CN214592688U - Anti-electromagnetic interference PCB mixed-voltage high-frequency circuit board - Google Patents
Anti-electromagnetic interference PCB mixed-voltage high-frequency circuit board Download PDFInfo
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- CN214592688U CN214592688U CN202120631488.3U CN202120631488U CN214592688U CN 214592688 U CN214592688 U CN 214592688U CN 202120631488 U CN202120631488 U CN 202120631488U CN 214592688 U CN214592688 U CN 214592688U
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Abstract
The utility model discloses an anti-electromagnetic interference's PCB mixes pressure high frequency circuit board, including first circuit board, the bottom surface of first circuit board is close to both ends fixed mounting and has first transmission pole, the other end fixedly connected with ground plate of first transmission pole, the bottom fixed surface of ground plate is connected with second transmission pole, the other end fixedly connected with second circuit board of second transmission pole. A PCB of anti-electromagnetic interference mixes presses high frequency circuit board, electrically conductive grid structure through setting up, can carry out size adjustment according to the structure that actually mixes and presses high frequency circuit board, and then reduce the degree of signal mutual interference each other, in order to weaken the noise radiation degree, and then reduce the degree of signal mutual interference each other, can also reduce the drilling number simultaneously, thereby the bulk strength of lifting circuit board, through the transmission rod structure that sets up, can keep apart the interval between the circuit board, thereby effectively the heat dispersion of lifting circuit board, prolong its life.
Description
Technical Field
The utility model relates to a PCB thoughtlessly presses high frequency circuit board technical field, in particular to anti-electromagnetic interference's PCB thoughtlessly presses high frequency circuit board.
Background
With the development of information technology, the demand for high-speed information transmission is increasing, for example, satellite communication, microwave communication, optical fiber communication and the like all require the development of information with high frequency; information transmission is urgently required to be developed to high speed due to the increase of the processing capacity and the information memory capacity of the computer technology, however, the printed circuit board bears the high-frequency information and the high-speed transmitted information, and the high frequency of the information puts requirements on the high-frequency performance of the printed circuit board; the existing PCB mixed-compression high-frequency circuit board has certain defects when in use, the problem of electromagnetic interference can be inevitably encountered in the use process on the structure of the common PCB mixed-compression high-frequency circuit board, and no corresponding structure is used for resisting protection, and meanwhile, after the common PCB mixed-compression high-frequency circuit board is assembled and used, the heat dissipation performance is poor due to the structural connection problem, and the service life of the common PCB mixed-compression high-frequency circuit board is easily shortened.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide an anti-electromagnetic interference PCB mixed-voltage high-frequency circuit board, which can effectively solve the problems in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides an anti-electromagnetic interference's PCB mixes voltage high frequency circuit board, includes first circuit board, the bottom surface of first circuit board is close to both ends fixed mounting and has first transmission pole, the other end fixedly connected with ground plate of first transmission pole, the bottom surface fixedly connected with second transmission pole of ground plate, the other end fixedly connected with second circuit board of second transmission pole.
Preferably, the first circuit board comprises an anti-interference coating, a high-frequency board and a glass fiber board, first conductive grids are arranged on the surface of the first circuit board close to the two ends, first mounting holes are formed in the surface of the first conductive grids, and first transmission rods are fixedly mounted on the surface, located in the first mounting holes, of the bottom end of the first circuit board.
Preferably, the anti-interference coating, the high-frequency plate and the glass fiber plate are sequentially bonded and pressed.
Preferably, a second conductive grid is fixedly arranged on the surface of the ground plate close to the two ends, a through hole is formed in the surface of the second conductive grid, a connecting end is fixedly arranged on the surface of the ground plate close to one side edge, and the ground plate is fixedly connected with the first circuit board through the second conductive grid, the through hole, the first conductive grid, the first mounting hole and the first transmission rod.
