CN214510812U - Heat radiation structure and cooking utensil - Google Patents
Heat radiation structure and cooking utensil Download PDFInfo
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- CN214510812U CN214510812U CN202023340630.3U CN202023340630U CN214510812U CN 214510812 U CN214510812 U CN 214510812U CN 202023340630 U CN202023340630 U CN 202023340630U CN 214510812 U CN214510812 U CN 214510812U
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Abstract
The utility model provides a heat radiation structure and cooking utensil. Wherein, heat radiation structure includes: the air conditioner comprises a shell, a first air passing port and a second air passing port are arranged on the shell; the heat transfer structure is arranged on the shell, a first end of the heat transfer structure is positioned outside the shell and is suitable for being matched with the structure to be radiated, and a second end of the heat transfer structure is positioned in the shell; the heat transfer semiconductor is arranged in the shell and positioned between the first air passing opening and the second air passing opening, the first end of the heat transfer semiconductor is matched with the second end of the heat transfer structure, and the second end of the heat transfer semiconductor forms a heat dissipation end; and the fan is arranged at the first air passing opening and/or the second air passing opening. The technical scheme of the utility model the cooling rate of the cooling structure of the electric pressure cooker among the prior art defect slower has been solved.
Description
Technical Field
The utility model relates to a small household electrical appliances technical field, concretely relates to heat radiation structure and cooking utensil.
Background
The electric pressure cooker is a common household appliance. The existing electric pressure cooker has a quick cooking function, and the principle of the electric pressure cooker is that food is pressurized in a sealing manner, so that the cooking temperature is improved, and the effect of shortening the cooking time is achieved, and therefore, the pressure cooker becomes an indispensable cooking appliance for modern fast-paced life. However, after the pressure cooking operation is finished, since the pressure in the cooker is higher than the atmospheric pressure, the user cannot open the cover immediately to take out food, especially soup, fluid or viscous food, and a long waiting time is needed for natural cooling in order to prevent overflow and cannot directly discharge air to carry out quick cooling. For example, when cooking porridge, the cooking time is about 35 minutes, but the natural cooling time after cooking is as high as 25 minutes, so that the user experience is poor.
In order to solve the technical problems, a cooling structure for cooling the cooking cavity is arranged in some electric pressure cookers in the prior art, but the existing cooling structure of the electric pressure cooker has the problem of insufficient cooling speed, so that the user experience is not obviously improved.
SUMMERY OF THE UTILITY MODEL
Therefore, the to-be-solved technical problem of the present invention is to overcome the slow cooling speed of the cooling structure of the electric pressure cooker in the prior art, thereby providing a heat dissipation structure and a cooking appliance.
In order to solve the technical problem, the utility model provides a heat radiation structure, include: the air conditioner comprises a shell, a first air passing port and a second air passing port are arranged on the shell; the heat transfer structure is arranged on the shell, a first end of the heat transfer structure is positioned outside the shell and is suitable for being matched with the structure to be radiated, and a second end of the heat transfer structure is positioned in the shell; the heat transfer semiconductor is arranged in the shell and positioned between the first air passing opening and the second air passing opening, the first end of the heat transfer semiconductor is matched with the second end of the heat transfer structure, and the second end of the heat transfer semiconductor forms a heat dissipation end; and the fan is arranged at the first air passing opening and/or the second air passing opening.
Optionally, the casing includes an annular side wall, and a top wall and a bottom wall disposed on upper and lower sides of the annular side wall, wherein the heat transfer structure is disposed on the bottom wall, the first air passing opening is disposed on the top wall, and the second air passing opening is disposed on the annular side wall.
Optionally, the first air passing opening is formed in the middle of the top wall, the plurality of second air passing openings are formed, and the plurality of second air passing openings are arranged at intervals along the circumferential direction of the annular side wall.
Optionally, a fan is disposed at the first air passing opening, the fan configured to be capable of drawing air and blowing air.
Optionally, the second end of the heat transfer semiconductor extends below the first air scoop.
Optionally, the number of the heat transfer structures is multiple, the multiple heat transfer structures are arranged at intervals along the circumferential direction of the first air passing opening, the number of the heat transfer semiconductors is multiple, and the multiple heat transfer structures and the multiple heat transfer semiconductors are arranged in one-to-one correspondence.
Optionally, the heat transfer semiconductor is in a fan-shaped structure.
