CN214638692U - Post-etching cleaning device for manufacturing semiconductor chip - Google Patents
Post-etching cleaning device for manufacturing semiconductor chip Download PDFInfo
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- CN214638692U CN214638692U CN202023289721.9U CN202023289721U CN214638692U CN 214638692 U CN214638692 U CN 214638692U CN 202023289721 U CN202023289721 U CN 202023289721U CN 214638692 U CN214638692 U CN 214638692U
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Abstract
The utility model relates to a chip manufacture equipment technical field, and a semiconductor chip makes with belt cleaning device after etching is disclosed, including ultrasonic cleaner, a plurality of dead levers of ultrasonic cleaner's outer wall fixedly connected with, the common fixedly connected with reservoir of pole wall of a plurality of dead levers, the through-hole has been seted up to the lower surface of reservoir, and the fixed pipe of pore wall fixedly connected with of through-hole, the inner wall fixedly connected with electric putter of fixed pipe, electric putter's bottom fixedly connected with U-shaped board, the outer wall fixedly connected with net frame of U-shaped board, a plurality of partition otter boards of inner wall fixedly connected with of net frame, the lower fixed surface of reservoir is connected with hollow plate, hollow plate's lower fixed surface intercommunication has a plurality of shower heads. The utility model discloses make semiconductor chip etching back belt cleaning device have secondary and wash and dry function, improved semiconductor chip abluent effect in belt cleaning device, improved semiconductor chip's manufacturing quality simultaneously.
Description
Technical Field
The utility model relates to a chip manufacture equipment technical field especially relates to a semiconductor chip makes with belt cleaning device after etching.
Background
Etching is a technique for removing materials by using a chemical reaction or a physical impact effect, and refers to removing a protective film of an area to be etched after exposure plate making and development, and contacting a chemical solution during etching to achieve the effect of dissolution and corrosion and form a concave-convex or hollow-out molding effect, and is widely applied to semiconductor chip manufacturing and circuit board manufacturing.
The existing semiconductor chip is not completely cleaned in the cleaning process after etching, impurities mixed in cleaning liquid after cleaning can still be attached to the surface of the semiconductor chip, the cleaning effect of a semiconductor chip cleaning device is influenced, and the manufacturing quality of the semiconductor chip is even influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving among the prior art semiconductor chip and having the incomplete condition of washing in the cleaning process after the etching, thoughtlessly there is impurity in the washing back washing liquid still can adhere to on the semiconductor chip surface, influences semiconductor chip belt cleaning device's cleaning performance, can influence the problem that semiconductor chip made the quality even, and the semiconductor chip makes with post-etch belt cleaning device who provides.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a post-etching cleaning device for manufacturing a semiconductor chip comprises an ultrasonic cleaning machine, wherein a plurality of fixing rods are fixedly connected to the outer wall of the ultrasonic cleaning machine, a liquid storage tank is fixedly connected to the rod wall of the fixing rods jointly, a through hole is formed in the lower surface of the liquid storage tank, a fixing pipe is fixedly connected to the hole wall of the through hole, an electric push rod is fixedly connected to the inner wall of the fixing pipe, a U-shaped plate is fixedly connected to the bottom end of the electric push rod, a net frame is fixedly connected to the outer wall of the U-shaped plate, a plurality of partition net plates are fixedly connected to the inner wall of the net frame, a hollow plate is fixedly connected to the lower surface of the liquid storage tank, a plurality of spray heads are fixedly communicated with the lower surface of the hollow plate, a water pump is fixedly connected to the inner wall of the liquid storage tank, a connecting pipe is fixedly communicated with the output end of the water pump, and the output end of the connecting pipe penetrates through the lower surface of the liquid storage tank to be fixedly communicated with the outer wall of the hollow plate, the outer wall of one of the fixed rods is fixedly connected with a drying mechanism.
Preferably, dry mechanism include with dead lever outer wall fixed connection's heating cabinet and hollow piece, fixing hole has been seted up to the upper surface of heating cabinet, and fixing hole's pore wall fixedly connected with hair-dryer, a plurality of heating pipes of inner wall fixedly connected with of heating cabinet, the lower fixed surface intercommunication of heating cabinet has communicating pipe, the output of communicating pipe and the fixed intercommunication of the outer wall of hollow piece, it has the blast pipe to be close to one side fixed intercommunication a plurality of net frame for hollow piece.
Preferably, a plurality of supporting legs are fixedly connected to the lower surface of the ultrasonic cleaning machine.
Preferably, the upper surface of the screen frame and the lower surface of the spray header are on the same vertical axis.
Preferably, the outer wall of the top end of the fixed pipe is movably sleeved with a cover plate, and the lower surface of the cover plate is movably connected with the upper surface of the liquid storage tank.
Preferably, an overflow pipe is fixedly communicated with the side wall of the ultrasonic cleaning machine.
Compared with the prior art, the utility model provides a semiconductor chip makes with etching back belt cleaning device possesses following beneficial effect:
1. the post-etching cleaning device for manufacturing the semiconductor chip is provided with a liquid storage tank, a water pump cleaning machine and an electric push rod, when the etched semiconductor chip needs to be cleaned, cleaning liquid is filled into the ultrasonic cleaning machine and the liquid storage tank firstly, then the semiconductor chip is placed on a net frame and is separated by a separation net plate, then the electric push rod is started, the electric push rod stretches the semiconductor chip in the net frame into the cleaning liquid in the ultrasonic cleaning machine through a U-shaped plate and starts the ultrasonic cleaning machine, the cleaning effect of the semiconductor chip is ensured by utilizing the high-frequency vibration of the ultrasonic cleaning machine, after the cleaning is finished, the electric push rod drives the semiconductor chip in the net frame to rise, then the water pump is started, the clean cleaning liquid in the liquid storage tank is sprayed onto the semiconductor chip through a connecting pipe and a spray head by the water pump, and the secondary cleaning is carried out on the semiconductor chip, the mechanism can ensure that the cleaning device has the function of secondary cleaning after the semiconductor chip is etched, improve the cleaning effect of the semiconductor chip in the cleaning device and improve the manufacturing quality of the semiconductor chip.
2. This semiconductor chip makes and uses washing unit after etching, through being provided with the heating pipe, hair-dryer and communicating pipe, after semiconductor chip washs and finishes, through starting heating pipe and hair-dryer, the heating pipe makes the inside temperature of heating cabinet rise, after the hair-dryer carries the heating cabinet internal heating to the outside air, the air after the heating passes through communicating pipe, hollow block and blast pipe spout to semiconductor chip, the hot-air dries semiconductor chip, this mechanism makes semiconductor chip etching back washing unit have the hot air drying function, avoid other magazines to be on semiconductor chip surface through the washing liquid is attached to, abluent quality after semiconductor chip etching has been ensured.
The part that does not relate to among the device all is the same with prior art or can adopt prior art to realize, the utility model discloses make semiconductor chip etching back belt cleaning device have secondary washing and dry function, improved semiconductor chip abluent effect in belt cleaning device, improved semiconductor chip's manufacturing quality simultaneously.
Drawings
Fig. 1 is a schematic structural diagram of a post-etching cleaning apparatus for manufacturing a semiconductor chip according to the present invention;
fig. 2 is a schematic structural diagram of a part a of a post-etching cleaning apparatus for manufacturing a semiconductor chip according to the present invention.
In the figure: 1 ultrasonic cleaner, 2 dead levers, 3 reservoir, 4 fixed pipes, 5 electric putter, 6U-shaped boards, 7 screen frames, 8 partition otter boards, 9 drying mechanism, 91 heating cabinet, 92 hollow block, 93 hair-dryers, 94 heating pipes, 95 communicating pipe, 96 blast pipe, 10 hollow board, 11 shower head, 12 water pump, 13 connecting pipes, 14 supporting legs, 15 apron, 16 overflow pipes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1-2, a post-etching cleaning device for semiconductor chip manufacturing, comprising an ultrasonic cleaning machine 1, wherein the outer wall of the ultrasonic cleaning machine 1 is fixedly connected with a plurality of fixing rods 2, the rod walls of the plurality of fixing rods 2 are fixedly connected with a liquid storage tank 3 together, the lower surface of the liquid storage tank 3 is provided with a through hole, the hole wall of the through hole is fixedly connected with a fixing pipe 4, the inner wall of the fixing pipe 4 is fixedly connected with an electric push rod 5, the bottom end of the electric push rod 5 is fixedly connected with a U-shaped plate 6, the outer wall of the U-shaped plate 6 is fixedly connected with a net frame 7, the inner wall of the net frame 7 is fixedly connected with a plurality of partition net plates 8, the lower surface of the liquid storage tank 3 is fixedly connected with a hollow plate 10, the lower surface of the hollow plate 10 is fixedly communicated with a plurality of spray heads 11, the inner wall of the liquid storage tank 3 is fixedly connected with a water pump 12, the output end of the water pump 12 is fixedly communicated with a connecting pipe 13, the output end of the connecting pipe 13 passes through the lower surface of the liquid storage tank 3 and is fixedly communicated with the outer wall of the hollow plate 10, the outer wall of one of the fixing rods 2 is fixedly connected with a drying mechanism 9.
A plurality of support legs 14 are fixedly connected to the lower surface of the ultrasonic cleaning machine 1.
The upper surface of the screen frame 7 and the lower surface of the spray head 11 are positioned on the same vertical axis, so that the cleaning liquid sprayed by the spray head 11 can clean the semiconductor chip in the screen frame 7.
The apron 15 has been cup jointed in the top outer wall activity of fixed pipe 4, and the lower surface of apron 15 and the upper surface swing joint of reservoir 3, apron 15 can prevent that the dust from falling into in the reservoir 3 washing liquid.
The overflow pipe 16 is fixedly connected to the side wall of the ultrasonic cleaning machine 1, the overflow pipe 16 can discharge the redundant cleaning liquid in the ultrasonic cleaning machine 1 in time, and the electric push rod 5, the water pump 12, the heating pipe 94 and the blower 93 are all electrically connected to the external power source through the control switch, which is a conventional technology and belongs to a conventional technology means of a person skilled in the art, and therefore, the details are not described.
In the utility model, when the etched semiconductor chip is needed to be cleaned, firstly, cleaning liquid is filled into the ultrasonic cleaning machine 1 and the liquid storage tank 3, then the semiconductor chip is placed on the net frame 7 and is separated by the separating net plate 8, then the electric push rod 5 is started, the electric push rod 5 extends the semiconductor chip in the net frame 7 into the cleaning liquid in the ultrasonic cleaning machine 1 through the U-shaped plate 6, and the ultrasonic cleaning machine 1 is started, the high-frequency vibration of the ultrasonic cleaning machine 1 is utilized to ensure the cleaning effect of the semiconductor chip, after the cleaning is finished, the electric push rod 5 is used to drive the semiconductor chip in the net frame 7 to rise, then the water pump 12 is started, the water pump 12 sprays the clean cleaning liquid in the liquid storage tank 3 onto the semiconductor chip through the connecting pipe 13 and the spray head 14, the secondary cleaning is carried out on the semiconductor chip, the impurities attached to the surface of the semiconductor chip are removed, the mechanism enables the cleaning device after the etching of the semiconductor chip to have the secondary cleaning function, the cleaning effect of the semiconductor chip in the cleaning device is improved, meanwhile, the manufacturing quality of the semiconductor chip is improved, after the semiconductor chip is cleaned, the heating pipe 94 and the blower 93 are started, the heating pipe 94 enables the temperature inside the heating box 91 to rise, then the blower 93 conveys outside air into the heating box 91 for heating, the heated air is sprayed to the semiconductor chip through the communicating pipe 95, the hollow block 92 and the exhaust pipe 96, the hot air dries the semiconductor chip, the mechanism enables the cleaning device after the semiconductor chip is etched to have a hot air drying function, other magazines are prevented from being attached to the surface of the semiconductor chip through cleaning liquid, and the cleaning quality of the semiconductor chip after the semiconductor chip is etched is guaranteed.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The post-etching cleaning device for manufacturing the semiconductor chip comprises an ultrasonic cleaning machine (1) and is characterized in that a plurality of fixing rods (2) are fixedly connected to the outer wall of the ultrasonic cleaning machine (1) and a plurality of liquid storage tanks (3) are fixedly connected to the rod walls of the fixing rods (2) jointly, through holes are formed in the lower surface of each liquid storage tank (3), fixing pipes (4) are fixedly connected to the hole walls of the through holes, electric push rods (5) are fixedly connected to the inner walls of the fixing pipes (4), U-shaped plates (6) are fixedly connected to the bottom ends of the electric push rods (5), net frames (7) are fixedly connected to the outer walls of the U-shaped plates (6), a plurality of partition net plates (8) are fixedly connected to the inner walls of the net frames (7), hollow plates (10) are fixedly connected to the lower surface of each liquid storage tank (3), and a plurality of spray heads (11) are fixedly communicated with the lower surface of each hollow plate (10), the inner wall fixedly connected with water pump (12) of reservoir (3), the fixed intercommunication of output of water pump (12) has connecting pipe (13), the output of connecting pipe (13) passes the lower surface of reservoir (3) and the fixed intercommunication of outer wall of hollow slab (10), one of them the outer wall fixedly connected with drying mechanism (9) of dead lever (2).
2. The post-etching cleaning device for manufacturing the semiconductor chip as recited in claim 1, wherein the drying mechanism (9) comprises a heating box (91) and a hollow block (92) fixedly connected with an outer wall of the fixing rod (2), a fixing through hole is formed in an upper surface of the heating box (91), a blower (93) is fixedly connected with a hole wall of the fixing through hole, a plurality of heating pipes (94) are fixedly connected with an inner wall of the heating box (91), a communicating pipe (95) is fixedly communicated with a lower surface of the heating box (91), an output end of the communicating pipe (95) is fixedly communicated with an outer wall of the hollow block (92), and a plurality of exhaust pipes (96) are fixedly communicated with one side of the hollow block (92) close to the mesh frame (7).
3. The post-etching cleaning device for manufacturing semiconductor chips as defined in claim 1, wherein a plurality of support legs (14) are fixedly attached to the lower surface of the ultrasonic cleaning machine (1).
4. The post-etch cleaning apparatus for manufacturing semiconductor chips as defined in claim 1, wherein the upper surface of the screen frame (7) and the lower surface of the shower head (11) are on the same vertical axis.
5. The post-etching cleaning device for manufacturing the semiconductor chip as claimed in claim 1, wherein a cover plate (15) is movably sleeved on the outer wall of the top end of the fixed pipe (4), and the lower surface of the cover plate (15) is movably connected with the upper surface of the liquid storage tank (3).
6. The post-etching cleaning device for manufacturing semiconductor chips as defined in claim 1, wherein an overflow pipe (16) is fixedly communicated with the side wall of the ultrasonic cleaning machine (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023289721.9U CN214638692U (en) | 2020-12-30 | 2020-12-30 | Post-etching cleaning device for manufacturing semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023289721.9U CN214638692U (en) | 2020-12-30 | 2020-12-30 | Post-etching cleaning device for manufacturing semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214638692U true CN214638692U (en) | 2021-11-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023289721.9U Active CN214638692U (en) | 2020-12-30 | 2020-12-30 | Post-etching cleaning device for manufacturing semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214638692U (en) |
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- 2020-12-30 CN CN202023289721.9U patent/CN214638692U/en active Active
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