CN214673844U - Cooling device for low-voltage switch cabinet - Google Patents
Cooling device for low-voltage switch cabinet Download PDFInfo
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- CN214673844U CN214673844U CN202121050516.9U CN202121050516U CN214673844U CN 214673844 U CN214673844 U CN 214673844U CN 202121050516 U CN202121050516 U CN 202121050516U CN 214673844 U CN214673844 U CN 214673844U
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- heat dissipation
- dissipation mechanism
- equipment cavity
- cabinet body
- fan
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Abstract
The utility model provides a heat sink for low-voltage switchgear, including the cabinet body, the base is installed to cabinet body lower part, cabinet body top is installed one-level heat dissipation mechanism, ventilation storehouse is installed to one-level heat dissipation mechanism lower part, install the control panel in the ventilation storehouse, be provided with upper apparatus chamber and lower apparatus chamber in the cabinet body, upper apparatus chamber is linked together with the ventilation storehouse, upper apparatus chamber both sides all are provided with the refrigeration storehouse, install second grade heat dissipation mechanism in the refrigeration storehouse, install the baffle between upper apparatus chamber and the lower apparatus chamber, install tertiary heat dissipation mechanism on the baffle and upper apparatus chamber is linked together through tertiary heat dissipation mechanism and lower apparatus chamber, lower apparatus chamber is linked together with the base, install the exhaust hole on the base; the utility model discloses a tertiary heat dissipation mechanism can adjust the heat dissipation degree according to the cabinet body temperature condition, has improved cabinet body radiating effect greatly.
Description
Technical Field
The utility model relates to a technical field of cubical switchboard especially relates to a heat sink for low-voltage switchgear.
Background
The low-voltage switch cabinet is mainly used for controlling and protecting a power system, the low-voltage switch can be operated through a power grid, then the operation needs to be input through a part of power equipment or some lines, or the low-voltage switch cabinet can be quitted from operation, and meanwhile, a fault part can be cut off in the power grid when a power fault occurs, so that the normal operation of the power grid is ensured; a large number of electric elements and connecting circuits in the low-voltage switch cabinet generate a large amount of heat after long-time operation, the accumulated heat is difficult to be dissipated to cause the temperature in the cabinet body to rise, and the electric elements which are kept in a high-temperature state for a long time are easy to generate electric fire, so that irrecoverable economic loss is caused.
SUMMERY OF THE UTILITY MODEL
To a large amount of electric elements and interconnecting link long-time operation production a large amount of heats in the present low-voltage switchgear, the heat that gathers is difficult to even the effluvium causes the internal portion temperature of cabinet to rise, keeps the electrical fire very easily to appear in high temperature state electric elements for a long time, causes the economic loss technical problem that can not retrieve, the utility model provides a heat sink for low-voltage switchgear.
In order to solve the above problem, the technical scheme of the utility model is so realized:
the cooling device for the low-voltage switch cabinet comprises a cabinet body, wherein a base is installed at the lower part of the cabinet body, a primary heat dissipation mechanism is installed at the top of the cabinet body, a ventilation bin is installed at the lower part of the primary heat dissipation mechanism, a control panel is installed in the ventilation bin, an upper equipment cavity and a lower equipment cavity are arranged in the cabinet body, the upper equipment cavity is communicated with the ventilation bin, a refrigeration bin is arranged on each of two sides of the upper equipment cavity, a secondary heat dissipation mechanism is installed in the refrigeration bin, a partition plate is installed between the upper equipment cavity and the lower equipment cavity, a tertiary heat dissipation mechanism is installed on the partition plate, the upper equipment cavity is communicated with the lower equipment cavity through the tertiary heat dissipation mechanism, the lower equipment cavity is communicated with the base, and an exhaust hole is installed in the base; the temperature monitoring assembly is installed in the upper equipment cavity or the lower equipment cavity, and the temperature monitoring assembly, the first-stage heat dissipation mechanism, the second-stage heat dissipation mechanism and the third-stage heat dissipation mechanism are all connected with the control panel.
Preferably, filter screens are installed on the refrigerating bin and the base.
Preferably, the one-level heat dissipation mechanism includes the one-level heat dissipation fan, and the one-level heat dissipation fan is installed and is installed the filter screen at cabinet body top and between one-level heat dissipation fan and the ventilation storehouse, and the one-level heat dissipation fan cooperatees with the second grade heat dissipation mechanism and the one-level heat dissipation fan is connected with the control panel.
Preferably, the second-stage heat dissipation mechanism comprises a semiconductor refrigeration piece, the semiconductor refrigeration piece is installed in the refrigeration bin, the heat dissipation end of the semiconductor refrigeration piece is located outside the cabinet body, the refrigeration end of the semiconductor refrigeration piece is located in the refrigeration bin, the semiconductor refrigeration piece is respectively matched with the first-stage heat dissipation mechanism and the third-stage heat dissipation mechanism, and the semiconductor refrigeration piece is connected with the control board.
Preferably, tertiary heat dissipation mechanism includes tertiary ventilating fan, and tertiary ventilating fan is installed on the baffle and tertiary ventilating fan and semiconductor refrigeration piece cooperate, and tertiary ventilating fan is connected with the control panel.
Preferably, the temperature monitoring subassembly includes temperature sensor, and temperature sensor installs in last equipment chamber or lower equipment intracavity and temperature sensor is connected with the control panel.
Preferably, a power supply and a controller are installed in the control panel, the power supply is connected with the controller, and the controller is respectively connected with a first-stage heat dissipation fan in the first-stage heat dissipation mechanism, a semiconductor refrigeration piece in the second-stage heat dissipation mechanism, a third-stage ventilation fan in the third-stage heat dissipation mechanism and a temperature sensor in the temperature monitoring assembly.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses a tertiary heat dissipation mechanism can adjust the heat dissipation degree according to cabinet body temperature condition, the cabinet body radiating effect has been improved greatly, through the internal temperature variation of temperature sensor real-time supervision cabinet when using, when the internal temperature of cabinet surpasses safe lower limit value, the controller at first controls the one-level heat dissipation mechanism and starts to carry out the ventilation cooling to the internal of cabinet, when the internal temperature of cabinet surpasses safe upper limit value, controller control one-level heat dissipation mechanism, second grade heat dissipation mechanism and tertiary heat dissipation mechanism start simultaneously and carry out quick cooling to the internal of cabinet, the normal operating environment of guarantee cubical switchboard.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic view of the internal structure of fig. 1.
1 is the cabinet body, 2 is the one-level heat dissipation fan, 3 is the semiconductor refrigeration piece, 5 is the filter screen, 6 is the ventilation storehouse, 7 is temperature sensor, 8 is the baffle, and 9 is tertiary ventilation fan.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without any creative effort belong to the protection scope of the present invention.
As shown in fig. 1, the cooling device for the low-voltage switch cabinet comprises a cabinet body 1, wherein a base is installed at the lower part of the cabinet body 1, a primary heat dissipation mechanism is installed at the top of the cabinet body 1, a ventilation bin 6 is installed at the lower part of the primary heat dissipation mechanism, a control panel is installed in the ventilation bin 6, an upper equipment cavity and a lower equipment cavity are arranged in the cabinet body 1, the upper equipment cavity is communicated with the ventilation bin 6, a refrigeration bin is arranged on each of two sides of the upper equipment cavity, filter screens 5 are installed on the refrigeration bin and the base, the filter screens in the ventilation bins are used for preventing external sundries from entering the interior of the cabinet body, a secondary heat dissipation mechanism is installed in the refrigeration bin, a partition plate 8 is installed between the upper equipment cavity and the lower equipment cavity, a tertiary heat dissipation mechanism is installed on the partition plate 8, the upper equipment cavity is communicated with the lower equipment cavity through the tertiary heat dissipation mechanism, the lower equipment cavity is communicated with the base, and an exhaust hole is installed on the base; go up the equipment chamber or install the temperature monitoring subassembly in the equipment chamber down, the temperature monitoring subassembly, one-level heat dissipation mechanism, second grade heat dissipation mechanism and tertiary heat dissipation mechanism all are connected with the control panel, the temperature monitoring subassembly includes temperature sensor 7, temperature sensor 7 installs at last equipment chamber or down equipment intracavity and temperature sensor 7 is connected with the control panel, install power and controller in the control panel, the power is connected with the controller, the controller respectively with one-level heat dissipation fan 2 in the one-level heat dissipation mechanism, semiconductor refrigeration piece 3 in the second grade heat dissipation mechanism, tertiary ventilation fan 9 in the tertiary heat dissipation mechanism and temperature sensor 7 in the temperature monitoring subassembly are connected.