Alternatively, the heat transfer semiconductor is a multilayer structure stacked one on top of another.
Optionally, the heat transfer structure includes a connecting rod, and a first heat transfer head and a second heat transfer head disposed at two ends of the connecting rod, the connecting rod passes through the housing, the first heat transfer head is located in the housing, and the second heat transfer head is located outside the housing.
Optionally, the first air inlet and the second air inlet are switchable structures.
Optionally, the heat radiation structure further comprises an annular baffle plate rotatably arranged on the inner side of the annular side wall, and an avoiding opening matched with the second air passing opening is formed in the annular baffle plate.
The utility model also provides a cooking utensil, include: a pot body having a cooking cavity; the pot cover is arranged on the pot cover; the heat dissipation structure is arranged on the pot cover and is the heat dissipation structure, and when the pot cover is closed relative to the pot body, the first end of the heat transfer structure is located in the cooking cavity.
Optionally, the outer shell of the lid forms the housing.
Optionally, the cooking appliance is an electric pressure cooker or an electric rice cooker.
The utility model discloses technical scheme has following advantage:
utilize the technical scheme of the utility model, heat radiation structure during operation, heat transfer structure transmit the heat to the second end from first end, and the fan starts and then makes the air current cross the wind gap from first wind gap or second and gets into, and the air current flows and takes away the heat of heat transfer semiconductor second end to realize the heat transfer, and continuously reduce and treat heat radiation structure's temperature. When the heat transfer coefficient of the heat transfer semiconductor is reduced, the fan is controlled to enable airflow to flow in the opposite direction, and meanwhile the current direction of the heat transfer semiconductor is changed, so that the heat transfer coefficient is improved again. The structure can ensure that the heat transfer semiconductor is always in an efficient heat transfer state, and the effect of rapid heat dissipation is realized. Therefore, the technical scheme of the utility model solves the problem of slow cooling speed of the cooling structure of the electric pressure cooker in the prior art.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 shows a schematic perspective view of a heat dissipation structure of the present invention;
FIG. 2 shows a schematic cross-sectional view of the heat dissipation structure of FIG. 1;
FIG. 3 is a schematic view of the heat transfer semiconductor of the heat dissipation structure of FIG. 1;
FIG. 4 shows a schematic side view of the heat dissipation structure of FIG. 1;
FIG. 5 shows an enlarged schematic view at A in FIG. 4;
fig. 6 is a schematic flow chart illustrating a control method of the cooking appliance of the present invention; and
fig. 7 shows a flow chart of step S1 of the control method in fig. 6.
Description of reference numerals:
10. a housing; 11. a first air passing opening; 12. a second air passing opening; 13. an annular sidewall; 14. a top wall; 15. a bottom wall; 20. a heat transfer structure; 21. a connecting rod; 22. a first heat transfer head; 23. a second heat transfer head; 30. a heat transfer semiconductor; 40. a fan; 50. an annular baffle; 51. avoiding the mouth.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
As shown in fig. 1 and 2, a heat dissipation structure in the present embodiment includes a case 10, a heat transfer structure 20, a heat transfer semiconductor 30, and a fan 40. Wherein, the casing 10 is provided with a first air inlet 11 and a second air inlet 12 on the casing 10. The heat transfer structure 20 is disposed on the housing 10, a first end of the heat transfer structure 20 is located outside the housing 10 and is adapted to cooperate with a structure to be heat dissipated, and a second end of the heat transfer structure 20 is located inside the housing 10. The heat transfer semiconductor 30 is disposed in the case 10 between the first air-passing opening 11 and the second air-passing opening 12, a first end of the heat transfer semiconductor 30 is fitted with a second end of the heat transfer structure 20, and the second end of the heat transfer semiconductor 30 forms a heat radiation end. The fan 40 is disposed at the first air-passing port 11 and/or the second air-passing port 12.
Utilize the technical scheme of this embodiment, heat radiation structure during operation, heat transfer structure 20 transmits the heat to the second end from first end, and fan 40 starts and then makes the air current get into from first wind gap 11 or second wind gap 12 of crossing, and the air current flows and takes away the heat of heat transfer semiconductor 30 second end to realize the heat transfer, and continuously reduce and wait heat radiation structure's temperature. When the heat transfer coefficient of the heat transfer semiconductor 30 is decreased, the fan 40 is controlled and the air current flows in the opposite direction while changing the current direction of the heat transfer semiconductor 30, thereby increasing the heat transfer coefficient again. The structure can ensure that the heat transfer semiconductor is always in an efficient heat transfer state, and the effect of rapid heat dissipation is realized. Therefore, the technical scheme of the embodiment overcomes the defect that the cooling speed of the cooling structure of the electric pressure cooker in the prior art is slow.
