CN214723244U

CN214723244U - Burnishing device is used in integrated circuit board production

Info

Publication number: CN214723244U
Application number: CN202120210935.8U
Authority: CN
Inventors: 王雪琴
Original assignee: Suzhou Shitai Intelligent Equipment Co ltd
Current assignee: Suzhou Shitai Intelligent Equipment Co ltd
Priority date: 2021-01-25
Filing date: 2021-01-25
Publication date: 2021-11-16
Anticipated expiration: 2031-01-25

Abstract

The utility model discloses a burnishing device is used in integrated circuit board production relates to burnishing device technical field, including the base, base upper surface rear end fixed mounting has the removal burnishing device, and base upper surface central point puts both sides fixed mounting and has centre gripping switching-over device, and base upper surface central point puts fixed mounting and has strutting arrangement. The utility model discloses an increase centre gripping switching-over device, two-sided polishing through rotatory realization circuit board, avoid carrying out the polishing of another side again at the centre gripping circuit board after the single face polishing finishes, save the centre gripping time, improve polishing efficiency simultaneously, increase heat abstractor, pass through the nozzle by the raceway and locate the water spray cooling to the emery wheel, prevent to cause the damage to the circuit board because of the temperature is too high in the polishing process, nozzle spun water can also wash the powder that the circuit board surface produced simultaneously, prevent that the circuit board from making the polishing precision decline because of the powder gathering.

Description

Burnishing device is used in integrated circuit board production

Technical Field

The utility model relates to a burnishing device relates to burnishing device technical field, concretely relates to burnishing device is used in integrated circuit board production.

Background

The integrated circuit board is manufactured by a semiconductor manufacturing process, a plurality of transistors, resistors, capacitors and other components are manufactured on a small single crystal silicon chip, the components are combined into a complete electronic circuit by a multilayer wiring or tunnel wiring method, and the integrated circuit board needs to be polished after being manufactured, so a polishing device is needed. The following problems exist in the prior art:

1. the two sides of the integrated circuit board need to be operated in the polishing process, the existing polishing device can only polish one side of the integrated circuit board, the polishing of the other side of the integrated circuit board needs to clamp the integrated circuit board again, the operation process is complex, the time is wasted, and the efficiency is low;

2. a large amount of heat can be generated in the polishing process of the integrated circuit board and can be generated along with the powder, the circuit board can be damaged due to untimely heat dissipation, and the polishing precision can be influenced due to the powder accumulated on the circuit board.

SUMMERY OF THE UTILITY MODEL

The utility model provides a polishing device for producing an integrated circuit board, which aims to have a double-sided polishing function and solve the problems of time waste and low efficiency of single-sided polishing; the other purpose is to solve the problems of heat dissipation and powder aggregation so as to achieve the effects of effective heat dissipation and circuit board protection.

In order to solve the technical problem, the utility model discloses the technical scheme who adopts is:

a polishing device for integrated circuit board production comprises a base, wherein a movable polishing device is fixedly mounted at the rear end of the upper surface of the base, clamping and reversing devices are fixedly mounted on two sides of the central position of the upper surface of the base, and a supporting device is fixedly mounted at the central position of the upper surface of the base;

the movable polishing device comprises a moving device, the moving device is fixedly arranged on the rear side of the upper surface of the base, the polishing device is fixedly arranged on the lower surface of the upper end of the moving device, and the heat dissipation device is fixedly arranged on the right side of the polishing device;

the clamping reversing device comprises reversing devices, the reversing devices are fixedly mounted on two sides of the center of the upper surface of the base, and the inward tail ends of the reversing devices are fixedly mounted with clamping devices.

The utility model discloses technical scheme's further improvement lies in: the movable device comprises a movable slide rail, the movable slide rail is fixedly installed on the rear side of the upper surface of the base, a movable support is movably installed inside the movable slide rail, and a movable telescopic column is fixedly installed on the right side of the movable support.

