CN214708508U - High-efficient radiating BMS shell - Google Patents

Abstract

The utility model discloses a high-efficient radiating BMS shell, include the casing down and fix last casing on the casing down, it forms the space that is used for holding the mainboard that is located inside with casing cooperation down to go up the casing, it still is fixed with the heat dissipation cover to go up the casing top surface, be equipped with the space that is used for holding the control panel in the heat dissipation cover, the heat dissipation cover bottom surface with it is used for the electricity to connect to offer on the casing top surface the connecting hole of mainboard and control panel. The utility model discloses set up control panel and mainboard separation, the control panel is fixed at the top surface of last casing through the heat exchanger that looses, and the mainboard is then installed at last casing and inside the casing down, and the control panel is direct to be dispelled the heat through the heat exchanger that looses in the course of the work, improves BMS's radiating efficiency greatly, avoids BMS continuous operation under high temperature, effectively improves its life and work efficiency.

Description

High-efficient radiating BMS shell

Technical Field

The utility model relates to a battery management system technical field, concretely relates to high-efficient radiating BMS shell.

Background

The BMS BATTERY management system (BATTERY MANAGEMENT SYSTEM), commonly known as a BATTERY caregiver or BATTERY manager, is mainly used to intelligently manage and maintain each BATTERY cell, prevent overcharging and overdischarging of the BATTERY, prolong the service life of the BATTERY, and monitor the state of the BATTERY. The BMS shell is used for fixedly storing the BMS, and the BMS must use the shell to fix and protect internal components when in use so as to ensure the normal operation of the system.

The control module group of BMS system, communication module etc. are all built-in the shell with current BMS shell, are connected with the external world through the interface of shell lateral wall. BMS system can release more heat at the course of the work, and all modules are all built-in can seriously influence the heat dissipation in the shell, lead to BMS system continuous operation under high temperature, influence its life-span and work efficiency.

Therefore, it is necessary to develop a BMS housing having a heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high-efficient radiating BMS shell to the BMS shell among the solution prior art is connected with the external world through the interface of shell lateral wall with the equal built-in shell of control module group, communication module etc. of BMS system. BMS system can release more heat at the course of the work, and all modules are all built-in can seriously influence the heat dissipation in the shell, lead to BMS system continuous operation under high temperature, influence its life-span and work efficiency's technical problem.

In order to realize the purpose, the technical scheme of the utility model is that:

the utility model provides a high-efficient radiating BMS shell, includes the casing down and fixes last casing on the casing down, it forms the space that is used for holding the mainboard that is located inside with casing cooperation down to go up the casing, it still is fixed with the heat dissipation cover to go up the casing top surface, be equipped with the space that is used for holding the control panel in the heat dissipation cover, the heat dissipation cover bottom surface with offer on the last casing top surface and be used for the electricity to connect the connecting hole of mainboard and control panel.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses set up control panel and mainboard separation, the control panel is fixed at the top surface of last casing through the heat exchanger that looses, and the mainboard is then installed at last casing and inside the casing down, and the control panel is direct to be dispelled the heat through the heat exchanger that looses in the course of the work, improves BMS's radiating efficiency greatly, avoids BMS continuous operation under high temperature, effectively improves its life and work efficiency.

On the basis of the technical scheme, the utility model discloses can also do as follows the improvement:

further, the lower shell is of a flat plate structure, the upper shell is of a box-shaped structure with an opening in the bottom surface, the main board is fixed to the top surface inside the upper shell, and a plurality of notches for installing connectors are formed in one side surface of the upper shell.

Through adopting above-mentioned scheme, the mainboard is fixed at the inside top surface of last casing, and control panel and heat exchanger that dispels the heat are fixed at last casing top surface simultaneously, and convenient to detach and installation also are convenient for connect between mainboard and the control panel.

Furthermore, vertical connecting columns are arranged at four corners of the top surface inside the upper shell, and the bottom surfaces of the connecting columns are fixed with the main board through bolts.

By adopting the scheme, the mainboard is hoisted through the connecting column, and the heat dissipation efficiency is further improved.

Furthermore, the heat dissipation cover is fixed with the upper shell through bolts penetrating through the bottom surface of the heat dissipation cover and the top surface of the upper shell.

Furthermore, the other side surface inside the upper shell is provided with a limiting edge for limiting the main board.

Furthermore, a circle of bulges are uniformly arranged on the outer side surface of the upper shell at intervals, and the lower shell is fixed with the bulges through bolts penetrating through the lower shell.

Further, the control panel is hoisted in the heat dissipation cover.

By adopting the scheme, the control panel is hoisted and fixed, and the heat dissipation efficiency is further improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

Fig. 1 is a schematic perspective view of an embodiment of the present invention.

Fig. 2 is a schematic view of another perspective structure according to an embodiment of the present invention.

