CN214542240U - Front-illuminated CMOS image sensor - Google Patents

Front-illuminated CMOS image sensor Download PDF

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Publication number
CN214542240U
CN214542240U CN202121065604.6U CN202121065604U CN214542240U CN 214542240 U CN214542240 U CN 214542240U CN 202121065604 U CN202121065604 U CN 202121065604U CN 214542240 U CN214542240 U CN 214542240U
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China
Prior art keywords
image sensor
cmos image
fixedly connected
mounting
illuminated cmos
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CN202121065604.6U
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Chinese (zh)
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张宏鑫
其他发明人请求不公开姓名
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Weixin Technology Zhejiang Co ltd
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Weixin Technology Zhejiang Co ltd
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Abstract

The utility model discloses a preceding formula CMOS image sensor that shines, including mounting panel and framework, the equal fixedly connected with multiunit U-shaped piece in upper and lower surface of framework, one side of U-shaped piece is provided with the torsional spring, the inner wall of U-shaped piece rotates through the torsional spring and is connected with the connecting cylinder, the one end of connecting cylinder is provided with the connector, the one end of connector is provided with the connector lug, connector lug run through connecting cylinder electric connection has the wiring strip, the surface of mounting panel is provided with the installing frame, the inner wall fixedly connected with bracing piece of installing frame, the one end fixedly connected with driving-disc of bracing piece, one side of driving-disc is provided with the drive shaft, just the one end fixedly connected with flabellum of drive shaft, the surface of installing frame is provided with the dust screen. The utility model discloses in, be convenient for collect the sensor and deposit, effectually protected the connector lug, the radiating effect is good simultaneously, has improved the life of sensor.

