CN214588525U

CN214588525U - High-efficient heat dissipation type modulation switch subassembly

Info

Publication number: CN214588525U
Application number: CN202022339734.6U
Authority: CN
Inventors: 周璟枫
Original assignee: Yixing Tianxiang Electronic Equipment Co ltd
Current assignee: Yixing Tianxiang Electronic Equipment Co ltd
Priority date: 2020-10-20
Filing date: 2020-10-20
Publication date: 2021-11-02
Anticipated expiration: 2030-10-20

Abstract

The utility model relates to a high-efficient heat dissipation type modulation switch assembly, including inner chamber and the casing that encircles the inner chamber setting, one side that is close to the casing in the inner chamber is provided with the pivot, the fixed stirring piece that is equipped with in the pivot, the other end of stirring piece runs through the casing setting, be close to the casing opposite side in the inner chamber and fix and be equipped with the temperature sensing chamber, the opening in temperature sensing chamber sets up downwards, and the temperature sensing intracavity is fixed and is equipped with memory alloy, the lower extreme of memory alloy extends the temperature sensing chamber setting, the lower extreme of memory alloy is fixed and is equipped with the connecting plate, slide in the casing and be equipped with the assorted movable block, the casing is equipped with the through-hole in one side in temperature sensing chamber; the utility model discloses a when the inside high temperature of switch module, can drive memory alloy automatically and take place deformation to drive inside heat by a large amount of effluviums through increasing the gas flow in the switch module, guaranteed switch module moving security.

Description

High-efficient heat dissipation type modulation switch subassembly

Technical Field

The utility model relates to an electrical switch technical field especially relates to a high-efficient heat dissipation type modulation switch subassembly.

Background

The switch is an important component of the smart home, and gradually develops towards wireless and intelligent directions along with formulation and improvement of related standards, meanwhile, the user experience requirements of people on the switch are higher and higher, the switch is widely applied to various electronic devices and is electrically connected to a circuit board, and the switch component generally realizes switching of a switch state by pivoting a switch panel back and forth between a closed position and an open position;

the existing switch assembly is used, more heat is often generated inside the switch assembly, the switch is made to radiate in a heat transfer mode in a traditional method, the radiating efficiency is extremely low, and when a high-power electric appliance works, a large load can be generated on the switch assembly, the low radiating efficiency can cause safety accidents, the normal use of household appliances is not facilitated, the safety of people is not facilitated, and a high-efficiency radiating type modulation switch assembly is provided.

SUMMERY OF THE UTILITY MODEL

The problem to prior art exists, the utility model provides a high-efficient heat dissipation type modulation switch subassembly has realized when the inside high temperature of switch module, can drive memory alloy automatically and take place deformation to drive inside heat by a large amount of effluviums through the gas flow that increases in the switch module, guaranteed switch module moving security.

The technical scheme of the utility model for solving the above technical problems provides a high-efficiency heat dissipation type modulation switch component, which comprises an inner cavity and a shell arranged around the inner cavity, wherein a rotating shaft is arranged at one side of the inner cavity close to the shell, a stirring block is fixedly arranged on the rotating shaft, the other end of the stirring block penetrates through the shell, a temperature sensing cavity is fixedly arranged at the other side of the inner cavity close to the shell, the opening of the temperature sensing cavity is arranged downwards, a memory alloy is fixedly arranged in the temperature sensing cavity, the lower end of the memory alloy extends out of the temperature sensing cavity, a connecting plate is fixedly arranged at the lower end of the memory alloy, a matched moving block is arranged in the shell in a sliding manner, a through hole is arranged at one side of the temperature sensing cavity of the shell, the inner cavity is communicated with the outside through hole, a corresponding baffle is vertically arranged at the through hole, and the baffle is fixedly arranged at the upper end of the moving block, the movable block is characterized in that a connecting rod is fixedly arranged on the lower wall of the movable block, a sliding cavity is arranged below the connecting rod, a first sealing block and a second sealing block are arranged in the sliding cavity in a sliding mode, the first sealing block is arranged above the second sealing block, the baffle and the first sealing block are fixedly connected, a through cavity is formed in the lower end of the sliding cavity in a communicated mode, the through cavity is arranged in a shell below the through cavity, a plurality of gas outlets are formed in the upper wall of the through cavity in a communicated mode, the gas outlets penetrate through the shell and extend into the inner cavity, and a gas pressure sprayer is fixedly arranged at the upper end of each gas outlet.

The utility model discloses the technical scheme who further injects does:

preferably, the upper end of through-hole is equipped with the draw-in groove, draw-in groove and baffle are the phase-match setting, just the upper end joint of baffle sets up in the draw-in groove.

Preferably, the side edge of the baffle plate and the side edge of the through hole are arranged in a matching mode, the baffle plate is made of metal, and protective paint is further coated on the surface of the baffle plate.

