CN214624503U - 皮-泡-皮物理发泡射频同轴线 - Google Patents
皮-泡-皮物理发泡射频同轴线 Download PDFInfo
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- CN214624503U CN214624503U CN202120387675.1U CN202120387675U CN214624503U CN 214624503 U CN214624503 U CN 214624503U CN 202120387675 U CN202120387675 U CN 202120387675U CN 214624503 U CN214624503 U CN 214624503U
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- skin
- shield
- copper foil
- foam
- radio frequency
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- 238000005187 foaming Methods 0.000 title claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000011889 copper foil Substances 0.000 claims abstract description 51
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 238000005452 bending Methods 0.000 claims description 3
- 239000010985 leather Substances 0.000 claims description 3
- 238000009954 braiding Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polyethylene forms Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
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Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202120387675.1U CN214624503U (zh) | 2021-02-22 | 2021-02-22 | 皮-泡-皮物理发泡射频同轴线 |
Applications Claiming Priority (1)
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CN202120387675.1U CN214624503U (zh) | 2021-02-22 | 2021-02-22 | 皮-泡-皮物理发泡射频同轴线 |
Publications (1)
Publication Number | Publication Date |
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CN214624503U true CN214624503U (zh) | 2021-11-05 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202120387675.1U Active CN214624503U (zh) | 2021-02-22 | 2021-02-22 | 皮-泡-皮物理发泡射频同轴线 |
Country Status (1)
Country | Link |
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CN (1) | CN214624503U (zh) |
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2021
- 2021-02-22 CN CN202120387675.1U patent/CN214624503U/zh active Active
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Skin Bubble Skin Hair Treatment Bubble RF Coaxial Line Effective date of registration: 20230809 Granted publication date: 20211105 Pledgee: Dalian Enterprise Credit Financing Guarantee Co.,Ltd. Pledgor: DALIAN TECHTRON CABLE CO.,LTD. Registration number: Y2023980051475 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20211105 Pledgee: Dalian Enterprise Credit Financing Guarantee Co.,Ltd. Pledgor: DALIAN TECHTRON CABLE CO.,LTD. Registration number: Y2023980051475 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |