CN214544708U - In-ear earphone - Google Patents

Abstract

The application discloses in-ear earphone includes: the ear shell comprises a sound outlet mouth, and the ear sleeve is sleeved on the outer side wall of the sound outlet mouth; the infrared sensor assembly comprises an infrared sensor, a sensor window and a sensor flexible circuit board, the infrared sensor is fixedly arranged in the sensor window, and the sensor window and the infrared sensor are arranged at the first end part of the sensor flexible circuit board together; a first groove is formed in the outer side wall of the sound outlet nozzle, a first through hole is formed in the bottom of the first groove, a first end portion of the sensor flexible circuit board is arranged in the first groove, and a second end portion of the sensor flexible circuit board enters the inner portion of the earshell through the first through hole and is connected to an earphone main board in the earshell; the infrared sensor is used for detecting the deformation of the earmuff, and the wearing detection of the in-ear earphone is realized. The in-ear earphone of this application is convenient for infrared sensor assembly's equipment, has improved sensitivity and the degree of accuracy of wearing the detection simultaneously.

Description

In-ear earphone

Technical Field

The application relates to the technical field of in-ear earphones, in particular to an in-ear earphone.

Background

With the continuous progress of science and technology, intelligent wearable electronic products are rapidly developed, in particular, in-ear earphones such as TWS (True Wireless Stereo) are favored by consumers, but the requirements of consumers are higher and higher, so that the appearance is required to be beautiful, the functions are complete, the wearing sensitivity is required, and the high requirement makes the reasonable stacking of the internal structure of the TWS earphone difficult.

In order to improve the wearing detection function of the earphone, an Infrared (IR) sensor is generally stacked inside the earshell on a side close to the skin outside the ear canal of the user, and the IR sensor is assembled on the earshell through an IR sensor window, so as to detect the wearing condition of the earphone. When the earphone contacts with the ear and is worn successfully, the infrared sensor can detect that the earphone is worn well, and the earphone starts to work normally.

However, the inventor finds that the stack structure adopted by the existing in-ear earphone has at least the following problems when the earphone is worn and detected:

1) infrared sensor assembles on the concha, and when the user worn the earphone, the concha can not laminate skin completely, wears the detection function inefficacy, and then leads to the earphone can not normally work.

2) The ear shell is usually designed in a curved surface, and the assembly space is relatively small, which causes difficulty in assembly of the IR sensor window, easily causes a step difference, affects the appearance, and due to the small space, a Flexible Printed Circuit (FPC) board of the IR sensor is difficult to stack in the ear shell, which causes difficulty in assembly of the FPC board, resulting in reduction of the product yield.

3) Since the IR sensor window and the earmuff need to be assembled together, they are different parts, which may affect the wearing comfort of the user.

SUMMERY OF THE UTILITY MODEL

In view of the problems of the prior art that the stacked structure adopted by the in-ear earphone has a poor detection effect on the wearing condition and is inconvenient to assemble, the in-ear earphone of the present application is proposed so as to overcome at least one of the above-mentioned problems.

In order to achieve the purpose, the following technical scheme is adopted in the application:

in accordance with one aspect of the present application, there is provided an in-ear headphone comprising: the ear shell comprises a sound outlet mouth, and the ear sleeve is sleeved on the outer side wall of the sound outlet mouth; also comprises an infrared sensor component which is arranged on the base,

the infrared sensor assembly comprises an infrared sensor, a sensor window and a sensor flexible circuit board, wherein the infrared sensor is fixedly arranged in the sensor window, and the sensor window and the infrared sensor are installed at the first end part of the sensor flexible circuit board together;

a first groove is formed in the outer side wall of the sound outlet nozzle, a first through hole is formed in the bottom of the first groove, a first end portion of the sensor flexible circuit board is arranged in the first groove, and a second end portion of the sensor flexible circuit board enters the inner portion of the earshell through the first through hole and is connected to an earphone main board in the earshell;

the infrared sensor is used for detecting the deformation of the earmuff, and the wearing detection of the in-ear earphone is realized.

Optionally, the upper surface of the sensor window is provided with a light guide column, the surface of the light guide column is in the shape of an arc protruding outwards, and at least one pair of opposite side surfaces in the sensor window are in the shape of an inwards-recessed arc.

Optionally, a pressure-sensitive adhesive is disposed on a back surface of the first end portion of the sensor flexible circuit board, and the first end portion of the sensor flexible circuit board is disposed in the first groove of the sound outlet mouth and used for preliminary fixing of the sensor flexible circuit board and the earmuff;

a first dispensing groove is formed in the first end portion of the sensor flexible circuit board and around the infrared sensor;

the sensor flexible circuit board in the earshell is further provided with at least one pressure-sensitive adhesive, and the pressure-sensitive adhesive is used for adhering the sensor flexible circuit board in the earshell.

Optionally, a second dispensing groove is formed in the bottom of the first groove and used for fixing and sealing the sensor flexible circuit board and the first groove.

Optionally, a second groove is provided on the inner housing of the sound outlet for fixing the sensor flexible circuit board entering the inside of the earshell.

Optionally, the sound outlet nozzle and the main body of the earshell are integrally formed by plastic injection molding.

Optionally, three rib positions are uniformly arranged on the side wall of the sound outlet mouth, and are used for fixing the ear cap and preventing the ear cap from rotating along the circumferential direction of the sound outlet mouth;

the lateral wall of the sound outlet nozzle is also provided with a boss on the circumference for fixing the ear cap and preventing the ear cap from falling off along the axial direction of the sound outlet nozzle.

Optionally, the inner side wall of the earmuff is provided with three third grooves matched with the three rib positions on the sound outlet mouth, and the third grooves are used for being matched and connected with the sound outlet mouth.

Optionally, the in-ear headphone further comprises a sound outlet mouth net, and the sound outlet mouth net is fixedly arranged at an outlet of the sound outlet mouth.

Optionally, the earmuff comprises an earmuff part I and an earmuff part II, wherein the earmuff part I and the earmuff part II are made of silica gel materials with different hardness and are formed through double-injection molding, and the hardness of the earmuff part I is greater than that of the earmuff part II;

the earmuff part is provided with a second through hole opposite to the first groove in position, and the infrared sensor detects the deformation of the earmuff part through the second through hole to realize the wearing detection of the in-ear earphone.

To sum up, the beneficial effect of this application is:

the utility model provides an in-ear earphone, through set up first recess on the lateral wall at the sound outlet, first through-hole is seted up to the bottom of first recess, the first end setting of the sensor flexible circuit board of installing sensor window and infrared sensor is in first recess, the second end of sensor flexible circuit board gets into the earlap inside and is connected to the inside earphone mainboard of earlap through first through-hole, with the signal transmission of realization and earphone mainboard, infrared sensor is used for detecting the deformation of earmuff, the realization detects wearing of in-ear earphone. The utility model provides an in-ear earphone sets up on the lateral wall of sound outlet mouth through the infrared sensor subassembly that will be used for detecting the earphone wearing condition, the equipment of the infrared sensor subassembly of being convenient for on the one hand, and on the other hand has also improved in-ear earphone and has worn sensitivity and the degree of accuracy that detects.

Drawings

FIG. 1 is a schematic view of an outer longitudinal section of an in-ear headphone assembly of one embodiment of the present application after assembly of an infrared sensor assembly at the output mouth;

FIG. 2 is a schematic view of an inner longitudinal section of an in-ear headphone assembly of one embodiment of the present application after assembly of an infrared sensor assembly at the output mouth;

FIG. 3 illustrates a schematic top view in transverse cross-section of an in-ear headphone assembly of one embodiment of the present application after assembly of an infrared sensor assembly at the output mouth;

FIG. 4 is a schematic perspective view of the sound outlet facing the slot according to an embodiment of the present application;

FIG. 5 illustrates a perspective view of a sensor window according to one embodiment of the present application;

FIG. 6 is a schematic diagram illustrating a front side of a sensor flexible circuit board with a sensor window mounted thereon according to one embodiment of the present application;

FIG. 7 illustrates a schematic front view of an infrared sensor assembly of one embodiment of the present application in cooperation with a mouthpiece;

FIG. 8 is a schematic diagram illustrating a backside structure of a sensor flexible circuit board with a sensor window mounted thereon according to an embodiment of the present application;

FIG. 9 illustrates a longitudinal cut-away view of an infrared sensor assembly of one embodiment of the present application;

FIG. 10 is a schematic longitudinal sectional view of an infrared sensor assembly of one embodiment of the present application in cooperation with a mouthpiece;

FIG. 11 is a schematic perspective view of a sound outlet side of the split groove according to an embodiment of the present application;

FIG. 12 illustrates a partial perspective view of an earmuff according to an embodiment of the present application;

FIG. 13 illustrates a schematic plan view of an earmuff according to an embodiment of the present application;

fig. 14 shows a schematic longitudinal cut-away view of a side opening of an ear loop according to an embodiment of the present application.

In the figure: 10. an earshell; 20. ear cap; 30. an infrared sensor assembly; 110. a sound outlet mouth; 210. an ear cap part; 220. a second ear cap part; 310. an infrared sensor; 320. a sensor flexible circuit board; 330. a sensor window; 1101. a first groove; 1102. a first through hole; 3201. a first end portion; 3202. a second end portion; 3203. a first dispensing slot; 1103. a second glue dispensing groove; 1104. a second groove; 1105. a rib position; 1106. a boss; 2101. a second through hole; 2102. a third groove; 3301. a light guide pillar; 40. a sound outlet mouth net; 50. pressure sensitive adhesive.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Based on this, the technical idea of this application is: utilize the play sound mouth on the in-ear earphone to pile up infrared sensor subassembly to improve the in-ear earphone wear the detection effect and wear the comfort. Specifically, a first groove is formed in the outer side wall of the sound outlet nozzle, and a first through hole is formed in the bottom of the first groove. During the equipment, install infrared sensor at the first end of sensor flexible circuit board through the infrared sensor window earlier, then set up the first end of sensor flexible circuit board in this first recess, later put into the earlap inside and be connected to the mainboard of earlap inside through this first through-hole with the second end of sensor flexible circuit board to utilize pressure sensitive adhesive and glue etc. to fix sensor flexible circuit board, thereby realize the equipment of infrared sensor subassembly and sound output mouth. And then assembling the sound outlet mouth net at the outlet of the sound outlet mouth, and finally assembling the earmuff on the earshell to complete the assembly of the in-ear earphone.

After the in-ear earphone equipment was accomplished, infrared sensor's function will normal operating, and when the user wore in-ear earphone, the earmuff can enter into the duct of people's ear, can contract simultaneously, and the deformation of earmuff is detected out in the light of infrared sensor transmission can shine on the earmuff to detect that the earphone is in the wearing state, the earphone begins normal work.

Fig. 1 is a schematic diagram illustrating an outer longitudinal section of an in-ear headphone after an infrared sensor assembly is assembled at a sound outlet, fig. 2 is a schematic diagram illustrating an inner longitudinal section of an in-ear headphone after an infrared sensor assembly is assembled at a sound outlet, fig. 3 is a schematic diagram illustrating a top view of a transverse section of an in-ear headphone after an infrared sensor assembly is assembled at a sound outlet, and fig. 4 is a schematic diagram illustrating a three-dimensional structure of a sound outlet facing a groove.

Referring to fig. 1 to 4, the in-ear headphone of the present application includes: the earmuff comprises an earmuff 10 and an earmuff 20, wherein the earmuff 10 comprises a sound outlet 110, and the earmuff 20 is sleeved on the outer side wall of the sound outlet 110.

The in-ear earphone of the embodiment of the present application further includes an infrared sensor assembly 30, specifically including an infrared sensor 310, a sensor flexible circuit board 320 and a sensor window 330, the infrared sensor 310 is fixedly disposed inside the sensor window 330, and the infrared sensor 310 is mounted at the first end 3201 of the sensor flexible circuit board 320 through the sensor window 330, so as to utilize the infrared light reflection principle to realize the detection of the wearing condition of the in-ear earphone.

