CN214757217U - Sensor casing, mainboard and electronic equipment - Google Patents

Abstract

The utility model relates to a sensor cover shell, mainboard and electronic equipment. The sensor cover shell is used for the cover to establish the sensor unit on the plate body of mainboard, and the sensor cover shell includes: the main body part is used for being connected to the plate body, and the main body part is provided with an accommodating cavity to be sleeved on the sensor unit on the plate body; the extension part is connected with the main body part and has elasticity, and the extension part is used for extending to the lateral wall of the plate body so as to realize collision buffering on the lateral wall of the plate body. According to the sensor casing, when the main body part is installed on the plate body of the mainboard, the extending part is elastic and can extend to the side wall of the plate body, so that collision buffering can be realized on the side wall of the plate body, direct collision between the plate body and external elements (such as equipment shells of a middle frame) at the position where the sensor casing is arranged is prevented, electronic elements on the plate body can be protected, and collision influence on the mainboard is reduced.

Description

Sensor casing, mainboard and electronic equipment

Technical Field

The utility model relates to an electronic equipment technical field especially relates to a sensor cover shell, mainboard and electronic equipment.

Background

For traditional electronic equipment, the main board inside the electronic equipment is often in direct contact with the equipment shell or only has a slight gap, so that when the equipment shakes, direct collision can occur between the main board and the equipment shell with difficulty in avoiding, and the board body of the main board and the electronic devices arranged on the board body are easily damaged.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a sensor housing, a motherboard, and an electronic device to solve the problem of how to reduce the impact on the motherboard.

The utility model provides a sensor cover shell for the cover is established and is located the sensor unit on the plate body of mainboard, includes:

the main body part is used for being connected to the plate body, and the main body part is provided with an accommodating cavity to be sleeved on the sensor unit on the plate body; and

the extension part is connected with the main body part and has elasticity, and the extension part is used for extending to the lateral wall of the plate body so as to realize collision buffering on the lateral wall of the plate body.

In some embodiments, the sensor case includes a folded-back portion connected to the extended portion, and the main body portion, the extended portion, and the folded-back portion form a clamping groove for clamping the plate body.

In some embodiments, the sensor case includes a fold-back portion connected to the extended portion, the plate body has two opposing faces, the main body portion is connected to one of the two faces, and the fold-back portion extends from the extended portion and is connected to the other of the two faces to form a grip on the plate body.

In some embodiments, the sensor casing is a silicone casing or a rubber casing, and the main body portion, the extension portion and the turn-back portion are of an integrally molded structure.

In some embodiments, the main body portion defines a receiving cavity for receiving the sensor unit, the turning portion defines a notch, the receiving cavity axially corresponds to the notch, and the sensor unit can be mounted to the receiving cavity through the notch.

In some embodiments, the receiving cavity forms an upper opening on a side of the main body portion away from the plate body, and forms a lower opening on a side of the main body portion toward the plate body, a cross-sectional size of the receiving cavity gradually decreases along a direction from the lower opening to the upper opening, and a cavity wall of the receiving cavity is used for clamping the sensor unit.

In some embodiments, the accommodating cavity forms an upper opening on a side of the main body portion away from the plate body, and the main body portion is provided with at least two upper openings spaced from each other.

In some embodiments, the sensor casing includes a light shielding portion having an annular structure, the light shielding portion is connected to a side of the main body portion away from the plate body, the accommodating cavity extends to a side of the main body portion away from the plate body to form an opening, and the light shielding portion is disposed around the opening.

The utility model provides a mainboard, includes sensor unit, plate body and above-mentioned arbitrary one the sensor cover shell, the sensor unit set up in the main part, the main part connect in the face of plate body, the extension by the main part extends to the lateral wall of plate body, in order to right the collision buffering is realized to the lateral wall of plate body.

In some embodiments, the extension abuts a side wall of the plate body.

In some embodiments, the sensor unit comprises at least one of an optoelectronic device and an electroacoustic device.

An electronic device comprises a housing and the mainboard, wherein the mainboard is arranged on the housing.

