CN214609255U

CN214609255U - Silicon-free heat conduction gasket for electronic product

Info

Publication number: CN214609255U
Application number: CN202120915325.8U
Authority: CN
Inventors: 张宇强; 王迪
Original assignee: Shenzhen Leizidun New Material Co ltd
Current assignee: Shenzhen Leizidun New Material Co ltd
Priority date: 2021-04-29
Filing date: 2021-04-29
Publication date: 2021-11-05
Anticipated expiration: 2031-04-29

Abstract

The utility model discloses a non-silicon heat conduction gasket for electronic products, which comprises a non-silicon heat conduction gasket main body, wherein a soft layer is arranged on the side surface of the non-silicon heat conduction gasket main body, the thickness of the soft layer is larger than that of the non-silicon heat conduction gasket main body, a limiting part is arranged in the soft layer, a cavity is arranged in the limiting part, and the limiting part is abutted against a non-silicon heat conduction gasket; limiting pieces are fixed on the side faces of the soft layers, each limiting piece is connected with the same stop block, the stop blocks are located above the silicon-free heat conducting gasket main body, and moisture-proof assemblies are arranged on the stop blocks. When the utility model is used, the transportation of the silicon-free heat conducting gasket main body is convenient; the cable is not easy to damage during transportation; the whole compression resistance and moisture resistance effect is good.

Description

Silicon-free heat conduction gasket for electronic product

Technical Field

The utility model relates to a no silicon heat gasket field, concretely relates to no silicon heat gasket for electronic product.

Background

The heat conducting gaskets fill the air gap between the heat generating device and the heat sink or metal base, and their flexible and elastic characteristics enable them to be used to cover very uneven surfaces. Heat is conducted from the discrete device or the entire PCB to the metal housing or diffuser plate, thereby increasing the efficiency and life of the heat-generating electronic assembly.

The existing heat conducting gasket part is made of a silicon-free material, and the silicon-free heat conducting gasket has defects and is easy to damage during transportation when in use.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a can solve the electron product of above-mentioned problem with no silicon heat conduction gasket, it is not fragile.

The utility model discloses a realize through following technical scheme: the utility model provides a no silicon thermal pad piece for electronic product, includes no silicon thermal pad piece main part, its characterized in that: the side surface of the silicon-free heat conduction gasket main body is provided with a soft layer, the thickness of the soft layer is larger than that of the silicon-free heat conduction gasket main body, a limiting part is arranged in the soft layer, a cavity is arranged in the limiting part, and the limiting part is abutted against one silicon-free heat conduction gasket; limiting pieces are fixed on the side faces of the soft layers, each limiting piece is connected with the same stop block, the stop blocks are located above the silicon-free heat conducting gasket main body, and moisture-proof assemblies are arranged on the stop blocks.

As the preferred technical scheme, a plurality of slots are formed in the inner side of the soft layer from top to bottom, the side face of the silicon-free heat conducting gasket body is inserted into the slots, and a slot is arranged between the two limiting parts which are adjacent from top to bottom.

As the preferred technical scheme, a cavity is arranged in the soft layer, the cavity surrounds the soft layer, an opening is formed in the top of the soft layer, and the stop block seals the opening.

As a preferred technical scheme, the limiting part and the soft layer are of an integrated structure.

As the preferred technical scheme, the limiting sheet is made of hard materials and is fixedly bonded on the soft layer.

As the preferred technical scheme, the check block is made of colloid materials, the moisture-proof component comprises gauze wrapping dry particles, and a plurality of air holes are formed in the check block.

The utility model has the advantages that: when the utility model is used, the transportation of the silicon-free heat conducting gasket main body is convenient; the cable is not easy to damage during transportation; the whole compression resistance and moisture resistance effect is good.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is an overall view of the present invention;

fig. 2 is a structural diagram of the stopper of the present invention.

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

This specification includes any features disclosed in the appended claims, abstract and drawings, which are, unless expressly stated otherwise, replaceable with other equivalent or similarly purposed alternative features. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.

In the description of the present invention, it is to be understood that the terms "one end", "the other end", "the outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The use of terms herein such as "upper," "above," "lower," "below," and the like in describing relative spatial positions is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented 90 degrees or at other orientations and the spatially relative descriptors used herein interpreted accordingly.

