CN214623629U - Touch screen structure module, display device and electronic equipment - Google Patents
Touch screen structure module, display device and electronic equipment Download PDFInfo
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- CN214623629U CN214623629U CN202023003088.2U CN202023003088U CN214623629U CN 214623629 U CN214623629 U CN 214623629U CN 202023003088 U CN202023003088 U CN 202023003088U CN 214623629 U CN214623629 U CN 214623629U
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Abstract
The utility model relates to a touch screen structure module, display device and electronic equipment, include: a substrate divided into a first region and a second region surrounding the first region; a plurality of blue light flip chips are arranged in the first area; a plurality of infrared transmitting chips positioned at two adjacent sides of the first area and a plurality of infrared receiving chips positioned at the other two adjacent sides of the first area are arranged in the second area; the plurality of infrared transmitting chips correspond to the plurality of infrared receiving chips one by one; through arranging blue light flip chip, infrared emission chip and infrared emission chip in same base plate on, also set up infrared flip chip in backlight unit's inside for whole module thickness is backlight unit's thickness, realizes touching the slimming of screen structure module.
Description
Technical Field
The utility model relates to an electronic equipment technical field especially relates to a touch screen structure module, display device and electronic equipment.
Background
As shown in fig. 1, in the prior art, an infrared touch screen is configured to fix an infrared touch module 20 in front of a backlight module 10, where the thickness of the infrared touch module 20 is at least 1mm, and the thickness of the whole module is thicker.
Therefore, how to provide a thin touch screen structure module is an urgent problem to be solved.
SUMMERY OF THE UTILITY MODEL
In view of the foregoing deficiencies of the related art, an object of the present application is to provide a touch screen structure module, a display device and an electronic device, which aim to solve the problem of thick overall thickness of the existing touch screen structure module.
In order to solve the technical problem, an embodiment of the utility model provides a touch screen structure module, include:
a substrate divided into a first region and a second region surrounding the first region;
a plurality of blue light flip chips are arranged in the first area;
a plurality of infrared transmitting chips positioned at two adjacent sides of the first area and a plurality of infrared receiving chips positioned at the other two adjacent sides of the first area are arranged in the second area; the plurality of infrared transmitting chips correspond to the plurality of infrared receiving chips one to one.
The utility model discloses an in the embodiment, be equipped with the tin cream on the base plate, a plurality of blue light flip chip a plurality of infrared emission chips a plurality of infrared receiving chip pass through respectively the tin cream with the base plate bonds.
In an embodiment of the present invention, a transparent protection adhesive layer is disposed on the substrate.
In an embodiment of the present invention, the transparent protective adhesive layer is a silica gel layer.
In an embodiment of the present invention, the thickness range of the transparent protective adhesive layer is 10-100 um.
In order to solve the problem, the utility model also provides a display device, display device includes as above touch screen structure module.
In order to solve the above problem, the present invention further provides an electronic device, which includes the display device as described above.
The utility model has the advantages that:
the utility model provides a touch screen structure module, display device and electronic equipment arranges blue light flip chip, infrared emission chip and infrared emission chip in on the same base plate, also sets up infrared flip chip in backlight unit's inside for whole module thickness is backlight unit's thickness, realizes touch screen structure module's slimming.
Drawings
FIG. 1 is a schematic structural diagram of a touch screen structure module in the prior art;
fig. 2 is a schematic structural diagram of a touch screen structural module according to an embodiment of the present invention;
fig. 3 is a schematic flow chart of a manufacturing method of a touch screen structure module according to the present invention;
fig. 4 is a schematic flow chart of a manufacturing method of another touch screen structure module according to the present invention;
description of reference numerals:
10-a backlight module; 20-an infrared touch module; 31-a substrate; 311-a first region; 312 — a second region; 321-an infrared emitting chip; 322-infrared receiving chip; 323-blue light flip chip.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
The infrared touch screen scheme among the prior art is fixed infrared touch module in backlight unit the place ahead, and infrared module thickness is thinnest more than 1mm, and its whole module thickness is thicker.
Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.
