CN214747807U - Chip detection equipment - Google Patents
Chip detection equipment Download PDFInfo
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- CN214747807U CN214747807U CN202120172662.2U CN202120172662U CN214747807U CN 214747807 U CN214747807 U CN 214747807U CN 202120172662 U CN202120172662 U CN 202120172662U CN 214747807 U CN214747807 U CN 214747807U
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Abstract
The utility model relates to a check out test set technical field, a chip check out test set is proposed, move on table surface through setting up chip transfer unit in order to drive the chip plummer, move in order to drive the camera in chip plummer top through setting up camera transfer unit, chip image information and control chip transfer unit and the synchronous motion of machine transfer unit that the analysis and treatment camera acquireed through the control unit acquisition, utilize machine vision to replace people's naked eye, the automatic identification and the classification of visual detection mechanism to the chip have been realized, intelligent degree is high, strong operability, whole testing process is automatic to be accomplished, need not pay out a large amount of manpowers, the labor cost is saved, the work efficiency is improved, the accuracy of detection has also been ensured in the automatic detection of while.
Description
Technical Field
The utility model relates to a check out test set technical field, more specifically say, relate to a chip check out test set.
Background
The chip is a foundation stone of the modern information society and plays a key role in a plurality of fields such as industrial machines, electronic equipment, military affairs and the like. With the progress of information technology, chips are continuously developed towards high integration, miniaturization and multi-functionalization, the sizes of the chips are smaller and smaller, and the types and specifications are various, so that the identification, classification and defect detection of the chips are particularly critical. However, currently, the research mainly includes positioning, dividing, defect detecting and measuring the sizes of the internal components of the chip, and the related research for chip identification, classification and counting at the user end is still lacked, so that the user still uses manpower to identify and classify the chip when facing a large number of chips with various specifications, and the production efficiency is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip detection equipment aims at solving prior art, and user side chip discernment is categorised to lean on the manual work to go on, the technical problem that production efficiency is low.
In order to solve the technical problem, the utility model provides a chip detection device, include:
the chip carrying mechanism comprises a chip carrying table and a chip conveying unit, and the chip conveying unit is connected with the chip carrying table to drive the chip carrying table to move on the working table surface;
the visual detection mechanism comprises a camera and a camera transmission unit, and the camera transmission unit is connected with the camera to drive the camera to move above the chip bearing table;
and the control unit is connected with the camera to acquire, analyze and process chip image information acquired by the camera, and is also connected with the chip transmission unit and the camera transmission unit to control the chip transmission unit and the camera transmission unit to move synchronously.
Further, the chip detection equipment further comprises a display unit, and the control unit is connected with the display unit to control the display unit to display the detection result.
Furthermore, the chip conveying unit comprises two X-axis moving supports arranged in parallel, a Y-axis moving support connected with the two X-axis moving supports, and a first sliding block movably connected to the Y-axis moving support, and the chip bearing table is arranged on the first sliding block.
Further, the camera conveying unit comprises a Z-axis moving support perpendicular to the working table surface and a second sliding block movably connected to the Z-axis moving support, and the camera is arranged on the second sliding block.
Furthermore, the X-axis moving support, the Y-axis moving support and the Z-axis moving support are all ball screws, the Y-axis moving support is sleeved with the first sliding block, and the Z-axis moving support is sleeved with the second sliding block.
Further, the X-axis moving support, the Y-axis moving support and the Z-axis moving support are respectively connected with a motor.
Further, the visual inspection mechanism further comprises an illumination unit, wherein the illumination unit comprises an annular light source arranged above the camera and a light source regulator electrically connected with the annular light source.
The utility model provides a chip detection equipment's beneficial effect lies in: compared with the prior art, the utility model discloses a chip testing equipment moves on table surface through setting up chip transfer unit in order to drive the chip plummer, move in order to drive the camera in chip plummer top through setting up camera transfer unit, chip image information and control chip transfer unit and the synchronous motion of machine transfer unit that the analysis and treatment camera acquireed through the control unit, utilize machine vision to replace people's naked eye, the automatic identification and the classification of visual detection mechanism to the chip have been realized, intelligent degree is high, high operability, whole testing process is automatic to be accomplished, need not pay out a large amount of manpowers, the labor cost is saved, the work efficiency is improved, the accuracy of detection has also been ensured in the detection of while automation.
