CN214757674U

CN214757674U - Dispensing device of SMT chip mounter

Info

Publication number: CN214757674U
Application number: CN202120499012.9U
Authority: CN
Inventors: 万锦青
Original assignee: Xuzhou Lingsheng New Energy Co ltd
Current assignee: Xuzhou Lingsheng New Energy Co ltd
Priority date: 2021-03-09
Filing date: 2021-03-09
Publication date: 2021-11-16
Anticipated expiration: 2031-03-09

Abstract

The utility model discloses a glue dispensing device of an SMT chip mounter, which comprises a base and a door plate; base: the front end of the base is of an open structure, a relay is arranged in the middle of the rear side face of the base, connecting sheets are mounted at four corners of the rear side face of the base, mounting holes corresponding to external preset bolts are formed in the side surfaces of the connecting sheets, a fixing ring is arranged at the lower end of the base, threads are formed in the outer ring side of the fixing ring, an electronic glue valve is arranged on the inner ring side of the fixing ring, a glue outlet head is connected to the outer ring side of the fixing ring in a threaded mode, and mounting grooves are formed in the left side and the right side of the inner rear side face of the base; door panel: be provided with two altogether, two door plants articulate respectively in the front end left and right sides of base, and the internal surface middle part of door plant sets up flutedly, go out the convenient change of rubber head, handle comparatively simply when the inside excessive phenomenon of gluing that appears of adhesive deposite device simultaneously, can reduce the time that the maintenance adhesive deposite device consumes to make adhesive deposite device's practicality stronger.

Description

Dispensing device of SMT chip mounter

Technical Field

The utility model relates to a dispensing device technical field specifically is a dispensing device of SMT chip mounter.

Background

The chip mounter is the main equipment in SMT's the production line, the chip mounter has developed into high-speed optics centering chip mounter from early low-speed machinery chip mounter, and to multi-functional, the flexible connection modularization development, the chip mounter is before the paster, need carry out the point to the assigned position and glue, but current adhesive deposite device is when using, it is comparatively difficult that the play rubber head changes, and adhesive deposite device is inside to appear overflowing to glue when phenomenon and be difficult to clear up, it is longer to consume time when leading to the staff to maintain adhesive deposite device, thereby adhesive deposite device's practicality has been influenced.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to overcome current defect, provide a dispensing device of SMT chip mounter, go out glue the head and conveniently change, handle comparatively simply when dispensing device is inside when the excessive phenomenon of gluing appears, can reduce the time that the maintenance dispensing device consumes to make dispensing device's practicality stronger, can effectively solve the problem in the background art.

In order to achieve the above object, the utility model provides a following technical scheme: a dispensing device of an SMT chip mounter comprises a base and a door plate;

base: the front end of the base is of an open structure, a relay is arranged in the middle of the rear side face of the base, connecting sheets are mounted at four corners of the rear side face of the base, mounting holes corresponding to external preset bolts are formed in the side surfaces of the connecting sheets, a fixing ring is arranged at the lower end of the base, threads are formed in the outer ring side of the fixing ring, an electronic glue valve is arranged on the inner ring side of the fixing ring, a glue outlet head is connected to the outer ring side of the fixing ring in a threaded mode, and mounting grooves are formed in the left side and the right side of the inner rear side face of the base;

door panel: the two door plates are respectively hinged to the left side and the right side of the front end of the base, a groove is formed in the middle of the inner surface of each door plate, temperature sensors are respectively arranged inside the grooves formed in the inner surfaces of the door plates and inside the mounting grooves formed in the base, and electric heating plates are arranged on the inner surfaces of the door plates and the back side surface of the inner part of the base;

wherein: the input end of the electric heating plate is electrically connected with the output end of a singlechip arranged outside through a relay, and the electronic glue valve and the temperature sensor are electrically connected with the singlechip arranged outside in a bidirectional mode through the relay.

Furthermore, the door sealing device further comprises two sealing gaskets, wherein the two sealing gaskets are arranged on the upper side and the lower side of the inner part of the base respectively, and opposite surfaces of the two sealing gaskets are in contact with the upper side surface and the lower side surface of the door plate respectively. The sealing gasket that sets up can promote adhesive deposite device's whole leakproofness to guarantee the inside stability when pressurizeing of adhesive deposite device, avoid adhesive deposite device to leak gas and influence the normal discharge of glue solution.