As shown in fig. 2, the primary heat dissipation mechanism includes a primary heat dissipation fan 2, the primary heat dissipation fan 2 is installed at the top of the cabinet body 1, a filter screen 5 is installed between the primary heat dissipation fan 2 and the ventilation bin 6, the primary heat dissipation fan 2 is matched with the secondary heat dissipation mechanism, and the primary heat dissipation fan 2 is connected with the control panel; the secondary heat dissipation mechanism comprises a semiconductor refrigeration piece 3, the semiconductor refrigeration piece 3 is installed in the refrigeration bin, the heat dissipation end of the semiconductor refrigeration piece 3 is positioned outside the cabinet body 1, the refrigeration end of the semiconductor refrigeration piece 3 is positioned in the refrigeration bin, the semiconductor refrigeration piece 3 is respectively matched with the primary heat dissipation mechanism and the tertiary heat dissipation mechanism, and the semiconductor refrigeration piece 3 is connected with the control panel; the three-stage heat dissipation mechanism comprises a three-stage ventilating fan 9, the three-stage ventilating fan 9 is arranged on a partition plate 8, the three-stage ventilating fan 9 is matched with the semiconductor refrigerating sheet 3, the three-stage ventilating fan can quickly dissipate heat and ventilate in the cavity of the lower equipment and can also accelerate the air in the cavity of the upper equipment after being refrigerated by the semiconductor refrigerating sheet to enter the cavity of the lower equipment, the heat dissipation and refrigeration effect in the cabinet body is greatly improved, the three-stage ventilating fan 9 is connected with a control panel, the heat dissipation degree can be adjusted according to the temperature condition of the cabinet body through the three-stage heat dissipation mechanism, the heat dissipation effect of the cabinet body is greatly improved, the temperature change in the cabinet body is monitored in real time through a temperature sensor during use, when the temperature in the cabinet body exceeds a safe lower limit value, the controller firstly controls the first-stage heat dissipation mechanism to start up to ventilate and dissipate heat in the cabinet body, and when the temperature in the cabinet body exceeds a safe upper limit value, the controller controls the first-stage heat dissipation mechanism, the second-stage heat dissipation mechanism and the third-stage heat dissipation mechanism to start up to cool the cabinet body quickly, the normal operation environment of the switch cabinet is guaranteed.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A cooling device for a low-voltage switch cabinet comprises a cabinet body (1), wherein a base is installed at the lower part of the cabinet body (1), and the cooling device is characterized in that a primary heat dissipation mechanism is installed at the top of the cabinet body (1), a ventilation bin (6) is installed at the lower part of the primary heat dissipation mechanism, a control panel is installed in the ventilation bin (6), an upper equipment cavity and a lower equipment cavity are arranged in the cabinet body (1), the upper equipment cavity is communicated with the ventilation bin (6), cooling bins are respectively arranged on two sides of the upper equipment cavity, a secondary heat dissipation mechanism is installed in the cooling bins, a partition plate (8) is installed between the upper equipment cavity and the lower equipment cavity, a tertiary heat dissipation mechanism is installed on the partition plate (8), the upper equipment cavity is communicated with the lower equipment cavity through the tertiary heat dissipation mechanism, the lower equipment cavity is communicated with the base, and an exhaust hole is installed on the base; the temperature monitoring assembly is installed in the upper equipment cavity or the lower equipment cavity, and the temperature monitoring assembly, the first-stage heat dissipation mechanism, the second-stage heat dissipation mechanism and the third-stage heat dissipation mechanism are all connected with the control panel.
2. The cooling device for low-voltage switchgear cabinets according to claim 1, wherein the cooling compartment and the base are both provided with a filter screen (5).
3. The cooling device for the low-voltage switch cabinet according to claim 1, wherein the primary heat dissipation mechanism comprises a primary heat dissipation fan (2), the primary heat dissipation fan (2) is installed at the top of the cabinet body (1), a filter screen (5) is installed between the primary heat dissipation fan (2) and the ventilation bin (6), the primary heat dissipation fan (2) is matched with the secondary heat dissipation mechanism, and the primary heat dissipation fan (2) is connected with the control panel.
4. The cooling device for the low-voltage switch cabinet according to claim 1 or 3, wherein the secondary cooling mechanism comprises a semiconductor refrigeration piece (3), the semiconductor refrigeration piece (3) is installed in the refrigeration bin, the cooling end of the semiconductor refrigeration piece (3) is located outside the cabinet body (1), the cooling end of the semiconductor refrigeration piece (3) is located in the refrigeration bin, the semiconductor refrigeration piece (3) is respectively matched with the primary cooling mechanism and the tertiary cooling mechanism, and the semiconductor refrigeration piece (3) is connected with the control panel.
5. The cooling device for the low-voltage switch cabinet according to claim 4, wherein the three-level heat dissipation mechanism comprises a three-level ventilating fan (9), the three-level ventilating fan (9) is installed on the partition plate (8), the three-level ventilating fan (9) is matched with the semiconductor refrigerating sheet (3), and the three-level ventilating fan (9) is connected with the control panel.
6. The cooling device for the low-voltage switch cabinet according to claim 1, wherein the temperature monitoring assembly comprises a temperature sensor (7), the temperature sensor (7) is installed in an upper equipment cavity or a lower equipment cavity, and the temperature sensor (7) is connected with the control board.
7. The cooling device for the low-voltage switch cabinet according to claim 1, 3, 5 or 6, wherein a power supply and a controller are installed in the control panel, the power supply is connected with the controller, and the controller is respectively connected with the primary heat dissipation fan (2) in the primary heat dissipation mechanism, the semiconductor refrigeration sheet (3) in the secondary heat dissipation mechanism, the tertiary ventilation fan (9) in the tertiary heat dissipation mechanism and the temperature sensor (7) in the temperature monitoring assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121050516.9U CN214673844U (en) | 2021-05-17 | 2021-05-17 | Cooling device for low-voltage switch cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121050516.9U CN214673844U (en) | 2021-05-17 | 2021-05-17 | Cooling device for low-voltage switch cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214673844U true CN214673844U (en) | 2021-11-09 |
Family
ID=78484539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121050516.9U Active CN214673844U (en) | 2021-05-17 | 2021-05-17 | Cooling device for low-voltage switch cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214673844U (en) |
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2021
- 2021-05-17 CN CN202121050516.9U patent/CN214673844U/en active Active
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