CN214712103U - Integrated composite substrate thick film heating device - Google Patents
Integrated composite substrate thick film heating device Download PDFInfo
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- CN214712103U CN214712103U CN202120529282.XU CN202120529282U CN214712103U CN 214712103 U CN214712103 U CN 214712103U CN 202120529282 U CN202120529282 U CN 202120529282U CN 214712103 U CN214712103 U CN 214712103U
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Abstract
The utility model relates to a thick film technical field that generates heat especially relates to a compound substrate thick film of integral type device that generates heat. The utility model combines the bottom end of the first metal substrate, the first solder layer, the metal heat conduction dispersion layer, the second solder layer, the second metal substrate, the thick film heating layer and the household appliance cup body into a whole to form an integrated composite substrate thick film heating device; when the thick film generates heat the layer circular telegram, the thick film generates heat the layer and can generate heat and heat second metal substrate, and second metal substrate passes through metal heat conduction dispersion layer homodisperse heat again to carry out the average heating to first metal substrate, effectively improve the inhomogeneous shortcoming of heating, avoid appearing burnt paste, appear the annular strip that generates heat etc. phenomenon with being of a specified duration. Therefore, the utility model discloses a compound substrate thick film of integral type device that generates heat, at the thick film technical field that generates heat, has higher technical content, technical innovation and vast market prospect.
Description
The technical field is as follows:
the utility model relates to a thick film technical field that generates heat especially relates to a compound substrate thick film of integral type device that generates heat.
Background art:
domestic appliances' heating cup such as chef machine, fried dish machine, soybean milk machine, broken wall machine on the market mainly includes the cup that metal material such as stainless steel made, and the bottom of cup is provided with the heat-generating body, and this heat-generating body is thick film heating device mostly. At present, the thick film heating device mainly comprises a stainless steel substrate and a thick film heating layer arranged on the end face of the bottom end of the stainless steel substrate, the periphery of the stainless steel substrate is welded and fixed with the inner side of the bottom of the cup body, and when the thick film heating layer is electrified, the thick film heating layer can heat the stainless steel substrate to heat objects in the cup body. The thick film heating device has the following defects: because the thick film layer that generates heat is the annular strip, and whole stainless steel substrate bottom terminal surface is not paved to full, so when heating, the bottom is laid the heating temperature of the stainless steel substrate department on thick film layer that generates heat higher, and the heating temperature of the stainless steel substrate department that the thick film layer that generates heat is not laid to the bottom is lower, leads to the heating of stainless steel substrate inhomogeneous promptly, appears burnt easily, appears the annular strip that generates heat with a specified duration and so on phenomenon.
The utility model has the following contents:
the utility model aims at providing a compound substrate thick film of integral type device that generates heat to the not enough of prior art existence, can effectively improve the inhomogeneous shortcoming of heating, avoid appearing burnt paste, appear phenomena such as annular strip of generating heat with a specified duration.
In order to realize the purpose, the utility model discloses a technical scheme is: an integrated composite substrate thick film heating device comprises a first metal substrate and a thick film heating layer, wherein the periphery of the first metal substrate is fixedly welded with the inner side of the bottom of a cup body of a household appliance, a metal heat conduction dispersion layer is arranged at the bottom end of the first metal substrate, and a first welding flux layer is arranged between the metal heat conduction dispersion layer and the first metal substrate, so that the end face of the bottom end of the first metal substrate is fixedly connected with the end face of the top end of the metal heat conduction dispersion layer; a second metal substrate is arranged at the bottom end of the metal heat conduction dispersion layer, and a second solder layer is arranged between the second metal substrate and the metal heat conduction dispersion layer, so that the bottom end face of the metal heat conduction dispersion layer is fixedly connected with the top end face of the second metal substrate; the thick film heating layer is arranged on the bottom end face of the second metal substrate.
The scheme is further improved in that the metal heat conduction dispersion layer is an aluminum plate or a copper plate, and the first metal substrate and the second metal substrate are stainless steel substrates.
The further improvement of the scheme is that the first solder layer and the second solder layer are solder layers.
The further improvement of the scheme is that the thick film heating layer is a nickel-chromium alloy heating layer.
The further improvement of the scheme is that the first metal substrate, the metal heat conduction dispersion layer and the second metal substrate are all round, square, regular pentagon or regular hexagon, the thickness of the first metal substrate is 1-10 mm, the thickness of the metal heat conduction dispersion layer is 1-10 mm, the thickness of the second metal substrate is 2-10 mm, the first metal substrate is made of 304 stainless steel, and the second metal substrate is made of 443 stainless steel.
In a further improvement of the above aspect, the first metal substrate may be made of a metal material such as a titanium alloy material.
In another embodiment, the periphery of the second metal substrate is upwards projected and formed with a flange, and the top end of the flange is welded and fixed with the bottom side of the household appliance cup body, so that the bottom end of the first metal substrate, the first solder layer, the metal heat conduction dispersion layer and the second solder layer are compactly placed in the flange.
