CN214563810U

CN214563810U - Improved LEDUV printing and curing device

Info

Publication number: CN214563810U
Application number: CN202023077994.7U
Authority: CN
Inventors: 李源
Original assignee: Qingdao Laiyidi Photoelectric Science And Technology Co ltd
Current assignee: Qingdao Laiyidi Photoelectric Science And Technology Co ltd
Priority date: 2020-12-20
Filing date: 2020-12-20
Publication date: 2021-11-02
Anticipated expiration: 2030-12-20

Abstract

The utility model relates to an improved LEDUV printing and curing device, which comprises an LED substrate; an outer cover body is buckled on the LED substrate; forming an inner cavity between the outer cover body and the LED substrate; a lower air outlet is formed at the lower end of the outer cover body and/or the LED substrate; the inner cavity of the cover is connected with a port of an air inlet for external connection; the utility model relates to a rationally, compact structure and convenient to use.

Description

Improved LEDUV printing and curing device

Technical Field

The utility model relates to an improved generation LEDUV printing solidification equipment is particularly suitable for flat-bed offset press, sheet-fed printing or to roll-type offset press.

Background

With the technical development of LED lamp particles in the field of UV printing, LEDs are generally adopted to replace the traditional halogen lamps for curing UV ink, the LED surface light source has the advantages of low energy consumption, stable wavelength, high safety, long service life and the like, and the energy consumption is only about 25% of that of the halogen lamps. However, the currently used curing devices have the following disadvantages: the curing speed is slow, and the high-speed printing is difficult to support, and especially white ink and silver ink are difficult to completely dry due to the high content of non-curing solvents of the ink. However, in the use process and continuous research and development of CN201510972722.8, it is found that, referring to the drying method of the traditional halogen lamp, the drying method has a good drying effect on the auxiliary curing air flow to properly increase the temperature and accelerate the volatilization and drying of the non-curing component-solvent of the ink, the auxiliary air flow is controlled at 60-80 degrees by the semiconductor heating technology, the curing and drying effect of the ink layer is greatly improved, the printing speed is improved by about 40%, and the curing and drying speed of the silver ink and the white ink is also improved.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that an improved generation LEDUV printing solidification equipment is provided on the whole.

In order to solve the above problems, the utility model adopts the following technical proposal:

an improved LED uv print curing apparatus comprising an LED substrate; an outer cover body is buckled on the LED substrate;

forming an inner cavity between the outer cover body and the LED substrate;

a lower air outlet is formed at the lower end of the outer cover body and/or the LED substrate;

the inner cavity of the cover is connected with an air inlet.

As a further improvement of the above technical solution:

a support plate is arranged in the cavity of the cover, and fans are distributed on the support plate;

the support plate divides the inner cavity of the cover into an air inlet cavity and an air outlet cavity;

the air inlet cavity is connected with the air inlet, and the lower air outlet is connected with the lower air outlet;

a heater and/or a temperature controller are arranged on the inner cavity of the cover.

The heater and/or the temperature controller are/is arranged at the air inlet cavity, the air outlet cavity and/or the lower air outlet.

The inner cavity of the cover is provided with a middle clapboard to divide the inner cavity of the cover into a plurality of cavities.

And the gas enters from the air inlet at one side of the lamp body, the heat gas flow generated in the curing process is heated by the semiconductor again to a proper temperature, and the heat gas flow is blown to the printing ink layer of the printed matter from the air outlet at the other side of the lamp body.

A semiconductor heater and a temperature controller are arranged on the inner cavity of the cover; the fan is disposed in the housing interior cavity.

A cooling shell positioned in the inner cavity of the cover is buckled on the LED substrate;

the cooling shell is respectively connected with a liquid inlet pipe and a liquid outlet pipe.

A base cooling flow portion is provided in the cooling housing; the base cooling flow part is respectively connected with the liquid inlet pipe and the liquid outlet pipe.

An intermediate partition plate is arranged on the cooling shell.

A small fan is arranged in the air inlet cavity of the partition plate, and a semiconductor heating device is arranged in the air outlet cavity;

a lower air outlet is arranged at the output side of the lower air outlet;

the utility model relates to a rationally, low cost, durable, safe and reliable, easy operation, labour saving and time saving, saving fund, compact structure and convenient to use. The utility model discloses to LED's waste heat utilization, the air knife gets into high-pressure draught and takes away LED's waste heat, has reduced the cooling consumption because with the LED waste heat as preheating, reduced the consumption and the temperature of heating.

Drawings

Fig. 1 is a schematic diagram of an application structure of embodiment 1 of the present invention.

Fig. 2 is a schematic structural diagram of embodiment 2 of the present invention.

Fig. 3 is a schematic structural diagram of the present invention.

Wherein, 1, cooling the shell; 2. an LED substrate; 3. an air inlet; 4. a lower air outlet; 5. an outer cover body; 6. an interior chamber of the housing; 7. a liquid inlet pipe; 8. a liquid outlet pipe; 9. a middle partition plate; 10. a support plate; 11. a fan; 12. an air inlet cavity; 13. an air outlet cavity; 14. a heater; 15. a temperature controller; 16. the base cools the flow portion.

Detailed Description

As shown in fig. 1 to 3, the improved LED uv print-curing apparatus of the present embodiment includes an LED substrate 2; an outer cover body 5 is buckled on the LED substrate 2;

an inner cover cavity 6 is formed between the outer cover body 5 and the LED substrate 2;

a lower air outlet 4 is arranged at the lower end of the outer cover body 5 and/or the LED substrate 2;

the inner cavity 6 of the cover is connected with an air inlet 3.

A support plate 10 is arranged in the cover inner cavity 6, and fans 11 are distributed on the support plate 10;

the supporting plate 10 divides the cover inner cavity 6 into an air inlet cavity 12 and an air outlet cavity 13;

the air inlet cavity 12 is connected with the air inlet 3, and the air outlet cavity 13 is connected with the lower air outlet 4;

example 1, as shown in fig. 1, the gas enters from the air inlet 3 on one side of the lamp body, and the gas flow with the heat generated in the curing process is heated by the semiconductor again to a proper temperature and blown from the air outlet 4 on the other side of the lamp body to the ink layer of the printed matter.

A heater 14 and/or a thermostat 15 are provided on the housing inner cavity 6.

The heater 14 and/or the temperature controller 15 are/is arranged at the air inlet cavity 12, the air outlet cavity 13 and/or the lower air outlet 4.

An intermediate partition 9 is arranged in the in-hood cavity 6 to divide the in-hood cavity 6 into a plurality of cavities.

The air flow entering from the air inlet 3 is preheated by the heat generated by the LED substrate 2 and then blown to the printed matter from the lower air outlet 4.

A heater 14 and/or a temperature controller 15 are arranged on the inner cavity 6 of the cover; a fan 11 is disposed in the hood inner cavity 6.

The LED substrate 2 is buckled with a cooling shell 1 positioned in the cover inner cavity 6;

the cooling shell 1 is connected with a liquid inlet pipe 7 and a liquid outlet pipe 8 respectively.

A base cooling flow portion 16 is provided in the cooling casing 1; the base cooling flow portion 16 is connected to the liquid inlet pipe 7 and the liquid outlet pipe 8, respectively.

An intermediate partition 9 is provided on the cooling housing 1.

A cold air knife and/or a lower air outlet 4 is/are arranged on the output side of the lower air outlet 4;

and a thermal infrared lamp is arranged at the lower end of the outer cover body 5 and/or the LED substrate 2.

The technical characteristics of the utility model can be combined or used independently, the outer cover body 5 realizes the covering of the back of the LED substrate 2, as shown in figure 2, as improvement, the air inlet 3 can be connected with an air compressor or an air pump, the lower air outlet 4 blows to the printed matter for air drying and chemical reaction is carried out through LED irradiation, the inner cavity 6 of the cover forms an air cavity for diversion, the liquid inlet pipe 7 and the liquid outlet pipe 8 can cool the LED, the intermediate baffle 9 is separated into two or more cavities, the fan 11 between the air inlet cavity 12 and the air outlet cavity 13 carries out secondary blast air distribution, the heater 14 realizes the heating of air flow, the temperature controller 15 realizes the temperature control, the base cooling flow part 16 and the cooling shell 1 form a liquid cavity for liquid circulation, the heat exchange of the air flow to the cooling liquid is realized by the existence of the cooling shell, when no cooling shell part exists, the direct cooling can be realized, are all protection ranges.

The present invention has been fully described for a clear disclosure, and is not further described in detail in the prior art.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; it is obvious to those skilled in the art that a plurality of embodiments of the present invention may be combined. Such modifications and substitutions do not depart from the spirit and scope of the embodiments of the present invention.

Claims

1. An improved LEDUV printing and curing device, which is characterized in that: comprises an LED substrate (2); an outer cover body (5) is buckled on the LED substrate (2);

an inner cover cavity (6) is formed between the outer cover body (5) and the LED substrate (2);

a lower air outlet (4) is arranged at the lower end of the outer cover body (5) and/or the LED substrate (2);

the inner cavity (6) of the cover is provided with an air inlet (3).

2. The improved LEDUV print-curing apparatus of claim 1, wherein: a support plate (10) is arranged in the inner cavity (6) of the cover, and fans (11) are distributed on the support plate (10);

the inner cavity (6) of the cover is divided into an air inlet cavity (12) and an air outlet cavity (13) by the support plate (10);

the air inlet cavity (12) is connected with the air inlet (3), and the air outlet cavity (13) is connected with the lower air outlet (4);

a heater (14) and/or a temperature controller (15) are arranged on the inner cavity (6) of the cover.

3. The improved LEDUV print-curing apparatus of claim 2, wherein: the heater (14) and/or the temperature controller (15) are/is arranged at the air inlet cavity (12), the air outlet cavity (13) and/or the lower air outlet (4);

the air inlet (3) is arranged on one side of the LED substrate (2), the LED substrate (2) is heated to a set temperature by the heater (14) with heat airflow generated in the curing process, the lower air outlet (4) is arranged on the LED substrate (2), and the heat airflow blows towards the printing ink layer.

4. The improved LEDUV print-curing apparatus of claim 1, wherein: the inner cavity (6) of the cover is provided with a middle clapboard (9) to divide the inner cavity (6) of the cover into a plurality of cavities.

5. The improved LEDUV print-curing apparatus of claim 1, wherein: the air flow entering from the air inlet (3) is preheated by heat generated by the LED substrate (2) and then blown to a printed matter from the lower air outlet (4).

6. The improved LEDUV print-curing apparatus of claim 1, wherein: a heater (14) and/or a temperature controller (15) are arranged on the inner cavity (6) of the cover; a fan (11) is disposed in the hood inner cavity (6).

7. The improved LEDUV print-curing apparatus of claim 6, wherein: a cooling shell (1) positioned in the cover inner cavity (6) is buckled on the LED substrate (2);

the cooling shell (1) is respectively connected with a liquid inlet pipe (7) and a liquid outlet pipe (8).

8. The improved LEDUV print-curing apparatus of claim 1, wherein: a base cooling flow section (16) is provided in the cooling casing (1); the base cooling flow part (16) is respectively connected with the liquid inlet pipe (7) and the liquid outlet pipe (8).

9. The improved LEDUV print-curing apparatus of claim 1, wherein: an intermediate partition plate (9) is arranged on the cooling shell (1).

10. The improved LEDUV print-curing apparatus of claim 1, wherein: a cold air knife and/or a lower air outlet (4) are/is arranged on the output side of the lower air outlet (4);

the lower end of the outer cover body (5) and/or the lower end of the LED substrate (2) are/is provided with a thermal infrared lamp.