The heat transfer semiconductor in this embodiment has a characteristic that heat can be transferred between the first end and the second end of the heat transfer semiconductor 30 after the heat transfer semiconductor 30 is energized. Specifically, when the semiconductor is powered on, electrons are emitted from the negative pole (-), first pass through the P-type semiconductor to absorb heat, and then pass to the N-type semiconductor to emit heat again. Every time the NP module passes, heat is transferred from one side to the other side, so that the heat transfer effect is realized. For example, in the present embodiment, the first end of the heat transfer semiconductor 30 is engaged with the heat transfer structure 20 having a higher temperature, so that heat can be transferred from the first end to the second end of the heat transfer semiconductor 30.
It should be noted that in the present embodiment, the flow direction of the air flow can be changed by controlling the operation of the fan 40. For example, the airflow may be made to enter from the first air passing opening 11 and be exhausted from the second air passing opening 12, where the first air passing opening 11 is an air inlet and the second air passing opening 12 is an air outlet; the air flow can enter from the second air passing opening 12 and be exhausted from the first air passing opening 11, and at this time, the first air passing opening 11 is an air outlet, and the second air passing opening 12 is an air inlet. Further, when the fan 40 can draw air and blow air, that is, the fan 40 can discharge air in two directions, only one fan is arranged at the first air passing opening 11 or the second air passing opening 12. When the fan 40 only has one-way air outlet, one fan 40 is arranged at each of the first air passing opening 11 and the second air passing opening 12.
As shown in fig. 1 and 2, in the present embodiment, the housing 10 includes an annular side wall 13, and a top wall 14 and a bottom wall 15 disposed on upper and lower sides of the annular side wall 13. Wherein the heat transfer structure 20 is arranged on the bottom wall 15, the first air passing opening 11 is arranged on the top wall 14, and the second air passing opening 12 is arranged on the annular side wall 13. Particularly, above-mentioned structure can be so that heat radiation structure can realize lateral part air inlet and upper portion air-out, perhaps realizes upper portion air inlet and lateral part air-out.
As shown in fig. 2, in the solution of the present embodiment, the first air passing opening 11 is disposed in the middle of the top wall 14, the plurality of second air passing openings 12 are provided, and the plurality of second air passing openings 12 are spaced apart along the circumferential direction of the annular side wall 13. Specifically, the plurality of second air passing openings 12 may realize air inlet or outlet in multiple directions in the circumferential direction, thereby improving the heat dissipation efficiency of the heat transfer semiconductor 30. Preferably, four second air passing openings 12 are provided in the present embodiment, and the adjacent second air passing openings 12 are ninety degrees in the circumferential direction.
As shown in fig. 2, in the present embodiment, the fan 40 is disposed at the first air passing opening 11, and the fan 40 is configured to draw air and blow air. As described above, when the fan 40 is a bidirectional air outlet, one fan 40 may be disposed at the first air passing opening 11 and the second air passing opening 12. In this embodiment, a fan 40 is provided at the first air passing opening 11. When the fan 40 draws air, the air flow enters from the second air passing opening 12 and flows out from the first air passing opening 11. When the blower 40 blows air, the air flow enters from the first air passing port 11 and flows out from the second air passing port 12.
As shown in fig. 2 and 3, in the solution of the present embodiment, the second end of the heat transfer semiconductor 30 extends to below the first air vent 11. Specifically, the first end of the heat transfer semiconductor 30 is fitted with the second end of the heat transfer structure 20, and the second end extends to below the first air-passing port 11, so that the heat of the heat transfer structure 20 can be transferred to below the first air-passing port 11 through the heat transfer semiconductor 30. When the fan 40 is activated, it may bring the air flow to take away the heat at the second end of the heat transfer semiconductor 30, thereby achieving heat exchange.
