CN214592663U

CN214592663U - Waterproof heat radiation structure of electronic circuit board

Info

Publication number: CN214592663U
Application number: CN202121041208.XU
Authority: CN
Inventors: 周永强; 孙国洋; 于梅; 孙晓燕
Original assignee: Yantai Xusheng Electric Technology Co ltd
Current assignee: Yantai Xusheng Electric Technology Co ltd
Priority date: 2021-05-14
Filing date: 2021-05-14
Publication date: 2021-11-02
Anticipated expiration: 2031-05-14

Abstract

The utility model relates to the technical field of electronic circuit boards, in particular to a waterproof heat dissipation structure of an electronic circuit board, which absorbs and dries water vapor in an upper shell and a lower shell through activated carbon in an insert box, simultaneously sucks external air into a heat dissipation box through a fan, removes dust through a filter screen and blows the air to a circuit board main body, thereby effectively enhancing the heat dissipation of the circuit board, flexibly overhauls and replaces the internal insert box, the circuit board main body and the like through the design of the upper shell and the lower shell, and has simple overall structure and stronger practicability; the circuit board comprises a lower shell, an upper shell and a circuit board main body, wherein the top of the lower shell is connected with the bottom of the upper shell, and the circuit board main body is positioned above the lower shell; still include shock pad, support, mounting screw, slot, insert box, heat dissipation case, baffle, fan, exhaust pipe, air outlet, filter screen, intake pipe and exhaust hole, the shock pad is fixed to be set up in the inside bottom of inferior valve, and the support is fixed to be set up in the top of shock pad, and the circuit board main part is located the top of support.

Description

Waterproof heat radiation structure of electronic circuit board

Technical Field

The utility model relates to an electronic circuit board technical field especially relates to a waterproof heat radiation structure of electronic circuit board.

Background

As is well known, a waterproof heat dissipation structure for an electronic circuit board is an auxiliary device used in the production and processing processes of electronic equipment for protecting the circuit board in the equipment from water and keeping the equipment operating normally, and is widely used in the technical field of electronic circuit boards; most of the existing electronic circuit board waterproof heat dissipation structures are provided with a sealing shell outside the circuit board for water prevention, but the heat dissipation performance is poor, and external water vapor can enter the inside of the circuit board to damage the circuit board.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a waterproof radiating structure of electronic circuit board that water-proof effects is better, heat dispersion is stronger.

The utility model discloses a waterproof heat dissipation structure of an electronic circuit board, which comprises a lower shell, an upper shell and a circuit board main body, wherein the top of the lower shell is connected with the bottom of the upper shell, and the circuit board main body is positioned above the lower shell; the fan is characterized by further comprising a shock pad, a support, a mounting screw, an inserting groove, an inserting box, a heat dissipation box, a partition plate, a fan, an exhaust pipe, an air outlet, a filter screen, an air inlet pipe and an exhaust hole, wherein the shock pad is fixedly arranged at the inner bottom end of the lower shell, the support is fixedly arranged at the top of the shock pad, a circuit board main body is arranged at the top of the support, the bottom of the mounting screw penetrates through the top of the circuit board downwards from the top of the circuit board and is inserted into the top of the support, the inserting groove is fixedly arranged at the top of the shock pad and is positioned below the circuit board main body, the rear part of the inserting box is inserted into the inserting groove backwards from the front part of the inserting groove, activated carbon is filled in the inserting box, the heat dissipation box is fixedly arranged at the inner top end of the upper shell, the partition plate is fixedly arranged at the inner lower end of the heat dissipation box, the fan is fixedly arranged at the left side of the top of the partition plate, the exhaust pipe is arranged at the left part of the partition plate and is arranged at the right side of the fan, the top of filter screen and the inside top of heat dissipation case are connected, and the intake pipe sets up in the right part of heat dissipation case and upwards passes the top of epitheca, and the exhaust hole sets up in the lower part of epitheca.

The utility model discloses a waterproof heat radiation structure of electronic circuit board still includes crown plate, otter board and top cap, and the crown plate is fixed to be set up in the top of epitheca and to be located the top of intake pipe, and the otter board is fixed to be set up in the top of crown plate, and the top cap is fixed to be set up in the top of otter board.