In some embodiments, a side of the extension portion facing away from the plate body abuts the housing.

According to the sensor casing, when the main body part is installed on the plate body of the mainboard, the extending part is elastic and can extend to the side wall of the plate body, so that collision buffering can be realized on the side wall of the plate body, direct collision between the plate body and external elements (such as equipment shells of a middle frame) at the position where the sensor casing is arranged is prevented, electronic elements on the plate body can be protected, and collision influence on the mainboard is reduced.

Drawings

FIG. 1 is a top view of a sensor case provided in an embodiment of the present application;

fig. 2 is a schematic structural diagram of a motherboard according to an embodiment of the present application;

FIG. 3 is a side view of a sensor sleeve provided in accordance with an embodiment of the present application;

FIG. 4 is an isometric view of a sensor case provided by an embodiment of the present application;

fig. 5 is a schematic structural diagram of a motherboard according to an embodiment of the present application;

FIG. 6 is a cross-sectional view of the main plate of FIG. 5 at B-B;

FIG. 7 is a cross-sectional view of the sensor housing of FIG. 1 at A-A;

fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 9 is a schematic diagram of a partial structure in an electronic device according to an embodiment of the present application;

fig. 10 is a schematic diagram of a partial structure in an electronic device according to an embodiment of the present application;

fig. 11 is a cross-sectional view of a portion of the electronic device of fig. 10 at C-C.

The sensor housing 10, the main body 110, the top side 112, the bottom side 114, the accommodation cavity 116, the upper opening 1162, the lower opening 1164, the cavity wall 1166, the extension portion 120, the folded portion 130, the light shielding portion 140, the clamping groove 101, the main board 20, the board body 210, the board surface 212, the side wall 214, the sensor unit 220, the electronic device 30, the housing 310, and the through hole 312.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "thickness", "upper", "lower", "vertical", "top", "bottom", "inner", "outer", "axial", "circumferential", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Referring to fig. 1 and 2, an embodiment of the present application provides a sensor cover case 10, and the sensor cover case 10 is used for covering a sensor unit 220 provided on a plate body 210 of a main board 20. The sensor unit 220 may be at least one of an optoelectronic device and an electroacoustic device, wherein the optoelectronic device may be an infrared light emitting device, a photoelectric conversion device (such as an image sensor), a flash lamp, etc., and the electroacoustic device may be a speaker, a receiver, a microphone, etc. After the sensor unit 220 is disposed on the board 210 of the motherboard 20, the sensor housing 10 can be mounted on the board 210 of the motherboard 20 to cover the sensor unit 220, and the sensor unit 220 can be fixed on the board 210 and electrically connected to the electronic components on the board 210. The motherboard 20 may be, but is not limited to, a circuit board in an electronic device, particularly an electronic device that is often in a wobbling state for a smartphone, a smart watch, a tablet computer, an unmanned aerial vehicle, a vehicle event recorder, a law enforcement recorder, and the like.

Referring to fig. 2, 3 and 4 in combination, the sensor casing 10 includes a main body portion 110 and an extension portion 120, the main body portion 110 is used for arranging the sensor unit 220, and the main body portion 110 can be connected to a plate surface 212 on one side of the plate body 210. The board surface 212 of the board 210 is generally used for disposing electronic components such as capacitors, inductors, resistors, traces, and the like. The extension portion 120 is connected to the main body portion 110, and the extension portion 120 has elasticity, and the extension portion 120 is configured to extend to the sidewall 214 of the plate body 210, that is, when the main body portion 110 is connected to the plate surface 212 of the plate body 210, the extension portion 120 can be located on the sidewall 214 of the plate body 210, so that the sidewall 214 of the plate body 210 can be impact-buffered. Specifically, the sensor sleeve 10 may be mounted to the end of the plate body 210, i.e., the main body 110 may be attached to the edge area of the panel surface 212, and the sensor sleeve 10 may have a smaller size such that the extension portion 120 is located on the sidewall 214 of the plate body 210. It should be noted that the plate body 210 has an upper side, a lower side and a side wall 214, the upper side and the lower side respectively correspond to the upper surface and the lower surface of the plate body 210, the side wall 214 corresponds to the peripheral side edge of the plate body 210, and the side wall 214 of the plate body 210 can also be understood as a side end surface located between the upper surface and the lower surface. And when it is described that the extension 120 extends to the sidewall 214, the extension 120 may abut the sidewall 214, or may maintain a spacing.