As shown in fig. 2 and 3, in the technical solution of the present embodiment, the number of the heat transfer structures 20 is multiple, the plurality of heat transfer structures 20 are arranged at intervals along the circumferential direction of the first air passing opening 11, the number of the heat transfer semiconductors 30 is multiple, and the plurality of heat transfer structures 20 and the plurality of heat transfer semiconductors 30 are arranged in one-to-one correspondence. Specifically, the number of the heat transfer structures 20 is four in the present embodiment, and the structures of the four heat transfer structures 20 are the same. Correspondingly, there are also four thermal semiconductors 30, and one thermal semiconductor 30 is provided at the second end of each thermal structure 20 to mate with it. The four heat transfer semiconductors 30 are radially disposed with respect to the first air passing opening 11. The structure can accelerate the heat dissipation efficiency of the heat dissipation structure.
As shown in fig. 3, in the present embodiment, the heat transfer semiconductor 30 has a fan-shaped structure. Specifically, the outer arc-shaped surface of the heat transfer semiconductor 30 is matched with the heat transfer structure 20, and the inner arc-shaped surface extends to below the first air passing opening 11. The four heat transfer semiconductors 30 form a generally circular structure. The above structure can greatly increase the heat transfer area of the heat transfer semiconductor 30, thereby improving the heat dissipation efficiency.
As shown in fig. 3, in the present embodiment, the heat transfer semiconductor 30 has a multilayer structure stacked one on top of another. Specifically, the heat transfer semiconductors 30 are in a sheet structure, and each of the heat transfer semiconductors 30 coupled to the heat transfer structure 20 has four layers stacked one on another, thereby increasing the heat transfer area of the heat transfer semiconductors 30 and improving heat dissipation efficiency.
As shown in fig. 2, in the solution of the present embodiment, the heat transfer structure 20 includes a connecting rod 21, and a first heat transfer head 22 and a second heat transfer head 23 disposed at two ends of the connecting rod 21, the connecting rod 21 passes through the casing 10, the first heat transfer head 22 is located inside the casing 10, and the second heat transfer head 23 is located outside the casing 10. Specifically, the first heat transfer head 22 and the second heat transfer head 23 have a flat structure, and thus the cross-section of the heat transfer structure 20 has an "I" shape. Preferably, both the first heat transfer head 22 and the second heat transfer head 23 are of circular configuration.
Preferably, in the technical solution of this embodiment, the first air inlet 11 and the second air inlet 12 are switchable structures. Specifically, the switchable structure means that the first air passing opening 11 and the second air passing opening 12 can be opened or closed by a baffle, a grill, or the like. Specifically, when the heat dissipation structure is not operated, the first air passing port 11 and the second air passing port 12 are closed, thereby preventing foreign substances such as dust, crawlers, and the like from entering. When the heat dissipation structure operates, the first air passing port 11 and the second air passing port 12 are opened, thereby ensuring that the air flow can circulate.
As shown in fig. 2, 4 and 5, in the technical solution of the present embodiment, the heat dissipation structure further includes an annular baffle 50 rotatably disposed inside the annular sidewall 13, and the annular baffle 50 is provided with an escape opening 51 adapted to the second air passing opening 12. Specifically, when the annular baffle 50 rotates, the escape opening 51 may be misaligned, overlapped, or partially overlapped with the second air passing opening 12. When the escape opening 51 and the second air passing opening 12 are misaligned, the second air passing opening 12 is closed. When the escape opening 51 coincides with the second air passing opening 12, the second air passing opening 12 is opened. Accordingly, by changing the angle at which the ring baffle 50 is rotated, the degree to which the second air passing hole 12 is opened can be adjusted.
The embodiment also provides a cooking appliance which comprises a pot body, a pot cover and a heat dissipation structure. Wherein, the pot body has the culinary art cavity, and the pot lid sets up on the pot lid, and heat radiation structure is foretell heat radiation structure. Further, when the lid is closed with respect to the body, the first end of the heat transfer structure 20 is located within the cooking cavity. Particularly, heat radiation structure is used for realizing cooking utensil culinary art back fast step-down effect of uncapping. After the culinary art is finished, the temperature in the culinary art cavity is higher, the pressure is higher, leads to the user to uncap fast. In the present embodiment, after the cooking is finished, the heat transfer structure 20 of the heat dissipation structure transfers the heat in the cooking cavity from the first end to the second end. At this time, the heat transfer semiconductor 30 is powered on, and the fan 40 is started, the heat transfer semiconductor 30 transfers heat from the second end of the heat transfer structure 20 to the position below the second air passing opening 12, the fan 40 starts air draft, and air flow enters from the first air passing opening 11 and flows out from the second air passing opening 12, so that heat exchange at the second end of the heat transfer structure 20 is taken away.