Preferably, a third conductive grid is installed on the surface of the second circuit board close to the two ends, a second mounting hole is formed in the surface of the third conductive grid, a second transmission rod is fixedly installed on the surface of the second mounting hole, and the second circuit board is fixedly connected with the ground plate through the third conductive grid, the second mounting hole, the second transmission rod, the through hole and the second conductive grid.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses in, through the electrically conductive grid structure that sets up, can carry out size adjustment according to the structure of actual mixed pressure high frequency circuit board, and then reduce the degree of signal mutual interference each other, in order to weaken noise radiation degree, and then reduce the degree of signal mutual interference each other, can also reduce the drilling number simultaneously, thereby the bulk strength of lifting circuit board, through the transmission pole structure that sets up, can keep apart the interval between the circuit board, thereby effectively promote the heat dispersion of circuit board, prolong its life.
Drawings
Fig. 1 is a schematic view of the whole structure of an anti-electromagnetic interference PCB mixed-voltage high-frequency circuit board of the present invention;
FIG. 2 is a sectional view of the PCB assembly of the anti-EMI mixed-voltage high-frequency PCB of the present invention;
fig. 3 is an enlarged view of a point a in fig. 1.
In the figure: 1. a first circuit board; 101. an anti-interference coating; 102. high-frequency plates; 103. a glass fiber board; 104. a first conductive mesh; 105. a first mounting hole; 106. a first transmission lever; 2. a ground plate; 201. a second conductive grid; 202. a through hole; 203. a connecting end; 3. a second circuit board; 301. a third conductive grid; 302. a second mounting hole; 303. a second transmission rod.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1-3, an anti-electromagnetic interference PCB mixed-voltage high-frequency circuit board includes a first circuit board 1, a first transmission rod 106 is fixedly installed on the bottom end surface of the first circuit board 1 near to two ends, the other end of the first transmission rod 106 is fixedly connected with a ground plate 2, the bottom end surface of the ground plate 2 is fixedly connected with a second transmission rod 303, and the other end of the second transmission rod 303 is fixedly connected with a second circuit board 3;
the first circuit board 1 comprises an anti-interference coating 101, a high-frequency board 102 and a glass fiber board 103, wherein a first conductive grid 104 is arranged on the surface of the first circuit board 1 close to two ends, a first mounting hole 105 is formed in the surface of the first conductive grid 104, and a first transmission rod 106 is fixedly mounted at the bottom end of the first circuit board 1 on the surface of the first mounting hole 105; the anti-interference coating 101, the high-frequency plate 102 and the glass fiber plate 103 are sequentially bonded and pressed in sequence; a second conductive grid 201 is fixedly arranged on the surface of the ground plate 2 close to two ends, a through hole 202 is formed in the surface of the second conductive grid 201, a connecting end 203 is fixedly arranged on the surface of the ground plate 2 close to one side edge, and the ground plate 2 is fixedly connected with the first circuit board 1 through the second conductive grid 201, the through hole 202, the first conductive grid 104, the first mounting hole 105 and the first transmission rod 106; the surface of the second circuit board 3 near to the two ends is provided with a third conductive grid 301, the surface of the third conductive grid 301 is provided with a second mounting hole 302, the surface of the second mounting hole 302 is fixedly provided with a second transmission rod 303, the second circuit board 3 is fixedly connected with the ground plate 2 through the third conductive grid 301, the second mounting hole 302, the second transmission rod 303, the through hole 202 and the second conductive grid 201, according to the actual use requirement and the size of the circuit board, the first conductive grid 104, the second conductive grid 201 and the third conductive grid 301 are respectively processed on the surfaces of the first circuit board 1, the ground plate 2 and the second circuit board 3, the conductive grid structure can be adjusted in size according to the structure of the actual mixed-compression high-frequency circuit board, so as to reduce the mutual interference degree of signals, so as to weaken the noise radiation degree, further reduce the mutual interference degree of the signals, and simultaneously reduce the number of drilled holes, therefore, the overall strength of the circuit board is improved, the first transmission rod 106 and the second transmission rod 303 are fixedly installed at corresponding positions, the first circuit board 1, the grounding plate 2 and the second circuit board 3 are tightly connected, and the transmission rod structure can isolate the distance among the circuit boards, so that the heat dissipation performance of the circuit boards is effectively improved, and the service life of the circuit boards is prolonged.