Drawings
In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the drawings that are needed in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, and in which:
fig. 1 is a schematic structural diagram of a chip detection device in an embodiment of the present invention.
Description of reference numerals:
1. a chip carrying mechanism; 11. a chip carrier; 12. a chip transfer unit; 121. an X-axis moving support; 122. a Y-axis moving support; 123. a first slider; 2. a visual detection mechanism; 21. a camera; 22. a camera transfer unit; 221. a Z-axis moving support; 222. a second slider; 3. a control unit; 4. a display unit; 5. a motor; 6. an annular light source; 7. a light source regulator; 8. a working table.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The following embodiments with reference to the drawings are illustrative and intended to explain the present invention, and should not be construed as limiting the invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "communicating" are to be construed broadly, e.g., as meaning both mechanically and electrically connected; the connection may be direct, indirect or internal, or may be a connection between two elements or an interaction relationship between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Preferred embodiments of the present invention are described below with reference to the accompanying drawings:
as shown in fig. 1, in this embodiment, the chip detection apparatus includes a chip carrying mechanism 1, a visual detection mechanism 2 and a control unit 3, the chip carrying mechanism 1 includes a chip carrying table 11 and a chip conveying unit 12, and the chip conveying unit 12 is connected to the chip carrying table 11 to drive the chip carrying table 11 to move on the working table 8. Specifically, chip plummer 11 is used for placing and fixed the chip that waits to detect, and chip plummer 11 that bears the weight of the chip can move on detecting table surface 8 under the drive of chip conveying unit 12, if move to detecting the position by chip material loading level, move to unloading position by detecting the position after detecting and finishing.
Specifically, the vision inspection mechanism 2 includes a camera 21 and a camera transfer unit 22, and the camera transfer unit 22 is connected to the camera 21 to move the camera 21 above the chip carrier 11. The camera 21 is preferably an area-array industrial camera, the camera 21 is connected to the camera transfer unit 22 through a camera connecting plate, and the camera 21 is preferably vertically mounted on the camera connecting plate so as to photograph and inspect the chip on the chip carrier 11.
Specifically, the control unit 3 is connected to the camera 21 to collect and analyze chip image information acquired by the camera 21, the camera 21 sends the chip image information to the single board computer of the control unit 3 through a connection line to perform corresponding image processing, recognizing and classifying operations, and optionally, the camera 21 is connected to the single board computer through a USB data line. The chip image information acquired by the camera 21 includes, but is not limited to, the number of chips, the size of the chips, and the like, and the control unit 3 may perform classification of the chips at the same time. The control unit 3 is connected with the chip transfer unit 12 and the camera transfer unit 22, and can control the chip transfer unit 12 and the camera transfer unit 22 to move synchronously, so that the chip bearing platform 11 is positioned right below the camera 21, and the obtained image is clearly visible.
Preferably, in this embodiment, the control board of the control unit 3 is english pegson nano.
The chip check out test set of this embodiment can realize the accurate location to multiple type of chip quantity statistics and relevant position on the chip plummer 11, and measure the size of a dimension of chip and then classify through machine vision, utilize machine vision to replace people's naked eye, realized visual detection mechanism 2 to the automatic identification and the classification of chip, intelligent degree is high, the maneuverability is strong, whole testing process is automatic to be accomplished, need not pay out a large amount of manpowers, the cost of labor has been saved, work efficiency is improved, the accuracy of detection has also been ensured to automatic detection simultaneously.
As shown in fig. 1, in this embodiment, the chip detection apparatus further includes a display unit 4, and the control unit 3 is connected to the display unit 4 to control the display unit 4 to display the detection result.
Specifically, the display operation screen of the display unit 4 may be an HDMI capacitive touch screen, and is mounted on a housing of the device to display a system interface of the chip detection device, where the interface may be written in a Qt manner, and options such as "chip detection", "chip classification", and "zero clearing" may be built in the interface. The control unit 3 is connected with the display unit 4 to carry out human-computer interaction and display of detection results, and the intelligent degree of the equipment is further improved.
