CN214566622U - Semiconductor chip plastic package device - Google Patents
Semiconductor chip plastic package device Download PDFInfo
- Publication number
- CN214566622U CN214566622U CN202120223875.3U CN202120223875U CN214566622U CN 214566622 U CN214566622 U CN 214566622U CN 202120223875 U CN202120223875 U CN 202120223875U CN 214566622 U CN214566622 U CN 214566622U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- block
- semiconductor chip
- flattening
- bevel gear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a semiconductor chip plastic envelope device, including base, stand, horizontal piece plastic envelope mechanism, the top of base is provided with flattening mechanism and complementary unit respectively, flattening mechanism is including placing platform, motor, axis of rotation, drive bevel gear, driven bevel gear, telescopic link, the piece that flattens, the standing groove has been seted up at the top of placing the platform, the output of motor passes through shaft coupling fixedly connected with axis of rotation, the fixed cover of drive bevel gear is established in the axis of rotation. The device places platform, motor, axis of rotation, threaded rod, limiting block, telescopic link, spring and the combination of flattening piece through the setting and uses, has solved the problem that current semiconductor chip plastic packaging device can't flatten well at the in-process that carries out the plastic envelope, utilizes the cooperation of threaded rod and movable block for control about the flattening piece, flatten after the semiconductor chip plastic envelope repeatedly, thereby eliminate the fold after the plastic envelope, protection electronic components, extension product life.
Description
Technical Field
The utility model relates to an integrated circuit chip plastic envelope technical field specifically is a semiconductor chip plastic envelope device.
Background
In the field of integrated circuit technology, packaging chips is one of the most basic processes, and chip packages are classified into many types, which often include plastic packages, ceramic packages, metal packages, and the like according to the nature of raw materials of the packages. Among them, the plastic package is a package structure with low cost, simple process and high reliability, is commonly used in the consumer electronics field, and has the highest market share.
The existing semiconductor chip plastic package device can not be well flattened in the plastic package process, so that wrinkles appear after the plastic package, the product can have problems after being used for a short time, the service life of the product is shortened, and the semiconductor chip plastic package device capable of being flattened through the plastic package is urgently needed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor chip plastic packaging device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor chip plastic package device comprises a base, a stand column and a transverse block plastic package mechanism, wherein a flattening mechanism and an auxiliary mechanism are respectively arranged at the top end of the base;
the flattening mechanism comprises a placing table, a motor, a rotating shaft, a driving bevel gear, a driven bevel gear, a telescopic rod and a flattening block, wherein a placing groove is formed in the top of the placing table, the output end of the motor is fixedly connected with the rotating shaft through a coupler, the driving bevel gear is fixedly sleeved on the rotating shaft and is meshed with the driven bevel gear, the driven bevel gear is fixedly sleeved on the outer wall of one end of a threaded rod, the other end of the threaded rod sequentially penetrates through the right side of a supporting block and the right side of a moving block and extends to the right side of the other supporting block, the left end of the threaded rod is rotatably connected with the right side of the other supporting block through a bearing, the outer wall of the threaded rod is in threaded connection with the moving block, a limiting block is fixedly connected to the front side of the other supporting block, the left end of the limiting block is fixedly connected to the front side of the other supporting block, the bottom end of the moving block is fixedly connected with the top end of a telescopic rod, the telescopic rod is arranged in a hollow mode, a spring is arranged in an inner cavity of the telescopic rod, and the bottom end of the telescopic rod is fixedly connected with the top end of the flattening block;
the auxiliary mechanism comprises a fan, a shell and an electric heating rod, wherein the moving block is hollow, the output end of the fan is fixedly connected to the top end of the moving block, the top of the shell is fixedly connected with the top of the inner cavity of the moving block, the output end of the fan is fixedly connected with the inside of the shell, the inner cavity of the shell is hollow, the electric heating rod is fixedly mounted on the right side of the inner cavity of the shell, a three-way valve is arranged at the bottom of the inner cavity of the shell in a communicated mode, a connecting pipe is arranged on the right branch pipe of the three-way valve in a communicated mode, a hose is arranged at the other end of the connecting pipe in a communicated mode, and the other end of the hose penetrates through the bottom of the inner cavity of the moving block and extends to the ventilation opening in a communicated mode.
Preferably, the bottom end of the upright column is fixedly connected with the top of the base, and the left side of the upright column is fixedly connected with the right side of the transverse block.
Preferably, the outer wall of the rotating shaft is rotatably sleeved with a supporting rod, and the right side of the supporting rod is fixedly connected with the right side of the supporting block.
Preferably, the bottom end of the supporting block is fixedly connected with the bottom end of the placing table.