When the main body 110 is mounted on the plate body 210 of the motherboard 20, the elastic extension portion 120 can extend to the sidewall 214 of the plate body 210, so as to buffer the sidewall 214 of the plate body 210 from collision, and prevent the plate body 210 from directly colliding with an external element (such as a housing of a device such as a middle frame) at a position where the sensor case 10 is disposed, thereby protecting an electronic element on the plate body 210 and reducing the impact on the motherboard 20.

The following description is provided for the sensor case 10 and its connection and assembly relationship with the plate body 210 and the sensor unit 220:

the main body 110 and the extension 120 of the sensor casing 10 may be integrally formed, and the main body 110 and the extension 120 may have elasticity together, for example, the whole material of the sensor casing 10 is silicon gel, or may be made of other materials having elasticity. The main body 110 of the sensor case 10 may also be adhered to the board surface 212 of the board 210 by means of common glue or optical adhesive, so that the sensor case 10 and the board 210 are relatively fixed. In some embodiments, the main body 110 and the plate 210 may be fixed by a common fixing method such as a snap fit, a screw connection, and the like. Referring to fig. 9, when the plate body 210 assembled with the elastic sensor casing 10 is mounted to the casing 310 of the device, since the main body 110 is fixed to the plate surface 212 and the extension portion 120 extends to the sidewall 214 of the plate body 210 to block the sidewall between the casing 310 and the plate body 210, the plate body 210 at the end assembled with the sensor casing 10 can achieve the impact buffering between the end and the casing 310 of the device through the sensor casing 10. In the case that the main body 110 can be fixed to the plate 210, the extension 120 may be spaced from the sidewall 214 of the plate 210, or may be directly abutted to the sidewall 214 of the plate 210.

In some embodiments, the extension 120 may be connected to an end of the body portion 110 and extend outward. The extension 120 may have a plate-like structure of a regular or irregular shape. The surface of the main body portion 110 and the extension portion 120 for facing the side of the device case 310, which surface may be a flat surface, share a surface forming the side of the sensor casing 10, thereby being capable of better contact with the conventional device case 310. The surface of the extension 120 for facing the side wall 214 of the plate body 210 may also be flat, whereby the collision of the plate body 210 can be well coped with. Of course, the surface of the sensor casing 10 facing the side of the device housing 310 and the surface of the extension portion 120 facing the side wall 214 of the plate body 210 may be non-planar, such as curved or folded, to adapt to the shape of the corresponding positions of the device housing 310 and the side wall 214 of the plate body 210.

The main body 110 includes a bottom side 114 for contacting the board surface 212 of the board body 210 and a top side 112 opposite to the bottom side, the top side 112 of the main body 110 is a side facing away from the board body 210, and the bottom side 114 is a side facing toward the board body 210. In some embodiments, the main body 110 has a receiving cavity 116 formed therein, and the receiving cavity 116 communicates with the outside through the bottom side 114, so that the sensor unit 220 can be inserted into the receiving cavity 116 from the bottom side 114 of the sensor sleeve 10 during the process of sleeving the sensor unit 220 on the sensor sleeve 10. In some embodiments, the bottom side 114 of the main body 110 has a ring-shaped structure, and the surface of the bottom side 114 is a plane or a plane similar to the plane, so that when the bottom side 114 of the main body 110 is connected to the board surface 212 of the board 210, the bottom side 114 of the main body 110 can enclose the sensor unit 220 in the receiving cavity 116, and dust on the board surface 212 is prevented from entering the receiving cavity 116 through the bottom side 114 of the main body 110 to affect the sensor unit 220.

