CN214627529U - Surface chemical nickel plating device for printed circuit board - Google Patents
Surface chemical nickel plating device for printed circuit board Download PDFInfo
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- CN214627529U CN214627529U CN202120739124.7U CN202120739124U CN214627529U CN 214627529 U CN214627529 U CN 214627529U CN 202120739124 U CN202120739124 U CN 202120739124U CN 214627529 U CN214627529 U CN 214627529U
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- nickel plating
- pipe
- thick bamboo
- wiring board
- printed wiring
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Abstract
The utility model relates to a printed wiring board nickel plating equipment technical field, specifically speaking relates to a printed wiring board surface chemistry nickel plating device, reduce the device and set up the positioner in nickel plating reduction device one side including the nickel plating, nickel plating reduction device comprises former pipe and the reducing agent pipe of setting in former pipe one side, positioner includes the pneumatic cylinder and sets up at the terminal spacing section of thick bamboo of inserting of pneumatic cylinder telescopic shaft, and spacing section of thick bamboo of inserting is vertical form setting, and the former pipe stretches into to spacing section of thick bamboo of inserting in and fixed mounting on the spacing inner wall of inserting a section of thick bamboo, and reducing agent pipe fixed mounting is linked together on the side of spacing section of thick bamboo of inserting and with the inside of spacing section of thick bamboo of inserting. The utility model discloses can carry out the shutoff to the peripheral position of nickel plating, prevent other positions departments of nickel raw materials adhesion on printed wiring board, facilitate the use, offer convenience for the user.
Description
Technical Field
The utility model relates to a printed wiring board nickel plating equipment technical field, specifically speaking relates to a printed wiring board surface chemistry nickel plating device.
Background
At present, when the printed circuit board is prepared, a chemical nickel plating method is usually adopted for preparation operation, a corresponding chemical nickel plating device is needed when the chemical nickel plating operation is carried out, and when the conventional chemical nickel plating device is used, the periphery of a specific nickel plating position cannot be blocked, so that nickel raw materials are easily adhered to other positions on the printed circuit board, the normal use of the printed circuit board is influenced, and inconvenience is brought to a user.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a printed wiring board surface chemistry nickel plating device to solve the defect that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a printed wiring board surface chemistry nickel plating device, includes nickel plating reduction device and sets up the positioner in nickel plating reduction device one side, nickel plating reduction device comprises former block pipe and the reducing agent pipe of setting in former block pipe one side, positioner includes the pneumatic cylinder and sets up the terminal spacing section of thick bamboo of inserting of pneumatic cylinder telescopic shaft, spacing section of thick bamboo of inserting is vertical form setting, the former block pipe stretch into to spacing section of thick bamboo interior and fixed mounting of inserting on the inner wall of spacing section of thick bamboo, reducing agent pipe fixed mounting be in spacing insert on the side of a section of thick bamboo and with spacing inside of inserting is linked together.
Preferably, the tail ends of the raw material pipe and the reducing agent pipe are provided with spray heads, and the spray heads are positioned in the limiting insertion barrels, so that stock solution can be conveniently sprayed out of the spray heads.
Preferably, the former feed pipe with the other end of reductant pipe all is provided with the hose, the end of hose is provided with the booster pump, be provided with the conveyer pipe on the end body of intaking of booster pump, one of them the end of conveyer pipe is provided with former feed cylinder, another one the end of conveyer pipe is provided with the reductant storage cylinder, is convenient for utilize booster pump work to realize carrying the stoste.
Preferably, the top surfaces of the raw material cylinder and the reducing agent storage cylinder are respectively provided with a replenishing pipe, so that corresponding stock solution can be replenished by utilizing the replenishing pipes.
Preferably, the positioning device further comprises a mounting bracket arranged on the external frame, and the hydraulic cylinder is fixedly mounted on the bottom surface of the mounting bracket, so that the hydraulic cylinder is conveniently and fixedly mounted.
Preferably, the last inseparable welding of telescopic shaft of pneumatic cylinder has the rectangular plate, be provided with the fixed plate on the spacing top barrel of inserting a section of thick bamboo, the rectangular plate with through a plurality of fastening bolt fixed connection between the fixed plate, conveniently insert a section of thick bamboo fixed mounting on the telescopic shaft of pneumatic cylinder with spacing.
