CN214588814U

CN214588814U - Corrosion-resistant chip

Info

Publication number: CN214588814U
Application number: CN202023301734.3U
Authority: CN
Inventors: 刘召
Original assignee: Guangyuan Yuanheng Technology Co ltd
Current assignee: Guangyuan Yuanheng Technology Co ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-11-02
Anticipated expiration: 2030-12-31

Abstract

The utility model discloses a corrosion-resistant chip, which comprises a chip body, wherein the surface of the chip body is provided with a plurality of heat dissipation holes, the interior of the chip body respectively comprises a base layer, a diffusion layer, an infusion layer, a conductor layer, a heat dissipation layer, a heat insulation layer and an anti-corrosion layer, and the interior of the anti-corrosion layer comprises an epoxy resin layer and an anti-corrosion paint layer; the utility model discloses a chip body, the louvre, the basic unit, the diffusion layer, the infusion layer, the conductor layer, the setting of anticorrosive coating and pin, make the chip have corrosion-resistant advantage, can carry out anticorrosive protection to the chip, the life of chip has been prolonged, the current poor problem of chip corrosion-resistant effect has been solved simultaneously, use through the basic unit, can bear the electronic component on the chip body, use through the louvre, can give off the heat that the chip produced when the function, use through the heat dissipation layer, can conduct the inside heat of chip body to the position of louvre.

Description

Corrosion-resistant chip

Technical Field

The utility model relates to a chip anticorrosion technical field specifically is a corrosion-resistant chip.

Background

A chip, also called microcircuit or integrated circuit, refers to a silicon chip containing integrated circuits, which is small in size, often a part of a computer or other electronic equipment, and is a way to miniaturize circuits (mainly including semiconductor devices and passive components) in electronics, and is usually manufactured on the surface of a semiconductor wafer, and an integrated circuit manufactured on the surface of a semiconductor chip is also called a thin film integrated circuit, and another thick film hybrid integrated circuit is a miniaturized circuit formed by independent semiconductor devices and passive components integrated on a substrate or a circuit board.

Over the years, the IC is continuously developing to a smaller external dimension, so that each chip can package more circuits, thereby increasing the capacity per unit area, reducing the cost and increasing the functions, while the chip itself needs to be optimized and improved while the functions are increased, and the chip is likely to be corroded due to the influence of the working environment or human factors of the existing chip, thereby damaging the inside of the chip and reducing the service life of the chip.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a corrosion-resistant chip possesses corrosion-resistant advantage, has solved the current poor problem of chip corrosion-resistant effect.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a corrosion-resistant chip, includes the chip body, the louvre has been seted up on the surface of chip body, the quantity of louvre is a plurality of, the inside of chip body includes basic unit, diffusion layer, instillation layer, conductor layer, heat dissipation layer, insulating layer and anticorrosive coating respectively, the inside of anticorrosive coating includes epoxy layer and anticorrosive paint layer.

Preferably, the bottom of basic unit and the top fixed connection of diffusion layer, the bottom of diffusion layer and the top fixed connection of instillation layer, the bottom of instillation layer and the top fixed connection of conductor layer, the bottom of conductor layer and the top fixed connection of heat dissipation layer, the bottom of heat dissipation layer and the top fixed connection of insulating layer, the bottom of insulating layer and the top fixed connection of anticorrosive coating.

Preferably, the bottom of the epoxy resin layer is fixedly connected with the top of the anti-corrosion paint layer, and all the layers are fixedly connected through hot pressing, adhesives or diffusion.

Preferably, the material of the base layer is a monocrystalline silicon wafer, and the material of the diffusion layer is a dopant.

Preferably, the material of the infusion layer is an ion infusion layer, the material of the heat dissipation layer is graphene, and the heat dissipation layer is concentrated near the position of the heat dissipation hole.

Preferably, the conductor layer is made of metal copper, and the thermal insulation layer is made of an organic thermal insulation material.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a setting of chip body, louvre, basic unit, diffusion barrier, instillation layer, conductive layer and anticorrosive coating makes the chip have corrosion-resistant advantage, can carry out anticorrosive protection to the chip, has prolonged the life of chip, has solved the current poor problem of chip corrosion-resistant effect simultaneously.

2. The utility model discloses a basic unit's use can bear the weight of electronic component on the chip body, use through the louvre, can give off the heat that the chip produced when the function, use through the heat dissipation layer, can conduct the inside heat of chip body to the position of louvre, carry out the heat dissipation protection to the chip body, use through the insulating layer, can completely cut off the external heat of chip body, use through the cooperation of epoxy layer and anticorrosive paint layer, can carry out anticorrosive protection to the chip body, prolong the life of chip.

Drawings

FIG. 1 is a three-dimensional schematic diagram of the structure of the present invention;

FIG. 2 is a schematic view of the structure of the present invention;

FIG. 3 is a schematic cross-sectional view of the chip body of the present invention;

fig. 4 is a schematic sectional view of the anticorrosive coating of the present invention.