Referring to fig. 4, 5, and 6, further, the sensor jacket 10 further includes a folded-back portion 130, and the folded-back portion 130 is connected to the extension portion 120. The turn-back portion 130 may be integrally formed with the extension portion 120. Specifically, in some embodiments, the main body 110, the extending portion 120 and the folding portion 130 are integrally formed and made of a silicone material, so that the sensor casing 10 forms an elastic silicone sleeve. Besides silicone, the extension portion 120 or the sensor housing 10 may be made of common elastic materials such as rubber, plastic, and soft PVC.

In some embodiments, the folding portion 130 is connected to an end of the extending portion 120 away from the main body portion 110, and the folding portion 130 may also have a plate-shaped structure. The folded-back portion 130 extends outward from the extension portion 120 and forms a clamping groove 101 with the main body portion 110, the clamping groove 101 is used for assembling a board body 210 of the main board 20, and the main body portion 110 and the folded-back portion 130 are used for clamping the board body 210. In this design, the sensor case 10 is not fixed to the plate body 210 by glue, screws, or the like, but the sensor case 10 is directly fixed to the plate body 210 by clamping the main body 110 and the folded portion 130.

Specifically, the plate body 210 has two opposing plate surfaces 212, which are generally planar. When the sensor jacket 10 is installed, the bottom side 114 of the main body portion 110 is connected to one of the two plate faces 212, that is, the side plate face 212 on which the sensor unit 220 is provided, and the folded-back portion 130 is extended by the extended portion 120 and connected to the other of the two plate faces 212 to form a clamp for the plate body 210. The surface of the folded portion 130 on the side close to the main body portion 110 may be a flat surface to match the flat surface 212 in the conventional plate body 210. To form an effective grip on the plate body 210, the shortest distance from the main body portion 110 to the folded-back portion 130 is equal to or less than the thickness of the plate body 210.

For the sensor casing 10 with the turn-back portion 130, since the sensor casing 10 has elasticity, for example, the sensor casing 10 is a silicone casing or a rubber casing, and the main body 110, the extension portion 120 and the turn-back portion 130 are integrally formed, when the sensor casing is mounted on the plate body 210, the turn-back portion 130 can be firstly acted to enable the turn-back portion 130 and the extension portion 120 to be deformed obviously, so as to enlarge the space of the clamping groove 101, and then the main body 110 is sleeved on the sensor unit 220, and simultaneously the plate body 210 is clamped into the clamping groove 101, and then the action on the turn-back portion 130 is removed, and when the extension portion 120 and the turn-back portion 130 are restored to the original shape, the plate body 210 can be clamped in the clamping groove 101.

However, instead of designing the entire sensor casing 10 as a silicone casing, only the extending portion 120 may be made elastic, and the main body portion 110 and the folded portion 130 need not be elastic. When the material of any one of the main body 110, the extending portion 120, and the folded portion 130 is different from that of the other, the main body, the extending portion 120, and the folded portion 130 may be fixed to each other by means of adhesion, screw connection, or the like. When the extending portion 120 has elasticity, the sensor housing 10 can achieve elastic buffering when the extending portion 120 collides with the device housing, and after the folding portion 130 is acted, the extending portion 120 can be indirectly acted to be elastically deformed to be bent, so as to enlarge the clamping groove 101, so that the sensor unit 220 on the plate body 210 can be placed into the main body portion 110 through the clamping groove 101.

In some embodiments, the folding-back portion 130 is provided with a notch, and the notch can be used to avoid a component on the board 210 or a structure on the device housing.

