CN214748441U - Photosensitive array probe card - Google Patents
Photosensitive array probe card Download PDFInfo
- Publication number
- CN214748441U CN214748441U CN202120747741.1U CN202120747741U CN214748441U CN 214748441 U CN214748441 U CN 214748441U CN 202120747741 U CN202120747741 U CN 202120747741U CN 214748441 U CN214748441 U CN 214748441U
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- photosensitive
- probe card
- circuit board
- processing module
- array
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- 239000000523 sample Substances 0.000 title claims abstract description 57
- 238000004804 winding Methods 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000016507 interphase Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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Abstract
The utility model discloses a photosensitive array probe card relates to sensor technical field, through the probe card, the circuit board, the signal processing module, the banding photosensitive array probe card that central processing module and photosensitive module makeed, banding photosensitive array probe card can install the rectangular shape clearance between transformer core and coil winding, monitors transformer coil winding internal surface, thereby solved and present in power transformer protection device, inconvenient shortcoming is observed in transformer core and coil winding's internal surface clearance space.
Description
Technical Field
The utility model belongs to the technical field of the sensor, especially, relate to a photosensitive array probe card.
Background
In application scenes that the strength of a light source, the area of the light source, the physical position of the light source and the like need to be detected in certain narrow spaces, when a common camera or an infrared camera is not convenient to install for carrying out global observation, for example, in a power transformer protection device, the gap between the inner surfaces of a transformer core and a coil winding is not large and is a long-strip-shaped space, and the camera is not convenient to install for carrying out observation.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a photosensitive array probe card to overcome current in power transformer protection device, inconvenient shortcoming is observed in the internal surface clearance space of transformer core and coil winding.
In order to achieve the above object, the present invention provides a photosensitive array probe card, including:
a probe card;
a circuit board disposed above the probe card;
the photosensitive modules are combined in an array form to form a photosensitive array, and the photosensitive array is arranged on the top of the circuit board;
the signal processing module is arranged at the top of the circuit board, is electrically connected with all the photosensitive modules and is used for processing and transmitting the photosensitive states detected by the photosensitive modules; and
and the central processing module is arranged at the top of the circuit board, is electrically connected with the signal processing module and is used for processing the data transmitted by the signal processing module and transmitting the signals.
Further, the photosensitive array adopts a single array, a double array, a triple array or a quadruple array.
Further, the photosensitive module adopts a photosensitive resistor or a photosensitive sensor.
Furthermore, the photosensitive module adopts a photosensitive resistor, and each photosensitive resistor is connected with a standard resistor in series for voltage division.
Furthermore, the signal processing module adopts a single chip microcomputer.
Furthermore, the central processing module adopts a single chip microcomputer.
Furthermore, the bottom of the probe card is arranged between the elongated gap between the transformer core and the coil winding.
Furthermore, the circuit board is a multilayer circuit board, no circuit is arranged on the bottom layer of the multilayer circuit board, and the bottom layer of the multilayer circuit board is completely insulated.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model provides a photosensitive array probe card, through the probe card, the circuit board, signal processing module, the banding photosensitive array probe card that central processing module and photosensitive module makeed, banding photosensitive array probe card can install the rectangular shape clearance between transformer core and coil winding, monitors transformer coil winding internal surface to solved and had now in power transformer protection device, inconvenient shortcoming is observed in transformer core and coil winding's internal surface clearance space.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only one embodiment of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a photosensitive array probe card according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a circuit structure of a photosensitive array probe card according to an embodiment of the present invention;
wherein: 1. a probe card; 2. a multilayer circuit board; 3. a signal processing module; 4. a central processing module; 5. a photosensitive module; 6. and an RS485 bus interface.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
Fig. 1 shows a schematic structural diagram of a photosensitive array probe card provided by the present invention, the photosensitive array probe card includes: the probe card comprises a probe card 1, a circuit board, a signal processing module 3, a central processing module 4 and a photosensitive module 5.
The probe card 1 is formed by processing a high-strength steel plate, and the probe card 1 serves as a substrate for supporting and fixing a circuit board.