The utility model discloses technical scheme's further improvement lies in: the polishing device comprises a feeding telescopic column, the feeding telescopic column is fixedly mounted on the lower surface of the upper end of the movable support, a polishing machine is fixedly connected to the lower end of the feeding telescopic column, and a polishing grinding wheel is movably mounted on the right side of the lower end of the polishing machine.

The utility model discloses technical scheme's further improvement lies in: the heat dissipation device comprises a water pipe, the water pipe is fixedly installed on the lower surface of the upper end of the movable support, and a nozzle is fixedly installed at the lower end of the water pipe.

The utility model discloses technical scheme's further improvement lies in: the reversing device comprises support plates, the support plates are fixedly arranged on two sides of the center of the upper surface of the base, a rotating sleeve is movably arranged at the upper end of the inner side surface of each support plate, and a motor is fixedly arranged on the inner surface of the upper end of each support plate and at the rear end of the corresponding rotating sleeve.

The utility model discloses technical scheme's further improvement lies in: the clamping device comprises a fixed clamp fixedly mounted on the inner surface of the rotating sleeve, a movable clamping plate is movably mounted inside the fixed clamp, and a fastening bolt is movably mounted on the upper surface of the movable clamping plate.

The utility model discloses technical scheme's further improvement lies in: the supporting device comprises a supporting telescopic column, the supporting telescopic column is fixedly arranged at the center of the upper surface of the base, and a supporting table is fixedly arranged at the upper end of the supporting telescopic column.

Owing to adopted above-mentioned technical scheme, the utility model discloses relative prior art, the technological progress who gains is:

1. the utility model provides a burnishing device is used in integrated circuit board production, this utility model discloses increase centre gripping switching-over device, the circuit board is placed between activity splint and fixation clamp, and it is fixed with it through screwing up fastening bolt, after the polishing of completion one side circuit board, the gear drive rotating sleeve on the gear cooperation rotating sleeve of motor through the output shaft rotates, and drive whole clamping device and circuit board rotation with this, still not polished one side up, continue the polishing, the device realizes the two-sided polishing of circuit board through the rotation, avoid again after the single face polishing the centre gripping circuit board carry out the polishing of another side, save the centre gripping time, improve polishing efficiency simultaneously.

2. The utility model provides a burnishing device is used in integrated circuit board production, this utility model discloses increase heat abstractor, remove about moving in the sliding rail by removing flexible post drive whole support and burnishing device during the polishing and polish, pass through the nozzle by the raceway simultaneously and to the cooling of the water spray of emery wheel department, prevent to cause the damage to the circuit board because of the temperature is too high in the polishing process, nozzle spun water can also wash the powder that the circuit board surface produced simultaneously, prevent that the circuit board from making the polishing precision descend because of the powder gathering.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic view of the back structure of the present invention;

FIG. 3 is a schematic structural view of the polishing device and the heat dissipation device of the present invention;

fig. 4 is a schematic structural view of the clamping and reversing device and the supporting device of the present invention;

fig. 5 is a schematic structural view of the clamping device of the present invention.

In the figure: 1. a base; 2. moving the polishing device; 21. a mobile device; 22. a polishing device; 23. a heat sink; 211. moving the slide rail; 212. moving the telescopic column; 213. moving the support; 221. feeding the telescopic column; 222. polishing the machine; 223. polishing the grinding wheel; 231. a water delivery pipe; 232. a nozzle;

3. clamping the reversing device; 31. a reversing device; 32. a clamping device; 311. a support plate; 312. rotating the sleeve; 313. a motor; 321. a fixing clip; 322. a movable splint; 323. fastening a bolt;

4. a support device; 41. supporting the telescopic column; 42. and a support table.

Detailed Description

The present invention will be described in further detail with reference to the following examples:

example 1

As shown in fig. 1-5, the utility model provides a burnishing device is used in integrated circuit board production, including base 1, base 1 upper surface rear end fixed mounting has removal burnishing device 2, and base 1 upper surface central point puts both sides fixed mounting and has centre gripping switching-over device 3, and base 1 upper surface central point puts fixed mounting and has strutting arrangement 4.