The outer side wall of the sound outlet 110 of the embodiment of the application is further provided with a first groove 1101, a first through hole 1102 is formed in the bottom of the first groove 1101, the first through hole 1102 is communicated with the inside of the earmuff 10, the first end 3201 of the sensor flexible circuit board 320 is arranged in the first groove 1101, then the second end 3202 of the sensor flexible circuit board 320 enters the inside of the earmuff 10 through the first through hole 1102 and is connected to the earphone main board inside the earmuff 10, and therefore the purpose of assembling the infrared sensor assembly 30 on the side wall of the sound outlet 110 is achieved. The connection manner of the second end 3202 of the sensor flexible circuit board 320 and the main board of the earphone may be soldering or any other electrical connection manner, and is not limited in particular.

Compare in the technical scheme who adopts in prior art with infrared sensor setting on the concha that is close to user's ear canal skin one side, the in-ear earphone of this application embodiment is all lower to the transformation cost and the transformation complexity of sound outlet mouth 110, and easily the equipment.

For the assembled in-ear earphone, after the user wears the earphone, the earmuff 20 also enters the ear canal of the human ear, the earmuff 20 contracts, and meanwhile, the light emitted by the infrared sensor 310 irradiates the earmuff 20 to detect the deformation of the earmuff 20, so that the wearing detection of the in-ear earphone is realized. Compare and detect the laminating condition of conch and user's skin through infrared sensor on the conch among the prior art, and then obtain the design whether the earphone was worn, this application sets up infrared sensor on the sound outlet mouth to the wearing of in-ear earphone detect more sensitively, and more accurate.

Fig. 5 is a schematic perspective view illustrating a sensor window according to an embodiment of the present application, fig. 6 is a schematic front view illustrating a sensor flexible circuit board having the sensor window mounted thereon according to an embodiment of the present application, and fig. 7 is a schematic front view illustrating an infrared sensor assembly according to an embodiment of the present application in cooperation with a mouthpiece.

Referring to fig. 5-7, in one embodiment of the present application, the upper surface of the sensor window 330 is further provided with a light guide 3301, where "upper surface" refers to a side of the sensor window 330 facing the outer side wall of the mouthpiece 110. The material that leaded light post 3301 adopted will have certain luminousness, for example the luminousness reaches 90% to make the light that infrared sensor 310 emitted can fully shine away through leaded light post 3301, specifically, the leaded light post of this application embodiment can adopt the Polycarbonate (PC for short) material to make.

Generally speaking, the lateral wall of sound outlet nozzle is arc, and consequently this application embodiment also designs leaded light post 3301's surface into outside bellied arc, like this can be better with leaded light post 3301 and sound outlet nozzle 110's lateral wall circumference complete coordination, avoid appearing the condition of protrusion and sunken, and then influence infrared sensor's function. Of course, it should be noted that the surface of the light guide pillar may be designed into a circular arc shape or other arc sizes, which mainly depends on the arc of the inner sidewall of the sound outlet nozzle attached thereto.

To the in-ear earphone especially TWS earphone, its inside spare part structure is all less, in order to make things convenient for the assembler to get and put sensor window 330, refer to fig. 5, this application embodiment can design at least a pair of relative side in the sensor window for inside sunken arc, and the assembler can hold between fingers or clip this arc side through tweezers when the equipment to realize the quick assembly of sensor window, also can avoid scraping the surface of leaded light post simultaneously.

Fig. 8 is a schematic view showing a back structure of a sensor flexible circuit board having a sensor window mounted thereon according to an embodiment of the present application, and fig. 9 is a schematic view showing a longitudinal section of an infrared sensor module according to an embodiment of the present application.

In an embodiment of the present application, referring to fig. 8, when the sensor flexible circuit board 320 is assembled into the first groove 1101 at the sound outlet 110, a Pressure sensitive adhesive 50 (PSA) may be disposed on a back surface of the first end portion 3201 of the sensor flexible circuit board 320, so that the first end portion 3201 of the sensor flexible circuit board 320 may be initially fixed to the ear shell 10 by the PSA, which facilitates subsequent assembly operations. Pressure-sensitive adhesives are a class of pressure-sensitive adhesives having good adhesion and temperature resistance, although those skilled in the art can flexibly select other types of adhesives according to actual needs, and are not listed here.