The embodiment of the utility model provides a:
referring to fig. 2, the touch screen structure module provided in this embodiment includes:
a substrate 31, the substrate 31 being divided into a first region 311 and a second region 312 surrounding the first region 311; a plurality of blue light flip chips 323 are arranged in the first region 311; a plurality of infrared emitting chips 321 located at two adjacent sides of the first region 311 and a plurality of infrared receiving chips 322 located at the other two adjacent sides of the first region 311 are arranged in the second region 312; the plurality of infrared transmitting chips 321 corresponds to the plurality of infrared receiving chips 322 one to one.
In this embodiment, a micron blue flip chip is disposed in the first region of the substrate to form a backlight module, and an optical distance OD of the backlight module is in a range of 0 to 1 mm. The second area of the substrate is a surrounding area surrounding the first area, and the infrared flip chip is arranged in the second area to form a transmitting and receiving module. As an example, as shown in fig. 2, the left side and the upper side of the first region are provided with infrared emitting chips; the right side and the lower side of the first area are both provided with infrared receiving chips. The infrared transmitting chips and the infrared receiving chips correspond to one another. As another example, the left side and the lower side of the first region are each provided with an infrared emitting chip, and the right side and the upper side of the first region are each provided with an infrared receiving chip. It can be understood that the setting positions of the infrared transmitting chip and the infrared receiving chip in the second area can be flexibly selected, and only the infrared transmitting chip is required to be positioned on two adjacent sides of the first area, and the infrared receiving chip is arranged on the other two adjacent sides of the first area.
Above-mentioned touch screen structure module arranges blue light flip chip, infrared emission chip and infrared emission chip in same base plate on, also sets up infrared flip chip in backlight unit's inside for whole module thickness is backlight unit's thickness, realizes touch screen structure module's slimming.
In some embodiments, a solder paste is disposed on the substrate, and the plurality of blue light flip chips, the plurality of infrared emitting chips, and the plurality of infrared receiving chips are respectively bonded to the substrate through the solder paste.
It can be understood that the solder paste can be placed on the bonding pads of the substrate by printing, and when various types of chips are fixed on the substrate subsequently, the electrodes on the blue light flip chip or the infrared emitting chip or the infrared receiving chip can be attached to the solder paste on the substrate, and then the solder paste is melted by reflow soldering, so that the chip electrodes and the bonding pads of the substrate are bonded together.
In some embodiments, a transparent protective glue layer is disposed on the substrate. Optionally, the transparent protective adhesive layer is a silica gel layer. Optionally, the thickness range of the transparent protective glue layer is 10-100 um.
It is understood that a transparent protective adhesive may be encapsulated on the surface of the substrate to protect the chips on the substrate. The transparent protective glue can be made of silica gel. The thickness of the transparent protective adhesive includes, but is not limited to, 10um, 20um, 50um, 100 um. In other words, the top surface of the transparent protective adhesive can be higher than the upper surface of the chip, can be flush with the upper surface of the chip, and can also be lower than the upper surface of the chip, and only the requirement that the transparent protective adhesive can wrap the chip to play a protective role is met.
The embodiment also provides a display device, which comprises the touch screen structure module shown in any one of the embodiments. The display device comprises a display panel and a touch screen structure module which are arranged oppositely, wherein the display panel displays images by utilizing backlight emitted by the touch screen structure module. In a specific application scene, when a user finger touches the screen, two infrared rays in the horizontal direction and the vertical direction passing through the position can be blocked, so that the coordinate position of a touch point on the screen can be judged. Any non-transparent object can change the infrared ray on the touch point to realize touch operation.
The embodiment also provides electronic equipment, and the electronic equipment comprises the display device in the embodiment. The embodiment of the utility model provides an electronic equipment can be for cell-phone, panel computer and wearable equipment etc. have the electronic equipment that shows the function. The electronic equipment adopts the touch screen structure module of the embodiment, has a small thickness, and meets the light and thin requirements of the electronic equipment.
The embodiment also provides a manufacturing method of the touch screen structure module, as shown in fig. 3 and 4, the method includes the following steps:
and S1, providing a substrate, and arranging a plurality of blue light flip chips in a first area of the substrate.
S2, arranging a plurality of infrared emission chips in the second area of the substrate and at two adjacent sides of the first area; and arranging a plurality of infrared receiving chips in one-to-one correspondence with the plurality of infrared transmitting chips in the second area of the substrate and on the other two adjacent sides of the first area.