Furthermore, still include the snap ring, the snap ring is installed in the upper end of base, and the snap ring corresponds the joint with the tip of the pipeline of giving vent to anger of the booster pump that the outside set up. The snap ring that sets up can be fixed the tip of the pipeline of giving vent to anger of the booster pump that the outside set up, avoids the pipeline tip to drop and influences the normal use of equipment.

Further, still include the funnel, the funnel sets up in the inside lower extreme of base, and the lower extreme discharge gate of funnel and the gluey mouth of advancing of electronic glue valve are corresponding. The funnel that sets up can be collected the glue solution that the rubber tube spills over, and the convenient change of funnel simultaneously can make things convenient for the staff to handle the excessive phenomenon of gluing to the use that makes equipment is more convenient.

Further, still include the hasp, the hasp is provided with two altogether, and both ends about two hasps were installed respectively in the surface of the door plant on right side, and the other end of hasp and the corresponding joint of the surface of left door plant. The hasp that sets up can be fixed the door plant of both sides, prevents that adhesive deposite device when removing the door plant and open and lead to inside rubber tube to drop to guarantee adhesive deposite device's normal operating.

Compared with the prior art, the beneficial effects of the utility model are that: this adhesive deposite device of SMT chip mounter has following benefit:

1. the glue outlet head is convenient to replace, meanwhile, the glue overflow phenomenon is easy to process when the glue overflow phenomenon occurs inside the glue dispensing device, and the time consumed by maintaining the glue dispensing device can be reduced, so that the glue dispensing device is high in practicability.

2. The sealing gasket that sets up can promote adhesive deposite device's whole leakproofness to guarantee the inside stability when pressurizeing of adhesive deposite device, avoid adhesive deposite device to leak gas and influence the normal discharge of glue solution.

3. The hasp that sets up can be fixed the door plant of both sides, prevents that adhesive deposite device when removing the door plant and open and lead to inside rubber tube to drop to guarantee adhesive deposite device's normal operating.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic diagram of the left side cross-sectional structure of the present invention.

In the figure: the automatic glue-spraying device comprises a base 1, a door plate 2, a connecting sheet 3, a relay 4, a fixing ring 5, an electronic glue valve 6, a glue outlet head 7, an electric heating plate 8, a temperature sensor 9, a sealing gasket 10, a clamping ring 11, a funnel 12 and a lock catch 13.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution: a glue dispensing device of an SMT chip mounter comprises a base 1 and a door panel 2;

base 1: the front end of the base is of an open structure, a relay 4 is arranged in the middle of the rear side face of the base 1, connecting sheets 3 are mounted at four corners of the rear side face of the base 1, mounting holes corresponding to external preset bolts are formed in the side surfaces of the connecting sheets 3, a fixing ring 5 is arranged at the lower end of the base 1, threads are formed in the outer ring side of the fixing ring 5, an electronic glue valve 6 is arranged on the inner ring side of the fixing ring 5, a glue outlet head 7 is connected to the outer ring side of the fixing ring 5 in a threaded mode, and mounting grooves are formed in the left side and the right side of the inner rear side face of the base 1; still including sealed the pad 10, sealed pad 10 is provided with two altogether, and two sealed pads 10 are installed respectively in the inside upper and lower both ends front side of base 1, and sealed opposite face of pad 10 contacts with the upper and lower both sides face of door plant 2 respectively. The sealing gasket 10 can improve the overall sealing performance of the dispensing device, so that the stability of the inside of the dispensing device during pressurization is ensured, and the phenomenon that the dispensing device leaks air to influence the normal discharge of glue liquid is avoided. Still include snap ring 11, snap ring 11 installs in the upper end of base 1, and snap ring 11 corresponds the joint with the tip of the pipeline of giving vent to anger of the booster pump that the outside set up. The snap ring 11 that sets up can be fixed the tip of the pipeline of giving vent to anger of the booster pump that the outside set up, avoids the pipeline tip to drop and influences the normal use of equipment. Still include funnel 12, funnel 12 sets up in the inside lower extreme of base 1, and the lower extreme discharge gate of funnel 12 corresponds with the gluey mouth of advancing of electronic gluey valve 6. The funnel 12 that sets up can be collected the glue solution that the rubber tube spills over, and funnel 12 is convenient to be changed simultaneously, can make things convenient for the staff to handle the glue phenomenon of overflowing to it is more convenient to make the use of equipment.