The utility model has the advantages that: the utility model combines the bottom end of the first metal substrate, the first solder layer, the metal heat conduction dispersion layer, the second solder layer, the second metal substrate, the thick film heating layer and the household appliance cup body into a whole to form an integrated composite substrate thick film heating device; when the thick film generates heat the layer circular telegram, the thick film generates heat the layer and can generate heat and heat second metal substrate, and second metal substrate passes through metal heat conduction dispersion layer homodisperse heat again to carry out the average heating to first metal substrate, effectively improve the inhomogeneous shortcoming of heating, avoid appearing burnt paste, appear the annular strip that generates heat etc. phenomenon with being of a specified duration. Therefore, the utility model discloses a compound substrate thick film of integral type device that generates heat, at the thick film technical field that generates heat, has higher technical content, technical innovation and vast market prospect.
Description of the drawings:
fig. 1 is a schematic structural diagram of embodiment 1 of the present invention.
Fig. 2 is a schematic structural diagram of embodiment 2 of the present invention.
Description of reference numerals: 1-a first metal substrate, 2-a thick film heating layer, 3-a cup body, 4-a metal heat conduction dispersion layer, 5-a first solder layer, 6-a second metal substrate, 61-a flange, 7-a second solder layer.
The specific implementation mode is as follows:
the invention will be further described with reference to the accompanying drawings,
example 1
As shown in fig. 1, the present invention includes a first metal substrate 1 and a thick film heat generating layer 2. The periphery of first metal substrate 1 and the inboard welded fastening in bottom of domestic appliance cup 3, the top end terminal surface of first metal substrate 1 and the bottom top side parallel and level of domestic appliance cup 3 can keep the whole smoothness of the medial surface of cup 3. The bottom end of the first metal substrate 1 is provided with a metal heat conduction dispersion layer 4, and the metal heat conduction dispersion layer 4 is used for uniformly dispersing the heated heat. A first solder layer 5 is arranged between the metal heat conduction dispersion layer 4 and the first metal substrate 1, so that the end surface of the bottom end of the first metal substrate 1 is fixedly connected with the end surface of the top end of the metal heat conduction dispersion layer 4; a second metal substrate 6 is arranged at the bottom end of the metal heat conduction dispersion layer 4, and a second solder layer 7 is arranged between the second metal substrate 6 and the metal heat conduction dispersion layer 4, so that the bottom end face of the metal heat conduction dispersion layer 4 is fixedly connected with the top end face of the second metal substrate 6; the thick film heating layer 2 is arranged on the bottom end face of the second metal substrate 6. Specifically, firstly, the thick film heating layer 2 is made on the end face of the bottom end of the second metal substrate 6; then, printing a first solder layer 5 on the top end face of the metal heat conduction dispersion layer 4, printing a second solder layer 7 on the bottom end face of the metal heat conduction dispersion layer 4, then placing a second metal substrate 6 on the bottom end face of the metal heat conduction dispersion layer 4, and placing a first metal substrate 1 on the top end face of the metal heat conduction dispersion layer 4; and then putting the ceramic body into a tunnel furnace for sintering to form an integrated composite substrate thick film heating device, and finally welding the integrated composite substrate thick film heating device with the household appliance cup body 3. When the thick film generates heat layer 2 circular telegram, the thick film generates heat layer 2 and can generate heat and heat second metal substrate 6, and second metal substrate 6 rethread metal heat conduction dispersion layer 4 homodisperse heat to carry out the homodisperse heat to first metal substrate 1, effectively improve the inhomogeneous shortcoming of heating, avoid appearing burnt paste, appear phenomena such as the annular strip that generates heat with being of a specified duration.
Preferably, the metal heat conduction dispersion layer 4 is an aluminum plate, and the first metal substrate 1 and the second metal substrate 6 are stainless steel substrates. Through experimental analysis, adopt aluminum plate as metal heat conduction dispersion layer 4, can transmit the heat dispersion that second metal substrate 6 transmitted to well for first metal substrate 1 uniformly, because stainless steel substrate is that horizontal heat transfer is effectual, aluminum plate is that vertical heat transfer is effectual, and simultaneously, aluminum plate's quality is light, the low price, and the sexual valence is higher, is applicable to domestic appliance's volume production. Of course, the metal heat conduction dispersion layer 4 is made of other metal plates capable of conducting heat and dispersing, such as copper plates, and the like, and also belongs to the protection scope of the utility model.
Preferably, the first solder layer 5 and the second solder layer 7 are both solder layers, and the solder is a tin-based alloy, so as to obtain good fixing and heat transfer effects. The thick film heating layer 2 is a nickel-chromium alloy heating layer to obtain the effects of stable and efficient heating and the like.