It should be noted that, the utility model relates to an anti-electromagnetic interference PCB mixes presses high frequency circuit board, when using, press together high frequency panel 102 and glass fiber panel 103 at first and form high frequency mixed circuit board, anti-interference coating 101 is sprayed on its surface, after it dries in air, can form first circuit board 1 and second circuit board 3, according to circuit board actual use demand and size, respectively on first circuit board 1, ground plate 2 and second circuit board 3 surface processing first conductive grid 104, second conductive grid 201 and third conductive grid 301, conductive grid structure can carry out size adjustment according to actual mixed pressing high frequency circuit board's structure, and then reduce the mutual interference's of signal degree, in order to weaken the noise radiation degree, and then reduce the mutual interference's of signal degree, can also reduce the number of bores simultaneously, thereby promote the bulk strength of circuit board, according to the actual model and size, the first mounting holes 105, the through holes 202 and the second mounting holes 302 are respectively formed in the surfaces of the first conductive grid 104, the second conductive grid 201 and the third conductive grid 301 at equal intervals, then the first circuit board 1, the ground plate 2 and the second circuit board 3 are respectively fixed by using a clamping tool, the first transmission rod 106 and the second transmission rod 303 are fixedly mounted at corresponding positions, so that the first circuit board 1, the ground plate 2 and the second circuit board 3 are tightly connected, and the transmission rod structure can isolate the intervals among the circuit boards, so that the heat dissipation performance of the circuit boards is effectively improved, and the service life of the circuit boards is prolonged.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. The utility model provides an anti-electromagnetic interference's PCB mixes voltage high frequency circuit board which characterized in that: including first circuit board (1), the bottom surface of first circuit board (1) is close to both ends fixed mounting and has first transmission pole (106), the other end fixedly connected with ground plate (2) of first transmission pole (106), the bottom surface fixedly connected with second transmission pole (303) of ground plate (2), the other end fixedly connected with second circuit board (3) of second transmission pole (303).
2. The PCB mixed-voltage high-frequency circuit board of claim 1, which is characterized in that: the first circuit board (1) comprises an anti-interference coating (101), a high-frequency board (102) and a glass fiber board (103), first conductive grids (104) are arranged on the surface of the first circuit board (1) close to two ends, first mounting holes (105) are formed in the surface of the first conductive grids (104), and first transmission rods (106) are fixedly mounted on the surface, located in the first mounting holes (105), of the bottom end of the first circuit board (1).
3. The PCB mixed-voltage high-frequency circuit board of claim 2, which is characterized in that: the anti-interference coating (101), the high-frequency plate (102) and the glass fiber plate (103) are sequentially bonded and pressed in sequence.
4. The PCB mixed-voltage high-frequency circuit board of claim 2, which is characterized in that: the surface of the grounding plate (2) is close to two ends, a second conductive grid (201) is fixedly installed, a through hole (202) is formed in the surface of the second conductive grid (201), a connecting end (203) is fixedly installed on the surface of the grounding plate (2) close to one side edge, and the grounding plate (2) is fixedly connected with the first circuit board (1) through the second conductive grid (201), the through hole (202), the first conductive grid (104), the first mounting hole (105) and the first transmission rod (106).
5. The PCB mixed-voltage high-frequency circuit board of claim 4, which is characterized in that: a third conductive grid (301) is installed on the surface of the second circuit board (3) close to two ends, a second mounting hole (302) is formed in the surface of the third conductive grid (301), a second transmission rod (303) is fixedly mounted on the surface of the second mounting hole (302), and the second circuit board (3) is fixedly connected with the grounding plate (2) through the third conductive grid (301), the second mounting hole (302), the second transmission rod (303), the through hole (202) and the second conductive grid (201).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120631488.3U CN214592688U (en) | 2021-03-29 | 2021-03-29 | Anti-electromagnetic interference PCB mixed-voltage high-frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120631488.3U CN214592688U (en) | 2021-03-29 | 2021-03-29 | Anti-electromagnetic interference PCB mixed-voltage high-frequency circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214592688U true CN214592688U (en) | 2021-11-02 |
Family
ID=78321385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120631488.3U Active CN214592688U (en) | 2021-03-29 | 2021-03-29 | Anti-electromagnetic interference PCB mixed-voltage high-frequency circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214592688U (en) |
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2021
- 2021-03-29 CN CN202120631488.3U patent/CN214592688U/en active Active
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