CN214702966U - Dicing die for semiconductor device - Google Patents
Dicing die for semiconductor device Download PDFInfo
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- CN214702966U CN214702966U CN202120363996.8U CN202120363996U CN214702966U CN 214702966 U CN214702966 U CN 214702966U CN 202120363996 U CN202120363996 U CN 202120363996U CN 214702966 U CN214702966 U CN 214702966U
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Abstract
The utility model discloses a slicing die for a semiconductor device, which comprises a die main body (1) and a base (2); the die main body is of a hollow columnar structure, the cross section of the die main body is of a regular polygon structure, and the number of edges of the cross section of the die main body is even; the mould main body is longitudinally placed on the base, and the base can completely cover the bottom opening of the mould main body; the semiconductor device is set in the mold body, and cured into a thick plate-like resin sample (3) by resin casting. The number of the cross section edges of the die main body is 8. The utility model discloses the resin sample after enabling the solidification directly grinds the observation face to semiconductor device from one side to be formed with the holding surface that is parallel to each other at the opposite side, the microscope of being convenient for carries out product failure analysis to the observation face of the resin sample of vertical setting, reduces grinding time and manpower, reduces the consumption of grinding abrasive paper and resin raw materials, improves work efficiency.
Description
Technical Field
The utility model relates to a quality testing auxiliary die of semiconductor product especially relates to a slicing die for semiconductor device.
Background
In the failure analysis process of a semiconductor device product, a device sample needs to be cured by resin, in the operation of curing the device sample by the resin, a slicing die in the prior art is of a hollow cylindrical structure, the diameter of the slicing die is generally 3cm, the sample is placed in the slicing die, and the round cake-shaped resin sample with a certain thickness is formed by resin pouring. The cured resin sample is ground (also called sliced) from one side edge of the resin sample to a viewing surface of the sample, which may be a position at four sides or four corners of the device sample, where cracks may appear.
The resin sample manufactured by the slicing die in the prior art is of a circular structure, and when the resin sample is ground to a device sample from one side, the opposite side of the side needs to be ground into a plane as a supporting surface, so that the resin sample is conveniently and longitudinally arranged, and the device sample can be observed by a microscope. Because there are a plurality of observation positions of each device sample, the resin sample needs to be repeatedly ground on both sides, which wastes manpower and time, and also wastes grinding sand paper and resin raw materials.
Disclosure of Invention
An object of the utility model is to provide a slicing die for semiconductor device enables the resin sample after the solidification and directly grinds (section) to semiconductor device's observation face from one side to be formed with the holding surface that is parallel to each other at the opposite side, the microscope of being convenient for carries out product failure analysis to the observation face of the resin sample of vertical setting, reduces grinding time and manpower, reduces the consumption of grinding abrasive paper and resin raw materials, improves work efficiency.
The utility model discloses a realize like this:
a slicing die for a semiconductor device comprises a die main body and a base; the die main body is of a hollow columnar structure, the cross section of the die main body is of a regular polygon structure, and the number of edges of the cross section of the die main body is even; the mould main body is longitudinally placed on the base, and the base can completely cover the bottom opening of the mould main body; the semiconductor device is set in the mold body and cured into a thick plate-like resin sample by resin casting.
The number of the cross section edges of the die main body is 8.
The base is of a circular flat structure.
The diameter of the base is not less than the maximum diagonal length of the cross section of the die main body.
The utility model discloses design into regular polygon's symmetrical structure with the mould cross section, the resin sample after enabling the solidification directly grinds (section) to semiconductor device's viewing surface from one side, and be formed with the holding surface that is parallel to each other at the opposite side, be used for vertically putting the resin sample, the microscope of being convenient for observes the viewing surface of resin sample and product failure analysis, reduce unnecessary holding surface grinding time, use manpower sparingly, reduce the consumption of grinding abrasive paper and resin raw materials, effectively improve work efficiency.
Drawings
Fig. 1 is a perspective view of a dicing die for a semiconductor device according to the present invention;
fig. 2 is a perspective view of a resin sample formed by curing the dicing die for a semiconductor device according to the present invention.
In the figure, 1 mold body, 2 base, 3 resin sample.
Detailed Description
The invention will be further explained with reference to the drawings and the specific embodiments.
