CN214793552U - Packaging structure of piezoresistive pressure sensor chip - Google Patents
Packaging structure of piezoresistive pressure sensor chip Download PDFInfo
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- CN214793552U CN214793552U CN202121010951.9U CN202121010951U CN214793552U CN 214793552 U CN214793552 U CN 214793552U CN 202121010951 U CN202121010951 U CN 202121010951U CN 214793552 U CN214793552 U CN 214793552U
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Abstract
The utility model discloses a packaging structure of piezoresistive pressure sensor chip, include from last clamping ring to setting gradually down, the isolation diaphragm, U-shaped seat and base plate, the inside of U-shaped seat is provided with the pressure sensor chip, the bottom of pressure sensor chip is connected with the inner bottom of U-shaped seat through insulating paster glue, the inside both sides of base plate evenly are provided with a plurality of wiring pins, the wiring pin passes through the wire and is connected with the pressure sensor chip, the bottom outside of base plate is provided with protective housing, protective housing's top is through the top outside swing joint of a plurality of flexible subassemblies and base plate. Has the advantages that: the structure design of the isolation diaphragm in the substrate packaging is optimized, and the selection and the processing of the insulating paster glue and the silicon oil are optimized, so that the reliability of chip protection is improved; in addition, the pressure sensor chip is connected with the wiring pin by adopting a 20um wire diameter bonding wire, so that the piezoresistive pressure output drift is convenient to have good stability.
Description
Technical Field
The utility model relates to a packaging technology field particularly, relates to a packaging structure of piezoresistive pressure sensor chip.
Background
The piezoresistive pressure sensor is formed by utilizing the piezoresistive effect of single crystal silicon. A monocrystalline silicon wafer is used as an elastic element, a group of equivalent resistors are diffused in a specific direction of monocrystalline silicon on the monocrystalline silicon wafer by utilizing the process of an integrated circuit, the resistors are connected into a bridge circuit, and the monocrystalline silicon wafer is arranged in a sensor cavity. When the pressure changes, the monocrystalline silicon generates strain, so that the strain resistance directly diffused on the monocrystalline silicon generates proportional change of the measured pressure, and then a bridge circuit obtains a corresponding voltage output signal.
In practical use, in order to prolong the service life of the piezoresistive pressure sensor chip, the piezoresistive pressure sensor chip is generally packaged, and the packaging technology is a technology for packaging an integrated circuit with an insulating plastic or ceramic material. In the existing packaging technology, although most of the packaging structures of the piezoresistive pressure sensors package and protect piezoresistive pressure sensor chips, the packaging structures cannot protect wiring pins connected with the piezoresistive pressure sensor chips, so that wiring terminals are easily damaged due to collision in the transportation process or idle time of the sensors; in addition, the existing packaging structure generally has the problems of improper displacement of the pressure sensor chip and improper bending of the lead, and can cause phenomena of cracking of a packaging shell, deformation of a chip metallization layer, tilting of a welding head, corrosion disconnection of an interconnection line, open circuit, short circuit and the like, so that the pressure sensor fails.
Patent number CN211425726U discloses a silicon piezoresistive pressure sensor packaging structure based on substrate, which realizes the protection of the wiring terminal by shrinking the wiring terminal to the inside of the lower substrate, however, when this kind of protection method is used in practice, the wiring terminal is always in the stressed state under the action of the spring, and continuously generates pressure to the L-shaped block, thus easily causing the deformation of the wiring terminal, and affecting the use effect.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
To the problem among the correlation technique, the utility model provides a packaging structure of piezoresistive pressure sensor chip to overcome the above-mentioned technical problem that current correlation technique exists.
Therefore, the utility model discloses a specific technical scheme as follows:
the utility model provides a packaging structure of piezoresistive pressure sensor chip, include from last to the clamping ring that sets gradually down, the isolating diaphragm, U-shaped seat and base plate, the inside of U-shaped seat is provided with the pressure sensor chip, the bottom of pressure sensor chip is glued through the insulating paster and is connected with the inner bottom of U-shaped seat, the inside both sides of base plate evenly are provided with a plurality of wiring pins, the wiring pin passes through the wire and is connected with the pressure sensor chip, the bottom outside of base plate is provided with protective housing, protective housing's top is through the top outside swing joint of a plurality of flexible subassemblies and base plate.