Preferably, the cooking appliance is an electric pressure cooker or an electric rice cooker, and the outer shell of the lid forms the housing. In particular, the cover structures of electric pressure cookers and rice cookers generally comprise an inner liner and a face cover, which form a casing. The housing 10 described above comprises annular side walls, a bottom wall 15 and a top wall 14, respectively, the inner lining forming the bottom wall 15, the annular side ring of the face cover forming the annular side wall 13 and the top plate of the face cover forming the top wall 14. Of course, the casing 10 may be separately provided in the pot lid as a housing structure of the heat dissipation structure.
The embodiment also provides a control method of a cooking appliance, where the cooking appliance is the above cooking appliance, and as shown in fig. 6, the control method of the embodiment includes:
step S1: after cooking is finished, the heat dissipation structure is started to dissipate heat of the cooking cavity;
step S2: and when the pressure in the cooking cavity is smaller than a first preset value, closing the heat dissipation structure.
Specifically, after cooking is finished, the pressure in the cooking cavity is large, and therefore the user cannot open the lid. At the moment, the heat dissipation structure is started to dissipate heat of the cooking cavity, so that the pressure in the cooking cavity is reduced. When the pressure in the cooking cavity is smaller than the first preset value, the user can open the cover at the moment, and the heat dissipation structure is closed at the moment.
It should be noted that the pressure in the cooking cavity may be measured by a pressure sensor, and therefore, the obtaining method is not described herein.
As shown in fig. 7, further, step S1 includes:
step S11: passing a current through the heat transfer semiconductor 30, controlling the fan 40 and making the air flow in from the second air passing opening 12 and flow out from the first air passing opening 11;
step S12: acquiring a first temperature difference between the first end of the heat-transfer semiconductor 30 and the first air passing opening 11, and executing step S13 when the first temperature difference is smaller than a second preset value;
step S13: changing the current direction of the heat transfer semiconductor 30, controlling the fan 40 and making the air flow in from the first air passing opening 11 and flow out from the second air passing opening 12;
step S14: a second temperature difference between the first end of the heat-transfer semiconductor 30 and the second air passing hole 12 is obtained, and when the second temperature difference is smaller than a third preset value, step S11 is performed.
In step S11, after the heat-transfer semiconductor 30 is powered on, the heat at the first end can be transported to the second end, and meanwhile, the fan 40 starts to draw air, at this time, air is introduced into the second air inlet 12, and air is discharged from the first air inlet 11.
In steps S12 and S13, when the first temperature difference is smaller than the second preset value, it indicates that the heat transfer coefficient of the heat transfer semiconductor 30 becomes lower, at this time, the blower 40 is switched to blowing, at this time, air is introduced into the first air passing opening 11, and air is discharged from the second air passing opening 12. Meanwhile, the current flowing into the heat transfer semiconductor 30 is changed in the opposite direction, that is, the positive and negative electrodes of the heat transfer semiconductor 30 are reversed, and heat is conducted from the second end to the first end of the heat transfer semiconductor 30, so that the heat transfer coefficient of the surface of the heat transfer semiconductor 30 is increased.
In step S14, when the second temperature difference is smaller than the third preset value, which indicates that the heat transfer coefficient of the heat transfer semiconductor 30 is decreased again, the process returns to step S11, i.e., the current is reversed again, and the fan 40 is turned into draft. The steps S11 to S14 are thus circulated, so that the heat transfer coefficient of the heat transfer semiconductor 30 is ensured, the heat dissipation is accelerated, and the purpose of rapid pressure reduction is achieved.
In step S11 and step S13, the flow of current applied to the heat-transfer semiconductor 30 is reversed.
It should be noted that the first temperature difference and the second temperature difference can be measured by arranging temperature sensors at the first air passing port 11, the second air passing port 12 and the first end of the heat transfer semiconductor 30.