Referring to fig. 9, the first end portion 3201 of the sensor flexible circuit board 320 of the embodiment of the present application is further provided with a first dispensing groove 3203 around the periphery where the infrared sensor 310 is mounted, and the shape and size of the first dispensing groove 3203 are determined according to the cross-sectional shape and size of the infrared sensor 310, and may be slightly larger than the outer side dimension of the infrared sensor 310. The width of the first dispensing groove 3203 may be designed according to actual requirements, for example, may be designed to be 0.3mm, so that the first dispensing groove 3203 can achieve the purpose of fixing the sensor window 330 and the infrared sensor 310 together on the sensor flexible circuit board 320, and at the same time, can have a certain capacity of accommodating excessive glue, so as to prevent the excessive glue from penetrating into the infrared sensor 310, and further affecting the function of the infrared sensor 310.

Referring to fig. 6 and 8-9, the sensor flexible circuit board 320 of the present embodiment is designed to be relatively long, which facilitates assembly of the second end 3202 of the sensor flexible circuit board 320 into the interior of the earshell 10 through the first through hole 1102. Specifically, the sensor flexible circuit board 320 entering the inside of the ear shell 10, that is, the second end 3202 of the sensor flexible circuit board 320, may be provided with at least one pressure-sensitive adhesive, for example, two or three pressure-sensitive adhesives are disposed at intervals, so that the sensor flexible circuit board 320 may be conveniently adhered inside the ear shell 10, and it is avoided that the function of the infrared sensor 310 is affected or the acoustic function of the earphone is affected due to the shaking of the sensor flexible circuit board 320 inside the ear shell 10. Of course, the skilled person can flexibly set the pressure sensitive adhesive according to actual requirements, and the pressure sensitive adhesive is not limited in particular, how to set the pressure sensitive adhesive on the second end 3202 of the sensor flexible circuit board 320.

Fig. 10 is a schematic longitudinal sectional view of an infrared sensor unit according to an embodiment of the present application in cooperation with a sound outlet, and fig. 11 is a schematic perspective view of a sound outlet side-split groove according to an embodiment of the present application. Referring to fig. 4, 10-11, in an embodiment of the present application, a second dispensing groove 1103 is further disposed at a bottom of the first groove 1101 on the sound outlet 110, and the second dispensing groove 1103 functions to fixedly seal between the sensor flexible circuit board 320 and the first groove 1101 on the sound outlet 110. Similarly, the width of the second dispensing groove 1103 may be designed according to actual requirements, for example, the width may also be designed to be 0.3mm, so that the second dispensing groove 1103 may have a certain ability of accommodating excess glue while achieving the purpose of fixing the sensor flexible circuit board 320 on the mouthpiece 110, so as to prevent the excess glue from permeating into the mouthpiece 110, thereby affecting the acoustic function of the earphone.

Referring to fig. 10, in an embodiment of the present application, a second groove 1104 is further disposed on the inner casing of the sound outlet 110, and the second groove 1104 mainly functions to fix the sensor flexible circuit board 320 entering the interior of the sound outlet 110 in the second groove 1104, so that the sensor flexible circuit board 320 is prevented from blocking the sound outlet 110, and the acoustic function of the earphone is prevented from being affected.

Most of the existing in-ear earphones are designed to separate the sound outlet 110 from the earshell 10 and then assembled into an integral structure, which results in more complicated assembly process and higher production cost. Therefore, in an embodiment of the present application, the main body of the sound outlet 110 and the ear shell 10 can be manufactured by plastic injection molding, which not only simplifies the assembly process of the in-ear earphone, but also reduces the production cost.

In an embodiment of the present application, referring to fig. 11, three ribs 1105 are uniformly disposed on the sidewall of the sound outlet 110, and are used to facilitate the ear cap 20 to be sleeved on the sidewall of the sound outlet 110, and simultaneously prevent the ear cap 20 from rotating along the circumferential direction of the sound outlet 110. The side wall of the sound outlet 110 is further provided with a boss 1106 on the circumferential direction, which is used for facilitating the ear cap 20 to be sleeved on the side wall of the sound outlet 110, and preventing the ear cap 20 from falling off along the axial direction of the sound outlet 110, thereby influencing the use experience of the user. Of course, the specific positions and numbers of the rib positions 1105 and the bosses 1106 can be flexibly set by those skilled in the art according to practical situations, which are not listed here.

