CN214544724U

CN214544724U - Bone conduction earphone

Info

Publication number: CN214544724U
Application number: CN202120571114.7U
Authority: CN
Inventors: 顾善勇; 王庆依
Original assignee: KING TONE INNOVATION
Current assignee: KING TONE INNOVATION
Priority date: 2021-03-19
Filing date: 2021-03-19
Publication date: 2021-10-29
Anticipated expiration: 2031-03-19

Abstract

The embodiment of the utility model discloses bone conduction earphone, including wearing subassembly, vibration subassembly and bone conduction subassembly, wear the subassembly be used for with bone conduction earphone wears in the head, and the vibration subassembly with wear that the subassembly is fixed continuous, wherein, the vibration subassembly includes circuit module, piezoelectric device and base plate, through the piezoelectric device input signal of telecommunication to being connected with circuit module in order to drive its deformation for piezoelectric device forms the vibration rather than fixed continuous base plate jointly, thereby makes the bone conduction subassembly that links to each other with the vibration subassembly is fixed along with the vibration subassembly vibration, with the bone conduction of realization sound. Therefore, the utility model discloses technical scheme consumption is lower, can provide good tone quality when wearing comfortablely.

Description

Bone conduction earphone

Technical Field

The embodiment of the utility model provides a relate to the microphone field, concretely relates to bone conduction earphone.

Background

Conventional ear bud headphones typically insert the headphones into the ear canal and transmit sound by vibrating the air, which then vibrates the eardrum of the person. When the earphone is used, the earplug type earphone plugs the earphone in the earhole, so that a user cannot hear the environmental sound, and danger is easy to occur; in addition, if such earphones are used for a long period of time, the eardrum is easily damaged. As a result, earphones that transmit sound by bone conduction have become popular.

In the existing technical scheme, most of bone conduction earphones are moving-coil bone conduction exciter earphones. The earphone core is a moving coil type exciter, the voice coil is located in a magnetic gap, and when the voice coil is electrified, thrust is generated to drive a magnetic circuit system, so that vibration is generated. But the transmission efficiency is poor, and the power consumption is higher; the transmitted sound signals are mainly low-frequency signals, and high-frequency signals are still transmitted by air, so that the tone quality is poor; and the low-frequency vibration sense is strong, and the wearing is uncomfortable.

SUMMERY OF THE UTILITY MODEL

In view of this, the embodiment of the utility model provides a bone conduction earphone, its consumption is lower, wears comfortablely, and tone quality is better.

The utility model discloses bone conduction earphone includes:

a wearing component for wearing the bone conduction headset on the head;

the vibrating assembly comprises a circuit module, a piezoelectric device and a substrate, the vibrating assembly is fixedly connected with the wearing assembly, the circuit module is electrically connected with the piezoelectric device, the piezoelectric device is fixedly connected with the substrate, and the circuit module is configured to input an electric signal to the piezoelectric device to drive the piezoelectric device to deform so that the piezoelectric device and the substrate form vibration together; and

the bone conduction assembly is fixedly connected with the vibration assembly, and vibrates along with the vibration assembly to realize bone conduction of sound.

Preferably, the wearing assembly comprises;

a head beam having a curvature fitting the head; and

the ear-hang has the shape of laminating with the ear, two the ear-hang set up respectively in the both ends of head roof beam, the ear-hang with the vibration subassembly is fixed continuous.

Preferably, one end of the wearing component close to the vibrating component is provided with a groove body matched with the base plate, and one end part of the base plate is embedded into the groove body;

one end of the bone conduction assembly close to the vibration assembly is provided with a groove body matched with the base plate, and the other end part of the base plate is embedded into the groove body;

the tank body is filled with hard filler.

Preferably, the substrate is formed in a sheet shape, and has a middle vibration part and fixing parts disposed at both ends of the substrate, and the middle vibration part and the fixing parts are fixedly connected by a cantilever.