As shown in fig. 1, in the present embodiment, the chip transfer unit 12 includes two X-axis moving supports 121 disposed in parallel, a Y-axis moving support 122 connected to the two X-axis moving supports 121, and a first slider 123 movably connected to the Y-axis moving support 122, and the chip carrier 11 is disposed on the first slider 123.
Specifically, the Y-axis moving frame 122 is vertically movably connected to the two X-axis moving frames 121, so that the Y-axis moving frame 122 can move on the two X-axis moving frames 121, the chip carrier 11 is disposed on the Y-axis moving frame 122, and further, the chip carrier 11 is mounted on the Y-axis moving frame 122 through the first slider 123, so that the chip carrier 11 can move parallel to the X-axis moving frame 121 along with the Y-axis moving frame 122 and can slide back and forth on the Y-axis moving frame 122. The chip bearing table 11 bearing the chip can move on the working table surface 8 according to the detection requirement, and automatic chip transmission is realized.
As shown in fig. 1, in the present embodiment, the camera transfer unit 22 includes a Z-axis moving bracket 221 disposed perpendicular to the work table 8, and a second slider 222 movably coupled to the Z-axis moving bracket 221, and the camera 21 is disposed on the second slider 222.
Specifically, the camera 21 is connected to the second slider 222 through a camera connecting plate, and the second slider 222 is movable up and down, i.e., in the Z-axis direction, with respect to the Z-axis moving bracket 221. Therefore, the camera 21 can be driven to move along the Z-axis direction, so that the distance between the camera 21 and the chip bearing table 11 can be adjusted in the photographing detection process, and the photographing definition of the camera 21 can be adjusted.
In one embodiment, the X-axis moving frame 121, the Y-axis moving frame 122 and the Z-axis moving frame 221 are all ball screws, the first slider 123 is sleeved on the Y-axis moving frame 122, and the second slider 222 is sleeved on the Z-axis moving frame 221.
Specifically, the ball screw is used as the most commonly used transmission element in tool machinery and precision machinery, can convert rotary motion into linear motion, and has the characteristics of high precision, reversibility, small frictional resistance and high efficiency. The X-axis moving frame 121, the Y-axis moving frame 122, and the Z-axis moving frame 221 can function as a linear guide by selecting a ball screw, and can ensure that the chip transfer and the camera 21 transfer can be performed with high accuracy and efficiency, thereby facilitating the improvement of the accuracy and efficiency of chip recognition and classification. The first slider 123 and the second slider 222 are respectively sleeved on the ball screw, and can move linearly along with the rotation of the ball screw,
as shown in fig. 1, in the present embodiment, the motors 5 are connected to the X-axis moving frame 121, the Y-axis moving frame 122, and the Z-axis moving frame 221, respectively. The X-axis moving frame 121, the Y-axis moving frame 122, and the Z-axis moving frame 221 are driven to rotate by motors 5, respectively.
As shown in fig. 1, in the present embodiment, the visual inspection mechanism 2 further includes an illumination unit, which includes a ring-shaped light source 6 disposed above the camera 21, and a light source adjuster 7 electrically connected to the ring-shaped light source 6.
Specifically, in the embodiment, in the chip image acquisition process, the acquired chip image is easily affected by external ambient light, and in order to make the imaging quality better, a supplementary illumination mode is adopted in the actual process to improve the shooting effect, so that the imaging quality of the image is better, and the recognition and classification results are more accurate. The ring light source 6 can be turned on and off by the light source adjuster 7.