In the embodiment, the mobile polishing device 2 is responsible for polishing and heat dissipation, the clamping and reversing device 3 is responsible for fixing and double-side conversion of the circuit board, and the supporting device 4 is used for bottom support of the circuit board during polishing.

As shown in fig. 1-5, in this embodiment, preferably, the supporting device 4 includes a supporting telescopic column 41, the supporting telescopic column 41 is fixedly installed at a central position of the upper surface of the base 1, a supporting platform 42 is fixedly installed at an upper end of the supporting telescopic column 41, the supporting telescopic column 41 drives the supporting platform 42 to move up and down, so as to support the lower bottom surface of the circuit board during polishing, and provide a bottom stress point for the circuit board.

Example 2

As shown in fig. 1-5, on the basis of embodiment 1, the utility model provides a technical solution: preferably, the clamping and reversing device 3 includes a reversing device 31, the reversing device 31 is fixedly installed on two sides of the central position of the upper surface of the base 1, the inward end of the reversing device 31 is fixedly installed with a clamping device 32, the reversing device 31 includes a support plate 311, the support plate 311 is fixedly installed on two sides of the central position of the upper surface of the base 1, the upper end of the inner side surface of the support plate 311 is movably installed with a rotating sleeve 312, the inner surface of the upper end of the support plate 311 is fixedly installed with a motor 313 at the rear end of the rotating sleeve 312, the clamping device 32 includes a fixing clamp 321, the fixing clamp 321 is fixedly installed on the inner surface of the rotating sleeve 312, a movable clamp plate 322 is movably installed inside the fixing clamp 321, a fastening bolt 323 is movably installed on the upper surface of the movable clamp plate 322, the circuit board is placed between the movable clamp plate 322 and the fixing clamp 321 and is fixed by screwing the fastening bolt 323, after finishing polishing of one circuit board, the motor 313 drives the rotating sleeve 312 to rotate by the gear of the output shaft matching with the gear on the rotating sleeve 312, and thus the whole clamping device 32 and the circuit board are driven to rotate, and the unpolished surface faces upwards to continue polishing.

Example 3

As shown in fig. 1-5, on the basis of embodiment 1, the utility model provides a technical solution: preferably, the movable polishing device 2 comprises a moving device 21, the moving device 21 is fixedly installed on the rear side of the upper surface of the base 1, the polishing device 22 is fixedly installed on the lower surface of the upper end of the moving device 21, the heat dissipation device 23 is fixedly installed on the right side of the polishing device 22, the moving device 21 comprises a movable slide rail 211, the movable slide rail 211 is fixedly installed on the rear side of the upper surface of the base 1, a movable support 213 is movably installed in the movable slide rail 211, a movable telescopic column 212 is fixedly installed on the right side of the movable support 213, the polishing device 22 comprises a feeding telescopic column 221, the feeding telescopic column 221 is fixedly installed on the lower surface of the upper end of the movable support 213, the lower end of the feeding telescopic column 221 is fixedly connected with a polishing machine 222, a polishing grinding wheel 223 is movably installed on the right side of the lower end of the polishing machine 222, the heat dissipation device 23 comprises a water pipe 231, the water pipe 231 is fixedly installed on the lower surface of the upper end of the movable support 213, a nozzle 232 is fixedly installed at the lower end of the water pipe 231, during polishing, the movable telescopic column 212 drives the whole movable support 213 and the polishing device 22 to move left and right in the movable sliding rail 211 for polishing, and meanwhile, the water pipe 231 sprays water to the polishing grinding wheel 223 through the nozzle 232 for cooling, so that the circuit board is prevented from being damaged due to too high temperature in the polishing process, and meanwhile, the water sprayed by the nozzle 232 can also wash away powder generated on the surface of the circuit board, so that the polishing precision of the circuit board is prevented from being reduced due to powder accumulation.

The working principle of the polishing device for producing the integrated circuit board is described in detail below.

