CN214753680U

CN214753680U - Chip placing device for packaging transient voltage suppression diode

Info

Publication number: CN214753680U
Application number: CN202120441822.9U
Authority: CN
Inventors: 李波; 阚春燕; 李芳�
Original assignee: Shandong Zhisheng Electronic Device Co ltd
Current assignee: Shandong Zhisheng Electronic Device Co ltd
Priority date: 2021-03-01
Filing date: 2021-03-01
Publication date: 2021-11-16
Anticipated expiration: 2031-03-01

Abstract

The utility model provides a chip placer is used in encapsulation of transient voltage suppression diode, including placing frock and solid brilliant frock, the top of placing frock and solid brilliant frock is provided with the swing arm, the swing arm rotates the below that sets up at the driving machine case, the one end of swing arm is provided with the sucking disc, one side of driving machine case is provided with the gauge rod, the bottom of gauge rod is provided with camera device, the top of gauge rod is provided with the display screen, camera device's bottom orientation is placed the frock, it sets up on the grip slipper to place the frock, the grip slipper sets up on the two-way movement subassembly, gu brilliant frock sets up on the horizontal migration subassembly. The utility model discloses utilize quick-witted case drive swing arm of driving to make it swing between placing frock and solid brilliant frock, directly absorb the chip by the sucking disc, the swing of two-way movement subassembly and horizontal migration subassembly cooperation swing arm, in addition the monitoring effect of camera device and display screen, improve the transfer efficiency of chip greatly, reasonable in design, production efficiency is higher, is fit for extensive the popularization.

Description

Chip placing device for packaging transient voltage suppression diode

Technical Field

The utility model belongs to the technical field of diode production facility, especially, relate to a chip placer is used in encapsulation of transient voltage suppression diode.

Background

A tvs diode is a high performance protection device in the form of a diode. When two poles of the TVS diode are impacted by reverse transient high energy, the TVS diode can change the high impedance between the two poles into low impedance at the speed of 10 to the order of minus 12 seconds, absorb surge power of thousands of watts and clamp the voltage between the two poles at a preset value, thereby effectively protecting precise components in an electronic circuit from being damaged by various surge pulses.

The placing tool for placing the chip and the die bonding tool for mounting the chip in the prior art are different, and the chip in the die bonding tool comes from the placing tool, so that the chip is transferred manually in most cases, the operation accuracy is low, and the production efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model discloses to the technical problem that above-mentioned diode chip exists in the packaging process, provide a chip placer for the encapsulation of transient voltage suppression diode that reasonable in design, simple structure, operation accuracy are higher and be favorable to improving production efficiency.

In order to achieve the above object, the technical solution adopted by the present invention is that, the chip placement device for packaging transient voltage suppressor diodes provided by the present invention comprises a placement tool and a die bonding tool, wherein the placement tool is rectangular, the die bonding tool is circular, the placement tool and the die bonding tool are both provided with placement grooves, a swing arm is arranged above the placement tool and the die bonding tool, the swing arm is rotatably arranged below a driving case, one end of the swing arm is provided with a suction cup for sucking the chip, the suction cup is driven by an air source arranged inside the driving case, one side of the driving case is provided with a detection rod, the bottom of the detection rod is provided with a camera device for shooting the transfer condition of the chip in the placement tool, the top of the detection rod is provided with a display screen electrically connected with the camera device, the utility model discloses a solid brilliant frock of camera device, including camera device, place frock, movable end and fly leaf, the frock is placed to camera device's bottom orientation, place the frock setting on the grip slipper, the grip slipper includes relative distribution's fixed plate and fly leaf, the fly leaf is pegged graft in one side of fixed plate, the bottom of fixed plate is provided with the centre gripping cylinder, the expansion end and the fly leaf fixed connection of centre gripping cylinder, the grip slipper sets up on the two-way movement subassembly, the two-way movement subassembly includes lateral shifting mechanism and longitudinal movement mechanism, gu brilliant frock sets up on the horizontal migration subassembly, the horizontal migration subassembly includes the base, one side of base is provided with the cantilever beam, the one end of cantilever beam is provided with removes the seat, it sets up on horizontal guide to remove the seat activity.

Preferably, the transverse moving mechanism, the longitudinal moving mechanism and the horizontal moving assembly each comprise a stepping cylinder, and the stepping cylinder is used for driving the transverse moving mechanism, the longitudinal moving mechanism or the horizontal moving assembly to do linear motion.

Preferably, the transverse moving mechanism and the longitudinal moving mechanism both comprise bases, the stepping cylinder is arranged on the bases, the bases are of groove body structures, a pair of guide rails consistent with the length direction of the guide rails are arranged on the bases, and groove plates used for being matched with the guide rails are arranged at the bottoms of the clamping seats and the bottoms of the bases in the transverse moving mechanism.

Preferably, the top of the fixed plate and the top of the movable plate are both provided with a clamping groove.

