CN214604805U

CN214604805U - Semiconductor circuit board die cutting machine

Info

Publication number: CN214604805U
Application number: CN202120728981.7U
Authority: CN
Inventors: 蒋峰
Original assignee: Chongqing Hongfutai Automation Equipment Co ltd
Current assignee: Chongqing Hongfutai Automation Equipment Co ltd
Priority date: 2021-04-09
Filing date: 2021-04-09
Publication date: 2021-11-05
Anticipated expiration: 2031-04-09

Abstract

The utility model discloses a semiconductor circuit board cutting press, in particular to the technical field of semiconductor processing, which comprises a machine table; the board top left and right sides all is fixed with the spindle, and the spindle outside has all cup jointed the main spring, and the welding has a platform between the spindle top, and top bench side installs electronic jar, and electronic cylinder bottom is provided with the ram rod rather than power end fixed connection and run through a platform, and the ram rod bottom is fixed with the punching press board, the beneficial effects of the utility model reside in that: when the punching rod continuously moves down and make punching press board bottom and movable sleeve top contact the back, will make the movable sleeve atress and drive the long post and move down, the long post can be through the sliding sleeve along the spindle sliding downwards, and the main spring can be stretched and open in addition, and die-cut mould alright die-cut to semiconductor circuit board after moving down in the lump, the user can select the die-cut mould of needs as required to through the movable sleeve with the quick removal of die-cut mould to die-cut point, need not to change die-cut mould, die-cut efficiency is better.

Description

Semiconductor circuit board die cutting machine

Technical Field

The utility model relates to a semiconductor processing technology field especially relates to a semiconductor circuit board die cutting machine.

Background

The blanking machine is a device which applies external force to plates, strips, pipes, profiles and the like by a press and a die to cause plastic deformation or separation of the plates, strips, pipes, profiles and the like, thereby obtaining workpieces (stamped parts) with required shapes and sizes.

When the conventional punching machine punches the semiconductor circuit board, the semiconductor circuit board is usually required to be punched into different sizes, and a punching die needs to be replaced, so that the punching efficiency is general.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor circuit board die cutting machine to solve current semiconductor circuit board die cutting machine, the general problem of die-cut efficiency.

The utility model provides a technical scheme that its technical problem adopted is: a semiconductor circuit board cutting press comprises a machine table;

the left side and the right side of the top of the machine platform are both fixed with shafts, the outer parts of the shafts are both sleeved with main springs, a top platform is welded between the tops of the shafts, an electric cylinder is mounted above the top platform, the bottom of the electric cylinder is provided with a stamping rod which is fixedly connected with a power end of the electric cylinder and penetrates through the top platform, the bottom of the stamping rod is fixed with a stamping plate, the left side and the right side of the bottom of the stamping plate are both fixed with a limiting shaft, a long column is arranged below the stamping plate, the left end and the right end of the long column are both fixed with sliding sleeves, two bilaterally symmetrically arranged through holes are communicated in the middle of the top of the long column, the top of the long column close to the inner sides of the two through holes are both provided with sliding grooves, the inner sides of the inner walls of the through holes are both provided with side grooves, moving blocks are both arranged in the side grooves, auxiliary springs are fixed between the inner ends of the moving blocks and the inner walls of the side grooves, and the top of the moving blocks are both provided with top openings, and all be provided with the circle piece in the apical lamella, be fixed with reset spring between circle piece bottom and the apical lamella bottom, the movable sleeve has all been cup jointed to the long post outside and near the perforation outside, the draw-in groove has all been seted up to the movable sleeve top left and right sides, just die-cut mould is all installed to the movable sleeve bottom.

Furthermore, the position of the limiting shaft corresponds to that of the through hole, the diameter of the limiting shaft is the same as the inner diameter of the through hole, and the distance between the inner sides of the two through holes is the same as the length of the movable sleeve.

Furthermore, the through hole, the sliding groove and the side groove are communicated, the outer end of the moving block extends into the through hole, the top of the round block penetrates through the top of the through hole, and the diameter of the round block is the same as the groove width of the sliding groove.

Furthermore, two sliding sleeves are respectively sleeved outside the crankshaft, the bottoms of the main springs are respectively fixed with the bottoms of the two sliding sleeves, and the tops of the main springs are fixed with the bottom of the top table.

Furthermore, two the draw-in groove outer end link up to the movable sleeve left and right sides respectively, just the groove width of draw-in groove is the same with the diameter of fritter.

Further, the two punching dies are different in size.

