CN214624544U - Flat multi-pair high-speed data transmission line - Google Patents
Flat multi-pair high-speed data transmission line Download PDFInfo
- Publication number
- CN214624544U CN214624544U CN202120342378.5U CN202120342378U CN214624544U CN 214624544 U CN214624544 U CN 214624544U CN 202120342378 U CN202120342378 U CN 202120342378U CN 214624544 U CN214624544 U CN 214624544U
- Authority
- CN
- China
- Prior art keywords
- layer
- insulating layer
- transmission line
- pair
- data transmission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005540 biological transmission Effects 0.000 title claims abstract description 73
- 239000010410 layer Substances 0.000 claims abstract description 220
- 239000011247 coating layer Substances 0.000 claims abstract description 17
- 238000001125 extrusion Methods 0.000 claims abstract description 14
- -1 polyethylene Polymers 0.000 claims description 56
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 27
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000004698 Polyethylene Substances 0.000 claims description 15
- 229920000573 polyethylene Polymers 0.000 claims description 15
- 239000004812 Fluorinated ethylene propylene Substances 0.000 claims description 12
- 239000004743 Polypropylene Substances 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 12
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims description 12
- 229920009441 perflouroethylene propylene Polymers 0.000 claims description 12
- 229920001155 polypropylene Polymers 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000012943 hotmelt Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 6
- 229920002799 BoPET Polymers 0.000 claims description 3
- 239000005041 Mylar™ Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 11
- 230000006872 improvement Effects 0.000 abstract description 4
- 230000009467 reduction Effects 0.000 abstract description 4
- 230000008859 change Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000005253 cladding Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000035772 mutation Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Images
Landscapes
- Insulated Conductors (AREA)
- Communication Cables (AREA)
Abstract
The invention discloses a flat multi-pair high-speed data transmission line, which comprises a plurality of transmission line pairs and an outer coating layer, wherein the transmission line pairs are vertically arranged and are arranged in the outer coating layer in a straight shape; the outer covering layer is composed of a semi-conductive shielding layer and an outer sheath layer, the semi-conductive shielding layer and the outer sheath layer are of a double-layer co-extrusion structure formed by one-time extrusion, the semi-conductive shielding layer is located inside and covers the outside of the transmission line pair, and the outer sheath layer is located outside the semi-conductive shielding layer. The invention adopts the structure of the co-extrusion outer coating layer of a plurality of transmission lines, removes the cabling procedure of the transmission lines, avoids the risk of damage to the wires caused by the cabling procedure of the transmission lines, and simultaneously plays a role in cost reduction and efficiency improvement; the plurality of transmission line pairs are vertically arranged and arranged in a straight shape, so that the width of the whole line is effectively reduced, and the space is saved for wiring in the machine and an interface terminal; the double-layer co-extruded semi-conductive shielding layer and the outer sheath layer are used as outer coating layers, and the anti-interference performance of the whole line is improved.
Description
Technical Field
The invention relates to the technical field of communication wires and cables, in particular to a flat multi-pair high-speed data transmission line.
Background
The rapid development of the internet and the rapid revolution of the digital technology of the society, the explosive growth of data is accelerated by the informatization development of enterprises, and more information services rely on the collection and application of mass data. To efficiently complete mass data transmission, two main breakthrough directions are to increase the transmission frequency of a single line and increase the number of data lines. However, the two directions conflict with each other, higher requirements on the structural stability and the integrity of the wire rod are provided by improving the transmission frequency of a single wire, and the risk of damage in the wire rod cabling process is multiplied by increasing the number of the data wires. For example: patent 201520300136.4 of Kunshan Guangzao wire Limited discloses a QSFP transmission line, which comprises eight wire cores, wherein the eight wire cores are required to be subjected to cabling procedures such as rotation and twisting to be manufactured into the QSFP transmission line, and the cabling procedure has a large risk of damaging wires. In addition, the data transmission line in the prior art is easily influenced by factors such as voltage change and the like, electric field mutation is generated, large electric signal noise is easily generated, and the anti-interference performance of the whole line is not strong.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the invention is to provide a flat multi-pair high-speed data transmission line according to the defects of the prior art, the high-speed data transmission line adopts a structure that a plurality of transmission lines are used for co-extrusion outer coating layers, the transmission line cabling procedure is removed, the risk that the transmission line cabling procedure causes damage to a wire is avoided, and meanwhile, the effects of cost reduction and efficiency improvement are achieved; the plurality of transmission line pairs of the high-speed data transmission line are vertically arranged and arranged in a straight shape, so that the width of the whole line is effectively reduced, and the space is saved for wiring in the machine and an interface terminal; the high-speed data transmission line adopts the double-layer co-extruded semi-conductive shielding layer and the outer sheath layer as the outer coating layer, so that the anti-interference performance of the whole line is improved.