Fig. 3 is a schematic sectional structure diagram of an embodiment of the present invention.

Shown in the figure:

1. a lower housing;

2. an upper housing; 201. a notch; 202. connecting columns; 203. a limiting edge; 204. a protrusion;

3. a heat dissipation cover;

4. a control panel;

5. a main board;

6. connecting holes;

7. and (4) a joint.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.

In the description of the present application, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

As shown in fig. 1 to 3, the present embodiment provides a BMS housing with high heat dissipation efficiency, which includes a lower case 1 and an upper case 2 fixed to the lower case 1.

Go up casing 2 and lower casing 1 cooperation formation and be located inside the space that is used for holding mainboard 5, go up 2 top surfaces of casing and still be fixed with heat dissipation cover 3, be equipped with the space that is used for holding control panel 4 in the heat dissipation cover 3, offer the connecting hole 6 that is used for electric connection mainboard 5 and control panel 4 on 3 bottom surfaces of heat dissipation cover and the 2 top surfaces of last casing.

With control panel 4 and 5 separation settings of mainboard, control panel 4 is fixed at the top surface of last casing 2 through heat exchanger 3, and mainboard 5 is then installed at last casing 2 and lower casing 1 inside, and control panel 4 directly dispels the heat through heat exchanger 3 in the course of the work.

Specifically, in this embodiment, the lower housing 1 is a flat plate structure, the upper housing 2 is a box-shaped structure with an open bottom, the main board 5 is fixed on the top surface inside the upper housing 2, and four notches 201 for installing the connectors 7 are formed in one side surface of the upper housing 2.

Mainboard 5 is fixed at the inside top surface of last casing 2, and control panel 4 and heat exchanger 3 are fixed at last casing 2 top surface simultaneously, and convenient to detach and installation also are convenient for connect between mainboard 5 and the control panel 4.

Vertical connecting columns 202 are arranged at four corners of the top surface inside the upper shell 2, and the bottom surfaces of the connecting columns 202 are fixed with the main board 5 through bolts. Mainboard 5 further improves its radiating efficiency through spliced pole 202 hoist and mount.

The heat radiating cover 3 is fixed to the upper case 2 by bolts passing through the bottom surface of the heat radiating cover 3 and the top surface of the upper case 2.

The other side surface inside the upper shell 2 is provided with a limiting edge 203 for limiting the main board 5.

A circle of bulges 204 are uniformly arranged on the outer side surface of the upper shell 2 at intervals, and the lower shell 1 is fixed with the bulges 204 through bolts penetrating through the lower shell 1.

Control panel 4 hoist and mount are in heat exchanger 3, and control panel 4 hoist and mount are fixed, further improve its radiating efficiency.

This embodiment sets up control panel 4 and 5 separation of mainboard, and control panel 4 is fixed at the top surface of last casing 2 through heat exchanger 3, and mainboard 5 then installs at last casing 2 and casing 1 inside down, and control panel 4 directly dispels the heat through heat exchanger 3 in the course of the work, improves BMS's radiating efficiency greatly, avoids BMS continuous operation under high temperature, effectively improves its life and work efficiency.

In the specification of the present invention, a large number of specific details are explained. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.

Claims (7)

1. The utility model provides a high-efficient radiating BMS shell, its characterized in that includes the casing down and fixes last casing on the casing down, go up casing and casing cooperation down and form the space that is used for holding the mainboard that is located inside, it still is fixed with the heat exchanger that looses to go up the casing top surface, be equipped with the space that is used for holding the control panel in the heat exchanger that looses, loose heat exchanger bottom surface with it is used for the electricity to connect to offer on the casing top surface the connecting hole of mainboard and control panel.

2. The BMS housing for efficient heat dissipation according to claim 1, wherein the lower case has a flat plate structure, the upper case has a box-shaped structure with an open bottom, the main board is fixed to an inner top surface of the upper case, and a plurality of notches for receiving connectors are formed at one side surface of the upper case.

3. The BMS housing for efficient heat dissipation according to claim 2, wherein vertical connection posts are provided at four corners of the top surface of the inside of the upper housing, and the bottom surfaces of the connection posts are fixed with the main board by bolts.

4. The BMS housing for efficient heat dissipation according to claim 2, wherein the heat dissipation cover is fixed to the upper case by bolts passing through a bottom surface of the heat dissipation cover and a top surface of the upper case.

5. The BMS housing for efficient heat dissipation according to claim 2, wherein a limiting rib for limiting the main board is provided at the other side surface inside the upper case.

6. The BMS housing for efficient heat dissipation according to claim 2, wherein a circle of protrusions are uniformly spaced at an outer side of the upper case, and the lower case is fixed to the protrusions by bolts passing through the lower case.

7. A BMS housing with efficient heat dissipation as in any one of claims 1 to 6, wherein said control board is suspended within said heat dissipation housing.

Images