Referring to fig. 6 and 7, on the other hand, in some embodiments, the main body 110 has a receiving cavity 116 formed therein for receiving the sensor unit 220, and the receiving cavity 116 may form an upper opening 1162 on the top side 112 of the main body 110, that is, an upper opening 1162 on a side of the main body 110 away from the board 210, and a lower opening 1164 on the bottom side 114 of the main body 110, that is, a lower opening 1164 on a side of the main body 110 toward the board 210. The sensor unit 220 may transmit a sensing signal to the outside through the upper opening 1162 or receive an external signal through the upper opening 1162. As described above, the sensor unit 220 may be a common sensor device such as an infrared light emitting device, a photoelectric conversion device (e.g., an image sensor), a flash, a speaker, a receiver, a microphone, and the like. With the sensor casing 10 provided with the folded-back portion 130 to form the grip groove 101, the accommodation chamber 116 communicates with the grip groove 101 through the lower opening 1164, so that the sensor unit 220 can be put into the accommodation chamber 116 through the grip groove 101. It should be noted that the main body 110 may be formed with at least two spaced apart upper openings 1162 on the top side 112. At this time, only one accommodating cavity 116 may be formed in the main body portion 110, and the at least two upper openings 1162 are formed through the same accommodating cavity 116, or a plurality of mutually independent accommodating cavities 116 may be formed, and each accommodating cavity 116 forms an upper opening 1162 on the top side 112 of the main body portion 110.

Further, in some embodiments, the cavity wall 1166 of the accommodating cavity 116 of the body portion 110 has a wedge-shaped structure, wherein the area of the upper opening 1162 is smaller than the area of the lower opening 1164, so that the sensor unit 220 can be easily loaded from the lower opening 1164 when being loaded into the accommodating cavity 116. The above description is also understood to mean that the cross-sectional dimension of the receiving cavity 116 gradually decreases along the direction from the lower opening 1164 to the upper opening 1162. As the cross-sectional area of the receiving cavity 116 decreases, the sensor unit 220 will be held by the cavity wall 1166 of the receiving cavity 116 to form an interference fit. In particular, at least one of the body portion 110 or the sensor unit 220 may have elastic properties, so that an interference fit between the two may be better achieved. It should be noted that the cavity wall 1166 of the accommodating cavity 116 is not necessarily designed to be a wedge-shaped structure, and the areas of the upper opening 1162 and the lower opening 1164 are not necessarily required to satisfy the relationship in the above embodiments, and in the case that the sensor unit 220 can be fixedly connected to the board body 210, the structure of the accommodating cavity 116 may have various designs, for example, the areas of the upper opening 1162 and the lower opening 1164 may also be the same, and the cavity wall 1166 of the accommodating cavity 116 is in a vertical plane structure.

Still further, in some embodiments, the sensor casing 10 further includes a light shielding portion 140, the light shielding portion 140 is connected to a side of the main body portion 110 away from the plate body 210, and the light shielding portion 140 is disposed around the upper opening 1162 to form an annular structure. Specifically, the light shielding portion 140 may be integrally formed with the main body portion 110, the extending portion 120, and the like, and may further have an elastic property. The light shielding portion 140 may be a silicone rubber ring. The light shielding portion 140 corresponds to a convex closed ring structure on the main body portion 110, and in this design, the light shielding portion 140 can block all directions that an unexpected signal (such as an optical signal or an acoustic signal) in the side peripheral region enters the accommodating cavity 116 through the upper opening 1162 to affect the sensor unit 220, so that a good light shielding effect can be provided for the sensor unit 220.

On the other hand, in some embodiments, the main body 110 may be provided with two, three or more accommodating cavities 116, so that an equal number of sensor units 220 can be sleeved on one sensor casing 10. Each receiving cavity 116 may also have an upper opening 1162 formed on the top side 112 of the body portion 110 and a lower opening 1164 formed on the bottom side 114, and any upper openings 1162 are spaced apart from each other. With reference to the above embodiment, for any one of the accommodating cavities 116, the design of the wedge-shaped cavity wall 1166 and the related opening area relationship may also be provided, and the light shielding portion 140 may be correspondingly disposed at the opening 1162, so that the light shielding portion 140 is disposed around the corresponding upper opening 1162 to implement light isolation. The optional modifications and the positional relationship with other structures brought by different accommodating cavities 116 can be referred to the description of the above corresponding embodiments, and will not be described herein again.

According to the sensor casing 10 and the assembling and acting relationship between the sensor casing 10 and the plate body 210 and the sensor unit 220 described in the above embodiments, the embodiment of the present application further provides a main board 20, and the main board 20 includes the plate body 210, the sensor unit 220 and the sensor casing 10. The sensor unit 220 is disposed on the plate surface 212 of the plate 210 and is also disposed on the main body 110 of the sensor housing 10, for example, the main body 110 can be fitted over the sensor housing. The extension portion 120 extends from the main body portion 110 to a sidewall 214 of the plate body 210 to achieve impact buffering for the sidewall 214 of the plate body 210. For the main board 20 provided in the embodiment of the present application, various structures, connections, and assembling relationships between the board body 210 and the sensor unit 220, that is, the sensor casing 10, can refer to the above embodiments, and the solutions described in the above embodiments can be regarded as the main board 20 in the embodiment of the present application can have structural designs, and are not repeated here.

In some embodiments, the sensor unit 220 is disposed at an edge region of the board surface 212, and the sensor housing 10 is then mounted to the edge region of the board body 210, so that the extension portion 120 can extend to the sidewall 214 of the board body 210 with a simpler structure, for example, can extend from the end of the main body 110 to the sidewall 214 of the board body 210 with a simple flat structure.

The sensor casing 10 is arranged on the plate body 210 of the main plate 20, so that the sensor unit 220 can be protected, the collision buffer can be realized on the plate body 210, and the impact on the whole main plate 20 is reduced. Generally, the plate body 210 of the main plate 20 has a substantially rectangular plate-shaped structure, and may have four end portions, wherein two pairs of end portions are oppositely located, each pair of end portions is referred to as a first end portion and a second end portion, and the end portion of each side of the plate body 210 may have a regular complete flat plate-shaped structure or a flat plate-shaped structure with an assembly gap. Referring to fig. 2 and 9, the sensor housing 10 may be disposed at any end portion farthest from the opposite end, for example, at the position where the first end portion is farthest from the second end portion, so that when the main board 20 is assembled with the housing 310 of the device and the end portion is close to the housing 310 of the device, the end portion of the board body 210 may be buffered from collision with the housing 310 by the sensor housing 10 disposed thereon, and may even be held in abutment with the housing 310 by the sensor housing 10.

In the above-described embodiment, when the sensor case 10 is provided with the folded-back portion 130 to form a clamping structure to the plate body 210, the sensor case 10 can be fixed to the plate body 210 mainly by clamping. However, the bottom side 114 of the main body 110 may be provided with an uneven structure, and the surface 212 of the plate body 210 facing the main body 110 may be provided with an uneven structure matching the uneven structure, so that the main body 110 and the uneven structure of the plate body 210 are engaged with each other, thereby achieving further stability of clamping and preventing the sensor housing 10 from being displaced relative to the plate body 210 after collision. Accordingly, in some embodiments, the surfaces of the side of the folded-back portion 130 facing the plate body 210 and the side of the plate body 210 facing the folded-back portion 130 may also be provided with concave-convex structures, and the concave-convex structures on the folded-back portion 130 and the plate body 210 can be mutually matched to form a clamping, so as to further realize the stability of the clamping. The concave-convex structure can be one of common structures such as a saw-toothed structure, a wavy structure, a square wave structure and the like.

Referring to fig. 8, an embodiment of the present application further provides an electronic device 30, where the electronic device 30 may specifically be a smartphone, a smart watch, a tablet computer, an unmanned aerial vehicle, a vehicle data recorder, a law enforcement recorder, and other devices that are often in a shaking state.