Furthermore, in order to improve the reliability of chip protection, silicone oil is filled in a gap between the isolation diaphragm and the U-shaped seat, and a plastic package body is filled in a gap between the outer side of the U-shaped seat and the inner side of the substrate.
Further, in order to realize reciprocating of protective housing, flexible subassembly includes vertical joint in the telescopic link in the base plate outside, and the middle part activity cover of telescopic link is equipped with the movable block, and the middle part of telescopic link and the inboard cover that is located the movable block are equipped with first spring, and the middle part of telescopic link and the bottom mounting that is located the inboard of movable block and first spring are provided with the stopper.
Further, in order to realize spacing the moving block, the top of the base plate is transversely clamped with a telescopic block, one side of the telescopic block, which is close to the moving block, is of an arc-shaped structure, and the other side of the telescopic block is provided with a second spring.
Furthermore, in order to realize automatic extension and retraction by driving the extension block by the moving block, both ends of the moving block are of a beveled surface structure, and one end of the extension block is tangent to the bevel of the moving block.
The utility model has the advantages that:
(1) through the structural design of an isolation diaphragm in the substrate packaging, silicone oil is filled between the U-shaped seat and the isolation diaphragm, a plastic package body is filled between the U-shaped seat and the substrate, and the selection and treatment of the insulation paster glue and the silicone oil are optimized, so that the reliability of chip protection is improved; in addition, the pressure sensor chip is connected with the wiring pin by adopting a 20um wire diameter bonding wire, so that the piezoresistive pressure output drift is convenient to have good stability.
(2) Through setting up flexible subassembly, can make protective housing carry out nimble shrink for the base plate, and can realize protective housing's location through the cooperation of flexible piece and movable block to utilize protective housing to protect the wiring pin, compare in the mode that the shrink that utilizes the wiring pin protected, the utility model discloses a protection mode can avoid the wiring pin impaired and guarantee the result of use of wiring pin.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a cross-sectional view of a package structure of a piezoresistive pressure sensor chip according to an embodiment of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
fig. 3 is a top view of a package structure of a piezoresistive pressure sensor chip according to an embodiment of the present invention;
fig. 4 is an axonometric view of a moving block in a package structure of a piezoresistive pressure sensor chip according to an embodiment of the present invention.
In the figure:
1. pressing a ring; 2. an isolation diaphragm; 3. a U-shaped seat; 4. a substrate; 5. a pressure sensor chip; 6. insulating paster glue; 7. a wiring pin; 8. a wire; 9. a protective housing; 10. a telescoping assembly; 1001. a telescopic rod; 1002. a moving block; 1003. a first spring; 1004. a limiting block; 1005. a telescopic block; 1006. a second spring; 11. a silicone oil; 12. and (7) molding the body.
Detailed Description
For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.
According to the utility model discloses an embodiment provides a packaging structure of piezoresistive pressure sensor chip.
Now combine the attached drawing and detailed implementation to the utility model discloses explain further, as shown in fig. 1-4, according to the utility model discloses a piezoresistive pressure sensor chip's packaging structure, include from last to the clamping ring 1 that sets gradually down, isolation diaphragm 2, U-shaped seat 3 and base plate 4, the inside of U-shaped seat 3 is provided with pressure sensor chip 5, pressure sensor chip 5's bottom is glued 6 through the insulating paster and is connected with the inner bottom of U-shaped seat 3, the inside both sides of base plate 4 evenly are provided with a plurality of wiring pins 7, wiring pin 7 passes through wire 8 and is connected with pressure sensor chip 5, and wire 8 is 20um line footpath bonding wire, the bottom outside of base plate 4 is provided with protective housing 9, protective housing 9's top is through the top outside swing joint of a plurality of flexible subassemblies 10 and base plate 4.