Preferably, first metal substrate 1, metal heat conduction dispersed layer 4, second metal substrate 6 are circular, and through experimental analysis, first metal substrate 1, metal heat conduction dispersed layer 4, second metal substrate 6 all adopt circularly, can be convenient for domestic appliance's production, use etc. greatly. Of course, the first metal substrate 1, the metal heat conduction dispersion layer 4, and the second metal substrate 6 all adopt a square, a regular pentagon, a regular hexagon, etc., and also belong to the protection scope of the present invention. The thickness of first metal substrate 1 is 1 ~ 10 millimeters, and the thickness of metal heat conduction dispersed layer 4 is 1 ~ 10 millimeters, and the thickness of second metal substrate 6 is 2 ~ 10 millimeters, this size specification, makes the utility model discloses a thick film device that generates heat has advantages such as better production facility, transportation package, space make full use of. First metal substrate 1 is made by 304 stainless steel, and second metal substrate 6 is made by 443 stainless steel, through experimental analysis, such structure benefit is, makes the utility model discloses a thick film heat generation device corrosion resistance, thermal stability all can be better. The first metal substrate can also be made of a metal material such as a titanium alloy material, and the substrate made of the titanium alloy material is used for boiling water and the like, so that the first metal substrate has good health-care effect and the like.
Example 2
As shown in fig. 2, embodiment 2 differs from embodiment 1 in that: the periphery of the second metal substrate 6 is upwards protruded and formed with a flange 61, and the top end of the flange 61 is welded and fixed with the bottom side of the household appliance cup body 3, so that the bottom end of the first metal substrate 1, the first solder layer 5, the metal heat conduction dispersion layer 4 and the second solder layer 7 are all compactly arranged in the flange 61. Such structure for flange 61 can wrap up first metal substrate 1 bottom, first solder layer 5, metal heat conduction dispersed layer 4, second solder layer 7, and the integral type structure is better, more firm, and first solder layer 5, metal heat conduction dispersed layer 4, second solder layer 7 all can not expose simultaneously, have better leakproofness, security etc.. Other structures of this embodiment are the same as those of embodiment 1, and are not described herein again.
Of course, the above description is only the preferred embodiment of the present invention, so all the equivalent changes or modifications made by the structure, features and principles in accordance with the claims of the present invention are included in the claims of the present invention.
Claims (7)
1. Compound substrate thick film of integral type device that generates heat, including first metal substrate (1), thick film layer (2) that generates heat, the inboard welded fastening in bottom of the periphery of first metal substrate (1) and domestic appliance cup (3), its characterized in that: a metal heat conduction dispersion layer (4) is arranged at the bottom end of the first metal substrate (1), and a first solder layer (5) is arranged between the metal heat conduction dispersion layer (4) and the first metal substrate (1), so that the bottom end face of the first metal substrate (1) is fixedly connected with the top end face of the metal heat conduction dispersion layer (4); a second metal substrate (6) is arranged at the bottom end of the metal heat conduction dispersion layer (4), and a second solder layer (7) is arranged between the second metal substrate (6) and the metal heat conduction dispersion layer (4), so that the bottom end face of the metal heat conduction dispersion layer (4) is fixedly connected with the top end face of the second metal substrate (6); the thick film heating layer (2) is arranged on the end face of the bottom end of the second metal substrate (6).
2. The integrated composite substrate thick film heat generating device of claim 1, wherein: the metal heat conduction dispersion layer (4) is an aluminum plate or a copper plate, and the first metal substrate (1) and the second metal substrate (6) are stainless steel substrates.
3. The integrated composite substrate thick film heat generating device of claim 1, wherein: the first solder layer (5) and the second solder layer (7) are solder layers.
4. The integrated composite substrate thick film heat generating device of claim 1, wherein: the thick film heating layer (2) is a nickel-chromium alloy heating layer.
5. The integrated composite substrate thick film heat generating device according to any one of claims 1 to 4, wherein: the heat-conducting and heat-conducting composite material is characterized in that the first metal substrate (1), the metal heat-conducting and heat-conducting dispersion layer (4) and the second metal substrate (6) are all round, square, regular pentagon or regular hexagon, the thickness of the first metal substrate (1) is 1-10 mm, the thickness of the metal heat-conducting and heat-conducting dispersion layer (4) is 1-10 mm, the thickness of the second metal substrate (6) is 2-10 mm, the first metal substrate (1) is made of 304 stainless steel, and the second metal substrate (6) is made of 443 stainless steel.
6. The integrated composite substrate thick film heat generating device of claim 1, wherein: the first metal substrate (1) is made of a titanium alloy material.
7. The integrated composite substrate thick film heat generating device of claim 5, wherein: the periphery of the second metal substrate (6) is upwards protruded to form a flange (61), the top end of the flange (61) is fixedly welded with the bottom side of the bottom of the household appliance cup body (3), and the bottom end of the first metal substrate (1), the first solder layer (5), the metal heat conduction dispersion layer (4) and the second solder layer (7) are compactly arranged in the flange (61).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120529282.XU CN214712103U (en) | 2021-03-12 | 2021-03-12 | Integrated composite substrate thick film heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120529282.XU CN214712103U (en) | 2021-03-12 | 2021-03-12 | Integrated composite substrate thick film heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214712103U true CN214712103U (en) | 2021-11-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120529282.XU Active CN214712103U (en) | 2021-03-12 | 2021-03-12 | Integrated composite substrate thick film heating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214712103U (en) |
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2021
- 2021-03-12 CN CN202120529282.XU patent/CN214712103U/en active Active
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