Description

Front-illuminated CMOS image sensor
Technical Field
The utility model relates to an image sensor technical field especially relates to a preceding formula CMOS image sensor that shines.
Background
The CMOS image sensor is a typical solid-state imaging sensor, and has a common historical source with a CCD, and generally consists of an image sensing cell array, a row driver, a column driver, a timing control logic, an AD converter, a data bus output interface, a control interface, and the like, which are generally integrated on the same silicon chip, and the working process thereof can be generally divided into a reset part, a photoelectric conversion part, an integration part, and a readout part.
At present CMOS image sensor, the connector lug on it is most with CMOS image sensor is vertical distribution, like this, it is very inconvenient when collecting CMOS image sensor, still easily cause the connector lug fracture to influence CMOS image sensor's normal use, except this, CMOS image sensor is under long-time service conditions, its self can produce a large amount of heats, if these heats can not get to discharge, easily cause the damage to its inside chip.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art, and provides a front-illuminated CMOS image sensor.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a front-lighting CMOS image sensor comprises a mounting plate and a frame body, wherein the upper surface and the lower surface of the frame body are fixedly connected with a plurality of groups of U-shaped blocks, one sides of the U-shaped blocks are provided with torsional springs, the inner walls of the U-shaped blocks are rotatably connected with connecting cylinders through the torsional springs, one ends of the connecting cylinders are provided with connectors, one ends of the connectors are provided with connector terminals, and the connector terminals penetrate through the connecting cylinders and are electrically connected with wiring strips;
the surface of mounting panel is provided with the installing frame, the inner wall fixedly connected with bracing piece of installing frame, the one end fixedly connected with driving-disc of bracing piece, one side of driving-disc is provided with the drive shaft, just the one end fixedly connected with flabellum of drive shaft, the surface of installing frame is provided with the dust screen, the surface of mounting panel is provided with the heating panel.
As a further description of the above technical solution:
the number of the heat dissipation plates is two, and the two sets of the heat dissipation plates are axially symmetrical relative to the mounting frame.
As a further description of the above technical solution:
the surface of installing frame is provided with fixing bolt, the installing frame passes through fixing bolt and dust screen fixed connection together.
As a further description of the above technical solution:
the interior bottom surface fixedly connected with mainboard of framework, the front of mainboard is provided with the display screen.
As a further description of the above technical solution:
the inside wall and the wiring strip fixed connection of framework are in the same place, mainboard and wiring strip electric connection are in the same place.
As a further description of the above technical solution:
the surface of mounting panel just is located the four corners department of mounting panel and is provided with the mounting hole.
As a further description of the above technical solution:
the frame body is located the front of mounting panel, the dust screen is located the reverse side of mounting panel.
As a further description of the above technical solution:
the cross-sectional shape of connecting cylinder is "T" shape, connector and connecting cylinder embedded link together.
The utility model discloses following beneficial effect has:
1. the utility model discloses in, pass through the connecting cylinder with the connector lug and rotate the connection on the U-shaped piece, can realize buckling to the connector lug, the wiring of the connector lug of both being convenient for can protect the connector lug when collecting CMOS image sensor again, prevents that the connector lug from breaking and influencing CMOS image sensor's use.
2. The utility model discloses in, set up the driving-disc and make the driving-disc drive flabellum rotate through the surface at the mounting panel, can carry out the thermal treatment to CMOS image sensor, avoid high temperature to cause the damage to the inside chip of CMOS image sensor to influence CMOS image sensor's life.
3. The utility model discloses in, set up the dust screen through the surface at the installing frame, when carrying out the heat dissipation, also can avoid external dust to get into CMOS image sensor's inside to cause the damage to CMOS image sensor.
4. The utility model discloses in, connector and the embedded connected mode of connecting cylinder are convenient for take off the connector lug from CMOS image sensor to be convenient for maintain and change convenience and strong adaptability to the connector lug.
Drawings
Fig. 1 is a front view of a front-illuminated CMOS image sensor according to the present invention;
FIG. 2 is an enlarged view taken at A in FIG. 1;
fig. 3 is a rear view of a front-illuminated CMOS image sensor according to the present invention;
fig. 4 is a rear view structural diagram of a front-illuminated CMOS image sensor according to the present invention;
fig. 5 is a perspective view of a front-illuminated CMOS image sensor according to the present invention.
Illustration of the drawings:
1. mounting a plate; 2. a frame body; 3. a main board; 4. a display screen; 5. a wire connection strip; 6. installing a frame; 7. a dust screen; 8. fixing the bolt; 9. a heat dissipation plate; 10. a support bar; 11. a drive disc; 12. a fan blade; 13. a U-shaped block; 14. a connector; 15. a connector lug; 16. a connecting cylinder; 17. and (7) installing holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-5, the present invention provides an embodiment: a front-illuminated CMOS image sensor comprises a mounting plate 1 and a frame body 2, wherein the frame body 2 is positioned on the front surface of the mounting plate 1, the upper surface and the lower surface of the frame body 2 are fixedly connected with a plurality of groups of U-shaped blocks 13, one sides of the U-shaped blocks 13 are provided with torsional springs, the inner walls of the U-shaped blocks 13 are rotatably connected with a connecting cylinder 16 through the torsional springs, one end of the connecting cylinder 16 is provided with a connecting head 14, the cross section of the connecting cylinder 16 is in a T shape, the connecting head 14 and the connecting cylinder 16 are connected together in an embedded mode, the embedded connecting mode is convenient for maintaining and replacing a connector lug 15, the convenience is high, one end of the connecting head 14 is provided with the connector lug 15, the connector lug 15 can rotate to connect the connector lug 15, the connector lug 15 can prevent the connector lug 15 from being broken, the connector lug 15 is protected, the connector lug 15 penetrates through the connecting cylinder 16 and is electrically connected with a connector strip 5, the interior bottom surface fixedly connected with mainboard 3 of framework 2, the front of mainboard 3 is provided with display screen 4, and the inside wall and the 5 fixed connection of wiring strip of framework 2 are in the same place, and mainboard 3 and 5 electric connection of wiring strip are in the same place.
The surface of the mounting plate 1 is provided with a mounting frame 6, the inner wall of the mounting frame 6 is fixedly connected with a support rod 10, one end of the support rod 10 is fixedly connected with a driving disc 11, one side of the driving disc 11 is provided with a driving shaft, one end of the driving shaft is fixedly connected with a fan blade 12, the fan blade 12 rotates under the action of the driving disc 11, the heat dissipation treatment can be carried out on the mainboard 3, the chip in the mainboard 3 is effectively damaged by high temperature on the surface, the service life of the CMOS image sensor is prolonged, the surface of the mounting frame 6 is provided with a dust screen 7, the dust screen 7 not only ensures the circulation of air, but also can carry out dust protection on the mainboard 3, the dust screen 7 is positioned on the reverse side of the mounting plate 1, the surface of the mounting frame 6 is provided with a fixing bolt 8, the mounting frame 6 is fixedly connected with the dust screen 7 through the fixing bolt 8, and the surface of the mounting plate 1 is provided with a heat dissipation plate 9, the heating panel 9 can accelerate the radiating effect to mainboard 3, and the quantity of heating panel 9 is two sets of, and two sets of heating panel 9 are axisymmetric about installing frame 6, and the surface of mounting panel 1 just is located the four corners department of mounting panel 1 and is provided with mounting hole 17.
The working principle is as follows: firstly, the mounting plate 1 and the frame body 2 thereon are mounted at a designated position through the mounting hole 17, after the mounting is completed, the connecting cylinder 16 is rotated to drive the connector lug 15 to rotate, so that the connector lug 15 and the frame body 2 are kept vertical, then, the circuit to be connected with the connector lug 15 is connected, so that the mainboard 3 is kept electrified to ensure that the CMOS image sensor can operate, at the moment, the driving disk 11 is electrified to drive the driving shaft and the fan blade 12 thereon to rotate, so as to carry out heat dissipation treatment on the CMOS image sensor, after the CMOS image sensor is used, the circuit connected with the connector lug 15 is disassembled, the connecting cylinder 16 is rotated to enable the connector lug 15 and the frame body 2 to be attached, the connector lug 15 is prevented from being extruded to be broken, and finally, after the connector lug 15 is damaged, the connector lug 14 is pulled out of the connecting cylinder 16, and then the connector lug 15 is maintained and replaced.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims (8)