And (2) the door panel: the two door plates 2 are respectively hinged to the left side and the right side of the front end of the base 1, a groove is formed in the middle of the inner surface of each door plate 2, temperature sensors 9 are respectively arranged inside the grooves formed in the inner surfaces of the door plates 2 and inside mounting grooves formed in the base 1, and electric heating plates 8 are arranged on the inner surfaces of the door plates 2 and the back side of the inner portion of the base 1; still include hasp 13, hasp 13 is provided with two altogether, and both ends about two hasp 13 are installed respectively in the surface of right side door plant 2, and the other end of hasp 13 corresponds the joint with the surface of left door plant 2. The hasp 13 that sets up can be fixed the door plant 2 of both sides, prevents that adhesive deposite device door plant 2 from opening and leading to inside rubber tube to drop when removing to guarantee adhesive deposite device's normal operating.

Wherein: the input end of the electric heating plate 8 is electrically connected with the output end of a singlechip arranged outside through the relay 4, and the electronic glue valve 6 and the temperature sensor 9 are electrically connected with the singlechip arranged outside in a bidirectional mode through the relay 4.

When in use: install base 1 to the moving mechanism of chip mounter in through connection piece 3, then carry out the electricity with relay 4 and the inside singlechip of chip mounter and be connected, put into base 1 inside after opening rubber tube end, and close door plant 2, pressurize with adhesive deposite device inside through the inside supercharging device of chip mounter, with the normal discharge of assurance glue solution, simultaneously through 6 control glue solution discharge amounts of electron glue valve, when adhesive deposite device blockked up, only need to change adhesive deposite device's normal use to play rubber head 7 and funnel 12 fast, thereby make adhesive deposite device's practicality stronger.

It should be noted that the relay 4 disclosed in this embodiment is an SPC-SFMC-X3632A type relay with great success in the Changsha, the electronic glue valve 6 is a ZDLM-16C type electronic glue valve manufactured by Zhejiang Yongxi auto-control valve Co., Ltd, the electric heating plate 8 is a cast aluminum electric heating plate manufactured by an electric heating plant in the Xinghua city, and the temperature sensor 9 is a WZP-187-3PBO type temperature sensor manufactured by Shanghai pine conductive heating sensor Co., Ltd. The relay 4 controls the electronic glue valve 6, the electric heating plate 8 and the temperature sensor 9 to work by adopting a method commonly used in the prior art.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a dispensing device of SMT chip mounter which characterized in that: comprises a base (1) and a door panel (2);

base (1): the front end of the base is of an open structure, a relay (4) is arranged in the middle of the rear side face of the base (1), connecting pieces (3) are mounted at four corners of the rear side face of the base (1), mounting holes corresponding to external preset bolts are formed in the side surface of each connecting piece (3), a fixing ring (5) is arranged at the lower end of the base (1), threads are formed in the outer ring side of each fixing ring (5), an electronic glue valve (6) is arranged on the inner ring side of each fixing ring (5), a glue outlet head (7) is connected to the outer ring side of each fixing ring (5) in a threaded mode, and mounting grooves are formed in the left side and the right side of the inner rear side face of the base (1);

door panel (2): the two door plates (2) are respectively hinged to the left side and the right side of the front end of the base (1), a groove is formed in the middle of the inner surface of each door plate (2), temperature sensors (9) are respectively arranged inside the grooves formed in the inner surface of each door plate (2) and inside mounting grooves formed in the base (1), and electric heating plates (8) are arranged on the inner surfaces of the door plates (2) and the back side of the inner part of the base (1);

wherein: the input end of the electric heating plate (8) is electrically connected with the output end of a singlechip arranged outside through a relay (4), and the electronic glue valve (6) and the temperature sensor (9) are electrically connected with the singlechip arranged outside in a bidirectional way through the relay (4).

2. The dispensing device of claim 1, wherein: still include sealed pad (10), sealed pad (10) are provided with two altogether, and both ends front side about two sealed pads (10) are installed respectively in the inside of base (1), and the opposite face of sealed pad (10) contacts with the upper and lower both sides face of door plant (2) respectively.

3. The dispensing device of claim 1, wherein: still include snap ring (11), snap ring (11) are installed in the upper end of base (1), and snap ring (11) correspond the joint with the tip of the pipeline of giving vent to anger of the booster pump that the outside set up.

4. The dispensing device of claim 1, wherein: still include funnel (12), funnel (12) set up in the inside lower extreme of base (1), and the lower extreme discharge gate of funnel (12) is corresponding with advancing gluey mouth of electronic glue valve (6).

5. The dispensing device of claim 1, wherein: still include hasp (13), hasp (13) are provided with two altogether, and both ends about two hasp (13) are installed respectively in the surface of right side door plant (2), and the other end of hasp (13) and the corresponding joint of surface of left door plant (2).