CN214797386U - Ultra-low power semiconductor power device - Google Patents

Abstract

The utility model relates to a semiconductor power device technical field just discloses an ultra-low power semiconductor power device, including bottom plate and device body, the fixed rectangle frame that is provided with in upper surface left side of bottom plate, the fixed left side wall that sets up in the rectangle frame of device body, the fixed water tank that is provided with in upper surface right side of bottom plate, the fixed water pump that is provided with in upper end of water tank, the right-hand member of water pump runs through to the inside and the fixedly connected with high pressure nozzle of water tank through first pipe, the left end of water pump passes through second pipe fixedly connected with heat absorption pipe, the lower extreme of heat absorption pipe is linked together through the inside that the left side wall that the third pipe runs through the water tank and water tank, the fixed actuating mechanism that is provided with in inside of water tank, actuating mechanism is connected with heat dissipation mechanism through the drive mechanism transmission. The utility model discloses a to the heat dissipation of semiconductor power device, reduced its power consumption.

Description

Ultra-low power semiconductor power device

Technical Field

The utility model relates to a semiconductor power device technical field especially relates to an ultra-low power semiconductor power device.

Background

Semiconductor power devices, also referred to previously as power electronics devices, are simply power handling semiconductor devices having the ability to handle high voltages and currents, early power semiconductor devices including high power diodes and thyristors, and so on, and are used primarily in industrial and power systems.

The main body of the conventional semiconductor power device is usually designed independently and has no temperature reduction device, so that the problem that the temperature is slowly dissipated in the use process, the normal use of the semiconductor power device is influenced, and the power consumption of the semiconductor power device is increased is caused.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving among the prior art semiconductor power device independent design, in case the temperature is higher, influence its normal use and increased its power consumption's problem, and the ultralow power semiconductor power device who proposes.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides an ultra-low power semiconductor power device, includes bottom plate and device body, the fixed rectangle frame that is provided with in upper surface left side of bottom plate, the device body is fixed to be set up in the left side wall of rectangle frame, the fixed water tank that is provided with in upper surface right side of bottom plate, the fixed water pump that is provided with in upper end of water tank, the right-hand member of water pump runs through to the inside of water tank and fixedly connected with high pressure nozzle through first pipe, the left end of water pump is through second pipe fixedly connected with heat absorption pipe, the lower extreme of heat absorption pipe runs through the left side wall of water tank and the inside of water tank is linked together through the third pipe, the inside of water tank is fixed and is provided with actuating mechanism, actuating mechanism is connected with heat dissipation mechanism through the drive mechanism transmission.

Preferably, the driving mechanism comprises a first rotating rod, an impeller and a first bevel gear, the first rotating rod is arranged in the water tank, rod walls at two ends of the first rotating rod are respectively rotatably connected with the left inner wall and the right inner wall of the water tank through a first bearing, and the impeller is fixedly sleeved with the rod wall of the first rotating rod and is arranged right below the high-pressure nozzle.

Preferably, drive mechanism includes mounting panel, second bull stick and two second bevel gears, the mounting panel is fixed to be set up in the inside left side wall of water tank, the middle part pole wall of second bull stick rotates through the inner wall of second bearing and mounting panel and cup joints, two second bevel gear is fixed respectively to be set up in the both ends of second bull stick, and the upper end meshing between second bevel gear and the first bevel gear is connected.

Preferably, the heat dissipation mechanism includes third bull stick and flabellum, the flabellum is fixed to be set up in the left end of third bull stick, the right-hand member pole wall of third bull stick is connected with the left side wall rotation of water tank through sealed bearing, the right-hand member of third bull stick runs through to the inside of water tank, and is connected through the meshing between third bevel gear and the second bevel gear of downside.

Preferably, the water tank adopts a semiconductor refrigeration water tank.

Preferably, the heat absorption pipe is a copper pipe.

Compared with the prior art, the utility model provides an ultra-low power semiconductor power device possesses following beneficial effect:

1. this ultra-low power semiconductor power device through setting up the high pressure nozzle in first pipe lower extreme, can drive the impeller rotation when the water pump is leading-in with water to realize that actuating mechanism passes through drive mechanism and drives heat dissipation mechanism work.

2. This ultra-low power semiconductor power device through setting up the semiconductor refrigeration water tank on bottom plate upper surface right side, can realize the refrigeration to the inside water of water tank, is convenient for absorb the heat that the device body produced when water passes through the heat-absorbing pipe.

The part that does not relate to in the device all is the same with prior art or can adopt prior art to realize, the utility model discloses a heat dissipation to semiconductor power device has reduced its power consumption.

Drawings

Fig. 1 is a schematic structural diagram of an ultra-low power semiconductor power device according to the present invention;

fig. 2 is an enlarged view of a portion a of fig. 1.

In the figure: the device comprises a base plate 1, a device body 2, a rectangular frame 3, a water tank 4, a water pump 5, a first guide pipe 6, a high-pressure nozzle 7, a second guide pipe 8, a heat absorption pipe 9, a third guide pipe 10, a first rotating rod 11, an impeller 12, a first bevel gear 13, a mounting plate 14, a second rotating rod 15, a second bevel gear 16, a third rotating rod 17, fan blades 18 and a third bevel gear 19.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Referring to fig. 1-2, an ultra-low power semiconductor power device, including bottom plate 1 and device body 2, the fixed rectangle frame 3 that is provided with in upper surface left side of bottom plate 1, device body 2 is fixed to be set up in the left side wall of rectangle frame 3, the fixed water tank 4 that is provided with in upper surface right side of bottom plate 1, the fixed water pump 5 that is provided with in upper end of water tank 4, the right-hand member of water pump 5 runs through to the inside and the fixedly connected with high pressure nozzle 7 of water tank 4 through first pipe 6, the left end of water pump 5 passes through 8 fixedly connected with heat absorption pipe 9 of second pipe, the lower extreme of heat absorption pipe 9 runs through the left side wall of water tank 4 through third pipe 10 and the inside of water tank 4 is linked together, the fixed actuating mechanism that is provided with in inside of water tank 4, actuating mechanism is connected with heat dissipation mechanism through the drive mechanism transmission.