Note that, the S1 includes: and S0, arranging solder paste on the substrate.
The S1 includes: s11, placing a plurality of blue light flip chips on the solder paste of the substrate in the first area of the substrate;
the S2 includes: s21, placing the infrared emission chips on the solder paste of the substrate in the second area of the substrate and on two adjacent sides of the first area; placing a plurality of infrared receiving chips which are in one-to-one correspondence with the plurality of infrared transmitting chips on the solder paste of the substrate in a second area of the substrate and on the other two sides adjacent to the first area;
said S2 then includes: and S3, melting solder paste through reflow soldering, and bonding the plurality of blue light flip chips, the plurality of infrared emitting chips and the plurality of infrared receiving chips on the substrate.
Note that, after S2, the method further includes: and S4, arranging a transparent protective glue layer on the substrate.
For better understanding the utility model discloses, this embodiment is right with a complete touch screen structure module preparation flow the utility model discloses do further illustration, this method includes:
1) placing solder paste on the substrate by printing;
2) arranging a blue light flip chip and an infrared flip chip on the solder paste in sequence;
3) melting the solder paste by adopting a reflow soldering mode so as to bond the chip electrode and the substrate bonding pad together;
4) and encapsulating a layer of transparent protective glue on the surface of the substrate by using silica gel in a molding mode to protect the chip on the substrate.
In a word, the utility model discloses can directly bond blue light flip chip and infrared flip chip on the base plate, and infrared flip chip thickness is thinnest to be 0.1 mm. Because the thickness of touch screen structure module is backlight unit's thickness, compare greatly reduced with the thickness of current touch screen structure module to the slimming of touch screen structure module has been realized.
To sum up, the utility model provides a touch screen structure module, display device and electronic equipment arranges blue light flip chip, infrared emission chip and infrared emission chip in on the same base plate, also sets up infrared flip chip in backlight unit's inside for whole module thickness is backlight unit's thickness, realizes touch screen structure module's slimming.
It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (7)
1. The utility model provides a touch screen structure module which characterized in that includes:
a substrate divided into a first region and a second region surrounding the first region;
a plurality of blue light flip chips are arranged in the first area;
a plurality of infrared transmitting chips positioned at two adjacent sides of the first area and a plurality of infrared receiving chips positioned at the other two adjacent sides of the first area are arranged in the second area; the plurality of infrared transmitting chips correspond to the plurality of infrared receiving chips one to one.
2. The touch screen structural module of claim 1, wherein a solder paste is disposed on the substrate, and the plurality of blue light flip chips, the plurality of infrared emitting chips, and the plurality of infrared receiving chips are respectively bonded to the substrate through the solder paste.
3. The touch screen structural module of claim 1, wherein a transparent protective adhesive layer is disposed on the substrate.
4. The touch screen structural module of claim 3, wherein the transparent protective adhesive layer is a silicone layer.
5. The touch screen structure module of claim 3, wherein the thickness of the transparent protective adhesive layer is in a range of 10-100 um.
6. A display device, comprising the touch screen structure module according to any one of claims 1 to 5.
7. An electronic apparatus characterized in that it comprises the display device according to claim 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023003088.2U CN214623629U (en) | 2020-12-14 | 2020-12-14 | Touch screen structure module, display device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023003088.2U CN214623629U (en) | 2020-12-14 | 2020-12-14 | Touch screen structure module, display device and electronic equipment |
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| Publication Number | Publication Date |
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| CN214623629U true CN214623629U (en) | 2021-11-05 |
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| CN202023003088.2U Active CN214623629U (en) | 2020-12-14 | 2020-12-14 | Touch screen structure module, display device and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112527155A (en) * | 2020-12-14 | 2021-03-19 | 深圳市聚飞光电股份有限公司 | Touch screen structure module, manufacturing method thereof, display device and electronic equipment |
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- 2020-12-14 CN CN202023003088.2U patent/CN214623629U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112527155A (en) * | 2020-12-14 | 2021-03-19 | 深圳市聚飞光电股份有限公司 | Touch screen structure module, manufacturing method thereof, display device and electronic equipment |
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