Preferably, the floor of the flattening block is in contact with the top of the standing board.
Preferably, the top end of the spring is fixedly connected with the top end of the inner cavity of the telescopic rod, and the bottom end of the spring is fixedly connected with the bottom of the inner cavity of the telescopic rod.
Preferably, the vent is fixedly connected to the top of the flattening block.
Preferably, the motor is fixedly connected to the right side of the placing table through a motor frame, and the motor can rotate positively and reversely.
The utility model provides a semiconductor chip plastic packaging device. The method has the following beneficial effects:
(1) the utility model discloses a platform, motor, axis of rotation, threaded rod, limiting block, telescopic link, spring and the combination of flattening piece are placed in the setting and are used, have solved current semiconductor chip plastic packaging device and can't fine problem of flattening at the in-process that carries out the plastic envelope, utilize the cooperation of threaded rod and movable block for control about the flattening piece, flatten after the semiconductor chip plastic envelope repeatedly, thereby eliminate the fold after the plastic envelope, protection electronic components, extension product life.
(2) The utility model discloses a set up fan, casing, electric bar, three-way valve, connecting pipe, hose and vent combination and use, solved current semiconductor chip plastic packaging device and can't heat or refrigerated problem to whole chip fine in the in-process that carries out the plastic envelope, remove with the help of the removal of movable block to make the vent can heat or cool off whole chip, reached convenient and fast's purpose.
Drawings
FIG. 1 is a front sectional view of the structure of the present invention;
FIG. 2 is a sectional view of the structure auxiliary mechanism of the present invention;
fig. 3 is a right side view of the whole structure of the utility model.
In the figure: 1. a base; 2. a column; 3. a transverse block; 4. a flattening mechanism; 41. a placing table; 42. a motor; 43. a rotating shaft; 44. a drive bevel gear; 45. a driven bevel gear; 46. a threaded rod; 47. a limiting block; 48. a moving block; 49. a support block; 410. a telescopic rod; 411. a spring; 412. flattening the block; 5. an auxiliary mechanism; 51. a fan; 52. a housing; 53. an electric heating rod; 54. a three-way valve; 55. a connecting pipe; 56. a hose; 57. a vent; 6. and (5) a plastic packaging mechanism.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-3, the utility model provides a technical solution: a semiconductor chip plastic package device comprises a base 1, a stand column 2 and a transverse block 3 plastic package mechanism 6, wherein the top end of the base 1 is respectively provided with a flattening mechanism 4 and an auxiliary mechanism 5, the bottom end of the stand column 2 is fixedly connected with the top of the base 1, and the left side of the stand column 2 is fixedly connected with the right side of the transverse block 3;
the flattening mechanism 4 comprises a placing table 41, a motor 42, a rotating shaft 43, a driving bevel gear 44, a driven bevel gear 45, a telescopic rod 410 and a flattening block 412, wherein a placing groove is formed in the top of the placing table 41, the output end of the motor 42 is fixedly connected with the rotating shaft 43 through a coupler, the motor 42 is fixedly connected to the right side of the placing table 41 through a motor frame, the motor 42 can rotate forwards and backwards, a supporting rod is rotatably sleeved on the outer wall of the rotating shaft 43, the right side of the supporting rod is fixedly connected with the right side of a supporting block 49, the driving bevel gear 44 is fixedly sleeved on the rotating shaft 43, the driving bevel gear 44 is connected with the driven bevel gear 45 in a meshing manner, the driven bevel gear 45 is fixedly sleeved on the outer wall of one end of a threaded rod 46, the other end of the threaded rod 46 sequentially penetrates through the right side of the supporting block 49, the right side of a moving block 48 and extends to the right side of another supporting block 49, and the left end of the threaded rod 46 is rotatably connected with the right side of another supporting block 49 through a bearing, the outer wall of the threaded rod 46 is in threaded connection with a moving block 48, the bottom ends of supporting blocks 49 are fixedly connected with the bottom end of a placing table 41, the front face of each supporting block 49 is fixedly connected with a limiting block 47, the left end of each limiting block 47 is fixedly connected with the front face of the other supporting block 49, the number of the limiting blocks 47 is two, the two limiting blocks 47 are symmetrically arranged around the central axis of the moving block 48, the back faces of the limiting blocks 47 are in contact with the front face of the moving block 48, the front face of the other limiting block 47 is in contact with the back face of the moving block 48, the bottom end of the moving block 48 is fixedly connected with the top end of a telescopic rod 410, the inside of the telescopic rod 410 is hollow, a spring 411 is arranged in an inner cavity of the telescopic rod 410, the top end of the spring 411 is fixedly connected with the bottom of the inner cavity of the telescopic rod 410, the bottom end of the telescopic rod 410 is fixedly connected with the top end of a flattening block 412, and the ground of the flattening block 412 is in contact with the top of the placing table 41, the flattening block 412 is made of rubber, so that flattening can be well performed without damaging electronic components on the semiconductor chip;