Preferably, the edge of the cantilever has no curvature; or

The edge of the cantilever has a curvature towards the inner or outer direction of the substrate; or

The edge of the cantilever extends zigzag along the direction in which the substrate extends.

Preferably, the cantilever is formed in a wavy shape which is convex or concave in a normal direction of the intermediate vibrating portion.

Preferably, the cantilever has a hollowed-out portion.

Preferably, the piezoelectric device is provided on one surface of the intermediate vibrating portion; or

The piezoelectric devices are provided on both surfaces of the intermediate vibrating portion.

Preferably, the vibration assembly comprises a sealing sleeve configured to encase the vibration assembly;

the bone conduction earphone comprises a balancing weight which is arranged on one surface of the piezoelectric device far away from the substrate;

gaps are reserved between the sealing sleeve and the balancing weight and between the sealing sleeve and the piezoelectric device.

Preferably, the bone conduction headset comprises a weight block disposed within the bone conduction assembly;

the bone conduction assembly is provided with a cover body for fixing the balancing weight.

The utility model discloses bone conduction earphone wears the subassembly and is used for with including wearing subassembly, vibration subassembly and bone conduction subassembly bone conduction earphone wears in the head, the vibration subassembly with wear that the subassembly is fixed continuous, wherein, the vibration subassembly includes circuit module, piezoelectric device and base plate, through the piezoelectric device input signal of telecommunication to being connected with circuit module electricity in order to drive its deformation for piezoelectric device forms the vibration rather than fixed continuous base plate jointly, thereby makes the bone conduction subassembly that links to each other with the vibration subassembly is fixed along with the vibration subassembly vibration, in order to realize the bone conduction of sound. Therefore, the utility model discloses technical scheme consumption is lower, can provide good tone quality when wearing comfortablely.

Drawings

The above and other objects, features and advantages of the embodiments of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

fig. 1 is a schematic perspective view of a bone conduction earphone according to a first embodiment of the present invention;

fig. 2 is an exploded schematic view of a first embodiment of a bone conduction headset according to an embodiment of the present invention;

fig. 3 is a side cross-sectional view of the vibration assembly of the first embodiment of the bone conduction headset of an embodiment of the present invention;

fig. 4 is a schematic perspective view of a bone conduction headset according to a second embodiment of the present invention;

fig. 5 is an exploded schematic view of a second embodiment of a bone conduction headset according to an embodiment of the present invention;

fig. 6 is a side cross-sectional view of a vibrating assembly of a second embodiment of a bone conduction headset of an embodiment of the present invention;

fig. 7 is a schematic perspective view of a first alternative implementation of a base plate of a bone conduction headset according to an embodiment of the present invention;

fig. 8 is a schematic perspective view of a second alternative implementation of a base plate of a bone conduction headset according to an embodiment of the present invention;

fig. 9 is a schematic perspective view of a third alternative implementation of a base plate of a bone conduction headset according to an embodiment of the present invention;

fig. 10 is a schematic perspective view of a fourth alternative implementation of the base plate of the bone conduction headset according to the embodiment of the present invention;

fig. 11 is a schematic perspective view of a fifth alternative implementation of a base plate of a bone conduction headset according to an embodiment of the present invention;

description of reference numerals:

1-a wearing assembly; 11-head beam; 12-ear hanging; 2-a vibrating assembly; 21-a circuit module; 22-a piezoelectric device; 23-a substrate; 24-a sealing sleeve; 25-shock absorbing filler; 3-a bone conduction assembly; 31-a cover body; 4-a groove body; 41-hard fillers; 51-an intermediate vibrating section; 52-a fixed part; 53-cantilever; 531-hollowed out; 6-balancing weight.

Detailed Description

The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth in detail. It will be apparent to those skilled in the art that the present invention may be practiced without these specific details. Well-known methods, procedures, components and circuits have not been described in detail so as not to obscure the present invention.

Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.

Unless the context clearly requires otherwise, throughout this specification, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".