The circuit board is arranged above the probe board 1 and is used for providing mounting positions for the photosensitive module 5, the signal processing module 3, the central processing module 4 and corresponding electrical connection; specifically, in the embodiment of fig. 1, the circuit board adopts a multilayer circuit board 2, the multilayer circuit board 2 is arranged on a substrate of the probe board 1, no circuit is arranged on the bottom layer of the multilayer circuit board 2, the bottom layer is completely insulated, and the bottom layer of the multilayer circuit board 2 is adhered to the substrate of the probe board 1 through screws or glue; the multilayer circuit board 2 is used for providing electrical connection for installing the signal processing module 3 and the photosensitive module 5 and connecting with a control system.
The photosensitive modules 5 are arranged on the top layer of the multilayer circuit board 2, and all the photosensitive modules 5 are electrically connected with the signal processing module 3 through the multilayer circuit board 2. The photosensitive module 5 is a photoresistor or a photosensitive sensor.
The signal processing module 3 is arranged on the top layer of the multilayer circuit board 2, the signal processing module 3 is respectively electrically connected with the photosensitive module 5 and the central processing module 4 of the multilayer circuit board 2, and the signal processing module 3 is used for processing the photosensitive state detected by the photosensitive module 5 and communicating with the central processing module 4 through a CAN bus.
The central processing module 4 is arranged on the top layer of the multilayer circuit board 2, the central processing module 4 is connected with the signal processing module 3 through a CAN bus, and the central processing module 4 is connected with the control system through an RS485 bus;
in one embodiment, the probe card 1 has a flat rectangular structure; the probe card 1 and the multi-layer circuit board 2 are identical in size. The length of the probe card 1 is set according to the transformer core height, for example: the length of the probe card 1 is identical to the transformer core height, and the length of the probe card 1 is 2/3 of the transformer core height.
The photosensitive modules 5 are arranged in an array on the multilayer circuit board 2. The array includes: single, double, triple, or quadruple arrays, etc.
When a plurality of signal processing modules 3 are adopted, the plurality of signal processing modules 3 are arranged in the middle of the photosensitive module 5 to form a row of arrangement.
Fig. 1 shows an optimal embodiment of a photosensitive array probe card 1, wherein the probe card 1 is a flat cuboid structure, the size of the probe card 1 is the same as that of a multilayer circuit board 2, so that the whole photosensitive array probe card 1 is strip-shaped, and the flat cuboid structure makes the whole photosensitive probe card 1 small in overall structure and convenient to install; the bottom layer of the multilayer circuit board 2 is fixed above the substrate of the probe board 1 in a form of being pasted by screws or glue, the signal processing module 3 is fixed on the top layer of the multilayer circuit board 2, the central processing module 4 is fixed on the top layer of the multilayer circuit board 2, the photosensitive module 5 forms a photosensitive matrix in an array form and is fixed on the top layer of the multilayer circuit board 2, for the purposes of attractiveness and convenience in installation, the signal processing module 3 is installed in a gap of the photosensitive matrix, a plurality of signal processing modules 3 are adopted, then the plurality of signal processing modules 3 form a row and are arranged in the gap of the photosensitive matrix, and the number of the signal processing modules 3 is determined according to the number of the photosensitive modules 5.
Fig. 2 shows an optimal embodiment of a circuit diagram of the photosensitive array probe board 1, wherein a photosensitive module 5 adopts a photosensitive resistor, each photosensitive resistor is connected in series with a standard resistor for voltage division, specifically, one end of the photosensitive resistor is grounded, the other end of the photosensitive resistor is connected with one end of the standard resistor, the other end of the standard resistor is connected with a power supply, the other end of the photosensitive resistor is connected with an a/D interface of a single chip microcomputer adopted by a signal processing module 3, communication between the signal processing module 3 and a central processing module 4 adopts a CAN bus communication mode, namely, the single chip microcomputer adopted by the signal processing module 3 is of a model STM32F042F6P6, the STM32F042F6P6 adopts a TSSOP20 packaging form, and the circuit diagram is small in occupied volume and convenient to install on the top layer of a strip-shaped small-area multilayer circuit board 2; the STM32F042F6P6 has 9 12-bit ADC channels, and can be connected to 9 photosensitive modules 5, so that each 9 photosensitive modules 5 are connected to 1 signal processing module 3, and the electrical connection of the entire photosensitive array probe board 1 can be realized by connecting a plurality of signal processing modules 3 to one central processing module 4; STM32F042F6P6 has CAN bus interface, carries out CAN bus communication through STM32F042F6P6 and central processing module 4, and the communication unit that CAN bus communication CAN be hung is not restricted, satisfies the quantity requirement completely under the lower condition of the communication rate of this system. The central processing module 4 adopts a high-performance singlechip STM32F103RBT6, the central processing module 4 is connected to each signal processing module 3 in a CAN bus communication mode, the photosensitive states of all photosensitive modules 5 are acquired, the working state of the transformer is identified, and the communication with a control system, a background and the like is carried out through an RS485 bus, wherein an RS485 bus interface 6 is arranged at one end of the top of the probe board 1.
