CN214585842U - Test processing device of printed wiring board - Google Patents

Test processing device of printed wiring board Download PDF

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Publication number
CN214585842U
CN214585842U CN202022316150.7U CN202022316150U CN214585842U CN 214585842 U CN214585842 U CN 214585842U CN 202022316150 U CN202022316150 U CN 202022316150U CN 214585842 U CN214585842 U CN 214585842U
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China
Prior art keywords
plate
circuit board
welded
printed wiring
wiring board
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CN202022316150.7U
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Chinese (zh)
Inventor
黄旻
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Xinye County Xinruo Electronic Technology Co.,Ltd.
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Hangzhou Lin'an Kejin Electronics Co ltd
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Priority to CN202022316150.7U priority Critical patent/CN214585842U/en
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Abstract

The utility model provides a test processing apparatus of printed wiring board relates to circuit board technical field, including bottom plate, montant, horizontal board, electric hydraulic cylinder, telescopic link, lifter plate and anti-bending device, the upper surface left and right sides of bottom plate all welds and is provided with the montant, and the upper end welding of montant is provided with horizontal board, and the upper surface central authorities of horizontal board are provided with electric hydraulic cylinder through the bolt fastening, and electric hydraulic cylinder's output welding is provided with the telescopic link. The utility model discloses a circuit board fixing device's setting is examined time measuring to the circuit board at needs, through placing the circuit board on the mesa, and the circuit board is in the below of preventing the bending device, and up mentions the handle, make the handle drive the penetrating rod up to move, cup joint the spring and be in tensile state, make the rubber slab break away from the mesa, along the rotatory rotor plate of bearing, make the rubber slab be in the top of circuit board, loosen the handle again, cup joint under the effect of spring resilience force, make the rubber slab fix the circuit board.