In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

Unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are intended to be inclusive and mean that, for example, they may be fixedly connected or detachably connected or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

Fig. 1 is a schematic perspective view of a bone conduction earphone according to a first embodiment of the present invention. Fig. 2 is an exploded schematic view of a first embodiment of a bone conduction headset according to an embodiment of the present invention. Fig. 3 is a side cross-sectional view of a vibration assembly of a first embodiment of a bone conduction headset according to an embodiment of the present invention. As shown in fig. 1, 2 and 3, the bone conduction headset includes a wearing assembly 1, a vibrating assembly 2 and a bone conduction assembly 3.

The wearing assembly 1 is used for wearing the bone conduction headset on the head and comprises a head beam 11 and an ear hook 12. The head beam 11 has a curvature fitting the head, and the ear hook 12 has a shape fitting the ear. The two ear hooks 12 are respectively arranged at two ends of the head beam 11 and fixedly connected with the vibration component 2. That is, the ear hook 12 has a shape that is convenient for the user to wear and remove the bone conduction headset, and is capable of disposing the vibration member 2 and the bone conduction member 3 around the user's ear in contact with the skin, i.e., skull bone, near the ear to achieve bone conduction of the sound signal. The head beam 11 has the function of connecting the two ear hooks 12 and preventing loss. In this embodiment, the head beam 11 is a rigid material, such as plastic. One end of the ear hook 12 is provided with a groove matched with the two ends of the head beam 11, and the head beam 11 is embedded into the groove and connected with the head beam. Alternatively, the head beam 11 may be a soft material, such as silicone. Alternatively, the connection of the head beam 11 to the ear hook 12 may also be varied, for example by gluing.

The vibration component 2 is fixedly connected with the wearing component 1 and comprises a circuit module 21, a piezoelectric device 22 and a substrate 23. The circuit module 21 is electrically connected to the piezoelectric device 22, and inputs an electrical signal to the piezoelectric device 22 to drive the piezoelectric device 22 to deform. The piezoelectric device 22 is fixedly connected to the substrate 23, and both of them vibrate. That is, according to the inverse piezoelectric effect, after the circuit module 21 outputs the electrical signal carrying the sound signal to the piezoelectric device 22, the piezoelectric device 22 can be driven to follow the electrical signal to generate the corresponding contraction motion. In the case where the piezoelectric device 22 is combined with the substrate 23, this deformation causes both to form a vertical bending motion like vibration, thereby transmitting an audio signal. In the present embodiment, the piezoelectric device 22 is a ceramic piezoelectric patch, which can reduce the power consumption of the earphone and improve the response speed compared to the conventional moving coil exciter. And because the ceramic piezoelectric patch has the piezoelectric effect, the resonant frequency of the ceramic piezoelectric patch has more excellent high-frequency characteristics compared with the traditional moving coil exciter, the frequency band of the earphone can be widened, and the tone quality is improved. Alternatively, the ceramic piezoelectric sheet may be replaced with other piezoelectric devices 22 capable of performing a deformation vibration function.

Further, in an alternative implementation, the vibration assembly 2 further includes a sealing sleeve 24. Sealing sleeve 24 is configured to encase vibrating assembly 2. A gap is left between the sealing sleeve 24 and the piezoelectric device 22. This gap allows the piezoelectric device 22 to vibrate smoothly without hindrance. And because one side of the piezoelectric device 22 is contacted with the substrate 23, and the other side is contacted with the air, when the piezoelectric device 22 vibrates, the substrate 23 is driven to vibrate and the air is also driven to vibrate, and the sealing sleeve 24 wraps the vibration component 2, so that the sound leakage can be prevented. In addition, while noise leakage is reduced, the sealing sleeve 24 can enable the product to have waterproof performance. In the present embodiment, the sealing sleeve 24 is made of silicone, and alternatively, other elastic materials may be used.

The bone conduction component 3 is fixedly connected with the vibration component 2 and vibrates along with the vibration component 2 to realize bone conduction of sound. That is, since the nature of sound is vibration, the bone conduction assembly 3 is attached to the head of the user while vibrating following the vibration assembly 2, so that the sound signal carried by this vibration is transmitted to the skull, ossicles and auditory nerves of the user to achieve bone conduction of sound.

Further, the bone conduction headset further comprises a weight block 6. The balancing weight 6 is arranged in the bone conduction component 3 and is used for adjusting the resonant frequency of the system, so that the bandwidth of the bone conduction earphone is widened, and the hearing sense is improved. In this embodiment, the bone conduction assembly 3 has a cover 31 for fixing the weight block 6 and shielding the weight block 6 to improve the appearance. Alternatively, the bone conduction assembly 3 may have no cover 31 or other means for fixing the weight 6.

Further, in an alternative implementation, the bone conduction headset may further include a shock-absorbing filler 25. In this embodiment, the shock-absorbing filler 25 is disposed between the piezoelectric device 22 and the bone conduction component 3, so that unnecessary contact between the piezoelectric device 22 and the housing of the bone conduction component 3 due to vibration can be avoided, noise can be reduced, and the use experience of the bone conduction headset can be improved. In the present embodiment, the shock absorbing filler 25 is foam, and may alternatively be other substances capable of achieving a shock absorbing function. Alternatively, the bone conduction headset may not have the shock-absorbing filler 25.

In the embodiment, the wearing component 1 and the bone conduction component 3 have a groove 4 matching with the base plate 23 at one end close to the vibration component 2, and the two end parts of the base plate 23 are embedded in the groove 4. Because the base plate 23 and the piezoelectric device 22 jointly form vibration, the deformation of the piezoelectric device 22 can be completely transmitted to the bone conduction assembly 3 by respectively connecting the two ends of the base plate 23 with the wearing assembly 1 and the bone conduction assembly 3. Further, the tank 4 is filled with a hard filler 41. The hard filler 41 prevents the base plate 23 from shaking in the groove 4, so that vibration is lost and not transmitted to the bone conduction member 3 entirely or more. In this embodiment, the base plate 23, the wearing assembly 1 and the bone conduction assembly 3 are welded, and the hard filler 41 is hard glue. Alternatively, other methods for fixing the base plate 23 and the wearing assembly 1 and the bone conduction assembly 3 to each other may be used, and the wearing assembly 1 and the bone conduction assembly 3 may not have the groove 4. Alternatively, the hard filler 41 may be other substances that can achieve vibration transmission.

The element that transmits the vibrations to the bone conduction assembly 3 is thus in fact the baseplate 23. In the present embodiment, the effective vibration parts of the bone conduction earphone are two vibration points formed at two parts of the base plate 23 connected to the wearing component 1 and the bone conduction component 3, and one vibration point formed on the inner side of the bone conduction component 3. When the ear-hook type vibration head is used, a user wears the ear-hook 12 on ears, the head beam 11 is arranged around the head, and the three vibration points are in contact with the skin, namely the skull, of the user. When the piezoelectric device 22 drives the substrate 23 to vibrate, the above parts can vibrate in the same phase, thereby effectively realizing bone conduction of sound.

Fig. 4 is a schematic perspective view of a bone conduction earphone according to a second embodiment of the present invention. Fig. 5 is an exploded schematic view of a second embodiment of a bone conduction headset according to an embodiment of the present invention. Fig. 6 is a side cross-sectional view of a vibrating assembly of a second embodiment of a bone conduction headset according to an embodiment of the present invention. As shown in fig. 4, 5 and 6, in the present embodiment, the weight 6 is disposed on a surface of the piezoelectric device 22 away from the substrate 23. That is, the weight 6 is disposed inside the sealing sleeve 24 and directly fixed to the surface of the piezoelectric device 22, so that the resonant frequency of the system can be more effectively adjusted to optimize the hearing. A gap is formed between the balancing weight 6 and the sealing sleeve 24, so that the piezoelectric device 22 is not prevented from deforming to generate vibration together with the substrate 23. In the present embodiment, the weight 6 is adhered to the surface of the piezoelectric device 22, and optionally, the weight 6 and the piezoelectric device 22 may be connected to each other by other methods.

In the present embodiment, due to the change of the installation position of the weight block 6, the bone conduction assembly 3 does not need to accommodate the weight block 6, and the shape thereof is also changed, which is smaller than that of the first embodiment. Thereby, the effective vibration portion of the bone conduction earphone is also changed. The base plate 23 forms a vibration point at the part connected with the wearing assembly 1, and the base plate 23 forms a vibration point together with the part connected with the bone conduction assembly 3 and the plane inside the bone conduction assembly 3. When the bone conduction earphone is used, a user wears the bone conduction earphone, and the two vibration points vibrate in the same phase, so that the bone conduction of sound is effectively realized.

Fig. 7 is a schematic perspective view of a first alternative implementation manner of a substrate of a bone conduction headset according to an embodiment of the present invention. Fig. 8 is a schematic perspective view of a second alternative implementation manner of a base plate of a bone conduction headset according to an embodiment of the present invention. Fig. 9 is a schematic perspective view of a third alternative implementation manner of a base plate of a bone conduction headset according to an embodiment of the present invention. Fig. 10 is a schematic perspective view of a fourth alternative implementation of a base plate of a bone conduction headset according to an embodiment of the present invention. Fig. 11 is a schematic perspective view of a fifth alternative implementation manner of a base plate of a bone conduction headset according to an embodiment of the present invention. As shown in fig. 7, 8, 9, 10, and 11, the substrate 23 is formed in a sheet shape, and includes an intermediate vibrating portion 51 and fixing portions 52 provided at both ends of the substrate 23, and the intermediate vibrating portion 51 and the fixing portions 52 are fixedly connected by a cantilever 53.

Wherein the piezoelectric device 22 is provided on the intermediate vibrating portion 51. In order to transmit the vibration of the piezoelectric device 22 to the substrate 23, the length of the intermediate vibrating portion 51 is required to be longer than the length of the piezoelectric device 22. In the first and second embodiments of the bone conduction headset, the piezoelectric devices 22 are provided on both sides of the intermediate vibrating portion 51. Alternatively, the piezoelectric device 22 may be provided only on one surface of the intermediate vibrating portion 51. And, in the first and second embodiments, the fixing portion 52 is a semicircular thin plate, and the base plate 23 is fixedly connected to the wearing member 1 and the bone conduction member 3 by inserting the fixing portions 52 at both ends into the grooves 4. Alternatively, the shape of the fixing portion 52 varies with the manner in which the base plate 23 is connected to the wearing assembly 1 and the bone conduction assembly 3.

In the first embodiment and the second embodiment, the substrate 23 may have different implementations. In the first alternative implementation, the second alternative implementation and the third alternative implementation of the substrate 23, the cantilever 53 of the substrate 23 and the intermediate vibrating portion 51 are substantially located in the same plane and have different shapes. For example, the edge of the cantilever 53 may not have a curvature, the edge of the cantilever 53 may have a curvature toward the inside or outside of the substrate 23, or the edge of the cantilever 53 may extend in a meandering manner in the direction in which the substrate 23 extends. That is, the cantilever 53 may be formed in various shapes to adjust the frequency of vibration transmission of the piezoelectric device 22. The vibration assembly 2 using different cantilevers 53 has different transmission efficiency to meet the use requirements of different people for the bone conduction headset.

Further, the cantilever 53 may also have a hollowed-out portion 531. In a fourth alternative implementation of the substrate 23, the cantilever 53 is formed as a rectangular sheet having the same width as the intermediate vibrating portion 51 and the fixing portion 52, and has a hollow portion 531 thereon. This design may also affect the vibration transfer efficiency of the substrate 23. Alternatively, the cutout 531 may have a different shape than this embodiment.