In order to solve the technical problems, the technical scheme of the invention is as follows: a flat multi-pair high-speed data transmission line comprises a plurality of transmission line pairs and an outer coating layer, wherein the transmission line pairs are vertically arranged and are arranged in a straight shape in the outer coating layer; the outer covering layer is composed of a semi-conductive shielding layer and an outer sheath layer, the semi-conductive shielding layer and the outer sheath layer are of a double-layer co-extrusion structure formed by one-time extrusion, the semi-conductive shielding layer is located inside and covers the outside of the transmission line pair, and the outer sheath layer is located outside the semi-conductive shielding layer.
Preferably, the plurality of transmission lines are arranged at equal intervals, and each transmission line pair is externally coated with a semi-conductive shielding layer.
Preferably, the number of the transmission line pairs is eight.
Preferably, the transmission line pair includes an inner conductor, a first insulating layer, a second insulating layer, a shielding layer, a ground line, and an inner layer, the first insulating layer covers the outer side of the inner conductor, the second insulating layer covers the outer side of the first insulating layer, the shielding layer covers the outer side of the second insulating layer, and the inner layer covers the outer sides of the shielding layer and the ground line.
Preferably, the number of the inner conductors is two, the number of the ground wires is two, the first insulating layers are respectively and independently coated outside each inner conductor, the second insulating layers are simultaneously coated outside the two first insulating layers which are arranged in parallel, the two ground wires are positioned on two sides of the shielding layer, and the inner layer is coated outside the two ground wires and the shielding layer.
Preferably, the inner conductor and the ground wire are single or multi-strand metal wires, the metal wire is any one of a silver-plated copper metal wire, a tin-plated copper metal wire, a bare copper metal wire, a silver-plated copper-clad steel metal wire and a silver-plated copper-clad aluminum metal wire, and the cross section of the inner conductor and the ground wire is any one of a circle, an ellipse and a flat.
Preferably, the first insulating layer is any one of a polyethylene insulating layer, a foamed polyethylene insulating layer, a polypropylene insulating layer, a foamed polypropylene insulating layer, a fluorinated ethylene propylene insulating layer, a foamed fluorinated ethylene propylene insulating layer, a polytetrafluoroethylene insulating layer, a foamed polytetrafluoroethylene insulating layer, a microporous polytetrafluoroethylene insulating layer and a meltable polytetrafluoroethylene insulating layer.
Preferably, the second insulating layer is any one of a polyethylene insulating layer, a foamed polyethylene insulating layer, a polypropylene insulating layer, a foamed polypropylene insulating layer, a fluorinated ethylene propylene insulating layer, a foamed fluorinated ethylene propylene insulating layer, a polytetrafluoroethylene insulating layer, a foamed polytetrafluoroethylene insulating layer, a microporous polytetrafluoroethylene insulating layer and a meltable polytetrafluoroethylene insulating layer.
Preferably, the shielding layer is any one or a combination of a plurality of shielding layers of a hot melt self-adhesive aluminum foil layer, a hot melt self-adhesive copper foil layer, a hot melt self-adhesive silver-plated copper foil layer, an aluminum foil layer, a copper foil layer and a silver-plated copper foil layer.
Preferably, the inner layer is any one of a plastic mylar inner layer, a polyethylene inner layer, a polytetrafluoroethylene inner layer, a polyperfluoroethylene propylene inner layer and a polyolefin inner layer.