Compared with the prior art, the utility model discloses an advantage lies in with positive effect:

1. the utility model provides a chip placer is used in encapsulation of transient voltage suppression diode utilizes driving machine case drive swing arm to make it swing between placing frock and solid brilliant frock to switch, directly absorbs the chip by the sucking disc, and the swing of two-way movement subassembly and horizontal migration subassembly cooperation swing arm can realize the motorized transfer of chip position, and the monitoring effect of camera device and display screen in addition improves the transfer efficiency of chip greatly, and productivity is higher. The utility model relates to a rationally, simple structure is fit for extensive the popularization.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.

Fig. 1 is a front view of a chip placement device for packaging a tvs according to an embodiment;

FIG. 2 is an isometric view of a placement tool and bi-directional movement assembly provided by an embodiment;

FIG. 3 is an isometric view of the die bonding tool and the horizontal movement assembly provided in the embodiment;

in the above figures, 1, a tool is placed; 2. die bonding tooling; 3. swinging arms; 4. a drive chassis; 5. a suction cup; 6. a probe rod; 7. a camera device; 8. a display screen; 9. a clamping seat; 91. a fixing plate; 92. a movable plate; 93. a clamping cylinder; 94. a clamping groove; 10. a bi-directional movement assembly; 101. a lateral movement mechanism; 102. a longitudinal movement mechanism; 103. a base; 104. a guide rail; 105. a groove plate; 11. a horizontal movement assembly; 111. a base; 112. a cantilever beam; 113. a movable seat; 114. a horizontal guide rail; 12. and (5) a stepping cylinder.

Detailed Description

In order to make the above objects, features and advantages of the present invention more clearly understood, the present invention will be further described with reference to the accompanying drawings and examples. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict. For convenience of description, the words "upper", "lower", "left" and "right" used herein refer to the same directions as the drawings, and do not limit the structure.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the present invention is not limited to the limitations of the specific embodiments of the present disclosure.

Embodiment, as shown in fig. 1, fig. 2 and fig. 3, the utility model provides a chip placer for encapsulation of transient voltage suppression diode, including placing frock 1 and solid brilliant frock 2, place frock 1 and be the rectangle, solid brilliant frock 2 is circularly, all is provided with the standing groove on placing frock 1 and the solid brilliant frock 2. The placing tool 1 and the die bonding tool 2 are prior art, and are not described herein again in this embodiment. The utility model discloses a key is for the chip place the frock and the solid brilliant frock between provide the structure that can realize mechanized transfer.

Specifically, the utility model is provided with a swing arm 3 above a placing tool 1 and a die bonding tool 2, the swing arm 3 is rotatably arranged below a driving case 4, one end of the swing arm 3 is provided with a sucker 5 for sucking a chip, the sucker 5 is driven by an air source arranged inside the driving case, one side of the driving case 4 is provided with a detecting rod 6, the bottom of the detecting rod 6 is provided with a camera device 7, the camera device 7 is used for shooting the transfer condition of the chip in the placing tool, the top of the detecting rod 6 is provided with a display screen 8 electrically connected with the camera device, the bottom of the camera device 7 faces the placing tool 1, the placing tool 1 is arranged on a clamping seat 9, the clamping seat 9 comprises a fixed plate 91 and a movable plate 92 which are relatively distributed, the movable plate 92 is inserted in one side of the fixed plate 91, the bottom of the fixed plate 91 is provided with a clamping cylinder 93, the movable end of the clamping cylinder 93 is fixedly connected with the movable plate 92, the clamping seat 9 is arranged on the bidirectional moving component 10, the bidirectional moving component 10 comprises a transverse moving mechanism 101 and a longitudinal moving mechanism 102, the die bonding tool 2 is arranged on the horizontal moving component 11, the horizontal moving component 11 comprises a base 111, a cantilever beam 112 is arranged on one side of the base 111, a moving seat 113 is arranged at one end of the cantilever beam 112, and the moving seat 113 is movably arranged on a horizontal guide rail 114. The driving case 4 drives the swing arm 3 to swing and switch between the placing tool 1 and the die bonding tool 2, when the driving case moves to the position above the placing tool, the chip is directly sucked by the sucker 5 until the chip is transferred to the die bonding tool 2, the placing tool and the die bonding tool can be changed in real time by the bidirectional moving assembly 10 and the horizontal moving assembly 11 matched with the swing of the swing arm 3, and the chip is directly transferred to the die bonding tool 2 from the placing tool, so that the motorized transfer of the position of the chip is realized; meanwhile, the camera device 7 can feed back the condition of the chip on the placing tool to the display screen 8 in time, and then feed back the condition of the chip to the worker through the display screen 8, so that the monitoring effect is achieved, the transfer efficiency of the chip is greatly improved, and the production capacity of a production line is further improved.

