein, but rather are provided for the purpose of making the disclosure more thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present, that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present, and that the terms "vertical", "horizontal", "left", "right" and the like are used herein for descriptive purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, and the terms used herein in the specification of the present invention are for the purpose of describing particular embodiments only and are not intended to limit the present invention, and the term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-3, the present invention provides a technical solution:

in an embodiment, referring to fig. 1, 2 and 3, a novel packaging structure of a silicon microphone includes a bottom case 1, an IC chip 101 and an MEMS chip 102 are correspondingly disposed inside the bottom case 1, a connecting portion 103 is disposed on the top of the bottom case 1, an internal structure size of a connecting cover 2 and an external structure size of the connecting portion 103 are correspondingly disposed, a connecting cover 2 is disposed on the top of the bottom case 1, and a sealing mechanism 3 is disposed on the top of the connecting cover 2.

In an embodiment, referring to fig. 1 and 2, the sealing mechanism 3 includes a first sealing cover 301, a second sealing cover 302, a first sound hole 303, a second sound hole 304 and a limiting groove 305, the top of the connecting cover 2 is correspondingly provided with the first sealing cover 301, the upper surface of the first sealing cover 301 is correspondingly provided with the first sound hole 303, the corner of the upper surface of the first sealing cover 301 is correspondingly provided with the limiting groove 305, the top of the first sealing cover 301 is provided with the second sealing cover 302, the upper surface of the second sealing cover 302 is provided with the second sound hole 304, the bottom of the second sealing cover 302 and the position corresponding to the limiting groove 305 are provided with a limiting block, the external structure size of the limiting block is correspondingly arranged with the internal structure size of the limiting groove 305, the first sealing cover 301 and the connecting cover 2 are designed in an integrated structure, the interior of the first sound hole 303 and the second sound hole 304 are correspondingly provided with a dust screen, and first sound hole 303 and second sound hole 304 are the structural design that staggers each other, first sound hole 303 is the state design that communicates each other with second sound hole 304, design through sealing mechanism 3, the structural design that staggers in first sound hole 303 and second sound hole 304, can effectually avoid external dust to enter into seal structure's inside, the inside of first sound hole 303 and second sound hole 304 all is provided with the dust screen simultaneously, greatly increased sealing mechanism 3's dirt resistance, make the operational environment of inside IC chip and MEMS chip better, overall leakproofness, protectiveness and practicality are higher.

The utility model discloses work flow: when using the packaging structure of the novel silicon microphone, install the end box 1 in assigned position department can, during the use, utilize first sound hole 303 and second sound hole 304 to use the silicon microphone, the inside that first sound hole 303 and second sound hole 304 stagger the design and effectually prevent external dust to enter into seal structure, protect IC chip 101 and MEMS chip 102's normal use, whole operation flow is simple convenient, through the design of sealing mechanism 3, the structural design that first sound hole 303 and second sound hole 304 stagger, can effectually avoid external dust to enter into seal structure's inside, the inside of first sound hole 303 and second sound hole 304 all is provided with the dust screen simultaneously, greatly increased sealing mechanism 3's dust proofness, make the operational environment of inside IC chip and MEMS chip better, compare with the packaging structure of current silicon microphone, the utility model discloses a design can improve the whole leakproofness of the packaging structure of silicon microphone, Protection and practicality.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A novel packaging structure of a silicon microphone comprises a bottom case (1), and is characterized in that: the top of end box (1) is provided with connects lid (2), the top of connecting lid (2) is provided with sealing mechanism (3), sealing mechanism (3) are including first sealed lid (301), the sealed lid of second (302), first sound hole (303), second sound hole (304) and spacing groove (305), the corresponding first sealed lid (301) that is provided with in top of connecting lid (2), first sound hole (303) have been seted up to the upper surface of first sealed lid (301) is corresponding, the inside homogeneous phase correspondence of first sound hole (303) and second sound hole (304) is provided with the dust screen, just first sound hole (303) and second sound hole (304) are the structural design that staggers each other, first sound hole (303) are the state design that communicates each other with second sound hole (304).

2. The packaging structure of a novel silicon microphone as claimed in claim 1, wherein: the bottom box comprises a bottom box body (1), wherein an IC chip (101) and an MEMS chip (102) are correspondingly arranged in the bottom box body (1), a connecting portion (103) is arranged at the top of the bottom box body (1), and the size of the inner structure of a connecting cover (2) corresponds to the size of the outer structure of the connecting portion (103).

3. The packaging structure of a novel silicon microphone as claimed in claim 1, wherein: a limiting groove (305) is correspondingly formed in a corner of the upper surface of the first sealing cover (301), a second sealing cover (302) is arranged at the top of the first sealing cover (301), and a second sound hole (304) is formed in the upper surface of the second sealing cover (302).

4. The packaging structure of a novel silicon microphone as claimed in claim 1, wherein: the bottom of the second sealing cover (302) and the position of the corresponding limiting groove (305) are provided with limiting blocks, the external structure size of each limiting block corresponds to the internal structure size of the corresponding limiting groove (305), and the first sealing cover (301) and the connecting cover (2) are designed to be of an integrated structure.