Fig. 12 illustrates a partial perspective view of an earmuff according to an embodiment of the present application. In an embodiment of the present application, referring to fig. 12, three third grooves 2102 are provided on an inner sidewall of the ear cap 20, which match with three rib positions 1105 on the sound outlet 110, and are configured to facilitate matching and connecting with the three rib positions 1105 on the sound outlet 110, so as to fix the ear cap 20 to a sidewall of the sound outlet 110 and prevent the ear cap 20 from rotating circumferentially along the sidewall of the sound outlet 110.

In one embodiment of the present application, referring to fig. 1-2, the in-ear headphone of the embodiment of the present application further includes a mouthpiece net 40, and the mouthpiece net 40 is fixedly disposed at an outlet of the mouthpiece 110. Specifically, the mouthpiece net 40 may be attached to the outlet of the mouthpiece 110 by glue by providing a third glue groove circumferentially at the outlet of the mouthpiece 110. The size of the third glue groove can also be designed according to actual conditions, but a certain capacity for accommodating excessive glue is required to prevent the excessive glue from flowing into and out of the sound mouth 110, so that the acoustic function of the earphone is influenced.

Fig. 13 is a schematic plan view showing the structure of an ear cap according to an embodiment of the present application, and fig. 14 is a schematic longitudinal sectional view showing a side opening of an ear cap according to an embodiment of the present application.

In an embodiment of the present application, referring to fig. 13-14, the earmuff 20 includes a first earmuff portion 210 and a second earmuff portion 220, and the first earmuff portion 210 and the second earmuff portion 220 are respectively formed by two-time injection molding by using silicone materials with different hardness.

Considering that the first ear muff part 210 is directly connected to the sound outlet 110 of the ear shell 10 and the second ear muff part 220 is directly contacted with the ear of a human, in order to ensure the stability of the ear muff 20 covering the sound outlet 110 and the comfort of the user when wearing the ear phone, the hardness of the first ear muff part 210 can be designed to be greater than that of the second ear muff part 220, for example, the first ear muff part 210 can be made of relatively hard silica gel material such as TY 65170 Shore a, so that the ear muff 20 can be fixed on the sound outlet 110, and the second ear muff part 220 can be made of relatively soft material such as TY 65150 Shore a.

Of course, the earmuff of which material is specifically adopted can be flexibly adjusted by a person skilled in the art according to actual requirements, and is not specifically limited herein.

In addition, referring to fig. 12 and 14, the first earmuff portion 210 of the embodiment of the present application is further provided with a second through hole 2101 opposite to the first through hole 1102 at the bottom of the first groove 1101, and the second through hole 2101 mainly functions to facilitate the transmission detection of the infrared sensor 310. When assembling the ear muff, it is necessary to ensure that the second through hole 2101 provided on the one part 210 of the ear muff can be aligned with the first groove 1101 on the sound outlet 110 to avoid affecting the normal operation of the infrared sensor 310. That is, to enable the light emitted from the infrared sensor 310 to irradiate the second ear muff part 220 through the second through hole 2101, the deformation of the second ear muff part 220 can be detected by the reflection of the light, and the wearing detection of the in-ear earphone can be further realized.

In summary, the in-ear earphone of the present application at least achieves the following technical effects:

1) the process is simplified: when the assembly is carried out, the infrared sensor assembly is directly assembled on the sound outlet mouth of the earshell, so that the assembly is convenient, the labor and equipment cost is reduced, and the production efficiency and the product yield are improved;

2) the assembly is simplified, and the cost is reduced: the sound outlet nozzle and the ear shell are designed into an integral structure and are integrally formed by injection molding, so that the production cost is reduced, the assembly process of the sound outlet nozzle is simplified, and the product yield is further improved;

3) the stacking space of the infrared sensor assembly is saved: the infrared sensor assembly does not need to be stacked in the earshell, so that the space in the earshell is saved, components with other functions such as a noise reduction microphone and the like can be added in the earshell, and other performances of the earphone can be conveniently expanded;

4) the earmuff design accords with ergonomic, and adopts the silica gel of different hardness to mould plastics, has improved the comfort of wearing, piles up the infrared sensor subassembly and assembles in the play sound mouth department of earmuff, later carries out the printing opacity through earmuff one, and signal feedback is carried out to earmuff two for infrared sensor can be better the detection in-ear earphone wear the condition.