By means of the scheme, the pressure sensor chip 5 and the U-shaped seat 3 are connected through the insulating patch glue 6 by the structural design of the isolation diaphragm 2 in the packaging of the substrate 4, and the selection and the processing of the insulating patch glue 6 are optimized, so that the reliability of chip protection is improved; in addition, the pressure sensor chip 5 is connected with the wiring pin 7 by adopting a 20um wire diameter bonding wire 8, so that the piezoresistive pressure output drift is convenient to have good stability.
In one embodiment, the gap between the isolation diaphragm 2 and the U-shaped seat 3 is filled with silicone oil 11, and the gap between the outside of the U-shaped seat 3 and the inside of the substrate 4 is filled with a plastic package body 12, so that the reliability of chip protection can be improved.
In one embodiment, flexible subassembly 10 includes vertical joint in the telescopic link 1001 in the base plate 4 outside, and the middle part activity cover of telescopic link 1001 is equipped with movable block 1002, and the middle part of telescopic link 1001 and the inboard cover that is located movable block 1002 are equipped with first spring 1003, and the middle part of telescopic link 1001 and the bottom mounting that is located the inboard of movable block 1002 and first spring 1003 are provided with stopper 1004, can drive protective housing 9 through telescopic link 1001 and reciprocate like this.
In one embodiment, the top of the base plate 4 is transversely clamped with a telescopic block 1005, one side of the telescopic block 1005 close to the moving block 1002 is of an arc-shaped structure, and the other side of the telescopic block 1005 is provided with a second spring 1006, so that the moving block 1002 can be limited.
In one embodiment, both ends of the moving block 1002 are in a chamfered structure, and one end of the telescopic block 1005 is tangent to the inclined surface of the moving block 1002, so that automatic extension and retraction of the telescopic block 1005 driven by the moving block 1002 can be realized.
For the convenience of understanding the technical solution of the present invention, the following detailed description is made on the working principle or the operation mode of the present invention in the practical process.
During practical application, can take place deformation after stainless steel isolating diaphragm 2 receives the effect of power, the produced power of deformation can be conducted on pressure sensor chip 5 through silicon oil 11, and pressure sensor chip 5 feels the output signal of telecommunication behind the pressure effect. In the process, due to the excellent elastic property of the stainless steel isolation diaphragm 2 and the characteristic that the silicone oil 11 is hardly compressible under a small pressure, when external pressure acts on the isolation diaphragm 2, the external pressure can be transmitted to the surface of the pressure sensor chip 5 without damage, and then an electric signal is transmitted out through the wiring pin 7.
When the sensor is in a transportation process or is idle, the protective shell 9 is pulled down, the protective shell 9 drives the telescopic rod 1001 to move downwards, the telescopic rod 1001 drives the moving block 1002 to move downwards through the limiting block 1004, the moving block 1002 compresses the telescopic block 1005 through the inclined surface at the bottom, when the moving block 1002 continues to move downwards below the telescopic block 1005, the telescopic block 1005 extends out and limits the moving block 1002 through the inclined surface at the top of the moving block 1002, and at the moment, the protective shell 9 covers and protects the wiring pins 7; on the contrary, when the sensor needs to be used, the protective housing 9 is pushed upwards, the protective housing 9 drives the telescopic rod 1001 to move upwards (at this time, the telescopic rod 1001 firstly compresses the first spring 1003 by using the limiting block 1004, the first spring 1003 transmits the elastic force to the moving block 1002 again, and the buffering of the moving block 1002 can be realized), the telescopic rod 1001 drives the moving block 1002 to move upwards, when the moving block 1002 moves to the upper side of the telescopic block 1005, the telescopic block 1005 extends out and limits the moving block 1002, and therefore the wiring pin 7 is exposed out of the protective housing 9.
