CN214794403U - Automatic optical detection device and circuit board detection system - Google Patents
Automatic optical detection device and circuit board detection system Download PDFInfo
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- CN214794403U CN214794403U CN202023003229.0U CN202023003229U CN214794403U CN 214794403 U CN214794403 U CN 214794403U CN 202023003229 U CN202023003229 U CN 202023003229U CN 214794403 U CN214794403 U CN 214794403U
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Abstract
The utility model discloses an automatic optical detection device and circuit board detecting system. An automated optical inspection apparatus comprising: the transmission device is used for bearing the element to be detected and transmitting the element to be detected to a specified position; a first light source for providing first detection light which propagates to a surface of the element to be detected and generates first information light; a second light source for providing second detection light which penetrates the element to be detected and generates second information light; and the imaging device is used for generating a first detection image according to the first information light and/or generating a second detection image according to the second information light. The imaging device is arranged above the transmission device, and the second light source is arranged below the transmission device. The utility model provides an automatic optical detection device can treat detecting element's upper and lower surface and carry out short-term test to improve the detection efficiency of circuit board.
Description
Technical Field
The application relates to the field of element detection, in particular to an automatic optical detection device and a circuit board detection system.
Background
In the related art, the LED chip is provided on the upper surface of the circuit board or the control chip is provided on the lower surface of the circuit board by performing the second reflow soldering on the circuit board. In order to detect the welding condition of the LED chip and the control chip, the circuit board is generally detected by different detection devices.
However, the multiple devices are required to work in a time-sharing manner through the detection of different detection devices, so that the space utilization rate of the production line is low, and the production efficiency is low.
SUMMERY OF THE UTILITY MODEL
The present application is directed to solving at least one of the problems in the prior art. Therefore, the application provides an automatic optical detection device and a circuit board detection system, which can perform rapid time-sharing detection on the upper surface and the lower surface of an element to be detected, so that the detection efficiency of a circuit board is improved.
An automatic optical inspection apparatus according to an embodiment of a first aspect of the present application includes: the transmission device is used for bearing the element to be detected and transmitting the element to be detected to a specified position; a first light source for providing first detection light which propagates to a surface of the element to be detected and generates first information light; a second light source for providing second detection light which penetrates the element to be detected and generates second information light; and the imaging device is used for generating a first detection image according to the first information light and/or generating a second detection image according to the second information light. The imaging device is arranged above the transmission device, and the second light source is arranged below the transmission device.
According to the utility model discloses automatic optical detection device has following beneficial effect at least: the upper surface and the lower surface of the element to be detected can be rapidly detected, so that the detection efficiency of the circuit board is improved.
According to some embodiments of the present invention, the conveying device comprises a conveyor belt body, the automatic optical inspection device further comprises a light source shielding device, the light source shielding device is disposed above the conveyor belt body;
the conveyer belt body is used for bearing an element to be detected, and the light source shielding device is used for absorbing the second detection light.
According to some embodiments of the invention, the transport device comprises a first guide rail, a second guide rail arranged opposite to the first guide rail;
and the light source shielding device is arranged above the transmission device and is used for absorbing the second detection light.
According to some embodiments of the invention, the transport device comprises a first guide rail, a second guide rail arranged opposite to the first guide rail;
and the light source shielding device is arranged above the transmission device and is used for absorbing the second detection light.
According to some embodiments of the invention, the first light source is arranged on the same side as the imaging device, the imaging device comprising a first camera device;
the first light source and the first camera device form an included angle, the first detection light is reflected on the surface of the element to be detected and generates first information light, and the imaging device converts the first information light into a first information electric signal.
According to some embodiments of the invention, the second light source is an X-ray generator for generating a second detection light, the second detection light being an X-ray.
According to some embodiments of the present invention, the light source shielding device is a lead plate for absorbing the second detection light, and the light source shielding device and the transmission device define a cavity, and the second camera device is disposed in the cavity;
the image pickup device includes a first image pickup device for receiving the first information light and a second image pickup device for receiving the second information light.
According to some embodiments of the present invention, the first camera device is a CCD imaging camera.
According to some embodiments of the invention, the conveyor belt body is a transparent belt body.
According to some embodiments of the invention, the first detection light has a wavelength in the range of 600nm to 800 nm.