Preferably, the thickness of the first sealing block and the second sealing block are both set by CM.

Preferably, the opening at the upper end of the air pressure nozzle is fixedly provided with a dust screen, and the dust screen is sleeved on the air pressure nozzle.

The utility model has the advantages that:

the utility model, through the mutual cooperation of the memory alloy, the connecting plate, the moving block and the baffle, when the temperature in the inner cavity is higher than the higher temperature, the memory alloy extends and pushes the connecting plate, so that the baffle moves down, the inner cavity is communicated with the outside, and the heat in the inner cavity is dissipated from the through hole; simultaneously the utility model discloses a mutually supporting of movable block, connecting rod, sliding chamber, first sealed piece and the sealed piece of second for memory alloy takes place deformation and promotes the movable block and move down the time, can promote first sealed piece and the sealed piece of second and move down, thereby push the inner chamber with the air in the external world, and when the intracavity flows including, go out from through-hole department, and take away a large amount of heats at the circulation in-process.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structure at A in FIG. 1;

in the figure: the device comprises an inner cavity 1, a shell 2, a rotating shaft 3, a poking block 4, a temperature sensing cavity 5, a memory alloy 6, a connecting plate 7, a moving block 8, a through hole 9, a baffle plate 10, a connecting rod 11, a sliding cavity 12, a first sealing block 13, a second sealing block 14, a through cavity 15, an air outlet 16, an air pressure nozzle 17 and a dust screen 18.

Detailed Description

Example 1

The embodiment provides a high-efficiency heat dissipation type modulation switch assembly, the structure of which is shown in fig. 1-2, and the modulation switch assembly comprises an inner cavity 1 and a shell 2 arranged around the inner cavity 1, one side of the inner cavity 1 close to the shell 1 is provided with a rotating shaft 3, the rotating shaft 3 is fixedly provided with a toggle block 4, the other end of the toggle block 4 penetrates through the shell 2, the other side of the inner cavity 1 close to the shell 2 is fixedly provided with a temperature sensing cavity 5, the opening of the temperature sensing cavity 5 is arranged downwards, the temperature sensing cavity 5 is internally and fixedly provided with a memory alloy 6, the memory alloy 6 is made of a nickel-titanium alloy material, the crystal structures of the nickel-titanium alloy above 40 ℃ and below 40 ℃ are different, when the temperature is changed at 40 ℃, the alloy contracts or expands to change the shape, the 40 ℃ is the 'metamorphosis temperature' of the nickel-titanium memory alloy 6, and is made into a linear shape to be in a stable state at high temperature, when the memory alloy is circularly wound into a spiral shape at room temperature, the memory alloy is in an unstable state, so that the memory alloy is immediately restored to be in a straight line shape in an original stable state as long as the memory alloy is heated to an abnormal temperature, the lower end of the memory alloy 6 extends out of a temperature sensing cavity 5, a connecting plate 7 is fixedly arranged at the lower end of the memory alloy 6, a matched moving block 8 is arranged in a shell 2 in a sliding manner, a through hole 9 is formed in one side of the temperature sensing cavity 5 of the shell 2, the inner cavity 1 is communicated with the outside through the through hole 9, a corresponding baffle plate 10 is vertically arranged at the through hole 9, and when the temperature in the inner cavity 1 is higher than the higher temperature (more than 40 degrees), the memory alloy 6 extends and pushes the connecting plate 7, so that the baffle plate 10 moves downwards, the inner cavity 1 is communicated with the outside, and the heat in the inner cavity 1 is dissipated from the through hole 9, the side edge of the baffle plate 10 and the side edge of the through hole 9 are arranged in a matching manner, the baffle plate 10 is made of metal, protective paint is coated on the surface of the baffle plate, when the baffle plate 10 blocks the water vapor and the like from the through hole 9 to the inner cavity 1, so that safety problems are prevented, and meanwhile, the surface of the baffle plate is prevented from being oxidized and rusted, a clamping groove is formed in the upper end of the through hole 9, the clamping groove and the baffle plate 10 are arranged in a matching manner, the upper end of the baffle plate 10 is clamped in the clamping groove, so that the sealing performance of the baffle plate 10 is further improved, the baffle plate 10 is fixedly arranged at the upper end of the moving block 8, a connecting rod 11 is fixedly arranged on the lower wall of the moving block 8, a sliding cavity 12 is formed below the connecting rod 11, a first sealing block 13 and a second sealing block 14 are arranged in the sliding cavity 12, the thicknesses of the first sealing block 13 and the second sealing block 14 are both set to be 1CM, so that the problem that the first sealing block 13 and the second sealing block 14 are inclined when sliding in the sliding cavity 12 is effectively prevented, the possibility that the sealing performance of the memory alloy is affected is avoided, the first sealing block 13 is arranged above the second sealing block 14, the baffle plate 10 and the first sealing block 13 are fixedly connected, the lower end of the sliding cavity 12 is communicated with the through cavity 15, the through cavity 15 is arranged in the shell 2 below, the upper wall of the through cavity 15 is communicated with the plurality of air outlets 16, the air outlets 16 penetrate through the shell 2 and extend into the inner cavity 1, the upper end of each air outlet 16 is fixedly provided with an air pressure nozzle 17, the upper end opening of the air pressure nozzle 17 is fixedly provided with a dustproof net 18, the dustproof net 18 is sleeved on the air pressure nozzle 17 to prevent dust and the like in the inner cavity 1 from entering the through cavity 15 from the nozzle 17, so that the cleaning is difficult, through the mutual matching of the moving block 8, the connecting rod 11, the sliding cavity 12, the first sealing block 13 and the second sealing block 14, when the memory alloy 6 deforms and pushes the moving block 8 to move downwards, thereby pushing the outside air into the inner cavity 1, and when flowing in the inner cavity 1, the air goes out from the through holes 9 and takes away a large amount of heat in the circulation process.