Description

Test processing device of printed wiring board
Technical Field
The utility model relates to a circuit board technical field, more specifically relates to a test processing apparatus of printed wiring board.
Background
In the production of a Printed Circuit Board (PCB), when testing the performance of the PCB, the PCB is usually mounted on an upper die, the lower die is a testing device, the PCB moves along with the upper die and the lower die in opposite directions, and the PCB electrically contacts with probes on the lower die to test the performance of the PCB. Therefore, the test processing device for the printed circuit board is designed to solve the problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem of proposing in the above-mentioned background to provide a test processing apparatus of printed wiring board.
In order to achieve the above object, the utility model provides a following technical scheme: a testing processing device of a printed circuit board comprises a bottom plate, vertical rods, transverse plates, an electric hydraulic cylinder, a telescopic rod, a lifting plate and an anti-bending device, wherein the vertical rods are welded on the left side and the right side of the upper surface of the bottom plate, the transverse plates are welded on the upper ends of the vertical rods, the electric hydraulic cylinder is fixedly arranged in the center of the upper surface of each transverse plate through bolts, the telescopic rod is welded on the output end of the electric hydraulic cylinder, the lifting plate is welded on the bottom surface of the telescopic rod, the anti-bending device is sleeved on the outer sides of the vertical rods, and a circuit board fixing device is welded on the left side of the upper surface of the bottom plate;
the lifting plate comprises a through hole, a detection device and a detection head, the through hole is formed in the left side and the right side of the upper surface of the lifting plate in a penetrating mode, the detection device is fixedly arranged on the surface of a bottom plate of the lifting plate through bolts, and the detection head is fixedly arranged at the bottom of the detection device;
the anti-bending device comprises a transverse rubber plate, lantern rings, needle through holes, a first buffer spring and a second buffer spring, wherein the lantern rings are welded on the left side and the right side of the transverse rubber plate, the needle through holes penetrate through the center of the upper surface of the transverse rubber plate, the first buffer springs are welded on the left side and the right side of the bottom surface of the transverse rubber plate, and the second buffer springs are welded on the left side and the right side of the upper surface of the transverse rubber plate;
circuit board fixing device cup joints including support column, bearing, rotor plate, through pole, handle, rubber slab and cup joints the spring, the outside surface top of support column cup joints and is provided with the bearing, the right side surface welding of bearing is provided with the rotor plate, the upper surface right side of rotor plate is run through and is provided with through pole, the top welding of running through the pole is provided with the handle, the bottom surface of running through the pole is provided with the rubber slab through the fixed glue is fixed, the top of running through the pole is cup jointed and is provided with and cup joints and cup joint the spring.
Preferably, the electric hydraulic cylinder and the detection device are both electrically connected with the external power supply through electric wires.
Preferably, the detection head is positioned right above the center of the transverse rubber plate.
Preferably, the detection head is provided with probes, and the distribution of the probes is the same as that of the needle through holes.
Preferably, the vertical rod penetrates through the through hole, and the vertical rod penetrates through the lantern ring.
Preferably, the elastic coefficient of the first buffer spring is smaller than the elastic coefficient of the second buffer spring.
Preferably, when the sleeve spring is in an uncompressed state, the rubber plate is tightly attached to the upper surface of the bottom plate.
The utility model provides a test processing apparatus of printed wiring board has following beneficial effect:
1. this kind of test processing apparatus of printed wiring board is provided with circuit board fixing device, through circuit board fixing device's setting, examine time measuring to the circuit board in needs, through placing the circuit board on the bottom plate, and the circuit board is in the below of preventing the bending device, and up mention the handle, make the handle drive run-through pole up move, cup joint the spring and be in tensile state, make the rubber slab break away from the bottom plate, along the rotatory rotor plate of bearing, make the rubber slab be in the top of circuit board, loosen the handle again, cup joint under the effect of spring resilience power, make the rubber slab fix the circuit board.
2. This kind of test processing apparatus of printed wiring board is provided with anti-buckling device, when needing to detect the circuit board, through opening electric hydraulic cylinder, electric hydraulic cylinder drives the telescopic link and down moves, thereby make the telescopic link drive the lifter plate and down move, the lifter plate moves detection device and detects the head and down moves, detect overhead probe and run through in the syringe needle through hole, down the extrusion again, make in the probe inserts the circuit board, detect, make the probe push down the in-process can not buckle, better protection probe, and detect and accomplish the back, it deviates from in the through hole to survey, make the probe keep vertical.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic view of the sectional structure of the lifting plate of the present invention.
Fig. 3 is a schematic structural view of the anti-bending device of the present invention.