In a fifth alternative implementation of the base plate 23, the cantilever 53 is formed in an undulation shape that is convex or concave in the normal direction of the intermediate vibrating portion 51. That is, the cantilever 53 is formed in a three-dimensional shape on a different plane from the intermediate vibrating portion 51, thereby further changing the transmission efficiency of the vibration.

In the above five optional implementations, the substrate 23 is made of a steel plate with certain rigidity. Alternatively, the substrate 23 may be made of other materials to meet different vibration transmission requirements. Optionally, the substrate 23 may also have implementations other than the above five optional implementations.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A bone conduction headset, comprising:

a wearing assembly (1) for wearing the bone conduction headset on the head;

the vibrating assembly (2) comprises a circuit module (21), a piezoelectric device (22) and a substrate (23), the vibrating assembly (2) is fixedly connected with the wearing assembly (1), the circuit module (21) is electrically connected with the piezoelectric device (22), the piezoelectric device (22) is fixedly connected with the substrate (23), and the circuit module (21) is configured to input an electric signal to the piezoelectric device (22) to drive the piezoelectric device (22) to deform so that the piezoelectric device (22) and the substrate (23) jointly form vibration; and

bone conduction subassembly (3), bone conduction subassembly (3) with vibration subassembly (2) are fixed to be linked to each other, bone conduction subassembly (3) is followed vibration subassembly (2) vibrate in order to realize the osteoacusis of sound.

2. Bone conduction headset according to claim 1, characterized in that the wearing assembly (1) comprises;

a head beam (11) having a curvature that fits the head; and

ear-hang (12), have with the shape of ear laminating, two ear-hang (12) set up respectively in the both ends of head roof beam (11), ear-hang (12) with vibration subassembly (2) are fixed continuous.

3. The bone conduction headset according to claim 1, wherein one end of the wearing assembly (1) close to the vibrating assembly (2) is provided with a groove (4) matched with the base plate (23), and one end part of the base plate (23) is embedded into the groove (4);

one end of the bone conduction assembly (3) close to the vibration assembly (2) is provided with a groove body (4) matched with the base plate (23), and the other end part of the base plate (23) is embedded into the groove body (4);

the tank body (4) is filled with hard fillers (41).

4. The bone conduction headset according to claim 1, wherein the base plate (23) is formed in a sheet shape, the base plate (23) has an intermediate vibrating portion (51) and fixing portions (52) provided at both ends of the base plate (23), and the intermediate vibrating portion (51) and the fixing portions (52) are fixedly connected by a cantilever (53).

5. The bone conduction headset of claim 4, wherein the edge of the cantilever (53) does not have a curvature; or

The edge of the cantilever (53) has a curvature towards the inner or outer direction of the substrate (23); or

The edge of the cantilever 53 meanders in the direction in which the substrate 23 extends.

6. The bone conduction headset according to claim 5, wherein the cantilever (53) is formed in a wave shape that is convex or concave in a normal direction of the intermediate vibrating portion (51).

7. Bone conduction headset according to claim 5, characterized in that the cantilever (53) has a hollowed-out portion (531).

8. The bone conduction headset according to claim 5, wherein the piezoelectric device (22) is provided on one face of the intermediate vibrating portion (51); or

The piezoelectric devices (22) are provided on both surfaces of the intermediate vibration section (51).

9. The bone conduction headset of claim 1, wherein the vibration assembly includes a sealing sleeve (24), the sealing sleeve (24) configured to encase the vibration assembly (2);

the bone conduction earphone comprises a balancing weight (6), wherein the balancing weight (6) is arranged on one surface, far away from the substrate (23), of the piezoelectric device (22);

gaps are reserved among the sealing sleeve (24), the balancing weight (6) and the piezoelectric device (22).

10. The bone conduction headset of claim 1, comprising a weight (6), the weight (6) being disposed within the bone conduction assembly (3);

the bone conduction assembly (3) has a cover (31) to secure the weight (6).