As shown in fig. 1-5, the circuit board is placed between the movable clamp plate 322 and the fixed clamp 321, and is fixed by tightening the fastening bolt 323, after polishing of one side of the circuit board is completed, the motor 313 drives the rotating sleeve 312 to rotate through the gear of the output shaft in cooperation with the gear on the rotating sleeve 312, and thus drives the whole clamping device 32 and the circuit board to rotate, the side which is not polished is upward, and polishing is continued, during polishing, the movable telescopic column 212 drives the whole movable support 213 and the polishing device 22 to move left and right in the movable slide rail 211 for polishing, and at the same time, the water pipe 231 sprays water to the polishing grinding wheel 223 through the nozzle 232 for cooling.

The present invention has been described in detail with reference to the above general description, but it will be apparent to one of ordinary skill in the art that modifications and improvements can be made to the invention. Therefore, modifications or improvements without departing from the spirit of the invention are within the scope of the invention.

Claims

1. The utility model provides a burnishing device is used in integrated circuit board production, includes base (1), its characterized in that: a movable polishing device (2) is fixedly installed at the rear end of the upper surface of the base (1), clamping and reversing devices (3) are fixedly installed on two sides of the central position of the upper surface of the base (1), and a supporting device (4) is fixedly installed at the central position of the upper surface of the base (1);

the movable polishing device (2) comprises a moving device (21), the moving device (21) is fixedly installed on the rear side of the upper surface of the base (1), the polishing device (22) is fixedly installed on the lower surface of the upper end of the moving device (21), and a heat dissipation device (23) is fixedly installed on the right side of the polishing device (22);

the clamping reversing device (3) comprises a reversing device (31), the reversing device (31) is fixedly installed on two sides of the center of the upper surface of the base (1), and a clamping device (32) is fixedly installed at the inward tail end of the reversing device (31).

2. The polishing apparatus for integrated circuit board production according to claim 1, wherein: the mobile device (21) comprises a mobile sliding rail (211), the mobile sliding rail (211) is fixedly installed on the rear side of the upper surface of the base (1), a mobile support (213) is movably installed inside the mobile sliding rail (211), and a mobile telescopic column (212) is fixedly installed on the right side of the mobile support (213).

3. The polishing apparatus for integrated circuit board production according to claim 1, wherein: the polishing device (22) comprises a feeding telescopic column (221), the feeding telescopic column (221) is fixedly mounted on the lower surface of the upper end of the movable support (213), a polishing machine (222) is fixedly connected to the lower end of the feeding telescopic column (221), and a polishing grinding wheel (223) is movably mounted on the right side of the lower end of the polishing machine (222).

4. The polishing apparatus for integrated circuit board production according to claim 1, wherein: the heat dissipation device (23) comprises a water pipe (231), the water pipe (231) is fixedly installed on the lower surface of the upper end of the movable support (213), and a nozzle (232) is fixedly installed at the lower end of the water pipe (231).

5. The polishing apparatus for integrated circuit board production according to claim 1, wherein: the reversing device (31) comprises a support plate (311), the support plate (311) is fixedly arranged on two sides of the center of the upper surface of the base (1), a rotating sleeve (312) is movably arranged at the upper end of the inner side surface of the support plate (311), and a motor (313) is fixedly arranged on the inner surface of the upper end of the support plate (311) and at the rear end of the rotating sleeve (312).

6. The polishing apparatus for integrated circuit board production according to claim 1, wherein: clamping device (32) including fixation clamp (321), fixation clamp (321) fixed mounting is in rotatory sleeve (312) internal surface, the inside movable mounting of fixation clamp (321) has movable clamp plate (322), movable clamp plate (322) upper surface movable mounting has fastening bolt (323).

7. The polishing apparatus for integrated circuit board production according to claim 1, wherein: the supporting device (4) comprises a supporting telescopic column (41), the supporting telescopic column (41) is fixedly installed at the center of the upper surface of the base (1), and a supporting table (42) is fixedly installed at the upper end of the supporting telescopic column (41).