The utility model discloses a waterproof heat radiation structure of electronic circuit board still includes the dry layer, and the dry layer is fixed to be set up in the middle part of crown plate.

The utility model discloses a waterproof heat radiation structure of electronic circuit board still includes the location strip, and the location strip is fixed to be set up in the middle part of inserting the box, and the inner of slot is provided with the spout, and the location strip is located the spout and can slide around.

The utility model discloses a waterproof heat radiation structure of electronic circuit board still includes constant head tank and locating lever, and the constant head tank sets up in the top of inferior valve, and the locating lever is fixed to be set up in the bottom of epitheca, and the bottom of locating lever inserts in the constant head tank from the top of constant head tank.

The utility model discloses a waterproof heat radiation structure of electronic circuit board still includes the sealing ring, and the sealing ring is fixed to be set up in the inferior valve of epitheca, and the lower part snare of sealing ring sets up in the upper portion of inferior valve.

The utility model discloses a waterproof heat radiation structure of electronic circuit board still includes set screw, and set screw's bottom passes the shock pad downwards from the top of shock pad and inserts in the inferior valve.

The utility model discloses a waterproof heat radiation structure of electronic circuit board still includes the guard net, and the guard net is fixed to be set up in the exhaust hole.

Compared with the prior art, the beneficial effects of the utility model are that: when using the waterproof heat radiation structure of electronic circuit board to carry out waterproofly to the circuit board, absorb the drying through the active carbon in the plug box to the steam in epitheca and the inferior valve, blow to the circuit board main part after the filter screen removes dust with outside air suction to the heat dissipation incasement through the fan simultaneously to effective heat dissipation of strengthening circuit board can overhaul the change to inside plug box and circuit board main part etc. in a flexible way in the design through the epitheca inferior valve, and overall structure is simple, and the practicality is stronger.

Drawings

Fig. 1 is a schematic structural diagram of the present invention;

FIG. 2 is a schematic view of the internal structure of the heat dissipation box of the present invention;

FIG. 3 is an enlarged schematic view of A in FIG. 1;

FIG. 4 is an enlarged schematic view of B of FIG. 1;

in the drawings, the reference numbers: 1. a lower case; 2. an upper shell; 3. a circuit board main body; 4. a shock pad; 5. a support; 6. mounting screws; 7. a slot; 8. inserting a box; 9. a heat dissipation box; 10. a partition plate; 11. a fan; 12. an exhaust duct; 13. an air outlet; 14. filtering with a screen; 15. an air inlet pipe; 16. an exhaust hole; 17. a ring plate; 18. a screen plate; 19. a top cover; 20. drying the layer; 21. a positioning bar; 22. positioning a groove; 23. positioning a rod; 24. a seal ring; 25. a set screw; 26. and (4) a protection net.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

As shown in fig. 1 to 4, the waterproof and heat dissipating structure for an electronic circuit board of the present invention comprises a lower casing 1, an upper casing 2 and a circuit board main body 3, wherein the top of the lower casing 1 is connected with the bottom of the upper casing 2, and the circuit board main body 3 is located above the lower casing 1; the novel fan is characterized by further comprising a shock pad 4, a support 5, a mounting screw 6, a slot 7, an insert box 8, a heat dissipation box 9, a partition plate 10, a fan 11, an exhaust pipe 12, an air outlet 13, a filter screen 14, an air inlet pipe 15 and an exhaust hole 16, wherein the shock pad 4 is fixedly arranged at the inner bottom end of the lower shell 1, the support 5 is fixedly arranged at the top of the shock pad 4, a circuit board main body 3 is arranged at the top of the support 5, the bottom of the mounting screw 6 penetrates through the circuit board downwards from the top of the circuit board and is inserted into the top of the support 5, the slot 7 is fixedly arranged at the top of the shock pad 4 and is arranged below the circuit board main body 3, the rear portion of the insert box 8 is inserted into the slot 7 backwards from the front portion of the slot 7, the insert box 8 is filled with activated carbon, the heat dissipation box 9 is fixedly arranged at the inner top end of the upper shell 2, the partition plate 10 is fixedly arranged at the inner lower end of the heat dissipation box 9, the fan 11 is fixedly arranged at the left side of the top of the partition plate 10, the exhaust pipe 12 is arranged at the left part of the fan 11 and downwards penetrates through the partition board 10, the air outlet 13 is arranged at the bottom of the heat dissipation box 9, the filter screen 14 is fixedly arranged at the top of the partition board 10 and positioned at the right side of the fan 11, the top of the filter screen 14 is connected with the top end of the interior of the heat dissipation box 9, the air inlet pipe 15 is arranged at the right part of the heat dissipation box 9 and upwards penetrates through the top of the upper shell 2, the exhaust hole 16 is arranged at the lower part of the upper shell 2, the exhaust fan further comprises a ring plate 17, a net plate 18, a top cover 19 and a drying layer 20, the ring plate 17 is fixedly arranged at the top of the upper shell 2 and positioned above the air inlet pipe 15, the net plate 18 is fixedly arranged at the top of the ring plate 17, the top cover 19 is fixedly arranged at the top of the net plate 18, and the drying layer 20 is fixedly arranged at the middle part of the ring plate 17; when using the waterproof heat radiation structure of electronic circuit board to carry out waterproofly to the circuit board, absorb the drying through the active carbon in the plug box to the steam in epitheca and the inferior valve, blow to the circuit board main part after the filter screen removes dust with outside air suction to the heat dissipation incasement through the fan simultaneously to effective heat dissipation of strengthening circuit board can overhaul the change to inside plug box and circuit board main part etc. in a flexible way in the design through the epitheca inferior valve, and overall structure is simple, and the practicality is stronger.