Preferably, the bottom surface of the limiting insertion cylinder is provided with a hollow sealing ring, so that the sealing effect between the limiting insertion cylinder and the printed circuit board is improved.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a positioner who sets up guarantees when using, can utilize spacing inserted cylinder and hollow sealing ring to realize carrying out the shutoff to specific nickel plating position periphery on the printed wiring board, prevent other positions department of nickel raw materials adhesion on the printed wiring board, facilitate the use, the chemical nickel plating device of having solved conventionality is when using, can not carry out the shutoff to specific nickel plating position periphery, cause other positions of nickel raw materials adhesion on the printed wiring board easily, influence the normal use of printed wiring board, the problem of inconvenience is brought for the user.
2. The utility model discloses a nickel plating reduction device who sets up is convenient for utilize the booster pump to carry the raw materials and carry out the nickel plating operation, facilitates the use.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural view of the nickel plating reduction apparatus of the present invention;
fig. 3 is a schematic structural diagram of the positioning device of the present invention.
In the figure: 1. a nickel plating reduction device; 10. a raw material pipe; 11. a reducing agent pipe; 12. a spray head; 13. a hose; 14. a booster pump; 15. a delivery pipe; 16. a raw material barrel; 17. a reductant storage cartridge; 18. a replenishing pipe; 2. a positioning device; 20. mounting a bracket; 21. a hydraulic cylinder; 211. a rectangular plate; 22. a fixing plate; 23. limiting the inserting cylinder; 24. and (4) a hollow sealing ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Referring to fig. 1-3, the present invention provides a technical solution:
the utility model provides a printed wiring board surface chemistry nickel plating device, including nickel plating reduction device 1 and the positioner 2 of setting in nickel plating reduction device 1 one side, nickel plating reduction device 1 comprises former block pipe 10 and the reducing agent pipe 11 of setting in former block pipe 10 one side, positioner 2 includes pneumatic cylinder 21 and sets up at the terminal spacing inserted cylinder 23 of pneumatic cylinder 21 telescopic shaft, spacing inserted cylinder 23 is vertical form setting, former block pipe 10 stretches into in spacing inserted cylinder 23 and fixed mounting on the inner wall of spacing inserted cylinder 23, reducing agent pipe 11 fixed mounting is linked together on the side of spacing inserted cylinder 23 and with the inside of spacing inserted cylinder 23, guarantee when using, can utilize spacing inserted cylinder 23 to realize blockking the periphery of nickel plating position on the printed wiring board, play and prevent other positions department of nickel raw materials adhesion on the printed wiring board, and convenient to use, bring convenience for the user.
In this embodiment, the spray head 12 is disposed at one end of each of the raw material tube 10 and the reducing agent tube 11, and the spray head 12 is located in the limiting insertion tube 23, so that the raw liquid can be conveniently sprayed out of the spray head 12 and enter the printed circuit board along the bottom end of the limiting insertion tube 23.
Specifically, the other ends of the raw material pipe 10 and the reducing agent pipe 11 are respectively provided with a hose 13, the end of the hose 13 is provided with a booster pump 14, a water inlet end pipe body of the booster pump 14 is provided with a delivery pipe 15, the end of one delivery pipe 15 is provided with a raw material cylinder 16, and the end of the other delivery pipe 15 is provided with a reducing agent storage cylinder 17, so that the raw material liquid can be delivered by utilizing the booster pump 14.
Further, the replenishing pipe 18 is integrally formed on the top surfaces of the source cartridge 16 and the reducing agent storage cartridge 17, so that the corresponding source liquid can be replenished by the replenishing pipe 18.
In addition, the positioning device 2 further comprises a mounting bracket 20 arranged on the external frame, and a fixed base on the hydraulic cylinder 21 is fixedly mounted on the bottom surface of the mounting bracket 20 through a plurality of fastening bolts, so that the hydraulic cylinder 21 is conveniently fixedly mounted.
It is worth to say that, the terminal close welding of the telescopic shaft of pneumatic cylinder 21 has rectangular plate 211, and close welding has fixed plate 22 on the top barrel of spacing section of thick bamboo 23, passes through a plurality of fastening bolt fixed connection between rectangular plate 211 and the fixed plate 22, conveniently with spacing section of thick bamboo 23 fixed mounting on the telescopic shaft of pneumatic cylinder 21.
It is worth noting that the hollow sealing ring 24 is integrally formed on the bottom surface of the limiting insertion barrel 23, so that the sealing effect between the limiting insertion barrel 23 and the printed circuit board is improved, and after the hollow sealing ring 24 is abutted against the printed circuit board, the situation that stock solution is not easy to leak between the hollow sealing ring 24 and the printed circuit board is avoided.