1. A front-illuminated CMOS image sensor includes a mounting board (1) and a frame body (2), characterized in that: the upper surface and the lower surface of the frame body (2) are fixedly connected with a plurality of groups of U-shaped blocks (13), one sides of the U-shaped blocks (13) are provided with torsion springs, the inner walls of the U-shaped blocks (13) are rotatably connected with connecting cylinders (16) through the torsion springs, one ends of the connecting cylinders (16) are provided with connecting heads (14), one ends of the connecting heads (14) are provided with wiring heads (15), and the wiring heads (15) penetrate through the connecting cylinders (16) and are electrically connected with wiring strips (5);
the surface of mounting panel (1) is provided with installing frame (6), the inner wall fixedly connected with bracing piece (10) of installing frame (6), the one end fixedly connected with driving-disc (11) of bracing piece (10), one side of driving-disc (11) is provided with the drive shaft, just one end fixedly connected with flabellum (12) of drive shaft, the surface of installing frame (6) is provided with dust screen (7), the surface of mounting panel (1) is provided with heating panel (9).
2. The front-illuminated CMOS image sensor according to claim 1, wherein: the number of the heat dissipation plates (9) is two, and the two heat dissipation plates (9) are axially symmetrical relative to the mounting frame (6).
3. The front-illuminated CMOS image sensor according to claim 1, wherein: the surface of the mounting frame (6) is provided with a fixing bolt (8), and the mounting frame (6) is fixedly connected with the dust screen (7) through the fixing bolt (8).
4. The front-illuminated CMOS image sensor according to claim 1, wherein: the inner bottom surface of the frame body (2) is fixedly connected with a main board (3), and a display screen (4) is arranged on the front surface of the main board (3).
5. The front-illuminated CMOS image sensor according to claim 4, wherein: the inside wall and the wiring strip (5) fixed connection of framework (2) are in the same place, mainboard (3) and wiring strip (5) electric connection are in the same place.
6. The front-illuminated CMOS image sensor according to claim 1, wherein: the surface of the mounting plate (1) and the four corners of the mounting plate (1) are provided with mounting holes (17).
7. The front-illuminated CMOS image sensor according to claim 1, wherein: the frame body (2) is located on the front face of the mounting plate (1), and the dustproof net (7) is located on the back face of the mounting plate (1).
8. The front-illuminated CMOS image sensor according to claim 1, wherein: the cross-sectional shape of connecting cylinder (16) is "T" shape, connector (14) and connecting cylinder (16) embedded connection are in the same place.
CN202121065604.6U 2021-05-18 2021-05-18 Front-illuminated CMOS image sensor Active CN214542240U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121065604.6U CN214542240U (en) 2021-05-18 2021-05-18 Front-illuminated CMOS image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121065604.6U CN214542240U (en) 2021-05-18 2021-05-18 Front-illuminated CMOS image sensor

Publications (1)

Publication Number Publication Date
CN214542240U true CN214542240U (en) 2021-10-29

Family

ID=78283854

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121065604.6U Active CN214542240U (en) 2021-05-18 2021-05-18 Front-illuminated CMOS image sensor

Country Status (1)

Country Link
CN (1) CN214542240U (en)

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