In the figure: 1 chip body, 2 louvres, 11 basic unit, 12 diffusion layers, 13 infusion layers, 14 conductor layers, 15 heat dissipation layers, 16 insulating layers, 17 anticorrosive layers, 171 epoxy resin layers, 172 anticorrosive paint layers.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, a corrosion resistant chip includes a chip body 1, a plurality of heat dissipation holes 2 are formed on the surface of the chip body 1, the number of the heat dissipation holes 2 is several, the chip body 1 includes a base layer 11, a diffusion layer 12, an infusion layer 13, a conductor layer 14, a heat dissipation layer 15, a thermal insulation layer 16 and an anti-corrosion layer 17, the anti-corrosion layer 17 includes an epoxy resin layer 171 and an anti-corrosion paint layer 172, the bottom of the base layer 11 is fixedly connected to the top of the diffusion layer 12, the bottom of the diffusion layer 12 is fixedly connected to the top of the infusion layer 13, the bottom of the infusion layer 13 is fixedly connected to the top of the conductor layer 14, the bottom of the conductor layer 14 is fixedly connected to the top of the heat dissipation layer 15, the bottom of the heat dissipation layer 15 is fixedly connected to the top of the thermal insulation layer 16, the bottom of the thermal insulation layer 16 is fixedly connected to the top of the anti-corrosion layer 17, the bottom of the epoxy resin layer 171 is fixedly connected to the top of the anti-corrosion paint layer 172, the above layers are all fixedly connected by hot pressing, adhesive or diffusion, the base layer 11 is made of monocrystalline silicon wafer, the diffusion layer 12 is made of dopant, the infusion layer 13 is made of ion infusion layer, the heat dissipation layer 15 is made of graphene, the heat dissipation layer 15 is concentrated near the position of the heat dissipation hole 2, the conductor layer 14 is made of metal copper, the heat insulation layer 16 is made of organic heat insulation material, the electronic element on the chip body 1 can be carried by using the base layer 11, the heat generated during the operation of the chip can be dissipated by using the heat dissipation hole 2, the heat in the chip body 1 can be conducted to the position of the heat dissipation hole 2 by using the heat dissipation layer 15, the chip body 1 is protected by heat dissipation, the heat outside of the chip body 1 can be isolated by using the heat insulation layer 16, and the epoxy resin layer 171 and the anti-corrosion paint layer 172 are matched for use, can carry out anticorrosive protection to chip body 1, prolong the life of chip, through chip body 1, louvre 2, basic unit 11, diffusion layer 12, infuse layer 13, conductor layer 14 and anticorrosive coating 17's setting, make the chip have corrosion-resistant advantage, can carry out anticorrosive protection to the chip, prolong the life of chip, solved the current poor problem of chip corrosion-resistant effect simultaneously.

During the use, through basic unit's 11 use, can bear the weight of electronic component on the chip body 1, use through louvre 2, can give off the heat that the chip produced when functioning, use through heat dissipation layer 15, can conduct the heat of chip body 1 inside to louvre 2's position, carry out the heat dissipation protection to chip body 1, use through insulating layer 16, can isolate chip body 1 external heat, use through the cooperation of epoxy layer 171 and anticorrosive paint layer 172, can carry out anticorrosive protection to chip body 1, the life of extension chip.

In summary, the following steps: this corrosion-resistant chip uses through the cooperation of chip body 1, louvre 2, basic unit 11, diffusion layer 12, infuse layer 13, conductor layer 14 and anticorrosive coating 17, has solved the current poor problem of chip corrosion-resistant effect.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A corrosion-resistant chip comprises a chip body (1), and is characterized in that: louvre (2) have been seted up on the surface of chip body (1), the quantity of louvre (2) is a plurality of, the inside of chip body (1) includes basic unit (11), diffusion layer (12), infuses layer (13), conductor layer (14), heat dissipation layer (15), insulating layer (16) and anticorrosive coating (17) respectively, the inside of anticorrosive coating (17) includes epoxy layer (171) and anticorrosive paint layer (172).

2. The corrosion-resistant chip of claim 1, wherein: the bottom of basic unit (11) and the top fixed connection of diffusion layer (12), the bottom of diffusion layer (12) and the top fixed connection who infuses layer (13), the bottom of infusing layer (13) and the top fixed connection of conductor layer (14), the bottom of conductor layer (14) and the top fixed connection of heat dissipation layer (15), the bottom of heat dissipation layer (15) and the top fixed connection of insulating layer (16), the bottom of insulating layer (16) and the top fixed connection of anticorrosive coating (17).

3. The corrosion-resistant chip of claim 1, wherein: the bottom of the epoxy resin layer (171) is fixedly connected with the top of the anti-corrosion paint layer (172), and all the layers are fixedly connected through hot pressing, adhesives or diffusion.

4. The corrosion-resistant chip of claim 1, wherein: the base layer (11) is made of monocrystalline silicon wafers, and the diffusion layer (12) is made of a dopant.

5. The corrosion-resistant chip of claim 1, wherein: the material of the infusion layer (13) is an ion infusion layer, the material of the heat dissipation layer (15) is graphene, and the heat dissipation layer (15) is concentrated near the position of the heat dissipation hole (2).

6. The corrosion-resistant chip of claim 1, wherein: the conductor layer (14) is made of metal copper, and the thermal insulation layer (16) is made of an organic thermal insulation material.