CN214708530U - Chip mounter suction nozzle capable of accurately mounting - Google Patents

Chip mounter suction nozzle capable of accurately mounting Download PDF

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Publication number
CN214708530U
CN214708530U CN202120959482.9U CN202120959482U CN214708530U CN 214708530 U CN214708530 U CN 214708530U CN 202120959482 U CN202120959482 U CN 202120959482U CN 214708530 U CN214708530 U CN 214708530U
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China
Prior art keywords
suction nozzle
chip mounter
seat
groove
side wall
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CN202120959482.9U
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Chinese (zh)
Inventor
鲁守法
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Chenzhou Xinyi Electronics Co ltd
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Chenzhou Xinyi Electronics Co ltd
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Abstract

The utility model discloses a can accurately carry out chip mounter suction nozzle of subsides dress, including location lid, air hose and fixing base, the inside of location lid is provided with the air hose, the inside on location caping end is provided with prevents rocking structure, the lateral wall of spacing pipe is connected with the inside mosaic of location caping end, buffer structure is installed to the bottom of location lid, buffer structure's below is provided with the fixing base, the top fixedly connected with suction nozzle core of air hose, the dismouting structure is installed to the bottom of fixing base lateral wall. The utility model discloses a be provided with and prevent rocking structure, because inlay groove and fixture block and be annular distribution respectively at the inside wall of spacing pipe and the lateral wall of air hose, inlay the inslot portion when the fixture block slides annular distribution and inlay the groove and firmly restrict the fixture block, make the fixture block can't rock inlaying the inslot portion, make the air hose can not appear the shake at the slip in-process, realized the precision when improving this suction nozzle paster.