Fig. 4 is a schematic structural view of the circuit board fixing device of the present invention.
In FIGS. 1-4: 1-bottom plate, 2-vertical rod, 3-transverse plate, 4-electric hydraulic cylinder, 5-telescopic rod, 6-lifting plate, 601-through hole, 602-detection device, 603-detection head, 7-anti-bending device, 701-transverse rubber plate, 702-lantern ring, 703-needle through hole, 704-first buffer spring, 705-second buffer spring, 8-circuit board fixing device, 801-support column, 802-bearing, 803-rotating plate, 804-through rod, 805-handle, 806-rubber plate and 807-sleeved spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1 to 4, in an embodiment of the present invention, a testing processing apparatus for a printed circuit board, includes a bottom plate 1, a vertical rod 2, a transverse plate 3, an electric hydraulic cylinder 4, a telescopic rod 5, a lifting plate 6 and an anti-bending device 7, wherein the vertical rod 2 is welded on both sides of the upper surface of the bottom plate 1, the transverse plate 3 is welded on the upper end of the vertical rod 2, the electric hydraulic cylinder 4 is fixed on the center of the upper surface of the transverse plate 3 through a bolt, the telescopic rod 5 is welded on the output end of the electric hydraulic cylinder 4, the lifting plate 6 is welded on the bottom surface of the telescopic rod 5, the anti-bending device 7 is sleeved on the outer side of the vertical rod 2, and a circuit board fixing device 8 is welded on the left side of the upper surface of the bottom plate 1;
the lifting plate 6 comprises a through hole 601, a detection device 602 and a detection head 603, the through hole 601 is arranged on both the left side and the right side of the upper surface of the lifting plate 6 in a penetrating manner, the detection device 602 is fixedly arranged on the surface of the bottom plate of the lifting plate 6 through bolts, and the detection head 603 is fixedly arranged at the bottom of the detection device 602;
the anti-bending device 7 comprises a transverse rubber plate 701, lantern rings 702, needle through holes 703, a first buffer spring 704 and a second buffer spring 705, wherein the lantern rings 702 are welded on the left side and the right side of the transverse rubber plate 701, the needle through holes 703 are arranged in the center of the upper surface of the transverse rubber plate 701 in a penetrating mode, the first buffer spring 704 is welded on the left side and the right side of the bottom surface of the transverse rubber plate 701, and the second buffer spring 705 is welded on the left side and the right side of the upper surface of the transverse rubber plate 701;
circuit board fixing device 8 is including support column 801, bearing 802, the rotor plate 803, run through pole 804, handle 805, rubber slab 806 and cup joint spring 807, the outside surface top of support column 801 cup joints and is provided with bearing 802, the right side surface welding of bearing 802 is provided with rotor plate 803, the upper surface right side of rotor plate 803 runs through and is provided with and runs through pole 804, the top welding that runs through pole 804 is provided with handle 805, the bottom surface that runs through pole 804 is provided with rubber slab 806 through the stationary glue is fixed, the top that runs through pole 804 cup joints and is provided with and cup joints spring 807.
In this embodiment, the electric hydraulic cylinder 4 and the detection device 602 are both electrically connected to the outside through an electric wire, so that the external power supply provides power for the electric hydraulic cylinder 4 and the detection device 602.
In this embodiment, the detection head 603 is located right above the center of the lateral rubber plate 701.
In this embodiment, the probes are disposed on the detecting head 603, and the distribution of the probes is the same as that of the needle through holes 703, so that the probes can penetrate through the through holes 703, and the probes are not bent.
In this embodiment, the stem 2 penetrates through the through hole 601, and the stem 2 penetrates through the ring 702.
In this embodiment, the elastic coefficient of the first buffer spring 704 is smaller than the elastic coefficient of the second buffer spring 705, so that the first buffer spring 704 is compressed first, and the transverse rubber plate 701 contacts the circuit board to be detected first.
In this embodiment, when the sleeve spring 807 is in an uncompressed state, the rubber plate 806 is tightly attached to the upper surface of the base plate 1.
When the testing and processing device of the printed circuit board of the utility model is used, firstly, the power is switched on, through the arrangement of the circuit board fixing device 8, when the circuit board needs to be tested, the circuit board is placed on the bottom plate 1, the circuit board is positioned below the anti-bending device 7, the handle 805 is lifted upwards, the handle 805 drives the penetrating rod 804 to move upwards, the sleeve spring 807 is in a stretching state, the rubber plate 806 is separated from the bottom plate 1, the rotating plate 803 is rotated along the bearing 802, the rubber plate 806 is positioned above the circuit board, then the handle 805 is loosened, under the action of the resilience force of the sleeve spring 807, the rubber plate 806 fixes the circuit board, the electric hydraulic cylinder 4 is opened, the electric hydraulic cylinder 4 drives the telescopic rod 5 to move downwards, the telescopic rod 5 drives the lifting plate 6 to move downwards, the lifting plate 6 drives the testing device 601 and the testing head 602 to move downwards, the probe on the detection head 602 penetrates through the needle through hole 703 and is then extruded downwards, so that the probe is inserted into a circuit board for detection, the probe cannot be bent in the pressing process, the probe is better protected, and after the detection is finished, the probe is separated from the through hole 703, so that the probe is kept vertical.
The above is only the preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent.