When photosensitive array probe card 1 used, install photosensitive array probe card 1 in the rectangular shape clearance between transformer core and coil winding, photosensitive module 5 of photosensitive array probe card 1 monitors transformer coil winding internal surface, and photosensitive array probe card 1's theory of operation does: the photosensitive resistors and the standard resistors are connected in series and divided to obtain sampling voltages, the sampling voltages are sent to the signal processing module 3 for A/D conversion, the signal processing module 3 monitors the photosensitive state of each photosensitive resistor in real time and then transmits the photosensitive state to the central processing module 4, the central processing module 4 performs subsequent processing according to the photosensitive state of the photosensitive resistors, for example, whether a short-circuit fault occurs in a transformer coil winding is judged and analyzed according to the photosensitive state of a single photosensitive device and the photosensitive state of adjacent photosensitive devices nearby, and the position of the short-circuit fault in the transformer coil winding, the turn-to-turn short circuit, the interlayer short circuit, the interphase short circuit and the like are obtained according to the serial number of the photosensitive devices. And finally, the singlechip transmits the identification result to the control system, and the identification result is uniformly controlled by the control system. Therefore, the fault can be found at the initial stage of the fault of the transformer, and the alarm signal and the action signal are sent out to isolate the transformer from the power system, so that the safe and reliable operation of the power system is ensured.
The above disclosure is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or modifications within the technical scope of the present invention, and all should be covered by the scope of the present invention.
Claims (8)
1. A photosensitive array probe card, comprising:
a probe card;
a circuit board disposed above the probe card;
the photosensitive modules are combined in an array form to form a photosensitive array, and the photosensitive array is arranged on the top of the circuit board;
the signal processing module is arranged at the top of the circuit board, is electrically connected with all the photosensitive modules and is used for processing and transmitting the photosensitive states detected by the photosensitive modules; and
and the central processing module is arranged at the top of the circuit board, is electrically connected with the signal processing module and is used for processing the data transmitted by the signal processing module and transmitting the signals.
2. The photosensitive array probe card of claim 1, wherein the photosensitive array is a single array, a double array, a triple array or a quadruple array.
3. The photosensitive array probe card of claim 1, wherein the photosensitive module employs a photo resistor or a photo sensor.
4. The photosensitive array probe card of claim 3, wherein the photosensitive module employs photosensitive resistors, each of which is connected in series with a standard resistor for voltage division.
5. The photosensitive array probe card of claim 1, wherein the signal processing module employs a single chip microcomputer.
6. The photosensitive array probe card of claim 1, wherein the central processing module employs a single chip microcomputer.
7. The photosensitive array probe card of claim 1, wherein the bottom of the probe card is disposed between an elongated gap between a transformer core and a coil winding.
8. The photosensitive array probe card of claim 1, wherein the circuit board is a multilayer circuit board, the bottom layer of the multilayer circuit board is not provided with wires, and the bottom layer of the multilayer circuit board is totally insulated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120747741.1U CN214748441U (en) | 2021-04-13 | 2021-04-13 | Photosensitive array probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120747741.1U CN214748441U (en) | 2021-04-13 | 2021-04-13 | Photosensitive array probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214748441U true CN214748441U (en) | 2021-11-16 |
Family
ID=78602350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120747741.1U Expired - Fee Related CN214748441U (en) | 2021-04-13 | 2021-04-13 | Photosensitive array probe card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214748441U (en) |
-
2021
- 2021-04-13 CN CN202120747741.1U patent/CN214748441U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211116 |