In summary, with the aid of the technical solution of the present invention, through the structural design of the isolation diaphragm 2 in the packaging of the substrate 4, the silicone oil 11 is filled between the U-shaped seat 3 and the isolation diaphragm 2, the plastic package body 12 is filled between the U-shaped seat 3 and the substrate 4, and the selection and processing of the insulation patch adhesive 6 and the silicone oil 11 are optimized, so as to improve the reliability of chip protection; in addition, the pressure sensor chip 5 is connected with the wiring pin 7 by adopting a 20um wire diameter bonding wire 8, so that the piezoresistive pressure output drift is convenient to have good stability.
In addition, through setting up flexible subassembly 10, can make protective housing 9 carry out nimble shrink for base plate 4, and can realize protective housing 9's location through the cooperation of flexible piece 1005 with the movable block to utilize protective housing 9 to protect wiring pin 7, compare in the mode that utilizes the shrink of wiring pin 7 to carry out the protection, the utility model discloses a protection mode can avoid wiring pin 7 impaired and guarantee the result of use of wiring pin 7.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a packaging structure of piezoresistive pressure sensor chip, its characterized in that includes from last clamping ring (1), isolation diaphragm (2), U-shaped seat (3) and base plate (4) that set gradually extremely down, the inside of U-shaped seat (3) is provided with pressure sensor chip (5), the bottom of pressure sensor chip (5) through insulating paster glue (6) with the interior bottom end of U-shaped seat (3) is connected, the inside both sides of base plate (4) evenly are provided with a plurality of wiring pins (7), wiring pin (7) through wire (8) with pressure sensor chip (5) are connected, the bottom outside of base plate (4) is provided with protective housing (9), the top of protective housing (9) through a plurality of flexible subassemblies (10) with the top outside swing joint of base plate (4).
2. The packaging structure of the piezoresistive pressure sensor chip according to claim 1, wherein the gap between the isolation diaphragm (2) and the U-shaped seat (3) is filled with silicone oil (11).
3. The packaging structure of the piezoresistive pressure sensor chip according to claim 1 or 2, wherein a plastic package body (12) is filled in a gap between the outer side of the U-shaped seat (3) and the inner side of the substrate (4).
4. The package structure of the piezoresistive pressure sensor chip according to claim 1, wherein the telescopic assembly (10) comprises a telescopic rod (1001) vertically clamped to the outer side of the base plate (4), a moving block (1002) is movably sleeved in the middle of the telescopic rod (1001), a first spring (1003) is sleeved in the middle of the telescopic rod (1001) and located on the inner side of the moving block (1002), and a limit block (1004) is fixedly arranged in the middle of the telescopic rod (1001) and located on the inner side of the moving block (1002) and at the bottom end of the first spring (1003).
5. The package structure of the piezoresistive pressure sensor chip according to claim 4, wherein a telescopic block (1005) is laterally clamped at the top of the substrate (4), one side of the telescopic block (1005) close to the moving block (1002) is in an arc-shaped structure, and a second spring (1006) is arranged on the other side of the telescopic block (1005).
6. The package structure of the piezoresistive pressure sensor chip according to claim 5, wherein both ends of the moving block (1002) are in a chamfered structure, and one end of the telescopic block (1005) is tangent to the inclined surface of the moving block (1002).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121010951.9U CN214793552U (en) | 2021-05-12 | 2021-05-12 | Packaging structure of piezoresistive pressure sensor chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202121010951.9U CN214793552U (en) | 2021-05-12 | 2021-05-12 | Packaging structure of piezoresistive pressure sensor chip |
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| CN214793552U true CN214793552U (en) | 2021-11-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115014627A (en) * | 2022-05-31 | 2022-09-06 | 武汉新烽光电股份有限公司 | High-precision atmospheric pressure sensor |
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2021
- 2021-05-12 CN CN202121010951.9U patent/CN214793552U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115014627A (en) * | 2022-05-31 | 2022-09-06 | 武汉新烽光电股份有限公司 | High-precision atmospheric pressure sensor |
| CN115014627B (en) * | 2022-05-31 | 2023-07-21 | 武汉新烽光电股份有限公司 | High-precision atmospheric pressure sensor |
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