Referring to fig. 9, 10 and 11 in combination, particularly when the electronic device 30 is a smartphone, the housing 310 can be understood as a middle frame of the device. The electronic device 30 includes a housing 310 and the main board 20 in any of the above embodiments, the main board 20 is disposed in the housing 310, and the extension portion 120 in the sensor casing 10 is located between the board body 210 of the main board 20 and the housing 310 of the device. The side of the extension 120 facing the plate 210 may abut the plate 210, and the side facing away from the plate 210 may also abut the housing 310. When the folded-back portion 130 is provided in the sensor jacket 10 to cooperate with the main body portion 110 to sandwich the plate body 210, the extending portion 120 may also be kept at a spaced distance from the plate body 210. When the electronic device 30 shakes, the elastic extension portion 120 is located between the board body 210 of the motherboard 20 and the housing 310 of the device, so that direct rigid collision between the board body 210 of the motherboard 20 and the housing 310 of the device can be prevented, the collision between the board body 210 of the motherboard 20 and the housing 310 of the device can be buffered, the electronic elements on the board body 210 can be protected, the service life of the electronic elements on the board body 210 can be prolonged, and the impact on the motherboard 20 can be reduced.

Further, in some embodiments, when the light shielding portion 140 having an annular structure is disposed on the sensor casing 10, an outer side structure of the light shielding portion 140 along the circumferential direction may form an interference fit with the housing 310, so that the sensor casing 10 may be fixed by the housing 310, and the light shielding effect may further be achieved, so as to prevent the light signal in the external undesired region from entering the device through a gap between the light shielding portion 140 and the housing 310. Specifically, in one embodiment, the housing 310 has a through hole 312, the through hole 312 axially corresponds to the receiving cavity 116 of the main body 110, the external signal can enter the sensor unit 220 located in the receiving cavity 116 through the through hole 312, and the light shielding portion 140 has an interference fit with the hole wall of the through hole 312 along the outer periphery of the annular structure thereof, and the interference fit may extend to 0.15mm deep into the through hole 312. In some embodiments, the sensor casing 10 is integrally formed of silicone, i.e. the sensor casing 10 is a silicone sleeve, and the light shielding portion 140 has corresponding elastic characteristics, thereby facilitating the interference fit with the housing 310.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. The utility model provides a sensor cover shell for the cover is established and is located the sensor unit on the plate body of mainboard, its characterized in that includes:

the main body part is used for being connected to the plate body, and the main body part is provided with an accommodating cavity to be sleeved on the sensor unit on the plate body; and

the extension part is connected with the main body part and has elasticity, and the extension part is used for extending to the lateral wall of the plate body so as to realize collision buffering on the lateral wall of the plate body.

2. The sensor casing of claim 1, comprising a fold-back portion connected to the extended portion, and the main body portion, the extended portion, and the fold-back portion form a clamping groove for clamping the plate body.

3. The sensor housing of claim 2, wherein the sensor housing is a silicone housing or a rubber housing, and the main body, the extension portion, and the turn-back portion are integrally formed.

4. The sensor housing according to claim 1, wherein the receiving chamber has an upper opening on a side of the main body portion facing away from the plate, and a lower opening on a side facing the plate, and the receiving chamber has a cross-sectional dimension gradually decreasing along a direction from the lower opening to the upper opening, and a chamber wall of the receiving chamber is used for clamping the sensor unit.

5. The sensor housing of claim 1, wherein the receiving cavity defines an upper opening on a side of the body portion facing away from the plate, and the body portion defines at least two spaced upper openings.

6. The sensor housing according to claim 1, comprising a light shielding portion having an annular structure, the light shielding portion being connected to a side of the main body portion away from the plate body, the receiving cavity extending to the side of the main body portion away from the plate body to form an opening, the light shielding portion being disposed around the opening.

7. A mainboard, characterized in that, includes sensor unit, plate body and the sensor cover shell of any one of claims 1 to 6, sensor unit set up in the main part, the main part connect in the face of plate body, the extension by the main part extends to the lateral wall of plate body to realize the collision buffering to the lateral wall of plate body.

8. The main panel as claimed in claim 7, wherein the extension portion abuts a side wall of the panel body.

9. An electronic device comprising a housing and the main board of claim 7 or 8, wherein the main board is disposed on the housing.

10. The electronic device of claim 9, wherein a side of the extension portion facing away from the board body abuts the housing.

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