When the switch assembly is used, when the internal temperature is higher than 40 ℃, the memory alloy 6 deforms and extends, the connecting plate 7 is pushed to move downwards, the moving block 8 moves downwards, the baffle plate 10 is moved away from the through hole 9, the inner cavity 1 is communicated with the outside, and meanwhile, the moving block 8 pushes the first sealing block 13 and the second sealing block 14 to move downwards in the moving process, air in the through cavity 15 is pushed to be sprayed into the inner cavity 1 from the air outlet 16 through the air pressure sprayer 17, heat in the inner cavity 1 is taken away and is dissipated from the through hole 9, and therefore the heat dissipation efficiency of the switch assembly is greatly improved.

In addition to the above embodiments, the present invention can also have other embodiments, and all technical solutions formed by equivalent replacement or equivalent transformation are all within the protection scope claimed in the present invention.

Claims

1. A high-efficiency heat-dissipation modulation switch assembly comprises an inner cavity (1) and a shell (2) arranged around the inner cavity (1), wherein a rotating shaft (3) is arranged at one side, close to the shell (2), in the inner cavity (1), a poking block (4) is fixedly arranged on the rotating shaft (3), the other end of the poking block (4) penetrates through the shell (2), the modulation switch assembly is characterized in that a temperature sensing cavity (5) is fixedly arranged at the other side, close to the shell (2), in the inner cavity (1), a temperature sensing cavity (5) is fixedly arranged, an opening of the temperature sensing cavity (5) is arranged downwards, a memory alloy (6) is fixedly arranged in the temperature sensing cavity (5), the lower end of the memory alloy (6) extends out of the temperature sensing cavity (5) and is fixedly provided with a connecting plate (7), a matched moving block (8) is slidably arranged in the shell (2), and a through hole (9) is formed in one side, close to the temperature sensing cavity (5), of the shell (2), the inner cavity (1) is communicated with the outside through the through hole (9), the corresponding baffle (10) is vertically arranged at the through hole (9), the baffle (10) is fixedly arranged at the upper end of the moving block (8), the connecting rod (11) is fixedly arranged on the lower wall of the moving block (8), the sliding cavity (12) is arranged below the connecting rod (11), the first sealing block (13) and the second sealing block (14) are arranged in the sliding cavity (12) in a sliding manner, the first sealing block (13) is arranged above the second sealing block (14), the baffle (10) and the first sealing block (13) are fixedly connected, the lower end of the sliding cavity (12) is communicated with the through cavity (15), the through cavity (15) is arranged in the shell (2) below, the upper wall of the through cavity (15) is communicated with a plurality of air outlets (16), and the air outlets (16) penetrate through the shell (2) and extend into the inner cavity (1), and an air pressure spray head (17) is fixedly arranged at the upper end of the air outlet (16).

2. A high-efficiency heat-dissipation modulation switch assembly as claimed in claim 1, wherein a clamping groove is formed at the upper end of the through hole (9), the clamping groove and the baffle (10) are arranged in a matching manner, and the upper end of the baffle (10) is clamped in the clamping groove.

3. A high efficiency heat dissipation type modulation switch assembly as defined in claim 1, wherein the side of said baffle (10) and the side of said through hole (9) are fitted, and said baffle (10) is made of metal, and the surface thereof is coated with protective paint.

4. A high efficiency heat dissipating modulation switch assembly as claimed in claim 1 wherein the first sealing block (13) and the second sealing block (14) are each 1CM thick.

5. The modulation switch component with high efficiency and heat dissipation type as recited in claim 1, wherein a dust screen (18) is fixedly arranged at an opening at the upper end of the air pressure nozzle (17), and the dust screen (18) is sleeved on the air pressure nozzle (17).