According to the utility model discloses a circuit board detecting system of second aspect embodiment, including the automatic light detection device of any one above-mentioned embodiment.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention will be further described with reference to the following drawings and examples, in which:
fig. 1 is a schematic structural diagram of an automatic optical inspection device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an automatic optical inspection device according to an embodiment of the present invention.
Description of the drawings: 100. an element to be detected; 200. a first light source; 300. an imaging device; 310. a first image pickup device; 320. a second image pickup device; 400. a light source shielding device; 500. a transmission device; 600. a second light source.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means is one or more, a plurality of means is two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
In the description of the present invention, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
In the related art, the LED chip is provided on the upper surface of the circuit board or the control chip is provided on the lower surface of the circuit board by performing the second reflow soldering on the circuit board. In order to detect the welding condition of the LED chip and the control chip, at least two optical detection procedures are required to detect the circuit board by different detection equipment.
The circuit board is detected through two different optical detection procedures, so that the production procedures of the circuit board are increased, and the detection efficiency of the circuit board is reduced. Based on the above problem, in order to improve the detection efficiency of the circuit board, the application provides an automatic optical detection device and a circuit board detection system, which can perform rapid detection on the circuit board.
The upper surface of the circuit board to be detected is provided with an LED chip, the lower surface of the circuit board to be detected is provided with a control chip for controlling the LED chip to work, the circuit board to be detected is subjected to time-sharing detection through an automatic optical detection device, and an upper surface image and a lower surface image of the circuit board to be detected are respectively acquired. The processor carries out image processing on the upper surface image and the lower surface image so as to judge whether the LED chip is welded at the correct position or not and control whether the chip has the condition of insufficient solder or not.
Referring to fig. 1-2, in some embodiments, an automatic optical inspection apparatus includes: the conveying device 500 is used for carrying the element 100 to be detected and conveying the element 100 to be detected to a specified position; a first light source 200 for providing first detection light which propagates to the surface of the element 100 to be detected and generates first information light; a second light source 600 for providing second detection light which penetrates the element to be detected 100 and generates second information light; the imaging device 300 is used for generating a first detection image according to the first information light and/or generating a second detection image according to the second information light. Wherein, the imaging device 300 is disposed above the transferring device 500, and the second light source 600 is disposed below the transferring device 500.
The component 100 to be detected is conveyed to a designated position by the conveying device 500 to acquire a first detection image of the upper surface of the component 100 to be detected and a second detection image of the lower surface of the component 100 to be detected. The designated position comprises a first detection station and a second detection station, the first detection station is used for imaging the upper surface of the workpiece to be detected, and the second detection station is used for imaging the lower surface of the workpiece to be detected.
Specifically, when the element 100 to be detected is located at the first detection station, the first light source 200 generates first detection light, the first detection light is transmitted to the surface of the element 100 to be detected and reflected, and first information light is generated, and the imaging device 300 receives the first information light and converts an optical signal into an electrical signal (first information electrical signal) to form a first detection image; when the element to be detected 100 is located at the second detection, the second light source 600 generates second detection light, the second detection light penetrates the element to be detected 100 and generates first information light, and the imaging device 300 receives the second information light and converts the optical signal into an electrical signal (second information electrical signal) to form a second detection image.
When the first detection light is reflected on the surface of the element 100 to be detected, the absorption coefficient or reflectivity of the surface of the element 100 to be detected to the first detection light is different, so that the first information light generated by reflection carries the characteristic information of the surface of the element 100 to be detected. The imaging device 300 receives the first information light and converts the light signal into an electrical signal to form a first detection image, and determines whether the component position on the surface of the component 100 to be detected is correctly soldered or not according to the first detection image.
When the second detection light is transmitted in the element 100 to be detected, the absorption coefficients of the surface or the interior of the element 100 to be detected to the second detection light are different, so that the second information light generated after projection carries the surface characteristic information of the element 100 to be detected. The imaging device 300 receives the second information light and converts the light signal into an electrical signal to form a second detection image, and determines whether the component to be detected 100 has a free solder in the surface of the component.
It can be understood that the conveying device 500 conveys the component 100 to be detected to the first detection station for top surface imaging detection, and when the top surface imaging detection is completed, the conveying device 500 conveys the component 100 to be detected to the second detection station for bottom surface imaging detection, so as to detect the top surface and the bottom surface of the component 100 to be detected in a time-sharing manner.