Description

Chip mounter suction nozzle capable of accurately mounting
Technical Field
The utility model relates to a chip mounter suction nozzle technical field, in particular to can accurately carry out subsides chip mounter suction nozzle of pasting dress.
Background
The chip mounter is mainly assembled on a dispensing machine or a screen printing machine in a production line, various electrical components are placed on a bonding pad through a movable mounting head, and in order to enable the various electrical components to stably move, a special chip mounter suction nozzle is often used for clamping the electrical components;
for this reason, patent specification CN209170826U discloses a chip mounter suction nozzle which is convenient to mount and demounts the suction nozzle by rotating the suction nozzle, but the demounting of the suction nozzle in this way makes the suction nozzle easily shake, resulting in a decrease in accuracy of the suction nozzle during chip mounting.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model aims at providing a can accurate chip mounter suction nozzle that pastes dress for solve the defect that the precision of current suction nozzle when the paster descends.
(II) contents of utility model
In order to solve the technical problem, the utility model provides a following technical scheme: the utility model provides a can accurate chip mounter suction nozzle who pastes dress that carries on, includes location lid, air hose and fixing base, the inside of location lid is provided with the air hose, the inside of location caping end is provided with prevents rocking structure, prevent rocking structure including spacing pipe, inlay groove and fixture block, the lateral wall of spacing pipe is inlayed with the inside of location caping end and is connected, buffer structure is installed to the bottom of location lid, buffer structure's below is provided with the fixing base, the top fixedly connected with suction nozzle core of air hose, the dismouting structure is installed to the bottom of fixing base lateral wall.
Preferably, the inside of spacing intraductal lateral wall is provided with inlays the groove, the lateral wall fixedly connected with fixture block of air pipe.
Preferably, be mosaic structure between spacing pipe and the locating cover inside, it is annular distribution that inlay the inside of groove at spacing intraductal lateral wall.
Preferably, buffer structure includes mount pad, buffer spring and spacing ring, the below of location lid lateral wall and with the inside wall threaded connection of mount pad, the inside bottom fixedly connected with buffer spring of mount pad, the below fixedly connected with spacing ring of air hose lateral wall.
Preferably, be threaded connection structure between mount pad and the location lid inside, be elastic connection between buffer spring and the spacing ring inside.
Preferably, the dismouting structure includes dismouting seat, elastic groove, spring buckle and locating hole, the inside wall of dismouting seat is inlayed with the bottom of fixing base lateral wall and is connected, the inside of fixing base lateral wall below is provided with the elastic groove, the inside one end fixedly connected with spring buckle of elastic groove, the inside of dismouting seat lateral wall is provided with the spring buckle.
Preferably, the elastic groove is elastically connected with the inside of the spring buckle, and the spring buckle is in a clamping structure with the inside of the positioning hole.
(III) advantageous effects
The utility model provides a pair of can accurate chip mounter suction nozzle that pastes dress that carries on, its advantage lies in: by arranging the anti-shaking structure, the embedding groove and the fixture block are respectively distributed on the inner side wall of the limiting pipe and the outer side wall of the air pipe in an annular manner, when the fixture block slides in the embedding groove, the fixture block is firmly limited by the annular distribution embedding groove, so that the fixture block cannot shake in the embedding groove, the air pipe cannot shake in the sliding process, and the accuracy of the suction nozzle in the surface mounting process is improved;
through the arrangement of the buffer structure, when the suction nozzle core moves downwards to place the adsorbed electrical component on the bonding pad, due to the elastic force of the buffer spring when the suction nozzle core descends, when the descending force of the suction nozzle core is large, the air pipe contracts towards the inside of the mounting seat and extrudes the buffer spring, so that the impact force between the electrical component and the bonding pad is reduced under the buffer of the buffer spring when the descending force of the suction nozzle core is too large, and the buffer of the suction nozzle core is realized;
through being provided with the dismouting structure, when installing this suction nozzle, inside inserting the fixing base of this suction nozzle perpendicular dismouting seat, make fixing base and dismouting seat form mosaic structure, after the fixing base inserts the inside dismouting seat, the inside spring buckle of elasticity inslot makes its one end insert inside the locating hole under self elastic action, make the inlaying between dismouting seat and the fixing base strengthened, only need when needs demolish spring buckle extrusion get into the elasticity inslot inside and extract the fixing base can, realized the convenient dismouting to this suction nozzle.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic three-dimensional structure of the present invention;
fig. 2 is a schematic view of a front cross-sectional structure of the buffer structure of the present invention;
FIG. 3 is a schematic view of the top-view cross-sectional structure of the anti-sway structure of the present invention;
FIG. 4 is a front view of the assembly/disassembly structure of the present invention;
fig. 5 is an enlarged partial cross-sectional view of the point a in fig. 4 according to the present invention.
