CN214581901U

CN214581901U - Radiator for semiconductor refrigerating device

Info

Publication number: CN214581901U
Application number: CN202022288853.3U
Authority: CN
Inventors: 颜伟雄; 李如娟; 陈洁
Original assignee: Chuzhou City Technical Supervision And Testing Center
Current assignee: Chuzhou City Technical Supervision And Testing Center
Priority date: 2020-10-14
Filing date: 2020-10-14
Publication date: 2021-11-02
Anticipated expiration: 2030-10-14

Abstract

The utility model discloses a radiator for a semiconductor refrigerating device, which structurally comprises a dustproof cover, a fan, a radiating pipe, a discharging device, a radiator core and radiating fins, wherein the dustproof cover is connected with the front end of the fan through bolts, the radiating pipe is riveted with the discharging device, the discharging device is fixedly embedded at the top end of the radiator core, the discharging device comprises a releasing plate, a replacing plate, a mounting frame and a conductive ring, the releasing plate is fixedly connected with the mounting frame, the replacing plate is in interference fit with the conductive ring, the mounting frame is fixedly connected with the conductive ring, and the conductive ring is welded at the central part of the releasing plate. Avoiding the adsorption of excessive dust while reducing the accumulation of static electricity.

Description

Radiator for semiconductor refrigerating device

Technical Field

The utility model relates to a semiconductor field, specifically are radiator that semiconductor refrigerating plant used.

Background

A radiator for semiconductor refrigerating unit is a device installed on semiconductor refrigerating unit to transfer the heat generated by machine in working procedure in time by blower fan for heat conduction through copper tube to avoid influence on its normal working.

The radiator for the semiconductor refrigerating device in the prior art generates static electricity when in operation to adsorb dust in the air on the surface, the dust can be accumulated into a group and becomes dust wadding after a period of time, the heat dissipation effect is reduced, the difficulty of cleaning work is increased due to the fact that the distance between the radiating fins is too small, the static electricity can be continuously accumulated in a short time, the static electricity is more generated particularly in places with lower temperature in the north, and when the static electricity contacts other objects, the static electricity is exploded instantly to cause the integrated circuit to be burnt.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, the present invention provides a heat sink for a semiconductor refrigeration device.

In order to achieve the above purpose, the present invention is realized by the following technical solution: the utility model provides a radiator that semiconductor refrigerating plant used, its structure includes dust cover, fan, cooling tube, discharge device, radiator core, fin, dust cover bolted connection is in the fan front end, the fan is connected with radiator core electricity, the cooling tube is connected with the discharge device riveting, discharge device inlays admittedly on radiator core top, radiator core and cooling tube flange joint, the fin welding is in radiator core's both sides, discharge device includes the release board, changes board, mounting bracket, electrically conductive circle, the release board inlays admittedly with the mounting bracket and is connected, change board and electrically conductive circle interference fit, the mounting bracket inlays admittedly with electrically conductive circle and is connected, electrically conductive circle welding is at the central point of release board.

Furthermore, the conductive ring comprises a copper pipe, a rotary rod, a storage cover, a coil groove, a cover lock, a threaded wire groove and a copper wire, the copper pipe is matched with the copper wire, the rotary rod is movably clamped with the coil groove, the storage cover is welded with the rotary rod, the coil groove is riveted with the copper pipe, the cover lock is fixedly connected with the storage cover, the threaded wire groove is welded inside the coil groove, and the copper wire is riveted in the threaded wire groove.

Furthermore, the release plate comprises a nylon plate, a sliding-out cover, a conductive interface, an electrode plate and a connecting block, the nylon plate is connected with the connecting block in an injection molding mode, the sliding-out cover is movably clamped on the inner side of the nylon plate, the conductive interface is connected with the electrode plate in a welding mode, the electrode plate is matched with the sliding-out cover, and the connecting block is connected with the electrode plate in a riveting mode.

Furthermore, the copper pipe is fixedly connected with the radiator core in an embedded mode, the coil groove and the thread groove are connected with the nylon plate in a welded mode, and the copper wire is connected with the conductive interface in a wound mode.