the auxiliary mechanism 5 comprises a fan 51, a shell 52 and an electric heating rod 53, the inside of the moving block 48 is hollow, the output end of the fan 51 is fixedly connected to the top end of the moving block 48, the top of the shell 52 is fixedly connected with the top of the inner cavity of the moving block 48, the output end of the fan 51 is fixedly connected with the inside of the shell 52, the inside of the shell 52 is hollow, the electric heating rod 53 is fixedly installed on the right side of the inner cavity of the shell 52, the fan 51 blows heat generated by the electric heating rod 53 onto a semiconductor chip, the bottom of the inner cavity of the shell 52 is provided with a three-way valve 54 in a communicating manner, the three-way valve 54 is arranged to facilitate left-right movement and heating or cooling of the flattening block 412, the right branch pipe of the three-way valve 54 is provided with a connecting pipe 55 in a communicating manner, the other end of the connecting pipe 55 is provided with a hose 56, the hose 56 is soft in material and facilitates compression or extension, the other end of the hose 56 penetrates through the bottom of the inner cavity of the moving block 48 and extends to a vent 57 in a communicating manner, the vent 57 is fixedly attached to the top of the flattening block 412.
The working principle is as follows: when the device is used, firstly, a chip is placed in a placing groove, firstly, the chip is heated, a fan 51, an electric heating rod 53 and a motor 42 are started to drive a rotating shaft 43 fixedly connected through a coupler, a threaded rod 46 is rotated through the transmission of a driving bevel gear 44 and a driven bevel gear 45, a moving block 48 is moved left and right in the horizontal direction due to the limitation of a limiting block 47, a spring 411 in a telescopic rod 410 fixedly connected to the bottom end of the moving block 48 is downwards extruded while moving, the telescopic rod 410 downwards extrudes a flattening block 412, the flattening block 412 presses a semiconductor chip, the fan 51 blows heat generated by the electric heating rod 53 into a three-way valve 54, the heat is blown to the chip in the plastic package through a connecting pipe 55 and a hose 56 through a vent 57, after the heating is finished, the plastic package mechanism 6 is started to perform the plastic package on the chip, after the plastic package is finished, the electric heating rod 53 is turned off, and the chip is directly cooled and flattened by blowing cold air, so that the plastic package effect is firmer.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a semiconductor chip plastic packaging device, includes base (1), stand (2), horizontal piece (3) plastic packaging mechanism (6), its characterized in that: the top end of the base (1) is respectively provided with a flattening mechanism (4) and an auxiliary mechanism (5);
the flattening mechanism (4) comprises a placing table (41), a motor (42), a rotating shaft (43), a driving bevel gear (44), a driven bevel gear (45), a telescopic rod (410) and a flattening block (412), wherein a placing groove is formed in the top of the placing table (41), the output end of the motor (42) is fixedly connected with the rotating shaft (43) through a coupler, the driving bevel gear (44) is fixedly sleeved on the rotating shaft (43), the driving bevel gear (44) is connected with the driven bevel gear (45) in a meshed mode, the driven bevel gear (45) is fixedly sleeved on the outer wall of one end of a threaded rod (46), the other end of the threaded rod (46) sequentially penetrates through the right side of a supporting block (49), the right side of a moving block (48) and extends to the right side of another supporting block (49), and the left end of the threaded rod (46) is rotatably connected with the right side of the supporting block (49) through a bearing, the outer wall of the threaded rod (46) is in threaded connection with a movable block (48), a limiting block (47) is fixedly connected to the front face of one supporting block (49), the left end of the limiting block (47) is fixedly connected to the front face of the other supporting block (49), the bottom end of the movable block (48) is fixedly connected with the top end of a telescopic rod (410), the inside of the telescopic rod (410) is arranged in a hollow mode, a spring (411) is arranged in the inner cavity of the telescopic rod (410), and the bottom end of the telescopic rod (410) is fixedly connected with the top end of a flattening block (412);
the auxiliary mechanism (5) comprises a fan (51), a shell (52) and an electric heating rod (53), the inner part of the moving block (48) is arranged in a hollow way, the output end of the fan (51) is fixedly connected with the top end of the moving block (48), the top of the shell (52) is fixedly connected with the top of the inner cavity of the moving block (48), and the output end of the fan (51) is fixedly connected with the inside of the shell (52), the shell (52) is hollow, the electric heating rod (53) is fixedly arranged on the right side of the inner cavity of the shell (52), the bottom of the inner cavity of the shell (52) is communicated with a three-way valve (54), the right branch pipe of the three-way valve (54) is communicated with a connecting pipe (55), the other end of the connecting pipe (55) is communicated with a hose (56), and the other end of the hose (56) penetrates through the bottom of the inner cavity of the moving block (48) and extends to a vent (57) to be communicated with the hose.