In the process of the loop of steps S11 to S14, as long as the pressure in the cooking cavity is detected to be less than the first preset value, the loop is skipped, that is, the heat dissipation structure is closed.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (14)
1. A heat dissipation structure, comprising:
the air conditioner comprises a shell (10), wherein a first air passing opening (11) and a second air passing opening (12) are formed in the shell (10);
the heat transfer structure (20) is arranged on the shell (10), a first end of the heat transfer structure (20) is positioned outside the shell (10) and is suitable for being matched with a structure to be radiated, and a second end of the heat transfer structure (20) is positioned in the shell (10);
the heat transfer semiconductor (30) is arranged in the shell (10) and is positioned between the first air passing opening (11) and the second air passing opening (12), the first end of the heat transfer semiconductor (30) is matched with the second end of the heat transfer structure (20), and the second end of the heat transfer semiconductor (30) forms a heat dissipation end;
a fan (40) disposed at the first air passing opening (11) and/or the second air passing opening (12).
2. The heat dissipation structure according to claim 1, wherein the housing (10) includes an annular side wall (13), and a top wall (14) and a bottom wall (15) provided on both upper and lower sides of the annular side wall (13), wherein the heat transfer structure (20) is provided on the bottom wall (15), the first air-passing opening (11) is provided on the top wall (14), and the second air-passing opening (12) is provided on the annular side wall (13).
3. The heat dissipation structure according to claim 2, wherein the first air inlet (11) is provided in a middle portion of the top wall (14), the second air inlet (12) is plural, and the plural second air inlets (12) are provided at intervals in a circumferential direction of the annular side wall (13).
4. The heat dissipation structure according to claim 3, wherein the fan (40) is provided at the first air-through opening (11), the fan (40) being configured to be capable of extracting air and blowing air.
5. The heat dissipation structure according to claim 3, wherein the second end of the heat transfer semiconductor (30) extends below the first air vent (11).
6. The heat dissipation structure of claim 3, wherein the heat transfer structures (20) are plural, the plural heat transfer structures (20) are arranged at intervals along the circumferential direction of the first air passing opening (11), the plural heat transfer semiconductors (30) are provided, and the plural heat transfer structures (20) and the plural heat transfer semiconductors (30) are arranged in one-to-one correspondence.
7. The heat dissipation structure according to claim 1 or 6, wherein the heat transfer semiconductor (30) is a fan-shaped structure.
8. The heat dissipation structure according to claim 1 or 6, wherein the heat transfer semiconductor (30) is a multilayer structure stacked one on top of another.
9. The heat dissipation structure according to claim 1, wherein the heat transfer structure (20) includes a connection rod (21), and a first heat transfer head (22) and a second heat transfer head (23) provided at both ends of the connection rod (21), the connection rod (21) passing through the casing (10), the first heat transfer head (22) being located inside the casing (10), the second heat transfer head (23) being located outside the casing (10).
10. The heat dissipation structure according to claim 1, wherein the first air vent (11) and the second air vent (12) are switchable structures.
11. The heat dissipation structure of claim 2, further comprising an annular baffle (50) rotatably disposed inside the annular side wall (13), wherein an avoidance opening (51) adapted to the second air passing opening (12) is disposed on the annular baffle (50).
12. A cooking appliance, comprising:
a pot body having a cooking cavity;
the pot cover is arranged on the pot cover;
a heat dissipating structure disposed on the lid, the heat dissipating structure being as claimed in any one of claims 1 to 11, wherein the first end of the heat transfer structure (20) is located within the cooking cavity when the lid is closed relative to the pot.
13. The cooking appliance of claim 12, wherein an outer shell of the lid forms the housing.
14. The cooking appliance of claim 12, wherein the cooking appliance is an electric pressure cooker or an electric rice cooker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023340630.3U CN214510812U (en) | 2020-12-31 | 2020-12-31 | Heat radiation structure and cooking utensil |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202023340630.3U CN214510812U (en) | 2020-12-31 | 2020-12-31 | Heat radiation structure and cooking utensil |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115429103A (en) * | 2022-09-15 | 2022-12-06 | 珠海格力电器股份有限公司 | Pot cover assembly and cooking utensil with same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115429103A (en) * | 2022-09-15 | 2022-12-06 | 珠海格力电器股份有限公司 | Pot cover assembly and cooking utensil with same |
| CN115429103B (en) * | 2022-09-15 | 2023-10-24 | 珠海格力电器股份有限公司 | Pot cover assembly and cooking utensil with same |
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