The driving mechanism comprises a first rotating rod 11, an impeller 12 and a first bevel gear 13, the first rotating rod 11 is arranged inside the water tank 4, rod walls at two ends are respectively rotatably connected with the left inner wall and the right inner wall of the water tank 4 through a first bearing, the impeller 12 is fixedly sleeved with the rod wall of the first rotating rod 11 and is arranged under the high-pressure spray head 7, and the rotation of the impeller 12 is conveniently realized when water is discharged.

The transmission mechanism comprises a mounting plate 14, a second rotating rod 15 and two second bevel gears 16, the mounting plate 14 is fixedly arranged on the inner left side wall of the water tank 4, the middle rod wall of the second rotating rod 15 is rotatably sleeved with the inner wall of the mounting plate 14 through a second bearing, the two second bevel gears 16 are respectively and fixedly arranged at two ends of the second rotating rod 15, the second bevel gears 16 at the upper ends are meshed with the first bevel gears 13, and the second rotating rod 15 is driven to rotate when the first rotating rod 11 rotates.

The heat dissipation mechanism comprises a third rotating rod 17 and fan blades 18, the fan blades 18 are fixedly arranged at the left end of the third rotating rod 17, the rod wall of the right end of the third rotating rod 17 is rotatably connected with the left side wall of the water tank 4 through a sealing bearing, the right end of the third rotating rod 17 penetrates through the inside of the water tank 4 and is connected with a second bevel gear 16 on the lower side through a third bevel gear 19 in a meshed mode, and therefore the third rotating rod 17 is driven to rotate when the second rotating rod 15 rotates.

The water tank 4 adopts a semiconductor refrigeration water tank, so that heat can be better absorbed during water circulation.

The heat absorption pipe 9 is made of a copper pipe, so that heat generated by the device can be absorbed conveniently.

The utility model discloses in, during the use, start water pump 5, water pump 5 is through the inside water suction of third pipe 10 with water tank 4, and through the inside that second pipe 8 and first pipe 6 got into water tank 4 behind the heat absorption pipe 9 absorbed heat, drive impeller 12 when water is spout from high pressure nozzle 7 and rotate, impeller 12 drives first bull stick 11 and rotates, first bull stick 11 is connected through the meshing between the second bevel gear 16 of first bevel gear 13 and upside and is driven second bull stick 15 and rotate, second bull stick 15 is connected through the meshing between second bevel gear 16 of downside and the third bevel gear 19 and is driven third bull stick 17 and rotate, third bull stick 17 drives flabellum 18 and rotates, realize the heat dissipation to device body 2, the effectual power consumption who reduces device body 2.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (6)

1. An ultra-low power semiconductor power device comprises a bottom plate (1) and a device body (2), and is characterized in that a rectangular frame (3) is fixedly arranged on the left side of the upper surface of the bottom plate (1), the device body (2) is fixedly arranged on the left side wall of the rectangular frame (3), a water tank (4) is fixedly arranged on the right side of the upper surface of the bottom plate (1), a water pump (5) is fixedly arranged at the upper end of the water tank (4), the right end of the water pump (5) penetrates into the water tank (4) through a first conduit (6) and is fixedly connected with a high-pressure spray head (7), the left end of the water pump (5) is fixedly connected with a heat absorption pipe (9) through a second conduit (8), the lower end of the heat absorption pipe (9) penetrates through the left side wall of the water tank (4) through a third conduit (10) and is communicated with the inside of the water tank (4), and a driving mechanism is fixedly arranged inside the water tank (4), the driving mechanism is connected with a heat dissipation mechanism through a transmission mechanism in a transmission manner.

2. The ultra-low power semiconductor power device according to claim 1, wherein the driving mechanism comprises a first rotating rod (11), an impeller (12) and a first bevel gear (13), the first rotating rod (11) is arranged inside the water tank (4), rod walls at two ends are respectively and rotationally connected with the left and right inner walls of the water tank (4) through first bearings, and the impeller (12) is fixedly sleeved with the rod wall of the first rotating rod (11) and is arranged right below the high-pressure nozzle (7).

3. An ultra-low power semiconductor power device according to claim 1, wherein the transmission mechanism comprises a mounting plate (14), a second rotating rod (15) and two second bevel gears (16), the mounting plate (14) is fixedly arranged on the left side wall of the inside of the water tank (4), the middle rod wall of the second rotating rod (15) is rotatably sleeved with the inner wall of the mounting plate (14) through a second bearing, the two second bevel gears (16) are respectively and fixedly arranged at two ends of the second rotating rod (15), and the second bevel gears (16) at the upper ends are in meshed connection with the first bevel gears (13).

4. The ultra-low power semiconductor power device according to claim 1, wherein the heat dissipation mechanism comprises a third rotating rod (17) and fan blades (18), the fan blades (18) are fixedly arranged at the left end of the third rotating rod (17), the right end rod wall of the third rotating rod (17) is rotatably connected with the left side wall of the water tank (4) through a sealed bearing, and the right end of the third rotating rod (17) penetrates into the water tank (4) and is in meshed connection with a second bevel gear (16) on the lower side through a third bevel gear (19).

5. An ultra-low power semiconductor power device according to claim 1, wherein the water tank (4) is a semiconductor refrigeration water tank.

6. An ultra-low power semiconductor power device according to claim 1, characterized in that the heat absorbing tube (9) is a copper tube.

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