In some embodiments, the processor stores a reference image of the detection result of the element 100 to be detected, and the processor performs comparison analysis on the reference image, the first detection image and the second detection image to obtain a comparison result, and determines whether the LED chip is soldered at a correct position or not and controls whether the chip has a cold solder condition or not according to the comparison result.
In some embodiments, the transporting device 500 comprises a conveyor belt, the automatic optical inspection device further comprises a light source shielding device 400, and the light source shielding device 400 is disposed above the conveyor belt; the conveyor belt is used for carrying the element 100 to be detected, and the light source shielding device 400 is used for absorbing the second detection light. When the upper surface of the element to be detected 100 is detected, the light source shielding device 400 and the second light source 600 are disposed opposite to each other to shield the second detection light, so as to prevent the second detection light from scattering to cause human body injury.
Specifically, since the second detection light has high penetration, when the upper surface of the element to be detected 100 is detected, the second detection light is shielded or absorbed by the light source shielding device 400, so that the second detection light is prevented from scattering to the detection environment and irradiating the body of the detection person.
In some embodiments, the automatic optical inspection device further comprises a first alignment control module and a second alignment control module. Before the automatic optical detection device detects the upper and lower surfaces of the element to be detected, the first alignment control module and the second alignment control module pre-align the element to be detected 100 respectively and read the pre-stored serial number of the circuit board. And the processor generates a corresponding detection result according to the pre-stored serial number, the first detection image and the second detection image.
In some embodiments, the transport device 500 includes a first rail, a second rail disposed opposite the first rail; the light source shielding device 400 is disposed above the transmission device 500 for absorbing the second detection light.
The first guide rail and the second guide rail are L-shaped guide rails, the first guide rail and the second guide rail are oppositely arranged to form a guide rail group, and the bent parts of the first guide rail and the second guide rail form a limiting assembly. The element 100 to be detected is limited by the limiting assembly in the guide rail set, and the position of the guide rail set is adjusted by the motor to adjust the position of the element 100 to be detected, so that the element 100 to be detected is transmitted to the first detection station and the second detection station.
In some embodiments, the first light source 200 is disposed on the same side as the imaging device 300, and the imaging device 300 includes a first camera 310; the first light source 200 and the first camera 310 are disposed at an included angle, the first detection light is reflected on the surface of the element 100 to be detected to generate first information light, and the imaging device 300 converts the first information light into a first information electrical signal.
The first light source 200 and the imaging device 300 are disposed on the same side, and the receiving end of the first camera 310 and the emitting end of the first light source 200 are disposed at an included angle. The surface of the component 100 to be detected is detected by laser triangulation to obtain the actual placement position of the sub-components on the surface of the component 100 to be detected. And analyzing the position error of the sub-element according to the pre-stored detection result, the reference image and the actual setting position of the sub-element to determine whether the setting position of the sub-element on the surface of the element to be detected 100 is within the allowable range.
For example, the element 100 to be detected is a circuit board, and an LED chip is disposed on an upper surface of the circuit board. The first light source 200 and the imaging device 300 are used for detecting the circuit board to confirm whether the LED chip has rotation, deviation, die bonding omission, solder paste adhesion and the like.
In some embodiments, the second light source 600 is an X-ray generator for generating second detection light, which is X-ray. The second information light is received by the imaging device 300 to obtain a second detection image by using the X-ray as the second detection light and performing transmission processing on the element to be detected 100 by the second detection light. And observing the welding condition of the sub-elements on the lower surface of the element to be detected 100 according to the second detection image.
For example, if X-rays are absorbed by the element 100 to be detected and there is a cold joint, or a blister at the welded portion of the sub-element, the amount of X-rays absorbed by the welded portion is reduced, which results in a reduction in the gradation of the corresponding position of the second detection image.
Specifically, if the bonding position of the control chip has a cold joint or a blank joint, the color of the corresponding region in the second detection image is grayish.