The invention has the beneficial effects that: the transmission line comprises a plurality of transmission line pairs and an outer coating layer, wherein the outer coating layer consists of a semi-conductive shielding layer and an outer sheath layer, the semi-conductive shielding layer and the outer sheath layer are of a double-layer co-extrusion structure formed by one-step extrusion, a transmission line cabling procedure is omitted, the risk of damage to a wire in the transmission line cabling procedure is avoided, and meanwhile the effects of cost reduction and efficiency improvement are achieved. Secondly, the plurality of transmission line pairs are vertically arranged and are arranged in the outer coating layer in a straight shape, so that the width of the whole line is effectively reduced, and the space is saved for wiring in the machine and an interface terminal. The outer coating layer of the invention is composed of a semi-conductive shielding layer and an outer sheath layer, and the semi-conductive shielding layer can enable the electric field to be gentle and excessive when the data transmission line is influenced by factors such as voltage change and the like, and cannot be suddenly changed along with the change of the factors such as voltage change and the like, so that the noise of an electric signal is reduced, and the anti-interference performance of the whole line is improved.
Drawings
Fig. 1 is a schematic cross-sectional view of a flat multi-pair high-speed wire according to an embodiment of the invention.
Fig. 2 is a schematic cross-sectional structure of a transmission line pair according to the present invention.
Detailed Description
The structural and operational principles of the present invention are explained in further detail below with reference to the accompanying drawings.
As shown in fig. 1, with reference to fig. 2, the present invention discloses a flat multi-pair high-speed data transmission line, which includes a plurality of transmission line pairs 100 and an outer cladding 200, wherein the plurality of transmission line pairs 100 are vertically arranged and are arranged in a "one" shape inside the outer cladding 200; the outer covering layer 200 is composed of a semi-conductive shielding layer 7 and an outer sheath layer 8, the semi-conductive shielding layer 7 and the outer sheath layer 8 are of a double-layer co-extrusion structure formed by one-time extrusion, the semi-conductive shielding layer 7 is located inside and covers the transmission line pair 100, and the outer sheath layer 8 is located outside the semi-conductive shielding layer 7.
As shown in fig. 1 and referring to fig. 2, the plurality of transmission line pairs 100 are arranged at equal intervals, and a semiconductive shielding layer 7 is coated outside each transmission line pair 100, so that the balance, stability and interference resistance of the flat multi-pair high-speed data transmission line can be further improved. In this embodiment, the number of the transmission line pairs 100 is eight, and high-speed data transmission is realized.
As shown in fig. 2, the transmission line pair 100 includes an inner conductor 1, a first insulating layer 2, a second insulating layer 3, a shielding layer 4, a ground line 5, and an inner layer 6, wherein the first insulating layer 2 covers the inner conductor 1, the second insulating layer 3 covers the first insulating layer 2, the shielding layer 4 covers the second insulating layer 3, the ground line 5 is disposed outside the shielding layer 4, and the inner layer 6 covers the shielding layer 4 and the ground line 5.
As shown in fig. 2, the number of the inner conductors 1 is two, the number of the ground wires 5 is two, the first insulating layers 2 are respectively and independently coated outside each inner conductor 1, the second insulating layers 3 are simultaneously coated outside the two first insulating layers 2 which are arranged in parallel, the two ground wires 5 are positioned at two sides of the shielding layer 4, and the inner layer 6 is coated outside the two ground wires 5 and the shielding layer 4.
Preferably, the inner conductor 1 and the ground wire 5 are single or stranded metal wires, the metal wires are any one of silver-plated copper metal wires, tin-plated copper metal wires, bare copper metal wires, silver-plated copper-clad steel metal wires and silver-plated copper-clad aluminum metal wires, and the cross sections of the inner conductor and the ground wire are any one of circular, oval and flat.
Preferably, the first insulating layer 2 is any one of a polyethylene insulating layer, a foamed polyethylene insulating layer, a polypropylene insulating layer, a foamed polypropylene insulating layer, a fluorinated ethylene propylene insulating layer, a foamed fluorinated ethylene propylene insulating layer, a polytetrafluoroethylene insulating layer, a foamed polytetrafluoroethylene insulating layer, a microporous polytetrafluoroethylene insulating layer, and a fusible polytetrafluoroethylene insulating layer. The second insulating layer 3 is any one of a polyethylene insulating layer, a foamed polyethylene insulating layer, a polypropylene insulating layer, a foamed polypropylene insulating layer, a fluorinated ethylene propylene insulating layer, a foamed fluorinated ethylene propylene insulating layer, a polytetrafluoroethylene insulating layer, a foamed polytetrafluoroethylene insulating layer, a microporous polytetrafluoroethylene insulating layer and a meltable polytetrafluoroethylene insulating layer.