2. The semiconductor chip molding package of claim 1, wherein: the bottom of stand (2) and the top fixed connection of base (1), the left side of stand (2) and the right side fixed connection of horizontal block (3).
3. The semiconductor chip molding package of claim 1, wherein: the outer wall of the rotating shaft (43) is rotatably sleeved with a supporting rod, and the right side of the supporting rod is fixedly connected with the right side of the supporting block (49).
4. The semiconductor chip molding package of claim 1, wherein: the bottom end of the supporting block (49) is fixedly connected with the bottom end of the placing table (41).
5. The semiconductor chip molding package of claim 1, wherein: the ground of the flattening block (412) is in contact with the top of the placing table (41).
6. The semiconductor chip molding package of claim 1, wherein: the top end of the spring (411) is fixedly connected with the top end of the inner cavity of the telescopic rod (410), and the bottom end of the spring (411) is fixedly connected with the bottom of the inner cavity of the telescopic rod (410).
7. The semiconductor chip molding package of claim 1, wherein: the vent (57) is fixedly connected to the top of the flattening block (412).
8. The semiconductor chip molding package of claim 1, wherein: the motor (42) is fixedly connected to the right side of the placing table (41) through a motor frame, and the motor (42) can rotate positively and reversely.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120223875.3U CN214566622U (en) | 2021-01-27 | 2021-01-27 | Semiconductor chip plastic package device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120223875.3U CN214566622U (en) | 2021-01-27 | 2021-01-27 | Semiconductor chip plastic package device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214566622U true CN214566622U (en) | 2021-11-02 |
Family
ID=78314350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120223875.3U Active CN214566622U (en) | 2021-01-27 | 2021-01-27 | Semiconductor chip plastic package device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214566622U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114496434A (en) * | 2021-12-30 | 2022-05-13 | 江苏芯锐传感科技有限公司 | NTC thermistor epoxy packaging hardware |
-
2021
- 2021-01-27 CN CN202120223875.3U patent/CN214566622U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114496434A (en) * | 2021-12-30 | 2022-05-13 | 江苏芯锐传感科技有限公司 | NTC thermistor epoxy packaging hardware |
| CN114496434B (en) * | 2021-12-30 | 2023-07-11 | 北京金迈捷科技股份有限公司 | NTC thermistor epoxy packaging hardware |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN214566622U (en) | Semiconductor chip plastic package device | |
| CN110861354A (en) | Biodegradable plastic film hot-pressing forming bag making machine | |
| CN115140608B (en) | Clamping and fixing device for solder wire winding production | |
| CN211566688U (en) | Quick hot briquetting equipment of silica gel product | |
| CN210579667U (en) | Cooling base for communication equipment | |
| CN210308978U (en) | A high-efficient type blowing device for wrapping bag production | |
| CN206795959U (en) | A kind of cake rapid cutting device | |
| CN215616898U (en) | Automobile spare and accessory part grinding device | |
| CN217917036U (en) | Automatic inflation packaging equipment for bubble bag production process | |
| CN215283223U (en) | Injection mold is used in processing of automotive interior plastics spare part | |
| CN211431175U (en) | Novel PVC gloves production device | |
| CN212422136U (en) | Blow molding device for plastic toy production | |
| CN210730561U (en) | Special-shaped aluminum profile extrusion die | |
| CN114347449A (en) | Plastic film blowing and winding device | |
| CN112498887A (en) | Automatic aligning and labeling device for television backseat based on Bernoulli principle | |
| CN112476869A (en) | Die convenient for taking materials for automobile parts and machining method | |
| CN112387527A (en) | Automobile decorative plate processing equipment with energy-saving effect and rapid forming | |
| CN219820813U (en) | Paper pressfitting rapid cooling structure | |
| CN212602107U (en) | Safe type grass land earth block press | |
| CN113145372A (en) | A spout gluey equipment for production of latex mattress | |
| CN219153491U (en) | PET bottle mould plastic mechanism | |
| CN216558044U (en) | Drying device is used in plastic grain production | |
| CN219028224U (en) | Structural mold for rubber molded product | |
| CN219132974U (en) | Dumbbell head rubber coating mould | |
| CN219926841U (en) | Pipe plastic mould cooling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |