CN214638424U - A belt cleaning device for SMT paster and SMT chip mounter thereof - Google Patents
A belt cleaning device for SMT paster and SMT chip mounter thereof Download PDFInfo
- Publication number
- CN214638424U CN214638424U CN202120760440.2U CN202120760440U CN214638424U CN 214638424 U CN214638424 U CN 214638424U CN 202120760440 U CN202120760440 U CN 202120760440U CN 214638424 U CN214638424 U CN 214638424U
- Authority
- CN
- China
- Prior art keywords
- solder paste
- scraper
- tin
- tin cream
- steel mesh
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 26
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 64
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 60
- 239000010959 steel Substances 0.000 claims abstract description 60
- 239000006071 cream Substances 0.000 claims abstract description 32
- 238000007639 printing Methods 0.000 claims abstract description 32
- 229910000679 solder Inorganic materials 0.000 claims description 131
- 238000007790 scraping Methods 0.000 claims description 35
- 238000007789 sealing Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 6
- 239000003814 drug Substances 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
Abstract
The utility model provides a belt cleaning device for SMT paster and SMT chip mounter thereof, set up tin cream remove device including the activity for get rid of remaining tin cream on the steel mesh tin cream remove device sets up first tin cream remove device and the second tin cream remove device of both ends department about the tin cream printing machine scraper including the activity, first tin cream remove device includes the first tin cream scraper blade that sets up for the vertical activity of steel mesh, first tin cream scraper blade terminal surface activity is equipped with second tin cream scraper blade, the side end face airtight slip of second tin cream scraper blade and first tin cream scraper blade meets, and the width of this second tin cream scraper blade is less than the width of first tin cream scraper blade. The utility model discloses a cooperation of first tin cream remove device, second tin cream remove device and tin cream printing machine's scraper carries out the residue to the steel mesh on line and washs, has improved the single batch printing number of times of steel mesh, has reduced and has pulled down the steel mesh and carry out liquid medicine abluent frequency to this life that has improved the steel mesh.
Description
Technical Field
The utility model relates to a SMT paster technical field specifically is a belt cleaning device for SMT paster and SMT chip mounter thereof.
Background
With the rapid development of the electronic industry, the SMT technology is becoming more and more perfect, and the patch element becomes the mainstream element in the electronic industry, so that the solder paste printing technology becomes more and more important. Wherein, whether the solder paste on the steel mesh can in time be cleared up plays extremely important effect whether the printing of solder paste printing quality is good. The existing steel mesh cleaning method generally adopts off-line cleaning, namely the steel mesh to be used is disassembled to be cleaned by using special cleaning equipment, but the operation efficiency is influenced and the service life of the steel mesh is influenced if the steel mesh is frequently disassembled to be cleaned off-line.
Therefore, the utility model provides an online carry out abluent device to the steel mesh, through improving the single batch printing number of times of steel mesh, reduce to pull down the steel mesh and carry out liquid medicine abluent frequency to this life who improves the steel mesh.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a belt cleaning device for SMT paster and SMT chip mounter thereof to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a cleaning device for SMT paster comprises a movable solder paste removing device, a first solder paste removing device and a second solder paste removing device, wherein the movable solder paste removing device is used for removing residual solder paste on a steel mesh and comprises a first solder paste scraping plate and a second solder paste removing device, the first solder paste removing device and the second solder paste removing device are movably arranged at the left end and the right end of a scraper of a solder paste printing machine, the first solder paste removing device comprises a first solder paste scraping plate, the first solder paste scraping plate is vertically movably arranged relative to the steel mesh, the end face of the first solder paste scraping plate is movably provided with a second solder paste scraping plate, the second solder paste scraping plate is connected with the side end face of the first solder paste scraping plate in a sealing and sliding mode, the width of the second solder paste scraping plate is smaller than that of the first solder paste scraping plate, when the scraper of the solder paste printing machine slides on the steel mesh in a reciprocating mode to perform solder paste printing, the first solder paste scraping plate and the scraper of the printing machine synchronously move, the bottom of the first solder paste scraping plate is connected with the steel mesh in a sealing mode, when the first solder paste scraping plate stops moving, the second solder paste scraper blade is horizontally arranged on the first solder paste scraper blade in a sliding mode.