Claims (7)

1. The utility model provides a test processing apparatus of printed wiring board, includes bottom plate (1), montant (2), horizontal board (3), electric hydraulic cylinder (4), telescopic link (5), lifter plate (6) and anti-bending device (7), its characterized in that: vertical rods (2) are welded on the left side and the right side of the upper surface of the bottom plate (1), a transverse plate (3) is welded on the upper end of each vertical rod (2), an electric hydraulic cylinder (4) is fixedly arranged in the center of the upper surface of each transverse plate (3) through a bolt, an expansion link (5) is welded on the output end of each electric hydraulic cylinder (4), a lifting plate (6) is welded on the bottom surface of each expansion link (5), an anti-bending device (7) is sleeved on the outer side of each vertical rod (2), and a circuit board fixing device (8) is welded on the left side of the upper surface of the bottom plate (1);
the lifting plate (6) comprises a through hole (601), a detection device (602) and a detection head (603), the through hole (601) penetrates through the left side and the right side of the upper surface of the lifting plate (6), the detection device (602) is fixedly arranged on the surface of the bottom plate of the lifting plate (6) through bolts, and the detection head (603) is fixedly arranged at the bottom of the detection device (602);
the anti-bending device (7) comprises a transverse rubber plate (701), a lantern ring (702), a needle through hole (703), a first buffer spring (704) and a second buffer spring (705), wherein the lantern ring (702) is welded on the left side and the right side of the transverse rubber plate (701), the needle through hole (703) penetrates through the center of the upper surface of the transverse rubber plate (701), the first buffer spring (704) is welded on the left side and the right side of the bottom surface of the transverse rubber plate (701), and the second buffer spring (705) is welded on the left side and the right side of the upper surface of the transverse rubber plate (701);
circuit board fixing device (8) including support column (801), bearing (802), rotor plate (803), run through pole (804), handle (805), rubber slab (806) and cup joint spring (807), the outside surface top of support column (801) is cup jointed and is provided with bearing (802), the right side surface welding of bearing (802) is provided with rotor plate (803), the upper surface right side of rotor plate (803) is run through and is provided with and runs through pole (804), the top welding that runs through pole (804) is provided with handle (805), the bottom surface that runs through pole (804) is fixed through fixed glue and is provided with rubber slab (806), the top that runs through pole (804) is cup jointed and is provided with to cup joint and is provided with and cup joints spring (807).
2. The printed wiring board test processing apparatus according to claim 1, wherein: the electric hydraulic cylinder (4) and the detection device (602) are electrically connected with external electricity through electric wires.
3. The printed wiring board test processing apparatus according to claim 1, wherein: the detection head (603) is positioned right above the center of the transverse rubber plate (701).
4. The printed wiring board test processing apparatus according to claim 1, wherein: probes are arranged on the detection head (603), and the distribution of the probes is the same as that of the needle through holes (703).
5. The printed wiring board test processing apparatus according to claim 1, wherein: the vertical rod (2) penetrates through the through hole (601), and the vertical rod (2) penetrates through the lantern ring (702).
6. The printed wiring board test processing apparatus according to claim 1, wherein: the elastic coefficient of the first buffer spring (704) is smaller than that of the second buffer spring (705).
7. The printed wiring board test processing apparatus according to claim 1, wherein: when the sleeve spring (807) is in an uncompressed state, the rubber plate (806) is tightly attached to the upper surface of the bottom plate (1).
CN202022316150.7U 2020-10-19 2020-10-19 Test processing device of printed wiring board Active CN214585842U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022316150.7U CN214585842U (en) 2020-10-19 2020-10-19 Test processing device of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022316150.7U CN214585842U (en) 2020-10-19 2020-10-19 Test processing device of printed wiring board

Publications (1)

Publication Number Publication Date
CN214585842U true CN214585842U (en) 2021-11-02

Family

ID=78313880

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022316150.7U Active CN214585842U (en) 2020-10-19 2020-10-19 Test processing device of printed wiring board

Country Status (1)

Country Link
CN (1) CN214585842U (en)

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20231110

Address after: 473500 No. 009 Xingye Road, East District, Xinye County, Nanyang City, Henan Province

Patentee after: Xinye County Xinruo Electronic Technology Co.,Ltd.

Address before: 310006 Yizhong Wangjia 70, fengcunling village, Taiyang Town, Lin'an District, Hangzhou City, Zhejiang Province

Patentee before: Hangzhou Lin'an Kejin Electronics Co.,Ltd.

TR01 Transfer of patent right