It should be noted that the booster pump 14 and the hydraulic cylinder 21 in the present embodiment are conventional technologies, and are not described in detail herein.
When the chemical nickel plating device on the surface of the printed circuit board is used, firstly, the hydraulic cylinder 21 is started and works, the hydraulic cylinder 21 works, the extension shaft on the hydraulic cylinder extends to drive the rectangular plate 211, the fixed plate 22 and the limiting insert cylinder 23 to move downwards, after the hollow sealing ring 24 is pressed against a special position on the printed circuit board, the booster pump 14 is connected with an external power supply and works, the booster pump 14 works to convey the stock solution in the corresponding stock cylinder 16 and the reducing agent storage cylinder 17 to the surface of the printed circuit board for chemical nickel plating operation, at the moment, the limiting insert cylinder 23 and the hollow sealing ring 24 can play the effect of blocking the stock solution from flowing around, prevent the nickel raw material from being adhered to other positions on the printed circuit board, the chemical nickel plating device is convenient to use, the problem that the conventional chemical nickel plating device is used, the periphery of the special nickel plating position cannot be blocked, and the nickel raw material is easily adhered to other positions on the printed circuit board is solved, the normal use of the printed circuit board is influenced, and the inconvenience is brought to users.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a nickel plating device is changeed to printed wiring board surface, its characterized in that: including nickel plating reduction device (1) and setting positioner (2) in nickel plating reduction device (1) one side, nickel plating reduction device (1) comprises former block pipe (10) and reducing agent pipe (11) of setting in former block pipe (10) one side, positioner (2) include pneumatic cylinder (21) and set up and be in pneumatic cylinder (21) telescopic shaft is terminal spacing insert a section of thick bamboo (23), spacing insert a section of thick bamboo (23) and be vertical form setting, former block pipe (10) stretch into to spacing insert in section of thick bamboo (23) and fixed mounting be in on the inner wall of spacing insert a section of thick bamboo (23), reducing agent pipe (11) fixed mounting be in spacing insert on the side of a section of thick bamboo (23) and with the inside of spacing insert a section of thick bamboo (23) is linked together.
2. The chemical nickel plating device for the surface of the printed wiring board according to claim 1, characterized in that: the tail ends of the raw material pipe (10) and the reducing agent pipe (11) are provided with spray heads (12), and the spray heads (12) are located in the limiting inserting barrels (23).
3. The chemical nickel plating device for the surface of the printed wiring board according to claim 1, characterized in that: former raw material pipe (10) with the other end of reductant pipe (11) all is provided with hose (13), the end of hose (13) is provided with booster pump (14), be provided with conveyer pipe (15) on the end body of intaking of booster pump (14), one of them the end of conveyer pipe (15) is provided with former feed cylinder (16), another one the end of conveyer pipe (15) is provided with reductant storage cylinder (17).
4. The chemical nickel plating device for the surface of the printed wiring board according to claim 3, wherein: and the top surfaces of the raw material cylinder (16) and the reducing agent storage cylinder (17) are provided with replenishing pipes (18).
5. The chemical nickel plating device for the surface of the printed wiring board according to claim 1, characterized in that: the positioning device (2) further comprises a mounting bracket (20) arranged on the external frame, and the hydraulic cylinder (21) is fixedly mounted on the bottom surface of the mounting bracket (20).
6. The chemical nickel plating device for the surface of the printed wiring board according to claim 1, characterized in that: the terminal close welding of telescopic shaft of pneumatic cylinder (21) has rectangular plate (211), be provided with fixed plate (22) on the top barrel of a section of thick bamboo (23) is inserted to spacing, rectangular plate (211) with through a plurality of fastening bolt fixed connection between fixed plate (22).
7. The chemical nickel plating device for the surface of the printed wiring board according to claim 1, characterized in that: and a hollow sealing ring (24) is arranged on the bottom surface of the limiting insertion cylinder (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120739124.7U CN214627529U (en) | 2021-04-13 | 2021-04-13 | Surface chemical nickel plating device for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120739124.7U CN214627529U (en) | 2021-04-13 | 2021-04-13 | Surface chemical nickel plating device for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214627529U true CN214627529U (en) | 2021-11-05 |
Family
ID=78401453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120739124.7U Active CN214627529U (en) | 2021-04-13 | 2021-04-13 | Surface chemical nickel plating device for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214627529U (en) |
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2021
- 2021-04-13 CN CN202120739124.7U patent/CN214627529U/en active Active
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