Compared with the prior art, the utility model discloses the beneficial effect who realizes:

when the punching rod continuously moves down and make punching press board bottom and movable sleeve top contact the back, will make the movable sleeve atress and drive the long post and move down, the long post can be through the sliding sleeve along the spindle sliding downwards, and the main spring can be stretched and open in addition, and die-cut mould alright die-cut to semiconductor circuit board after moving down in the lump, the user can select the die-cut mould of needs as required to through the movable sleeve with the quick removal of die-cut mould to die-cut point, need not to change die-cut mould, die-cut efficiency is better.

Drawings

FIG. 1 is a general schematic view of the present invention;

fig. 2 is an enlarged view of a portion a of fig. 1 according to the present invention;

FIG. 3 is a partial perspective view of the movable sleeve of the present invention;

fig. 4 is a partial perspective view of the long column of the present invention.

In the figure: 1-machine table, 2-machine shaft, 3-top table, 4-electric cylinder, 5-stamping rod, 6-stamping plate, 7-limit shaft, 8-main spring, 9-sliding sleeve, 10-long column, 11-movable sleeve, 12-stamping die, 13-perforation, 14-side groove, 15-auxiliary spring, 16-sliding groove, 17-moving block, 18-round block, 19-clamping groove, 20-reset spring and 21-top opening.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a semiconductor circuit board cutting press comprises a machine table 1;

the left side and the right side of the top of the machine table 1 are both fixed with machine shafts 2, main springs 8 are sleeved outside the machine shafts 2, top tables 3 are welded between the tops of the machine shafts 2, electric cylinders 4 are installed above the top tables 3, stamping rods 5 which are fixedly connected with power ends of the electric cylinders 4 and penetrate through the top tables 3 are arranged at the bottoms of the electric cylinders 4, stamping plates 6 are fixed at the bottoms of the stamping rods 5, limiting shafts 7 are fixed at the left side and the right side of the bottoms of the stamping plates 6, long columns 10 are arranged below the stamping plates 6, sliding sleeves 9 are fixed at the left ends and the right ends of the long columns 10, two through holes 13 which are symmetrically arranged in the left and the right directions are penetrated in the middle of the tops of the long columns 10, the two sliding sleeves 9 are respectively sleeved outside the two machine shafts 2, the bottoms of the two main springs 8 are respectively fixed with the bottoms of the two sliding sleeves 9, the tops of the main springs 8 are fixed with the bottoms of the top tables 3, the position of the limiting shaft 7 corresponds to that of the through hole 13, the diameter of the limiting shaft 7 is the same as the inner diameter of the through hole 13, the distance between the inner sides of the two through holes 13 is the same as the length of the movable sleeve 11, sliding grooves 16 are formed in the top of the long column 10 and close to the inner sides of the two through holes 13, side grooves 14 are formed in the inner sides of the inner walls of the through holes 13, movable blocks 17 are arranged in the side grooves 14, auxiliary springs 15 are fixed between the inner ends of the movable blocks 17 and the inner walls of the side grooves 14, top openings 21 are formed in the top of the movable blocks 17, round blocks 18 are arranged in the top openings 21, return springs 20 are fixed between the bottoms of the round blocks 18 and the bottoms of the top openings 21, the through holes 13, the sliding grooves 16 and the side grooves 14 are communicated, the outer ends of the movable blocks 17 extend into the through holes 13, the tops of the round blocks 18 penetrate through the tops of the through holes 13, and the diameters of the round blocks 18 are the groove widths of the sliding grooves 16, the movable sleeve 11 has all been cup jointed to the long post 10 outside and being close to the perforation 13 outside, draw-in groove 19 has all been seted up to the 11 top left and right sides of movable sleeve, two draw-in groove 19 outer end link up respectively to the 11 left and right sides of movable sleeve, just the groove width of draw-in groove 19 is the same with the diameter of circle piece 18, just die-cut mould 12, two are all installed to movable sleeve 11 bottom die-cut mould 12's size is different.

When the semiconductor circuit board is needed to be punched, the corresponding punching die 12 is selected according to the punching size needed, the round block 18 is pressed downwards to enable the return spring 20 to be stressed and extruded, after the top of the round block 18 is retracted into the through hole 13, the movable sleeve 11 above the corresponding punching die 12 slides inwards, the movable sleeve 11 slides to the position between the two through holes 13, the clamping groove 19 corresponds to the through hole 13 at the moment, and then the round block 18 is loosened to enable the movable sleeve to be reset through the return spring 20;

