CN214673084U - Connecting module and equipment - Google Patents

Abstract

The present disclosure relates to a connection module and an apparatus. This connection module includes: the connecting module comprises a conductive bracket, wherein two ends of the conductive bracket are provided with metal pins which are used for fixing the connecting module on a mounting position and are grounded; the insulating plate is fixed between the two ends of the conductive bracket and is provided with a through hole; and the connecting terminal penetrates through the through hole of the insulating plate and is separated from the conductive support. This connection module passes through the insulation board and keeps apart conductive support and connecting terminal to be connected through metal pin ground connection, make conductive support form the electrically conductive electrostatic shield to connecting terminal, thereby wholly improve the power supply performance of connection module.

Description

Connecting module and equipment

Technical Field

The present disclosure relates to the field of electronic technologies, and in particular, to a connection module and a device.

Background

With the development of electronic technology, more and more electronic products are provided. The types of electronic products are also increasing. However, any electronic product needs a power supply to supply power, and particularly, the electronic product serving as the mobile terminal cannot be powered by the power supply. However, due to the distribution of circuit modules in product design, the power supply of some electronic products cannot be directly connected to the functional circuit board, so that the power supply cannot directly supply power to the electronic products.

Disclosure of Invention

The present disclosure provides a connection module and an apparatus.

In a first aspect of the embodiments of the present disclosure, a connection module is provided, which includes:

the connecting module comprises a conductive bracket, a connecting module and a connecting module, wherein two ends of the conductive bracket are provided with metal pins, and the metal pins are used for fixing the connecting module on a mounting position and grounding;

the insulating plate is fixed between the two ends of the conductive bracket; the insulating plate is provided with a through hole;

and the connecting terminal penetrates through the through hole and is separated from the conductive support.

In some embodiments, the metal pins are DIP dual in-line package pins.

In some embodiments, the metal pins are two and are respectively arranged at two opposite ends of the conductive bracket.

In some embodiments, the insulating plate further has a plurality of fixing grooves connected in one-to-one correspondence to the through holes;

the connecting terminal is the T type, includes: a first portion and a second portion, the second portion being fixed at an intermediate position of the first portion, wherein:

the second part is fixed in the fixing groove;

the first portion is disposed through the through hole.

In some embodiments, a plurality of the connection terminals are equally spaced on the insulating plate.

In some embodiments, the pitch between adjacent connection terminals has a first threshold.

In some embodiments, the length of the connection terminal in the through hole in the first direction of extension of the insulating plate plane has a second threshold value, and the length of the connection terminal in the through hole in the second direction of extension of the insulating plate plane has a third threshold value; wherein the first extending direction and the second extending direction are two different directions extending along the plane of the insulating plate.

In a second aspect of the embodiments of the present disclosure, an apparatus is provided, which includes a circuit board, a battery, and the connection module of the first aspect of the embodiments; the connecting module is fixed on the circuit board through a metal pin and electrically connected with a grounding layer of the circuit board, and a connecting terminal of the connecting module is electrically connected with a power supply interface of the battery.

In some embodiments, the circuit board has a conductive hole conductively connected to the ground layer, and the metal pin is inserted into the conductive hole to be fixed to the circuit board and conductively connected to the conductive hole.

In some embodiments, the circuit board has a connection point electrically connected to the connection terminal, and the connection terminal and the connection point are soldered by an SMT surface soldering process.

In some embodiments, the connection terminal includes a first connection end and a second connection end, the first connection end and the second connection end being two opposite connection end points on the connection terminal, wherein:

the first connecting end and the second connecting end are distributed on different sides of the insulating plate,

the first connecting end is connected with the connecting point of the circuit board, and the second connecting end is used for being connected with a power supply.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

the connection module that this disclosed embodiment provided includes: the conductive support, wherein, the direction of both ends orientation installation position of the conductive support extends and has the metal pin used for fixing the connection module on the installation position and earthing; the insulating plate is fixed between the two ends of the conductive bracket and is provided with a through hole; and the connecting terminal penetrates through the through hole of the insulating plate and is separated from the conductive support. This connection module passes through the insulation board and keeps apart conductive support and connecting terminal to be connected through metal pin ground connection, make conductive support form the electrically conductive electrostatic shield to connecting terminal, thereby wholly improve the power supply performance of connection module.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a first schematic structural diagram illustrating a connection module according to an exemplary embodiment.

Fig. 2 is a schematic structural diagram of a connection module according to an exemplary embodiment.

Fig. 3 is a schematic structural diagram three of a connection module according to an exemplary embodiment.

Fig. 4 is a fourth schematic structural diagram illustrating a connection module according to an exemplary embodiment.

Fig. 5 is a schematic structural diagram of a connection module according to an exemplary embodiment.

Fig. 6 is a sixth schematic structural diagram illustrating a connection module according to an exemplary embodiment.

Fig. 7 is a schematic diagram illustrating an application of a connection module according to an exemplary embodiment.

Fig. 8 is a seventh schematic structural diagram illustrating a connection module according to an exemplary embodiment.

Fig. 9 is a schematic diagram eight illustrating a structure of a connection module according to an exemplary embodiment.

Fig. 10 is a schematic diagram illustrating another connection module according to an exemplary embodiment.

FIG. 11 is a block diagram illustrating an electronic device in accordance with an example embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.

With the development of electronic technology, more and more electronic products are provided. The types of electronic products are also increasing. However, any electronic product needs a power supply to supply power, and particularly, the electronic product serving as the mobile terminal cannot be powered by the power supply. However, due to the distribution of circuit modules in product design, the power supply of some electronic products cannot be directly connected to the functional circuit board, so that the power supply cannot directly supply power to the electronic products. Such as a notebook computer. The notebook computer has a large-capacity lithium battery as a power supply to supply power to a hardware circuit.

The present disclosure provides a connection module. Fig. 1 is a first schematic structural diagram illustrating a connection module according to an exemplary embodiment. Fig. 2 is a schematic structural diagram of a connection module according to an exemplary embodiment. As shown in fig. 1 and 2, the connection module includes:

the connecting module comprises a conductive bracket 10, wherein two ends of the conductive bracket 10 are provided with metal pins 13, and the metal pins 13 are used for fixing the connecting module on a mounting position and grounding;

an insulating plate 11 fixed between both ends of the conductive bracket 10; the insulating plate 11 is provided with a through hole;

and a connection terminal 12 penetrating the through hole and separated from the conductive bracket 10.

In the embodiment of the present disclosure, the conductive bracket 10 may have conductivity, and may be made of a conductive material, such as a metal material (e.g., steel alloy). The conductive bracket 10 may be a U-shaped bracket and the mounting location may be a ground mounting location on the circuit board. When the support is installed, the U-shaped opening of the U-shaped support faces the circuit board, and the two U ends of the support are fixedly installed in contact with the circuit board. And the two U ends can be led out to form metal pins 13 which are fixed with the mounting positions of the circuit board. The two ends of the conductive support 10 extending out of the metal pins may have a certain distance therebetween. The insulating plate is fixed in the interval between both ends. The space can be as large as possible under the condition that the metal pins are fixed at the mounting positions, so that the contact area of the fixed insulating plate 11 is increased, and the whole connecting module is stable in whole structure.

In the embodiment of the present disclosure, the insulating plate 11 may be made of plastic material and has insulating properties. The insulating plate 11 has at least one through hole. The insulating plate 11 has at least a certain thickness to stabilize the connecting terminal 12 when the connecting terminal 12 is inserted into the through hole. The connection terminals 12 are separated from the conductive support 10 by an insulating plate 11.

In the embodiment of the present disclosure, the metal pin 13 may be a portion of the conductive bracket 10 itself, and may have a structure with a certain height, such as a cylindrical shape or a rectangular parallelepiped shape, so as to be fixed to the mounting position. For example, when the mounting site is a hole-shaped structure, the metal pin 13 structure having a certain height facilitates insertion into the hole for mounting.

In the embodiment of the present disclosure, the connection terminal 12 may be a conductive structure, and may be made of a conductive material, for example, a metal material including a metal such as copper, which is easy to be conductive and has small impedance. After the connection terminal 12 is inserted into the through hole, two connection terminals can be formed, which can be used for connecting the current input and the current output respectively.

In the embodiment of the present disclosure, the connection module includes: the connecting module comprises a conductive bracket 10, wherein metal pins 13 which are used for fixing the connecting module on a mounting position and are grounded extend from two ends of the conductive bracket 10 towards the direction of the mounting position; an insulating plate 11 fixed between both ends of the conductive support 10 and having a through hole; and a connection terminal 12 inserted into the through hole of the insulating plate 11 and separated from the conductive bracket 10. The connection module isolates the conductive support 10 from the connection terminal 12 through the insulating plate 11 and is connected to the ground through the metal pin 13, so that the conductive support 10 forms an electrostatic shield for conducting electricity to the connection terminal 12, and the power supply performance of the connection module is integrally improved.

In some embodiments, the metal pins 13 are DIP dual in-line package pins.

In the embodiment of the present disclosure, the metal pin 13 may be a DIP pin led out after dual in-line package is performed on the connection module. In the installation position of DIP pin plug-in hole shape, can improve the joint strength who connects module and installation position, it is much higher than the joint strength who forms through SMT (Surface Mount Technology, Surface welding technique) welding for product plug stability is better.

In some embodiments, as shown in fig. 1 and 2, the metal pins 13 are two and are respectively disposed at two opposite ends of the conductive support 10.

In the embodiment of the present disclosure, two metal pins 13 may be led out from two ends of the conductive bracket 10 contacting the mounting location, and distributed at two opposite ends of the conductive bracket 10 to achieve balanced distribution, so that the connection module is more stably mounted at the mounting location.

In some embodiments, the insulating plate 11 further has a plurality of fixing grooves 14 connected in one-to-one correspondence with the through holes;

the connection terminal 12 is of a T-shape and includes: a first portion and a second portion, the second portion being secured at an intermediate position of the first portion, wherein:

the second part is fixed in the fixing groove 14;

the first part is arranged in the through hole in a penetrating mode.

In the embodiment of the present disclosure, fig. 3 is a schematic structural diagram three of a connection module according to an exemplary embodiment. As shown in fig. 3, in order to increase the stability of the connection terminal 12 on the insulating plate 11, fixing grooves 14 are formed on the insulating plate 11 at the periphery of the connection through-hole, and the fixing grooves 14 are directly connected to the through-hole. The connection terminal 12 may be a T-type terminal. When the T-shaped terminal is placed vertically, the first portion may be a lateral portion of the terminal and the second portion may be a longitudinal portion of the terminal.

In the embodiment of the present disclosure, the fixing groove 14 may be a longitudinally formed groove, a transversely formed groove, or another circumferentially formed groove. However, the length of the fixing groove 14 may be set so as not to contact the through hole at the adjacent position. I.e. the first fixing groove 14 is connected with only one through hole.

In the embodiment of the present disclosure, when the first portion of the connection terminal 12 is inserted into the through hole, the second portion of the connection terminal 12 is fixed in the fixing groove 14, thereby improving the stability of the connection terminal 12 on the insulating plate 11.

In some embodiments, as shown in fig. 3, a plurality of connection terminals 12 are equally spaced on the insulating plate 11.

In the present embodiments, when the plurality of connection terminals 12 are provided on the insulating plate 11, the connection terminals 12 are equally spaced apart from each other.

In other embodiments, the plurality of connection terminals 12 on the insulating plate 11 may be equally spaced or unequally spaced on the insulating plate 11, depending on the distribution of terminals on the structure to be connected.

In some embodiments, the pitch between adjacent connection terminals 12 has a first threshold.

In the embodiment of the present disclosure, the first threshold of the distance between the adjacent connection terminals 12 is between 1mm and 2mm, and may be 1.25 mm. Under the condition of meeting the requirement of miniaturization of the connection module, in order to increase the connection quantity of the connection terminals 12, the distance between the connection terminals 12 can be properly adjusted, so as to improve the overall power supply efficiency of the connection module.

In some embodiments, the length of the connection terminal 12 in the through hole along the first direction of extension of the plane of the insulating plate 11 has a second threshold value, and the length of the connection terminal 12 in the through hole along the second direction of extension of the plane of the insulating plate 11 has a third threshold value; wherein the first and second extension directions are two different directions extending along the plane of the insulating plate 11.

In the embodiment of the present disclosure, fig. 4 is a schematic structural diagram of a connection module according to an exemplary embodiment. As shown in fig. 4, the length 32 of the connection terminal 12 in the through hole in the first extension direction of the plane of the insulating plate 11 may be understood as the width of the terminal for transmitting current in the connection terminal 12. The width has a second threshold value, which is between 0.6mm and 1.2mm, and a specific value may be 0.9 mm. The length 31 of the connection terminal 12 in the through hole in the second direction of extension of the plane of the insulating plate 11 can be understood as the thickness of the terminal for transmitting current in the connection terminal 12. The thickness has a third threshold value, which is between 0.2mm and 0.4mm, and a specific value may be 0.3 mm.

In the embodiment of the present disclosure, the width and thickness of the connection terminal 12 are increased appropriately to meet the requirement of miniaturization of the connection module, so as to effectively increase the current intensity passing through the connection terminal 12, thereby improving the power supply performance of the connection module.

The embodiment of the present disclosure further provides a device, which includes a circuit board, a battery, and the connection module of the above embodiment; the connection module is fixed on the circuit board through a metal pin 13 and electrically connected with a ground layer of the circuit board, and a connection terminal of the connection module is electrically connected with a power supply interface of the battery.

The device in the embodiment of the disclosure may have a circuit board and a connection module connected to the circuit board, where the connection module is used to receive power supplied by an external power supply. The metal pins 13 of the connection module are fixed on the circuit board and connected with the grounding layer of the circuit board, so as to supply power to the circuit board and realize grounding. The equipment with the connecting module can be directly connected with the external power supply so as to obtain the electric quantity supply of the external power supply.

In some embodiments, the circuit board has a conductive hole for electrically connecting to the ground layer, and the metal pin 13 is inserted into the conductive hole to be fixed to the circuit board and contact with the conductive hole to form an electrical connection.

In the embodiment of the disclosure, when the connection module is connected to the circuit board, the mounting position on the circuit board may be a conductive hole conductively connected to the ground layer. The metal pins 13 of the connection module can be inserted into the conductive holes to be embedded with the conductive holes, so as to be fixed with the circuit board and be grounded through the conductive holes.

In some embodiments, the circuit board has a connection point electrically connected to the connection terminal 12, and the connection terminal 12 and the connection point are soldered by an SMT surface soldering process.

In the embodiment of the present disclosure, a connection point of the circuit board electrically connected to the connection terminal 12 may have a conductive pad, and a connection end of the connection terminal 12 connected to the circuit board may be soldered to the conductive pad of the connection point of the circuit board by an SMT mounting method. Through SMT mounting mode, the miniaturization of pad packaging on the circuit board is facilitated.

In some embodiments, as shown in fig. 4, the connection terminal 12 includes a first connection end 33 and a second connection end 34, the first connection end 33 and the second connection end being two opposite connection end points on the connection terminal 12, wherein:

the first connection end 33 and the second connection end are distributed on different sides of the insulating plate 11,

the first connection end 33 is connected to a connection point of the circuit board and the second connection end is used for connection to a power supply.

In the embodiment of the present disclosure, after the connection terminal 12 is inserted into the through hole, two connection terminals, namely the first connection terminal 33 and the second connection terminal, may be formed on different sides of the insulation board 11. When there is an application, the first connection end 33 is connected to a connection point of a circuit board, and the second connection is available for connection to a power supply. The power supply current of the power supply is input from the second connection terminal and output from the first connection terminal 33 to the circuit board. The width and thickness of the terminal portion of the second connection terminal can be properly larger than the thickness of the width of the terminal portion of the first connection terminal 33, so as to ensure that the connection module can bear larger power supply current. When using, can set up a plurality of connecting terminal 12 on the insulation board 11 of connection module to form at the second link and arrange the terminal, the power supply interface department of power can set up the electric current output terminal who matches with the range terminal of second link, thereby realizes that the power supply interface and the second link of power match.

In some embodiments, fig. 5 is a schematic structural diagram of a connection module according to an exemplary embodiment. As shown in fig. 5, when the connection module is connected to the circuit board, the bottom of the connection terminal 12 connected to the circuit board of the connection terminal 12 and the bottom end surfaces 52 and 53 of the conductive support 10 extending out of the two ends of the metal pin 13 can be used as a common support plane to support the connection module, so that the connection module achieves a good balance effect.

In some embodiments, fig. 6 is a sixth schematic structural view illustrating a connection module according to an exemplary embodiment. As shown in fig. 6, when the connection module is connected to the circuit board, the positions of the circuit board corresponding to the bottom end surfaces 71 of the two ends of the conductive support 10 extending out of the metal pins 13 are electrical wiring areas. In order not to affect the wiring of the circuit board, a gap is left between the bottom end surface 72 of the conductive support 10 and the circuit board, so that the potential risk of electrical short circuit caused by the contact between the bottom end surface 72 and the circuit board is reduced.

In some embodiments, fig. 7 is a schematic diagram illustrating an application of a connection module according to an exemplary embodiment. As shown in fig. 7, the connection module 1 may be integrated in the notebook 2, a first connection end of the connection module is connected to a circuit board of the notebook 2, and a second connection end of the connection module is connected to a power supply interface of the lithium battery 3, so that the lithium battery 3 integrated in the notebook 1 supplies power to the circuit board.

In some embodiments, fig. 8 is a seventh structural diagram illustrating a connection module according to an exemplary embodiment. As shown in fig. 8, when the connection module is connected to the power supply interface of the power supply, in order to increase the connection stability, a slot and an elastic wall 63 may be disposed on the end surfaces 61 at the two ends of the conductive bracket 10 of the connection module, for matching with the power supply interface of the power supply, so as to provide a suitable insertion and extraction force for the interface connection. After the connection is successful, the connection terminal 12 is inserted into the power supply interface to perform safe power transmission.

In some embodiments, fig. 9 is a schematic structural diagram eight illustrating a connection module according to an exemplary embodiment. As shown in fig. 9, the metal pins 13 of the connection module can be further arranged in 4 numbers without affecting the wiring of the circuit board, so as to enhance the connection stability between the connection module and the circuit board.

Fig. 10 is a schematic diagram illustrating another connection module according to an exemplary embodiment. As shown in fig. 10, the present application further provides another connection module fixed to a circuit board by using an SMT mounting method, in which the metal pins 13 are eliminated, and the connection module is soldered to the circuit board by using a patch 21/22. However, the connection mode is not good in stability of a DIP inserting and fixing mode.

FIG. 11 is a block diagram illustrating an electronic device in accordance with an example embodiment. For example, the electronic device may be a notebook computer, a mobile phone, a tablet computer, and the like.

Referring to fig. 11, the electronic device may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input/output (I/O) interface 812, a sensor component 814, and a communication component 816.

The processing component 802 generally controls overall operation of the electronic device, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing components 802 may include one or more processors 820 to execute instructions to perform all or a portion of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interaction between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

The memory 804 is configured to store various types of data to support operations at the electronic device. Examples of such data include instructions for any application or method operating on the electronic device, contact data, phonebook data, messages, pictures, videos, and so forth. The memory 804 may be implemented by any type or combination of volatile or non-volatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.