Referring to fig. 1 and 2, a dicing die for a semiconductor device includes a die main body 1 and a base 2; the die main body 1 is of a hollow columnar structure, the cross section of the die main body 1 is of a regular polygon structure, and the number of edges of the cross section of the die main body 1 is even; the mould main body 1 is longitudinally placed on the base 2, and the base 2 can completely cover the bottom opening of the mould main body 1; the semiconductor device was set in the mold body 1, and cured into a thick plate-like resin sample 3 by resin casting.
Preferably, the number of the edges of the cross section of the die body 1 is 8, the rectangular semiconductor device can be cured in the die body 1 to form the resin sample 3 with a regular octagonal structure, four observation surfaces of the semiconductor device are parallel to four edges of the die body 1, when the resin on one side of the resin sample 3 is ground to the observation surface of the semiconductor device, the observation surface is parallel to the edge on one side of the resin sample 3, the edge on the other side of the resin sample 3 can be directly used as a supporting surface and is parallel to the observation surface, the supporting surface is formed without special grinding, and manpower is greatly saved.
Preferably, the base 2 is a circular flat plate-shaped structure, the diameter of the base 2 is not less than the maximum diagonal length of the cross section of the die main body 1, so that the die main body 1 is completely covered by the base 2, resin curing operation of the semiconductor device in the die main body 1 is facilitated, formation of the resin sample 3 with a regular octagonal structure is facilitated, and resin does not leak out.
Preferably, the observation surface of the semiconductor device is parallel to the edge of the cross section of the mold body 1 during curing, so that the resin sample 3 has a support surface parallel to the observation surface when the observation surface of the mold body 1 is ground. The semiconductor device may also be placed and cured in any direction as required by subsequent inspection and analysis.
The utility model discloses a use method is:
the cross section of the die main body 1 is a regular octagon, the size of the regular octagon can be determined according to the size of a semiconductor device required to be cured, and the semiconductor device can be placed into the die main body 1 and completely cured in resin. The mold body 1 is placed on the base 2, and the bottom surface of the mold body 1 is closed by the base 2. The semiconductor device is placed on the base 2 and inside the mold body 1, with the multiple viewing surfaces of the semiconductor device as parallel as possible to the sides of the mold body 1 (i.e., the edges of the cross-section). By resin curing the semiconductor device, a resin sample 3 of a regular octagon was formed. The semiconductor device can be cured by a resin curing method in the prior art, and the details are not repeated here.
In the product failure analysis, one side of the resin sample 3 is ground to the observation surface of the semiconductor device, and the other side of the resin sample 3 is used as a supporting surface, because the resin sample 3 has a symmetrical structure and the supporting surface is parallel to the observation surface, when the resin sample 3 is vertically placed with the supporting surface as a bottom surface, the resin sample 3 keeps stable in the longitudinal direction, and the observation surface of the semiconductor device can face to the microscope, which is convenient for observing cracks and the like on the observation surface of the semiconductor device. When other observation surfaces are observed, the same grinding mode is adopted, and due to the regular octagonal structure of the resin sample 3, the relatively parallel supporting surfaces can be found in each grinding direction of the semiconductor device, so that the grinding time is reduced by half.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention, therefore, any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention should be included in the scope of the present invention.
Claims (4)
1. A slicing die for a semiconductor device is characterized in that: comprises a mould main body (1) and a base (2); the die main body (1) is of a hollow columnar structure, the cross section of the die main body (1) is of a regular polygon structure, and the number of edges of the cross section of the die main body (1) is even; the mould main body (1) is longitudinally placed on the base (2), and the base (2) can completely cover the bottom opening of the mould main body (1); the semiconductor device is arranged in a mold main body (1), and is cured into a thick plate-shaped resin sample (3) by resin casting.
2. The dicing die for semiconductor devices according to claim 1, wherein: the number of the cross section edges of the die main body (1) is 8.
3. The dicing die for semiconductor devices according to claim 1, wherein: the base (2) is of a circular flat structure.
4. The dicing die for semiconductor devices according to claim 3, wherein: the diameter of the base (2) is not less than the maximum diagonal length of the cross section of the die main body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120363996.8U CN214702966U (en) | 2021-02-09 | 2021-02-09 | Dicing die for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120363996.8U CN214702966U (en) | 2021-02-09 | 2021-02-09 | Dicing die for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214702966U true CN214702966U (en) | 2021-11-12 |
Family
ID=78567394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120363996.8U Active CN214702966U (en) | 2021-02-09 | 2021-02-09 | Dicing die for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214702966U (en) |
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2021
- 2021-02-09 CN CN202120363996.8U patent/CN214702966U/en active Active
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