Preferably, two second solder paste scraping plates which are identical in structure and can move synchronously are movably arranged on two end faces of the first solder paste scraping plate respectively, the two second solder paste scraping plates are flush with the bottom of the first solder paste scraping plate, and when the first solder paste scraping plate moves on the steel mesh in a reciprocating mode, the two second solder paste scraping plates are fixedly arranged at one end of the first solder paste scraping plate.
Preferably, horizontal groove has been seted up to first tin cream scraper blade terminal surface lower extreme department, and this horizontal groove both ends are the opening form, are located a plurality of evenly distributed's vertical groove has still been seted up to the lower extreme department of the terminal surface of first tin cream scraper blade, the upper end in vertical groove and the lower extreme intercommunication in horizontal groove, the bottom in vertical groove flushes with the bottom of first tin cream scraper blade, the upper end in vertical groove is the opening form, and the tank bottom surface in this vertical groove upwards sets up for the slope.
Preferably, the two end faces of the first solder paste scraper are identical in structure, a protrusion matched with the horizontal groove is fixedly arranged on the end face of the second solder paste scraper, and the protrusion is arranged in the horizontal groove in a sliding mode.
Preferably, the bottom of the horizontal groove is further provided with a horizontal groove with an upward opening, and the side end of the horizontal groove is connected with the upper end opening of the vertical groove.
Preferably, the second solder paste removing device and the first solder paste removing device have the same structure, and when a scraper of a solder paste printing machine slides on a steel mesh in a reciprocating manner to perform solder paste printing, the second solder paste removing device and the first solder paste removing device are alternately arranged on the steel mesh in a sliding manner.
An SMT chip mounter, including any one of the belt cleaning device who is used for SMT paster in the aforesaid.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses a cooperation of first tin cream remove device, second tin cream remove device and tin cream printing machine's scraper carries out the residue to the steel mesh on line and washs, has improved the single batch printing number of times of steel mesh, has reduced and has pulled down the steel mesh and carry out liquid medicine abluent frequency to this has improved the life of steel mesh, and, through the cooperation of first tin cream scraper blade and second tin cream scraper blade, has improved the cleaning efficiency to the tin cream residue on the steel mesh.
Drawings
FIG. 1 is a schematic view of a first solder paste removing device and a second solder paste removing device of the present invention;
FIG. 2 is a schematic view of a first solder paste scraper of the present invention;
FIG. 3 is a schematic view of the structure of the first solder paste scraper and the second solder paste scraper of the present invention;
fig. 4 is the schematic diagram of the matching structure of the middle protrusion and the horizontal groove of the present invention.
In the figure: 1 first solder paste removing device, 11 first solder paste scraper, 111 horizontal groove, 112 vertical groove, 113 horizontal groove, 12 second solder paste scraper, 121 bump and 2 second solder paste removing device.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1:
a cleaning device for SMT patches comprises a movable solder paste removing device, wherein the solder paste removing device for removing residual solder paste on a steel mesh comprises a first solder paste removing device 1 and a second solder paste removing device 2 which are movably arranged at the left end and the right end of a scraper of a solder paste printing machine, the second solder paste removing device 2 and the first solder paste removing device 1 are identical in structure, when the scraper of the solder paste printing machine slides on the steel mesh in a reciprocating manner to perform solder paste printing, the second solder paste removing device 2 and the first solder paste removing device 1 are alternately arranged on the steel mesh in a sliding manner, the first solder paste removing device 1 comprises a first solder paste scraper 11 which is vertically and movably arranged relative to the steel mesh, a second solder paste scraper 12 is movably arranged on the end face of the first solder paste scraper 11, the second solder paste scraper 12 is connected with the side end face of the first solder paste scraper 11 in a closed sliding manner, and the width of the second solder paste scraper 12 is smaller than that of the first solder paste scraper 11, when a scraper of a solder paste printing machine performs solder paste printing by sliding on a steel mesh in a reciprocating manner, a first solder paste scraper blade 11 and the scraper of the printing machine move synchronously, the bottom of the first solder paste scraper blade 11 is connected with the steel mesh in a sealing manner, when the first solder paste scraper blade 11 stops moving, a second solder paste scraper blade 12 is horizontally arranged on the first solder paste scraper blade 11 in a sliding manner, specifically, two second solder paste scraper blades 12 with the same structure and moving synchronously are respectively and movably arranged on two end surfaces of the first solder paste scraper blade 11, the two second solder paste scraper blades 12 are flush with the bottom of the first solder paste scraper blade 11, and when the first solder paste scraper blade 11 moves on the steel mesh in a reciprocating manner, the two second solder paste scraper blades 12 are fixedly arranged at one end of the first solder paste scraper blade 11;