In some embodiments, the light source shielding device 400 is a lead plate for absorbing the second detection light, and the light source shielding device 400 and the transmission device define a cavity; the image pickup device includes a first image pickup device 310 and a second image pickup device 320, the first image pickup device 310 is configured to receive the first information light, and the second image pickup device 320 is configured to receive the second information light. Wherein the second camera 320 is disposed in the cavity
Because lead has higher atomic number, density, isolate or absorb X-ray through the lead plate to avoid X-ray scattering to in the detection environment, thereby protect the detection personnel.
The light source shielding device 400 may be limited by a limiting component in the guide rail set, and the position of the light source shielding device 400 may be adjusted by the guide rail set.
In some embodiments, the first camera 310 is a CCD imaging camera. The first information light and the second information light are subjected to photoelectric conversion through a CCD imaging camera to form a first detection image and a second detection image. And storing the first detection image and the second detection image into a processor, and calling the first detection image and the second detection image by the processor to generate and judge whether the element 100 to be detected is qualified.
In some embodiments, the conveyor belt is a transparent belt. By arranging the conveyor belt body as a transparent belt body, the second detection light is prevented from being absorbed by the conveyor belt while the element 100 to be detected is borne, so that the detection precision is reduced.
In some embodiments, the first detection light has a wavelength in the range of 600nm to 800 nm. The upper surface of the element to be inspected 100 is irradiated with specific detection light in the visible light band to obtain a first detection image. The first inspection image is used to characterize the firmware state of the sub-elements of the top surface of the element 100 to be inspected.
In some embodiments, the present application further provides a circuit board inspection system comprising the automatic light inspection device of any of the above embodiments. The circuit board detection system can carry out rapid time-sharing detection on the upper surface and the lower surface of the element to be detected by controlling the automatic light detection device, so that the detection efficiency of the circuit board is improved.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art. Furthermore, the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.
Claims (10)
1. An automated optical inspection apparatus, comprising:
the transmission device is used for bearing the element to be detected and transmitting the element to be detected to a specified position;
a first light source for providing first detection light which propagates to a surface of the element to be detected and generates first information light;
a second light source for providing second detection light which penetrates the element to be detected and generates second information light;
the imaging device is used for generating a first detection image according to the first information light and/or generating a second detection image according to the second information light;
the imaging device is arranged above the transmission device, and the second light source is arranged below the transmission device.
2. The automated optical inspection device of claim 1, wherein the transport device comprises a conveyor belt, the automated optical inspection device further comprising a light source shielding device disposed above the conveyor belt;
the conveyer belt body is used for bearing an element to be detected, and the light source shielding device is used for absorbing the second detection light.
3. The automated optical inspection device of claim 1, wherein the transport device includes a first rail, a second rail disposed opposite the first rail;
and the light source shielding device is arranged above the transmission device and is used for absorbing the second detection light.
4. The automated optical inspection device of claim 2, wherein the first light source is disposed on a same side as the imaging device, the imaging device including a first camera device;
the first light source and the first camera device form an included angle, the first detection light is reflected on the surface of the element to be detected and generates first information light, and the imaging device converts the first information light into a first information electric signal.
5. The automated optical inspection device of claim 3, wherein the second light source is an X-ray generator configured to generate a second inspection light, the second inspection light being X-rays.
6. The automated optical inspection device of claim 4, wherein the light source shielding device is a lead plate for absorbing the second inspection light, and the light source shielding device and the transmission device define a cavity;
the camera device comprises a first camera device and a second camera device, the first camera device is used for receiving the first information light, the second camera device is used for receiving the second information light, and the second camera device is arranged in the cavity.
7. The automated optical inspection device of claim 6, wherein the first camera device is a CCD imaging camera.
8. The automated optical inspection device of claim 2, wherein the conveyor belt is a transparent belt.
9. The automated optical inspection device of claim 7, wherein the first inspection light has a wavelength in the range of 600nm to 800 nm.
10. A board inspection system comprising the automated optical inspection device of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023003229.0U CN214794403U (en) | 2020-12-14 | 2020-12-14 | Automatic optical detection device and circuit board detection system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023003229.0U CN214794403U (en) | 2020-12-14 | 2020-12-14 | Automatic optical detection device and circuit board detection system |
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| Publication Number | Publication Date |
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| CN214794403U true CN214794403U (en) | 2021-11-19 |
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| CN202023003229.0U Active CN214794403U (en) | 2020-12-14 | 2020-12-14 | Automatic optical detection device and circuit board detection system |
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