Further, the clamping seat 9 can clamp or release the placing tool under the action of the clamping cylinder 93. The transverse moving mechanism 101 provides transverse moving capability for placing the tool, and the longitudinal moving mechanism 102 provides longitudinal moving capability for placing the tool, so that the bidirectional moving assembly 10 provides two vertical movements for placing the tool, and the functional requirements of the swing arm 3 and the sucking disc 5 on chip extraction can be met. The moving seat 113 and the horizontal guide rail 114 in the horizontal moving assembly 11 provide the die bonder 2 with a lateral moving capability, and the array distribution characteristics of the top placing grooves can meet the functional requirements of the swing arms and the suckers for placing chips. Meanwhile, the cantilever beam 112 serves as an intermediate connection structure between the base 111 and the movable base 113, so that on one hand, a transition effect is achieved, and on the other hand, the space utilization rate of the whole horizontal moving assembly in production line equipment can be improved.

For the extraction efficiency and the placement efficiency of chip, the utility model provides a lateral shifting mechanism 101, longitudinal movement mechanism 102 and horizontal migration subassembly 111 all include a step cylinder 12, and step cylinder 12 is used for driving lateral shifting mechanism 101, longitudinal movement mechanism 102 or horizontal migration subassembly 11 and makes linear motion, and step cylinder 12's step-by-step distance corresponds the standing groove interval on the corresponding frock to satisfy the requirement that mechanized chip was shifted, improve the production efficiency of producing the line.

In order to improve the practicality of two-way moving subassembly 10 and horizontal migration subassembly 11, the utility model provides a lateral shifting mechanism 101 and longitudinal movement mechanism 102 all include base 103, and step-by-step cylinder 12 sets up on base 103, and base 103 is the cell body structure, is provided with a pair of guide rail 104 unanimous rather than length direction on the base 103, and the bottom of base all is provided with in the bottom of grip slipper 9 and the lateral movement mechanism 102 and is used for with guide rail complex frid 105. A stepping cylinder in the longitudinal moving mechanism 102 drives a base of the transverse moving mechanism 101, and a groove plate of the transverse moving mechanism 101 longitudinally moves on a guide rail in the longitudinal moving mechanism 102; the stepping cylinder in the transverse moving mechanism 101 drives the clamping seat 9, and the groove plate of the clamping seat 9 transversely moves on the guide rail in the transverse moving mechanism. Like this, bidirectional movement subassembly 10 can make the chip in placing the frock carry out bidirectional movement according to the rectangle array characteristics of standing groove to satisfy the chip and shift the demand.

In order to improve the stability of placing the frock on the grip slipper, the utility model provides a fixed plate 91 and fly leaf 92's top all is provided with centre gripping groove 94, utilizes centre gripping groove 94 to come and the both sides edge butt of placing frock 1, and centre gripping cylinder 93 drive fly leaf 92 then can press from both sides tightly places frock 1, reasonable in design, simple structure, the practicality is stronger.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in other forms, and any person skilled in the art may use the above-mentioned technical contents to change or modify the equivalent embodiment into equivalent changes and apply to other fields, but any simple modification, equivalent change and modification made to the above embodiments according to the technical matters of the present invention will still fall within the protection scope of the technical solution of the present invention.

Claims

1. A chip placement device for packaging a transient voltage suppressor diode comprises a placement tool and a die bonding tool, wherein the placement tool is rectangular, the die bonding tool is circular, and placement grooves are formed in the placement tool and the die bonding tool, and the device is characterized in that a swing arm is arranged above the placement tool and the die bonding tool and is rotatably arranged below a drive case, one end of the swing arm is provided with a sucker for sucking a chip, the sucker is driven by an air source arranged in the drive case, one side of the drive case is provided with a detection rod, the bottom of the detection rod is provided with a camera device, the camera device is used for shooting the transfer condition of the chip in the placement tool, the top of the detection rod is provided with a display screen electrically connected with the camera device, the bottom of the camera device faces the placement tool, the placement tool is arranged on a clamping seat, the clamping seat comprises a fixed plate and a movable plate which are distributed oppositely, the movable plate is inserted into one side of the fixed plate, a clamping cylinder is arranged at the bottom of the fixed plate, the movable end of the clamping cylinder is fixedly connected with the movable plate, the clamping seat is arranged on a bidirectional moving assembly, the bidirectional moving assembly comprises a transverse moving mechanism and a longitudinal moving mechanism, the die fixing tool is arranged on a horizontal moving assembly, the horizontal moving assembly comprises a base, a cantilever beam is arranged on one side of the base, a moving seat is arranged at one end of the cantilever beam, and the moving seat is movably arranged on a horizontal guide rail.

2. The chip placement apparatus for tvs packaging as claimed in claim 1, wherein said lateral movement mechanism, said longitudinal movement mechanism and said horizontal movement module each comprise a stepping cylinder, said stepping cylinder being configured to drive said lateral movement mechanism, said longitudinal movement mechanism or said horizontal movement module to move linearly.

3. The chip placement device for transient voltage suppression diode packaging as recited in claim 2, wherein the lateral movement mechanism and the longitudinal movement mechanism each comprise a base, the stepping cylinder is disposed on the base, the base is of a groove structure, the base is provided with a pair of guide rails having the same length direction as the stepping cylinder, and the bottom of the holder and the bottom of the base in the lateral movement mechanism are provided with groove plates for matching with the guide rails.

4. The TVS diode package chip placement device of claim 3, wherein the clamping grooves are formed at the tops of the fixed and movable plates.