in order to further improve the cleaning effect of the solder paste removing device on the steel mesh, the utility model is provided with a horizontal groove 111 at the lower end of the end face of the first solder paste scraper 11, and both ends of the horizontal groove 111 are open, a plurality of vertical grooves 112 which are evenly distributed are also provided at the lower end of the end face of the first solder paste scraper 11, the upper end of the vertical groove 112 is communicated with the lower end of the horizontal groove 111, the bottom of the vertical groove 112 is flush with the bottom of the first solder paste scraper 11, the upper end of the vertical groove 112 is open, and the groove bottom of the vertical groove 112 is arranged obliquely upwards, furthermore, the two end faces of the first solder paste scraper 11 have the same structure, a bulge 121 which is matched with the horizontal groove 111 is fixedly arranged on the end face of the second solder paste scraper 12, and the bulge 121 is arranged in the horizontal groove 111 in a sliding manner, and the bottom of the horizontal groove 111 is also provided with a horizontal groove 113 which is opened upwards, and the side end of the horizontal groove 113 is connected with the upper end of the vertical groove 112, therefore, the unsolidified solder paste residue on the steel plate enters the horizontal groove 111 through the vertical groove 112, and then the solder paste residue in the horizontal groove 111 is removed through the protrusion 121 of the second scraper 12, thereby improving the cleaning efficiency of the solder paste residue on the steel plate.
Example 2:
an SMT chip mounter comprising the cleaning device for SMT chip mounting described in embodiment 1.
The utility model discloses an application principle: the cleaning device of the utility model is an online cleaning device, namely, the steel mesh is cleaned in time in the process of tin paste printing, specifically, when a scraper of a tin paste printing machine slides rightwards on the steel mesh, a first tin paste scraper blade 11 of a first tin paste removing device 1 positioned at the left end of the scraper is abutted against the steel mesh and slides rightwards, thereby, the remained unsolidified tin paste on the upper surface of the steel mesh after the tin paste printing is cleaned in time, when the scraper of the tin paste printing machine slides leftwards on the steel mesh, a first tin paste scraper blade of a second tin paste removing device 2 positioned at the right end of the scraper is abutted against the steel mesh and slides leftwards, thereby, the remained unsolidified tin paste on the upper surface of the steel mesh after the tin paste printing is cleaned in time, therefore, the steel mesh is cleaned on line by the first tin paste removing device 1 and the second tin paste removing device 2, the steel mesh batch printing times of the steel mesh are improved, the frequency of removing the steel mesh for cleaning with the liquid medicine is reduced, so that the service life of the steel mesh is prolonged;
the utility model discloses in, first tin cream remove device 1 is the same with second tin cream remove device 2's structure and principle of action, uses first tin cream remove device 1 as an example now, specifically explains its theory of operation, as follows:
specifically, when the first solder paste scraper 11 slides rightwards on the steel mesh, the bottom of the first solder paste scraper 11 is in sealed sliding connection with the steel mesh, so that unsolidified solder paste residues are scraped;
specifically, solder paste residues enter the horizontal groove 113 in the horizontal groove 111 along the upward inclined bottom surface in the vertical groove 112, when the first solder paste scraper 11 slides to the end of the steel mesh, the second solder paste scraper 12 is started, when the second solder paste scraper 12 slides horizontally on the first solder paste scraper 11, the second solder paste scraper 12 strips and removes the solder paste residues on the first solder paste scraper 11, and the solder paste residues in the horizontal groove 111 are scraped by the protrusion 121, so that the first solder paste scraper 11 can be recycled and reused, wherein the horizontal groove 113 is arranged to increase the holding capacity of the horizontal groove 111 for the solder paste residues, and the first solder paste scraper 11 and the scraper of the solder paste printer move at the same time interval; thus, the first solder paste removing apparatus 1 completes the cleaning operation of the residue on the steel mesh.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A belt cleaning device for SMT paster which characterized in that: the tin paste removing device comprises a tin paste removing device movably arranged, the tin paste removing device used for removing residual tin paste on a steel mesh comprises a first tin paste removing device (1) and a second tin paste removing device (2) movably arranged at the left end and the right end of a scraper of a tin paste printing machine, the first tin paste removing device (1) comprises a first tin paste scraping plate (11) movably arranged vertically relative to the steel mesh, a second tin paste scraping plate (12) is movably arranged on the end face of the first tin paste scraping plate (11), the second tin paste scraping plate (12) is connected with the side end face of the first tin paste scraping plate (11) in a sealing sliding mode, the width of the second tin paste scraping plate (12) is smaller than that of the first tin paste scraping plate (11), when the scraper of the tin paste printing machine slides on the steel mesh in a reciprocating mode to print the tin paste, the first tin paste scraping plate (11) and the scraper of the printing machine move synchronously, and the bottom of the first tin paste scraping plate (11) is connected with the steel mesh in a sealing mode, when the first solder paste scraper (11) stops moving, the second solder paste scraper (12) is horizontally arranged on the first solder paste scraper (11) in a sliding mode.
2. A cleaning device for an SMT patch as defined in claim 1, wherein: two second solder paste scraping plates (12) which are identical in structure and move synchronously are movably arranged on two end faces of the first solder paste scraping plate (11) respectively, the two second solder paste scraping plates (12) are flush with the bottom of the first solder paste scraping plate (11), and when the first solder paste scraping plate (11) moves on the steel mesh in a reciprocating mode, the two second solder paste scraping plates (12) are fixedly arranged at one end of the first solder paste scraping plate (11).
3. A cleaning device for an SMT patch as defined in claim 1 or 2, wherein: horizontal groove (111) have been seted up to first tin cream scraper blade (11) terminal surface lower extreme department, and this horizontal groove (111) both ends are the opening form, are located a plurality of evenly distributed's vertical groove (112) have still been seted up to the lower extreme department of the terminal surface of first tin cream scraper blade (11), the upper end of vertical groove (112) and the lower extreme intercommunication of horizontal groove (111), the bottom of vertical groove (112) flushes with the bottom of first tin cream scraper blade (11), the upper end of vertical groove (112) is the opening form, and the tank bottom surface of this vertical groove (112) upwards sets up for the slope.
4. A cleaning device for an SMT patch as defined in claim 3, wherein: the structure of two end faces of the first solder paste scraper (11) is the same, a bulge (121) matched with the horizontal groove (111) is fixedly arranged on the end face of the second solder paste scraper (12), and the bulge (121) is arranged in the horizontal groove (111) in a sliding mode.
5. A cleaning device for an SMT patch according to claim 4, wherein: the bottom of the horizontal groove (111) is also provided with a horizontal groove (113) with an upward opening, and the side end of the horizontal groove (113) is connected with the upper end opening of the vertical groove (112).
6. A cleaning device for an SMT patch according to claim 5, wherein: the second solder paste removing device (2) and the first solder paste removing device (1) are identical in structure, and when a scraper of a solder paste printing machine slides on a steel mesh in a reciprocating mode to perform solder paste printing, the second solder paste removing device (2) and the first solder paste removing device (1) are arranged on the steel mesh in a sliding mode alternately.
7. An SMT chip mounter is characterized in that: cleaning apparatus for SMT patches comprising any of claims 1-6.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202120760440.2U CN214638424U (en) | 2021-04-14 | 2021-04-14 | A belt cleaning device for SMT paster and SMT chip mounter thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202120760440.2U CN214638424U (en) | 2021-04-14 | 2021-04-14 | A belt cleaning device for SMT paster and SMT chip mounter thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN214638424U true CN214638424U (en) | 2021-11-09 |
Family
ID=78462137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202120760440.2U Expired - Fee Related CN214638424U (en) | 2021-04-14 | 2021-04-14 | A belt cleaning device for SMT paster and SMT chip mounter thereof |
Country Status (1)
Country | Link |
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CN (1) | CN214638424U (en) |
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2021
- 2021-04-14 CN CN202120760440.2U patent/CN214638424U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211109 |