In the figure: 1. a positioning cover; 2. an air tube; 3. a nozzle core; 4. an anti-sway structure; 401. a limiting pipe; 402. embedding a groove; 403. a clamping block; 5. a buffer structure; 501. a mounting seat; 502. a buffer spring; 503. a limiting ring; 6. a fixed seat; 7. a disassembly and assembly structure; 701. disassembling and assembling the seat; 702. An elastic groove; 703. a spring buckle; 704. and (7) positioning the holes.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-5, the utility model provides a chip mounter suction nozzle that can accurately carry out mounting, including location lid 1, air pipe 2 and fixing base 6, the inside of location lid 1 is provided with air pipe 2, the inside at location lid 1 top is provided with anti-sway structure 4, anti-sway structure 4 includes spacing pipe 401, inlay groove 402 and fixture block 403, the lateral wall of spacing pipe 401 is connected with the inside of location lid 1 top is inlayed, the inside of the spacing pipe 401 inside wall is provided with inlay groove 402, the lateral wall of air pipe 2 is fixedly connected with fixture block 403, be the mosaic structure between spacing pipe 401 and the inside of location lid 1, inlay groove 402 is annular distribution in the inside of spacing pipe inside wall 401;
specifically, as shown in fig. 1, 2 and 3, when the structure is used, firstly, by providing the anti-shaking structure 4, when the suction nozzle positions an electrical component, the top end of the suction nozzle core 3 contacts with a pad, and the air tube 2 is contracted under the action of the buffer structure 5, the fixture block 403 slides inside the embedding groove 402 during contraction of the air tube 2, and the embedding groove 402 and the fixture block 403 which are distributed in an annular shape keep the air tube 2 vertical during sliding, so that the precision of the suction nozzle is improved;
the bottom end of the positioning cover 1 is provided with a buffer structure 5, the buffer structure 5 comprises an installation seat 501, a buffer spring 502 and a limiting ring 503, the lower part of the outer side wall of the positioning cover 1 is in threaded connection with the inner side wall of the installation seat 501, the bottom end inside the installation seat 501 is fixedly connected with the buffer spring 502, the lower part of the outer side wall of the air pipe 2 is fixedly connected with the limiting ring 503, the installation seat 501 and the positioning cover 1 are in a threaded connection structure, and the buffer spring 502 is elastically connected with the inside of the limiting ring 503;
specifically, as shown in fig. 1 and fig. 2, when the structure is used, firstly, when the nozzle core 3 places an electrical component on a pad, the nozzle core 3 and the electrical component collide with the pad, at this time, the collision force is transferred upwards and the air tube 2 is contracted and slides towards the mounting seat 501, at this time, the limiting ring 503 will press the buffer spring 502, so that the collision force is buffered by the elastic force of the buffer spring 502, thereby preventing the electrical component from being damaged due to the larger collision force of the nozzle core 3;
a fixed seat 6 is arranged below the buffer structure 5, the top end of the air tube 2 is fixedly connected with a suction nozzle core 3, a dismounting structure 7 is arranged at the bottom end of the outer side wall of the fixed seat 6, the dismounting structure 7 comprises a dismounting seat 701, an elastic groove 702, a spring buckle 703 and a positioning hole 704, the inner side wall of the dismounting seat 701 is connected with the bottom end of the outer side wall of the fixed seat 6 in an embedding manner, the elastic groove 702 is arranged inside the lower side of the outer side wall of the fixed seat 6, one end inside the elastic groove 702 is fixedly connected with the spring buckle 703, the spring buckle 703 is arranged inside the outer side wall of the dismounting seat 701, the elastic groove 702 is elastically connected with the inside of the spring buckle 703, and a clamping structure is formed between the spring buckle 703 and the inside of the positioning hole 704;
specifically, as shown in fig. 1, fig. 4 and fig. 5, when using this structure, at first because the dismouting seat 701 is connected with inlaying of fixing base 6, make can carry out the primary connection between fixing base 6 and the dismouting seat 701, inlay in-process spring buckle 703 will insert the inside of locating hole 704 under self elasticity effect, make constitute the reinforcement between dismouting seat 701 and the fixing base 6, when needs dismantle only need press spring buckle 703 get into the inside of elasticity groove 702 and with fixing base 6 vertically upwards pull up can, with this dismouting that makes this suction nozzle more convenient.
The working principle is as follows: when the suction nozzle is used, the dismounting seat 701 is connected with the chip mounter body, then the fixed seat 6 of the suction nozzle is vertically inserted into the dismounting seat 701, so that the fixed seat 6 is in embedded connection with the dismounting seat 701, after the fixed seat 6 is inserted into the bottom end of the dismounting seat 701, the spring buckle 703 in the elastic groove 702 is outwards ejected under the action of self elasticity and inserted into the positioning hole 704, so that the dismounting seat 701 and the fixed seat 6 are firmly fixed, and the suction nozzle is connected with the chip mounter;
secondly, after the suction nozzle is installed, the chip mounter is started to enable the suction nozzle core 3 to absorb electrical components and move to the position above the bonding pad, then the suction nozzle core 3 moves downwards under the action of the chip mounter and enables the electrical components to be in contact with the bonding pad, when the electrical components are in contact with the bonding pad, the impact force generated when the suction nozzle core 3 moves downwards is gradually transmitted upwards, the air pipe 2 slides towards the inside of the mounting seat 501 to enable the limiting ring 503 to extrude the buffer spring 502, and the impact force of the suction nozzle core 3 is relieved by the buffer spring 502 under the elastic force action of the buffer spring 502;
finally, in the sliding process of the air pipe 2, the embedding grooves 402 which are annularly distributed on the upper portion of the outer side wall of the air pipe 2 slide inside the clamping blocks 403, and the clamping blocks 403 and the embedding grooves 402 are in one-to-one correspondence and are annularly distributed, so that the air pipe 2 on the inner side of the embedding grooves 402 is firmly limited inside the limiting pipe 401, the air pipe 2 is kept vertical in the sliding process, and the use work of the suction nozzle of the chip mounter is finally completed.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims (7)