5) Reduce infrared sensor's mistake and touch, improve detection efficiency: as long as the user wears the earphone, the earmuff enters the auditory canal, and the infrared sensor works normally.

While the present invention has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood by those skilled in the art that the foregoing detailed description is for the purpose of better explaining the present application, and the scope of protection of the present application shall be subject to the scope of protection of the claims.

Claims (10)

1. An in-ear headphone comprising: the ear shell comprises a sound outlet mouth, and the ear sleeve is sleeved on the outer side wall of the sound outlet mouth; it is characterized by also comprising an infrared sensor component,

the infrared sensor assembly comprises an infrared sensor, a sensor window and a sensor flexible circuit board, wherein the infrared sensor is fixedly arranged in the sensor window, and the sensor window and the infrared sensor are installed at the first end part of the sensor flexible circuit board together;

a first groove is formed in the outer side wall of the sound outlet nozzle, a first through hole is formed in the bottom of the first groove, a first end portion of the sensor flexible circuit board is arranged in the first groove, and a second end portion of the sensor flexible circuit board enters the inner portion of the earshell through the first through hole and is connected to an earphone main board in the earshell;

the infrared sensor is used for detecting the deformation of the earmuff, and the wearing detection of the in-ear earphone is realized.

2. An in-ear headphone according to claim 1, characterized in that the upper surface of the sensor window is provided with a light guiding pillar, the surface of the light guiding pillar is in the shape of an outwardly convex arc, and at least one pair of opposite side surfaces of the sensor window are in the shape of an inwardly concave arc.

3. An in-ear headphone according to claim 1,

the back surface of the first end part of the sensor flexible circuit board is provided with a pressure-sensitive adhesive, and the first end part of the sensor flexible circuit board is arranged at the first groove at the sound outlet mouth and used for preliminary fixing of the sensor flexible circuit board and the earmuff;

a first dispensing groove is formed in the first end portion of the sensor flexible circuit board and around the infrared sensor;

the sensor flexible circuit board in the earshell is further provided with at least one pressure-sensitive adhesive, and the pressure-sensitive adhesive is used for adhering the sensor flexible circuit board in the earshell.

4. An in-ear headphone according to claim 1, characterized in that the bottom of the first recess is provided with a second glue dispensing groove for a fixed sealing between the sensor flexible circuit board and the first recess.

5. An in-ear headphone as claimed in claim 1, characterized in that the inner housing of the sound outlet mouth is provided with a second recess for fixing the sensor flexible circuit board into the interior of the ear shell.

6. An in-ear headphone as claimed in claim 1, wherein the sound outlet mouth is integrally formed with the body of the earshell by plastic injection molding.

7. An in-ear headphone according to claim 1,

three rib positions are uniformly arranged on the side wall of the sound outlet mouth and used for fixing the ear cap and preventing the ear cap from rotating along the circumferential direction of the sound outlet mouth;

the lateral wall of the sound outlet nozzle is also provided with a boss on the circumference for fixing the ear cap and preventing the ear cap from falling off along the axial direction of the sound outlet nozzle.

8. An in-ear headphone as claimed in claim 7, wherein the inner side wall of the ear muff is provided with three third grooves matching with the three ribs on the sound outlet mouth for matching connection with the sound outlet mouth.

9. An in-ear headphone according to claim 1, characterized in that the in-ear headphone further comprises a sound outlet mouth net fixedly arranged at an outlet of the sound outlet mouth.

10. An in-ear headphone according to any one of the claims 1-9, wherein the ear muffs comprise a first ear muff part and a second ear muff part, the first ear muff part and the second ear muff part are made of silicone materials with different hardness and are formed by two-shot injection molding, wherein the hardness of the first ear muff part is greater than that of the second ear muff part;

the earmuff part is provided with a second through hole opposite to the first groove in position, and the infrared sensor detects the deformation of the earmuff part through the second through hole to realize the wearing detection of the in-ear earphone.

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