Preferably, the shielding layer 4 is any one or a combination of a plurality of shielding layers of a hot melt self-adhesive aluminum foil layer, a hot melt self-adhesive copper foil layer, a hot melt self-adhesive silver-plated copper foil layer, an aluminum foil layer, a copper foil layer and a silver-plated copper foil layer.
Preferably, the inner layer 6 is any one of a plastic mylar inner layer, a polyethylene inner layer, a polytetrafluoroethylene inner layer, a polyperfluoroethylene propylene inner layer, and a polyolefin inner layer.
The semi-conductive shielding layer and the outer sheath layer of the outer coating layer are of a double-layer co-extrusion structure formed by one-step extrusion, a transmission line cabling procedure is omitted, the risk of damage to a wire caused by the transmission line cabling procedure is avoided, and meanwhile, the effects of cost reduction and efficiency improvement are achieved. The plurality of transmission line pairs are vertically arranged and are arranged in the outer coating layer in a straight shape, so that the width of the whole line is effectively reduced, and the space is saved for wiring and interface terminals in the machine. The outer coating layer of the invention consists of a semi-conductive shielding layer and an outer sheath layer, and the semi-conductive shielding layer can enable the electric field to be smoothly excessive when the data transmission line is influenced by factors such as voltage change and the like, and cannot generate sudden change along with the change of the factors such as voltage change and the like, thereby reducing the noise of an electric signal and improving the anti-interference performance of the whole line.
The above description is only a preferred embodiment of the present invention, and all the minor modifications, equivalent changes and modifications made to the above embodiment according to the technical solution of the present invention are within the scope of the technical solution of the present invention.
Claims (10)
1. A flat multi-pair high-rate data transmission line, characterized in that: the transmission line pair transmission line comprises a plurality of transmission line pairs and an outer coating layer, wherein the plurality of transmission line pairs are vertically arranged and are arranged in the outer coating layer in a straight shape; the outer covering layer is composed of a semi-conductive shielding layer and an outer sheath layer, the semi-conductive shielding layer and the outer sheath layer are of a double-layer co-extrusion structure formed by one-time extrusion, the semi-conductive shielding layer is located inside and covers the outside of the transmission line pair, and the outer sheath layer is located outside the semi-conductive shielding layer.
2. The flat multi-pair high rate data transmission line of claim 1, wherein: the transmission lines are arranged at equal intervals, and a semi-conductive shielding layer covers the outside of each transmission line pair.
3. The flat multi-pair high rate data transmission line of claim 1, wherein: the number of the transmission line pairs is eight.
4. The flat multi-pair high-rate data transmission line according to any one of claims 1 to 3, wherein: the transmission line pair comprises an inner conductor, a first insulating layer, a second insulating layer, a shielding layer, a ground wire and an inner layer, wherein the first insulating layer is coated outside the inner conductor, the second insulating layer is coated outside the first insulating layer, the shielding layer is coated outside the second insulating layer, the ground wire is arranged on the outer side of the shielding layer, and the inner layer is coated outside the shielding layer and the ground wire.
5. The flat, multi-pair, high rate data transmission line of claim 4, wherein: the number of the inner conductors is two, the number of the ground wires is two, the first insulating layers are respectively and independently coated outside each inner conductor, the second insulating layers are simultaneously coated outside the two first insulating layers which are arranged in parallel, the two ground wires are positioned on two sides of the shielding layer, and the inner layer is coated outside the two ground wires and the shielding layer.
6. The flat, multi-pair, high rate data transmission line of claim 4, wherein: the inner conductor and the ground wire are single or multi-strand metal wires, the metal wires are any one of silver-plated copper metal wires, tin-plated copper metal wires, bare copper metal wires, silver-plated copper-clad steel metal wires and silver-plated copper-clad aluminum metal wires, and the cross sections of the inner conductor and the ground wire are any one of round, oval and flat.
7. The flat, multi-pair, high rate data transmission line of claim 4, wherein: the first insulating layer is any one of a polyethylene insulating layer, a foamed polyethylene insulating layer, a polypropylene insulating layer, a foamed polypropylene insulating layer, a fluorinated ethylene propylene insulating layer, a foamed fluorinated ethylene propylene insulating layer, a polytetrafluoroethylene insulating layer, a foamed polytetrafluoroethylene insulating layer, a microporous polytetrafluoroethylene insulating layer and a meltable polytetrafluoroethylene insulating layer.