then, a semiconductor circuit board to be punched is clamped to the top of the machine table 1 through an external clamping device and aligned to the position of the punching plate 6, the round block 18 is shifted inwards through a tool, the moving block 17 can also move inwards and extrude the secondary spring 15, when the front part of the moving block 17 is taken into the side groove 14 and clamped in the clamping groove 19, the round block 18 moves into the sliding groove 16, the electric cylinder 4 is connected to a power supply and started, the electric cylinder 4 drives the punching rod 5 to press downwards after being started, meanwhile, the punching plate 6 also presses downwards, when the limiting shaft 7 moves downwards together and is inserted into the through hole 13, the limiting shaft 7 can shield the outer end of the side groove 14, therefore, the moving block 17 is not easy to reset to the original position through the secondary spring 15, the movable sleeve 11 can be limited to a moving point, the tool is removed at the moment, when the punching rod 5 moves downwards continuously and the bottom of the punching plate 6 is contacted with the top of the movable sleeve 11, the movable sleeve 11 is stressed and drives the long column 10 to move downwards, the long column 10 can slide downwards along the crankshaft 2 through the sliding sleeve 9, the main spring 8 can be stretched, and the punching die 12 can punch the semiconductor circuit board after moving downwards together;

after die-cut, start electronic jar 4 and drive punching press board 6 through punching press pole 5 and lift up, because of the resilience of main spring 8, long post 10 alright shift up along spindle 2 through sliding sleeve 9 in the lump, when 6 bottoms of punching press board and movable sleeve 11 top separation and spacing axle 7 follow perforation 13 internal shift back, resilience through auxiliary spring 15 can make movable block 17 and circle piece 18 reset, thereby it is spacing no longer to carry out movable sleeve 11, the user can select die-cut mould 12 of needs as required, and through movable sleeve 11 with the quick removal of die-cut mould 12 to die-cut point, need not to change die-cut mould 12, die-cut efficiency is better.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a semiconductor circuit board die cutting machine, includes board (1), its characterized in that:

the machine is characterized in that a machine shaft (2) is fixed on the left side and the right side of the top of a machine table (1), a main spring (8) is sleeved on the outer portion of the machine shaft (2), a top table (3) is welded between the tops of the machine shaft (2), an electric cylinder (4) is installed above the top table (3), a stamping rod (5) which is fixedly connected with a power end of the electric cylinder (4) and penetrates through the top table (3) is arranged at the bottom of the electric cylinder (4), a stamping plate (6) is fixed at the bottom of the stamping rod (5), limiting shafts (7) are fixed on the left side and the right side of the bottom of the stamping plate (6), a long column (10) is arranged below the stamping plate (6), sliding sleeves (9) are fixed at the left end and the right end of the long column (10), two through holes (13) which are symmetrically arranged left and right are arranged in the middle of the top of the long column (10), sliding grooves (16) are formed in the top of the long column (10) and close to the inner sides of the two through holes (13), side grooves (14) are formed in the inner side of the inner wall of the through hole (13), moving blocks (17) are arranged in the side grooves (14), auxiliary springs (15) are fixed between the inner ends of the moving blocks (17) and the inner wall of the side grooves (14), top openings (21) are formed in the tops of the moving blocks (17), round blocks (18) are arranged in the top openings (21), reset springs (20) are fixed between the bottoms of the round blocks (18) and the bottoms of the top openings (21), movable sleeves (11) are sleeved on the outer portions of the long columns (10) and close to the outer sides of the through hole (13), clamping grooves (19) are formed in the left side and the right side of the top of each movable sleeve (11), and punching molds (12) are installed at the bottoms of the movable sleeves (11).

2. The semiconductor circuit board cutting press of claim 1, wherein: the position of the limiting shaft (7) corresponds to that of the through hole (13), the diameter of the limiting shaft (7) is the same as the inner diameter of the through hole (13), and the distance between the inner sides of the two through holes (13) is the same as the length of the movable sleeve (11).

3. The semiconductor circuit board cutting press of claim 1, wherein: the through hole (13), the sliding groove (16) and the side groove (14) are communicated, the outer end of the moving block (17) extends into the through hole (13), the top of the round block (18) penetrates through the top of the through hole (13), and the diameter of the round block (18) is the same as the groove width of the sliding groove (16).

4. The semiconductor circuit board cutting press of claim 1, wherein: the two sliding sleeves (9) are respectively sleeved outside the two shafts (2), the bottoms of the two main springs (8) are respectively fixed to the bottoms of the two sliding sleeves (9), and the tops of the main springs (8) are fixed to the bottom of the top platform (3).

5. The semiconductor circuit board cutting press of claim 1, wherein: the outer ends of the two clamping grooves (19) are respectively communicated with the left side and the right side of the movable sleeve (11), and the groove width of the clamping grooves (19) is the same as the diameter of the round block (18).

6. The semiconductor circuit board cutting press of claim 1, wherein: the two punching dies (12) are different in size.