The utility model discloses a waterproof heat radiation structure of an electronic circuit board, which also comprises a positioning strip 21, wherein the positioning strip 21 is fixedly arranged in the middle of the plug box 8, the inner end of the slot 7 is provided with a chute, and the positioning strip 21 is positioned in the chute and can slide back and forth; the installation of inserting the box is convenient for through above-mentioned setting and is fixed.

The utility model discloses a waterproof heat radiation structure of an electronic circuit board, also include locating slot 22 and locating lever 23, the locating slot 22 is set up in the top of the inferior valve 1, the locating lever 23 is fixed and set up in the bottom of the superior casing 2, the bottom of the locating lever 23 is inserted into locating slot 22 from the top of the locating slot 22; the upper shell and the lower shell are convenient to position and install through the arrangement.

The utility model discloses a waterproof heat radiation structure of an electronic circuit board, which also comprises a sealing ring 24, wherein the sealing ring 24 is fixedly arranged on the lower shell 1 of the upper shell 2, and the lower part of the sealing ring 24 is sleeved on the upper part of the lower shell 1; strengthen the sealed effect of epitheca and inferior valve through above-mentioned setting.

The utility model discloses a waterproof heat dissipation structure of an electronic circuit board, which also comprises a fixing screw 25, wherein the bottom of the fixing screw 25 passes through the shock pad 4 downwards from the top of the shock pad 4 and is inserted into the lower shell 1; the fixation of the shock pad is strengthened through the arrangement.

The utility model discloses a waterproof heat dissipation structure of an electronic circuit board, which also comprises a protection net 26, wherein the protection net 26 is fixedly arranged in the exhaust hole 16; the exhaust holes are protected through the arrangement.

The utility model discloses a waterproof heat radiation structure of electronic circuit board, it is when using waterproof heat radiation structure of electronic circuit board to carry out waterproofly to the circuit board, absorb the drying through the active carbon in the plug box to the steam in epitheca and the inferior valve, simultaneously through the fan with outside air suction heat dissipation incasement then blow to the circuit board main part after the filter screen removes dust, thereby effective reinforcing line board's heat dissipation, can overhaul the change to inside plug box and circuit board main part etc. in a flexible way in the design through the epitheca inferior valve, the overall structure is simple, therefore, the practicality is stronger, before accomplishing above-mentioned action, at first remove it to the position that the user needed.

The utility model discloses a waterproof heat radiation structure of electronic circuit board, above the mounting means, the connected mode or the mode that sets up of all parts are common mechanical type to the concrete structure, model and the coefficient index of its all parts are its from taking the technique, as long as can reach all can implement of its beneficial effect, so do not add at much and give unnecessary details.