8. The flat, multi-pair, high rate data transmission line of claim 4, wherein: the second insulating layer is any one of a polyethylene insulating layer, a foamed polyethylene insulating layer, a polypropylene insulating layer, a foamed polypropylene insulating layer, a fluorinated ethylene propylene insulating layer, a foamed fluorinated ethylene propylene insulating layer, a polytetrafluoroethylene insulating layer, a foamed polytetrafluoroethylene insulating layer, a microporous polytetrafluoroethylene insulating layer and a meltable polytetrafluoroethylene insulating layer.
9. The flat, multi-pair, high rate data transmission line of claim 4, wherein: the shielding layer is any one or combination of a plurality of shielding layers of a hot melt self-adhesive aluminum foil layer, a hot melt self-adhesive copper foil layer, a hot melt self-adhesive silver-plated copper foil layer, an aluminum foil layer, a copper foil layer and a silver-plated copper foil layer.
10. The flat, multi-pair, high rate data transmission line of claim 4, wherein: the inner layer is any one of a plastic Mylar inner layer, a polyethylene inner layer, a polytetrafluoroethylene inner layer, a polyfluortetraethylene inner layer and a polyolefin inner layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120342378.5U CN214624544U (en) | 2021-02-07 | 2021-02-07 | Flat multi-pair high-speed data transmission line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120342378.5U CN214624544U (en) | 2021-02-07 | 2021-02-07 | Flat multi-pair high-speed data transmission line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214624544U true CN214624544U (en) | 2021-11-05 |
Family
ID=78441377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120342378.5U Active CN214624544U (en) | 2021-02-07 | 2021-02-07 | Flat multi-pair high-speed data transmission line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214624544U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240021341A1 (en) * | 2022-03-02 | 2024-01-18 | Foxconn (Kunshan) Computer Connector Co., Ltd. | Cable |
-
2021
- 2021-02-07 CN CN202120342378.5U patent/CN214624544U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240021341A1 (en) * | 2022-03-02 | 2024-01-18 | Foxconn (Kunshan) Computer Connector Co., Ltd. | Cable |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2373503A1 (en) | Low delay skew multi-pair cable and method of manufacture | |
| CN110610780A (en) | Cable with a flexible connection | |
| CN214624544U (en) | Flat multi-pair high-speed data transmission line | |
| CN204375457U (en) | The high speed USB data cable of resistance to high electric current | |
| CN112802629A (en) | Flat multi-pair high-speed data transmission line | |
| CN210956275U (en) | High-speed data transmission cable for automobile | |
| CN211507180U (en) | Industrial computer equipment and Ethernet connecting cable | |
| CN211208027U (en) | Seven kinds of data cables of high shielding performance | |
| US8269106B2 (en) | Mirrored arc conducting pair | |
| CN210837284U (en) | High-symmetry high-speed data transmission line | |
| WO2022126945A1 (en) | Sixteen-pair high-rate data transmission cable | |
| CN219891911U (en) | Communication cable for Ethernet | |
| CN201904105U (en) | Digital closed-circuit television cable for ship and ocean engineering | |
| CN217113944U (en) | Double-core high-speed cable pair | |
| CN211828241U (en) | Low-capacitance cable for connection of measuring system | |
| CN219610047U (en) | Novel foaming insulation high-speed data transmission's data cable | |
| CN210896658U (en) | High-frequency and low-loss shielding type six-class environment-friendly digital communication cable | |
| CN220020637U (en) | Star-shaped insulated high-speed data transmission data cable | |
| CN217306183U (en) | Totally enclosed shielding seven-type network cable | |
| CN217181893U (en) | Multifunctional composite cable | |
| CN221101713U (en) | Multilayer lapped data cable | |
| US11887749B2 (en) | Cable | |
| CN210837287U (en) | Automobile bus cable | |
| CN209980813U (en) | Novel shielded low-loss high-speed transmission cable | |
| CN218886887U (en) | Data transmission line |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518000, 1st and 19th floors of Building 1, Jinxinnuo, No. 50 Baolong Second Road, Baolong Community, Baolong Street, Longgang District, Shenzhen City, Guangdong Province Patentee after: KINGSIGNAL TECHNOLOGY Co.,Ltd. Country or region after: China Address before: 518000 26 / F, block B, building 10, Shenzhen Bay science and technology ecological park, No.10, Gaoxin South 9th Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: KINGSIGNAL TECHNOLOGY Co.,Ltd. Country or region before: China |