The utility model relates to a chip detection equipment's the categorised flow of chip discernment as follows:
firstly, turning on a power supply, starting up an English great jetson nano, enabling a system interface to be seen on an HDMI capacitive touch screen, displaying a chip image stream acquired by a camera on the interface, and arranging buttons for chip detection, chip classification, zero clearing and operation of a chip transmission unit 12 on the interface; secondly, placing the chip to be detected on the chip transmission unit 12, adjusting the chip bearing table 11 to enable the chip bearing table 11 to be placed under the camera 21, adjusting the position of the camera 21 in the Z-axis direction to enable the obtained image to be clear and visible, operating a chip detection button of the HDMI capacitive touch screen, and transmitting the currently acquired image into the control unit 3; the control unit 3 preprocesses the acquired chip image and converts the color image into a gray image; carrying out image binarization, image edge detection and image ROI region extraction on the preprocessed image, specifically Canny edge detection; performing image segmentation on the ROI of the image, and performing image morphological change, specifically, adopting an adaptive threshold image segmentation method, and adopting an image morphological change method of image expansion and image corrosion; extracting the chip contour by an image contour extraction method, eliminating abnormal contours by the shape rule of the chip, and counting the number of the rest contours; estimating the size of the chip according to the proposed contour, and classifying the chip; and displaying the chip contour extraction result and the chip size estimation result on an interactive interface through a display unit 4, thereby completing automatic identification and classification of the chips.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. A chip detection apparatus, comprising:
the chip carrying mechanism comprises a chip carrying table and a chip conveying unit, and the chip conveying unit is connected with the chip carrying table to drive the chip carrying table to move on the working table surface;
the visual detection mechanism comprises a camera and a camera transmission unit, and the camera transmission unit is connected with the camera to drive the camera to move above the chip bearing table;
and the control unit is connected with the camera to acquire, analyze and process chip image information acquired by the camera, and is also connected with the chip transmission unit and the camera transmission unit to control the chip transmission unit and the camera transmission unit to move synchronously.
2. The chip detection device according to claim 1, wherein the chip detection device further comprises a display unit, and the control unit is connected with the display unit to control the display unit to display the detection result.
3. The chip detection apparatus according to claim 1, wherein the chip transfer unit includes two X-axis moving supports arranged in parallel, a Y-axis moving support connected to the two X-axis moving supports, and a first slider movably connected to the Y-axis moving support, the chip stage being disposed on the first slider.
4. The chip inspection apparatus according to claim 3, wherein the camera transfer unit includes a Z-axis moving support disposed perpendicular to the work table, and a second slider movably coupled to the Z-axis moving support, the camera being disposed on the second slider.
5. The apparatus for inspecting chips as defined in claim 4, wherein the X-axis moving frame, the Y-axis moving frame and the Z-axis moving frame are all ball screws, the first slider is disposed on the Y-axis moving frame, and the second slider is disposed on the Z-axis moving frame.
6. The chip inspection apparatus according to claim 5, wherein motors are respectively connected to the X-axis moving support, the Y-axis moving support, and the Z-axis moving support.
7. The chip inspection apparatus according to claim 1, wherein the visual inspection mechanism further comprises an illumination unit, the illumination unit comprising a ring light source disposed above the camera, and a light source adjuster electrically connected to the ring light source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120172662.2U CN214747807U (en) | 2021-01-21 | 2021-01-21 | Chip detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120172662.2U CN214747807U (en) | 2021-01-21 | 2021-01-21 | Chip detection equipment |
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| CN214747807U true CN214747807U (en) | 2021-11-16 |
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| CN202120172662.2U Active CN214747807U (en) | 2021-01-21 | 2021-01-21 | Chip detection equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114354648A (en) * | 2021-12-28 | 2022-04-15 | 深圳市深科达智能装备股份有限公司 | Coating detection equipment and coating detection method |
| CN114441555A (en) * | 2022-01-14 | 2022-05-06 | 上海世禹精密机械有限公司 | Automatic solder ball array packaging and ball mounting detection system |
| TWI810103B (en) * | 2022-09-07 | 2023-07-21 | 大陸商環旭電子股份有限公司 | Method, system, storage medium and intelligent terminal for detecting wafers on tray |
-
2021
- 2021-01-21 CN CN202120172662.2U patent/CN214747807U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114354648A (en) * | 2021-12-28 | 2022-04-15 | 深圳市深科达智能装备股份有限公司 | Coating detection equipment and coating detection method |
| CN114441555A (en) * | 2022-01-14 | 2022-05-06 | 上海世禹精密机械有限公司 | Automatic solder ball array packaging and ball mounting detection system |
| TWI810103B (en) * | 2022-09-07 | 2023-07-21 | 大陸商環旭電子股份有限公司 | Method, system, storage medium and intelligent terminal for detecting wafers on tray |
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