Furthermore, the replacing plate is matched with the sliding-out cover, and two ends of the mounting frame are respectively connected with the radiator core and the connecting block in a welding mode.

Furthermore, the static electricity can be guided to the coil groove from the copper pipe and can be introduced to the electrode plate through the copper wire wound on the conductive interface.

Further, the nylon plate is an antistatic material plate, which can absorb and release the impact of static electricity.

Advantageous effects

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model relates to a radiator that semiconductor refrigerating plant used passes through discharge device's copper pipe with the produced static water conservancy diversion of radiator core to coil groove, later through the copper wire of other end winding on electrically conductive interface with static with in the electrode piece with the electric ion become the electric ion absorbed by the nylon board and release away, reduce the static energy that the radiator core sent, avoid adsorbing the accumulation that too much dust reduced static simultaneously.

Drawings

Fig. 1 is a schematic structural diagram of a heat sink for a semiconductor refrigeration device according to the present invention.

Fig. 2 is a schematic structural diagram of the discharging device of the present invention.

Fig. 3 is a schematic structural view of the conductive ring of the present invention.

Fig. 4 is a schematic structural diagram of the inside of the conductive ring of the present invention.

Fig. 5 is a schematic structural view of the release plate of the present invention.

In the figure: the heat radiator comprises a dust cover-1, a fan-2, a radiating pipe-3, a discharging device-4, a radiator core-5, a radiating fin-6, a release plate-41, a replacing plate-42, a mounting rack-43, a conductive ring-44, a copper pipe-441, a rotary rod-442, a storage cover-443, a coil groove-444, a cover lock-445, a thread groove-446, a copper wire-447, a nylon plate-411, a sliding cover-412, a conductive interface-413, an electrode plate-414 and a connecting block-415.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some embodiments, not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Examples

As shown in fig. 1-5, the present invention provides a heat sink for a semiconductor refrigeration device, the structure of which includes a dust cover 1, a fan 2, a heat dissipating pipe 3, a discharging device 4, a heat sink core 5, and a heat dissipating fin 6, wherein the dust cover 1 is bolted to the front end of the fan 2, the fan 2 is electrically connected to the heat sink core 5, the heat dissipating pipe 3 is riveted to the discharging device 4, the discharging device 4 is embedded to the top end of the heat sink core 5, the heat sink core 5 is flanged to the heat dissipating pipe 3, the heat dissipating fin 6 is welded to two sides of the heat sink core 5, the discharging device 4 includes a releasing plate 41, a replacing plate 42, a mounting bracket 43, and a conductive ring 44, the releasing plate 41 is embedded to the mounting bracket 43, the replacing plate 42 is in interference fit with the conductive ring 44, the mounting bracket 43 is embedded to the conductive ring 44, the conductive ring 44 is welded to the central portion of the releasing plate 41, the conductive ring 44 comprises a copper pipe 441, a rotary rod 442, a storage cover 443, a coil groove 444, a cover lock 445, a thread groove 446 and a copper lead 447, the copper pipe 441 is matched with the copper lead 447, the rotary rod 442 is movably clamped with the coil groove 444, the storage cover 443 is welded with the rotary rod 442, the coil groove 444 is riveted with the copper pipe 441, the cover lock 445 is fixedly embedded with the storage cover 443, the thread groove 446 is welded inside the coil groove 444, the copper lead 447 is riveted inside the thread groove 446, the release plate 41 comprises a nylon plate 411, a slide-out cover 412, a conductive interface 413, an electrode plate 414 and a connecting block 415, the nylon plate 411 is connected with the connecting block 415 in an injection molding manner, the slide-out cover 412 is movably clamped inside the nylon plate 411, the conductive interface 413 is welded with the electrode plate 414, the electrode plate 414 is matched with the slide-out cover 412, the connecting block 415 is riveted with the electrode plate 414, the copper pipe 441 is fixedly connected with the radiator core 5, the coil groove 444 and the thread groove 446 are welded with the nylon plate 411, the copper wire 447 is wound with the conductive interface 413, the replacement plate 42 is matched with the sliding-out cover 412, and two ends of the mounting frame 43 are respectively welded with the radiator core 5 and the connecting block 415.

The working principle of the present invention is explained as follows:

the utility model relates to a semiconductor refrigerating device, the fan 2 is rotated to discharge heat through the radiator core 5, the radiating pipe 3 and the radiating fin 6 play a role in cooperation, the dustproof cover 1 prevents excessive dust from entering the fan blades, the static electricity generated during the operation of the radiator core 5 is connected with the radiator core 5 through the mounting frame 43, the sliding-out cover 412 is pulled out to place the electrode plate 414 in the replacing plate 42, the cover lock 445 is opened to place the copper wire 447 into the coil groove 444 along the thread groove 446 through the rotating rod 442 and the storage cover 443 is opened, static electricity generated by the radiator core 5 is guided into the coil groove 444 through the copper tube 441 of the discharging device 4, and then the static electricity is neutralized into electric ions by the electrode plate 414 through the copper wire 447 wound on the conductive interface 413, and the electric ions are absorbed and released by the nylon plate 411, so that the static electricity energy emitted by the radiator core 5 is reduced, excessive dust is prevented from being adsorbed, and the static electricity accumulation is reduced.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a radiator that semiconductor refrigerating plant used, its structure includes dust cover (1), fan (2), cooling tube (3), discharge device (4), radiator core (5), fin (6), its characterized in that: the dustproof cover (1) is connected to the front end of the fan (2) through bolts, the fan (2) is electrically connected with the radiator core (5), the radiating pipe (3) is connected with the discharging device (4) in a riveting mode, the discharging device (4) is embedded at the top end of the radiator core (5), the radiator core (5) is connected with the radiating pipe (3) in a flange mode, and the radiating fins (6) are welded on two sides of the radiator core (5);

discharge apparatus (4) are including release board (41), change board (42), mounting bracket (43), electrically conductive circle (44), release board (41) and mounting bracket (43) are connected with the embedded solid, change board (42) and electrically conductive circle (44) interference fit, mounting bracket (43) and electrically conductive circle (44) are connected with the embedded solid, electrically conductive circle (44) welding is at the central point of release board (41).

2. A heat sink for a semiconductor cooling device according to claim 1, wherein: the conductive ring (44) comprises a copper pipe (441), a rotary rod (442), a storage cover (443), a coil groove (444), a cover lock (445), a threaded wire groove (446) and a copper wire (447), wherein the copper pipe (441) is matched with the copper wire (447), the rotary rod (442) is movably clamped with the coil groove (444), the storage cover (443) is welded with the rotary rod (442), the coil groove (444) is riveted with the copper pipe (441), the cover lock (445) is fixedly embedded with the storage cover (443), the threaded wire groove (446) is welded inside the coil groove (444), and the copper wire (447) is riveted in the threaded wire groove (446).

3. A heat sink for a semiconductor cooling device according to claim 1, wherein: the release plate (41) comprises a nylon plate (411), a sliding-out cover (412), a conductive interface (413), an electrode plate (414) and a connecting block (415), the nylon plate (411) is connected with the connecting block (415) in an injection molding mode, the sliding-out cover (412) is movably clamped on the inner side of the nylon plate (411), the conductive interface (413) is connected with the electrode plate (414) in a welding mode, the electrode plate (414) is matched with the sliding-out cover (412), and the connecting block (415) is connected with the electrode plate (414) in a riveting mode.

4. A heat sink for a semiconductor cooling device according to claim 2, wherein: the copper tube (441) is fixedly connected with the radiator core (5), the coil groove (444) and the thread groove (446) are connected with the nylon plate (411) in a welding mode, and the copper lead (447) is connected with the conductive interface (413) in a winding mode.

5. A heat sink for a semiconductor cooling device according to claim 1, wherein: the replacing plate (42) is matched with the sliding-out cover (412), and two ends of the mounting frame (43) are respectively connected with the radiator core (5) and the connecting block (415) in a welding mode.