The power components 806 provide power to various components of the electronic device. The power components 806 may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power for electronic devices.

The multimedia component 808 includes a screen that provides an output interface between the electronic device and the user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundary of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front facing camera and/or a rear facing camera. The front camera and/or the rear camera may receive external multimedia data when the electronic device is in an operating mode, such as a shooting mode or a video mode. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive external audio signals when the electronic device is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may further be stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.

The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to: a home button, a volume button, a start button, and a lock button.

The sensor assembly 814 includes one or more sensors for providing various aspects of state assessment for the electronic device. For example, the sensor assembly 814 may detect an open/closed state of the electronic device, the relative positioning of components, such as a display and keypad of the electronic device, the sensor assembly 814 may also detect a change in the position of the electronic device or a component of the electronic device, the presence or absence of user contact with the electronic device, orientation or acceleration/deceleration of the electronic device, and a change in the temperature of the electronic device. Sensor assembly 814 may include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

The communication component 816 is configured to facilitate wired or wireless communication between the electronic device and other devices. The electronic device may access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, communications component 816 further includes a Near Field Communications (NFC) module to facilitate short-range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, Ultra Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

In an exemplary embodiment, the electronic device may be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, microprocessors or other electronic components for performing the above-described methods.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims (11)

1. A battery connection module, comprising:

the connecting module comprises a conductive bracket, a connecting module and a connecting module, wherein two ends of the conductive bracket are provided with metal pins, and the metal pins are used for fixing the connecting module on a mounting position and grounding;

the insulating plate is fixed between the two ends of the conductive bracket; the insulating plate is provided with a through hole;

and the connecting terminal penetrates through the through hole and is separated from the conductive support.

2. The connection module according to claim 1, wherein the metal pins are dual in-line package pins.

3. The connection module according to claim 1 or 2, wherein the two metal pins are respectively disposed at two opposite ends of the conductive support.

4. The connection module according to claim 1, wherein the insulating plate further has a plurality of fixing grooves connected in one-to-one correspondence to the through holes;

the connecting terminal is the T type, includes: a first portion and a second portion, the second portion being fixed at an intermediate position of the first portion, wherein:

the second part is fixed in the fixing groove;

the first portion is disposed through the through hole.

5. The connection module according to claim 4, wherein the plurality of connection terminals are equally spaced on the insulating plate.

6. The connection module according to claim 4, wherein a pitch between adjacent connection terminals has a first threshold.

7. The connection module according to claim 4, wherein the length of the connection terminal in the through hole along the first direction of extension of the plane of the insulating plate has a second threshold value, and the length of the connection terminal in the through hole along the second direction of extension of the plane of the insulating plate has a third threshold value; wherein the first extending direction and the second extending direction are two different directions extending along the plane of the insulating plate.

8. An electronic device, comprising:

a circuit board, a battery, and the connection module of any one of claims 1-7; the connecting module is fixed on the circuit board through a metal pin and electrically connected with a grounding layer of the circuit board, and a connecting terminal of the connecting module is electrically connected with a power supply interface of the battery.

9. The connector module according to claim 8, wherein the circuit board has a conductive hole electrically connected to the ground layer, and the metal pin is inserted into the conductive hole to be fixed to the circuit board and electrically connected to the conductive hole.

10. The connection module according to claim 8, wherein the circuit board has connection points electrically connected to the connection terminals, and the connection terminals and the connection points are soldered by a surface soldering process.

11. The connection module according to claim 10, wherein the connection terminal comprises a first connection end and a second connection end, the first connection end and the second connection end being two opposite connection end points on the connection terminal, wherein:

the first connecting end and the second connecting end are distributed on different sides of the insulating plate,

the first connecting end is connected with the connecting point of the circuit board, and the second connecting end is used for being connected with a power supply.

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