1. The utility model provides a can accurate chip mounter suction nozzle who pastes dress, includes location lid (1), air pipe (2) and fixing base (6), its characterized in that: an air pipe (2) is arranged inside the positioning cover (1), an anti-shaking structure (4) is arranged inside the top end of the positioning cover (1), the anti-shaking structure (4) comprises a limiting pipe (401), an embedding groove (402) and a clamping block (403), the outer side wall of the limiting pipe (401) is connected with the inside of the top end of the positioning cover (1) in an embedded mode, a buffering structure (5) is installed at the bottom end of the positioning cover (1), and a fixing seat (6) is arranged below the buffering structure (5);
the top end of the air pipe (2) is fixedly connected with a suction nozzle core (3);
and the bottom end of the outer side wall of the fixed seat (6) is provided with a dismounting structure (7).
2. The suction nozzle of a chip mounter according to claim 1, wherein: the inside of spacing pipe (401) inside wall is provided with inlays groove (402), lateral wall fixedly connected with fixture block (403) of air pipe (2).
3. The suction nozzle of a chip mounter according to claim 1, wherein: spacing pipe (401) and location lid (1) are inside between be mosaic structure, inlay groove (402) and be the annular distribution in the inside of spacing pipe (401) inside wall.
4. The suction nozzle of a chip mounter according to claim 1, wherein: buffer structure (5) are including mount pad (501), buffer spring (502) and spacing ring (503), the below of location lid (1) lateral wall and the inside wall threaded connection of mount pad (501), the inside bottom fixedly connected with buffer spring (502) of mount pad (501), below fixedly connected with spacing ring (503) of air pipe (2) lateral wall.
5. The suction nozzle of a mounter according to claim 4, wherein said suction nozzle comprises: the mounting seat (501) and the positioning cover (1) are in a threaded connection structure, and the buffer spring (502) and the limiting ring (503) are in elastic connection.
6. The suction nozzle of a chip mounter according to claim 1, wherein: the disassembly and assembly structure (7) comprises a disassembly and assembly seat (701), an elastic groove (702), a spring buckle (703) and a positioning hole (704), the inner side wall of the disassembly and assembly seat (701) is embedded and connected with the bottom end of the outer side wall of the fixing seat (6), the elastic groove (702) is arranged inside the lower portion of the outer side wall of the fixing seat (6), the spring buckle (703) is fixedly connected to one end inside the elastic groove (702), and the spring buckle (703) is arranged inside the outer side wall of the disassembly and assembly seat (701).
7. The suction nozzle of a chip mounter according to claim 6, wherein: the elastic groove (702) is elastically connected with the inside of the spring buckle (703), and the spring buckle (703) is in a clamping structure with the inside of the positioning hole (704).
CN202120959482.9U 2021-05-07 2021-05-07 Chip mounter suction nozzle capable of accurately mounting Active CN214708530U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120959482.9U CN214708530U (en) 2021-05-07 2021-05-07 Chip mounter suction nozzle capable of accurately mounting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120959482.9U CN214708530U (en) 2021-05-07 2021-05-07 Chip mounter suction nozzle capable of accurately mounting

Publications (1)

Publication Number Publication Date
CN214708530U true CN214708530U (en) 2021-11-12

Family

ID=78535780

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120959482.9U Active CN214708530U (en) 2021-05-07 2021-05-07 Chip mounter suction nozzle capable of accurately mounting

Country Status (1)

Country Link
CN (1) CN214708530U (en)

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