In the waterproof and heat dissipating structure of the electronic circuit board of the present invention, the terms "up, down, left, right, front, back, inner, and vertical and horizontal" are included in the terms to represent the orientation of the terms in the normal use state, or be a trivial term understood by those skilled in the art, and should not be considered as limiting the term, at the same time, the numerical terms "first," "second," and "third," etc. do not denote any particular quantity or order, but rather are used to distinguish one from another, furthermore, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements, but also includes other elements not expressly listed or inherent to such process, method, article, or apparatus.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims

1. A waterproof heat dissipation structure of an electronic circuit board comprises a lower shell (1), an upper shell (2) and a circuit board main body (3), wherein the top of the lower shell (1) is connected with the bottom of the upper shell (2), and the circuit board main body (3) is positioned above the lower shell (1); the novel solar cell module is characterized by further comprising a shock pad (4), a support (5), mounting screws (6), slots (7), an insert box (8), a heat dissipation box (9), a partition plate (10), a fan (11), an exhaust pipe (12), an air outlet (13), a filter screen (14), an air inlet pipe (15) and exhaust holes (16), wherein the shock pad (4) is fixedly arranged at the bottom end of the inner part of the lower shell (1), the support (5) is fixedly arranged at the top of the shock pad (4), the circuit board main body (3) is arranged at the top of the support (5), the bottoms of the mounting screws (6) penetrate through the top of the circuit board from the top of the circuit board downwards to be inserted into the top of the support (5), the slots (7) are fixedly arranged at the top of the shock pad (4) and are arranged below the circuit board main body (3), the rear part of the insert box (8) is inserted into the slots (7) from the front part of the slots (7) backwards, and the insert box (8) is filled with activated carbon, heat dissipation case (9) are fixed to be set up in the inside top of epitheca (2), baffle (10) are fixed to be set up in the inside lower extreme of heat dissipation case (9), fan (11) are fixed to be set up in the top left side of baffle (10), exhaust pipe (12) set up in the left part of fan (11) and pass baffle (10) downwards, air outlet (13) set up in the bottom of heat dissipation case (9), filter screen (14) are fixed to be set up in the top of baffle (10) and lie in right-hand of fan (11), the top of filter screen (14) is connected with the inside top of heat dissipation case (9), intake pipe (15) set up in the right part of heat dissipation case (9) and upwards pass the top of epitheca (2), exhaust hole (16) set up in the lower part of epitheca (2).

2. The waterproof and heat-dissipating structure of an electronic circuit board according to claim 1, further comprising a ring plate (17), a screen plate (18) and a top cover (19), wherein the ring plate (17) is fixedly disposed on the top of the upper case (2) and located above the air inlet pipe (15), the screen plate (18) is fixedly disposed on the top of the ring plate (17), and the top cover (19) is fixedly disposed on the top of the screen plate (18).

3. The waterproof and heat-dissipating structure of an electronic circuit board according to claim 2, further comprising a drying layer (20), wherein the drying layer (20) is fixedly disposed in the middle of the ring plate (17).

4. The waterproof and heat-dissipating structure of an electronic circuit board according to claim 1, further comprising a positioning bar (21), wherein the positioning bar (21) is fixedly disposed in the middle of the inserting box (8), the inner end of the slot (7) is provided with a sliding slot, and the positioning bar (21) is disposed in the sliding slot and can slide back and forth.

5. The waterproof and heat-dissipating structure of an electronic circuit board according to claim 1, further comprising a positioning groove (22) and a positioning rod (23), wherein the positioning groove (22) is disposed at the top of the lower case (1), the positioning rod (23) is fixedly disposed at the bottom of the upper case (2), and the bottom of the positioning rod (23) is inserted into the positioning groove (22) from the top of the positioning groove (22).

6. The waterproof and heat-dissipating structure of an electronic circuit board according to claim 1, further comprising a sealing ring (24), wherein the sealing ring (24) is fixedly disposed on the lower case (1) of the upper case (2), and the lower portion of the sealing ring (24) is disposed on the upper portion of the lower case (1) in a sleeved manner.

7. The waterproof and heat-dissipating structure of an electronic circuit board according to claim 1, further comprising a fixing screw (25), wherein the bottom of the fixing screw (25) is inserted into the lower case (1) from the top of the cushion (4) downward through the cushion (4).

8. The waterproof and heat-dissipating structure of an electronic circuit board according to claim 1, further comprising a protective mesh (26), wherein the protective mesh (26) is fixedly disposed in the air vent (16).