In the present invention, unless otherwise explicitly specified or limited, the terms "set", "coupled", "connected", "penetrating", "plugging", and the like are to be understood in a broad sense, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

As shown in fig. 1 to 2, the heat conducting gasket comprises a silicon-free heat conducting gasket body 1, wherein a soft layer 2 is arranged on the side surface of the silicon-free heat conducting gasket body 1, the thickness of the soft layer 2 is greater than that of the silicon-free heat conducting gasket body 1, the soft layer can protrude out of each heat conducting gasket and protect the heat conducting gasket, a limiting part 3 is arranged in the soft layer 2, a buffer cavity is arranged in the limiting part 3, and the limiting part 3 is abutted against one silicon-free heat conducting gasket body 1; the side of soft layer 2 is fixed with spacing piece 5, and each spacing piece 5 is connected with same dog 6, and the dog contradicts with spacing piece can, dog 6 is located the top of no silicon heat-conducting gasket main part 1, is provided with dampproofing subassembly 7 on the dog 6.

Wherein, a plurality of slots are formed on the inner side of the soft layer 2 from top to bottom, the side surface of the silicon-free heat conducting gasket main body 1 is inserted into the slots, and a slot is arranged between the two limiting parts 3 which are adjacent up and down. Spacing portion and no silicon heat conduction gasket main part contact have increased the stability when no silicon heat conduction gasket transports.

Wherein, be provided with cavity 211 in the soft layer 2, the deformation extrusion of being convenient for, cavity 211 surrounds soft layer 2, and the top on soft layer 2 is formed with the opening, and dog 6 seals the opening.

Wherein, spacing portion 3 and soft layer 2 structure as an organic whole.

Wherein, spacing piece 5 is made for hard material, and spacing piece 5 bonds and fixes on soft layer 2, for example plastics make, has increased the structural strength of side, has increased crashworthiness and crushing resistance.

Wherein, dog 6 is made for the colloid material, and dampproofing subassembly 7 is including the gauze parcel dry particle, is provided with a plurality of bleeder vents 8 on the dog 6. The effect of the moisture-proof component is exerted through the air holes, and moisture-proof protection is increased.

This technical scheme can place each no silicon heat conduction gasket main part in the slot when using, protects no silicon heat conduction gasket through the soft layer of gluing the system, has increased the crashworthiness of side.

When the technical scheme is used, the soft layer protects the silicon-free heat conducting gasket main body. The stop blocks protect the tops of the silicon-free heat conducting gaskets, so that the silicon-free heat conducting gaskets are not easy to damage in the transportation process.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.

Claims

1. The utility model provides a no silicon thermal pad piece for electronic product, includes no silicon thermal pad piece main part (1), its characterized in that: the side face of the silicon-free heat conduction gasket main body (1) is provided with a soft layer (2), the thickness of the soft layer (2) is larger than that of the silicon-free heat conduction gasket main body (1), a limiting part (3) is arranged in the soft layer (2), a buffer cavity is arranged in the limiting part (3), and the limiting part (3) is abutted against one silicon-free heat conduction gasket main body (1); limiting sheets (5) are fixed on the side faces of the soft layers (2), each limiting sheet (5) is connected with a same stop block (6), each stop block (6) is located above the silicon-free heat conducting gasket main body (1), and a damp-proof assembly (7) is arranged on each stop block (6).

2. The non-silicon thermal pad for electronic products of claim 1, wherein: a plurality of slots are formed in the inner side of the soft layer (2) from top to bottom, the side face of the silicon-free heat conduction gasket main body (1) is inserted into the slots, and one slot is arranged between the two limiting parts (3) which are adjacent up and down.

3. The non-silicon thermal pad for electronic products of claim 1, wherein: a cavity (211) is arranged in the soft layer (2), the cavity (211) surrounds the soft layer (2), an opening is formed in the top of the soft layer (2), and the stop block (6) seals the opening.

4. The non-silicon thermal pad for electronic products of claim 1, wherein: the limiting part (3) and the soft layer (2) are of an integrated structure.

5. The non-silicon thermal pad for electronic products of claim 1, wherein: the limiting sheet (5) is made of hard material, and the limiting sheet (5) is bonded and fixed on the soft material layer (2).

6. The non-silicon thermal pad for electronic products of claim 1, wherein: the check block (6) is made of colloid materials, the moisture-proof component (7) comprises dry particles wrapped by gauze, and a plurality of air holes (8) are formed in the check block (6).