CN214503693U - Electrode device for testing surface circuit of ceramic substrate of thermal printing head - Google Patents

Abstract

The utility model relates to an electrode device for testing a circuit on the surface of a ceramic substrate of a thermal printing head, which has reasonable structure and simple and convenient operation and can ensure that a part to be tested is quickly and reliably connected with a detection device, and is characterized in that a vertical plate is arranged in a supporting mechanism, a pin supporting sleeve is fixed at the inner side of the vertical plate, a tensioning spring is sleeved at the outer side of a pin and penetrates along the lower end of the pin supporting sleeve and is connected with a common electrode plate at the upper part of the pin supporting sleeve, and the tensioning spring is compressed between the lower end part of the pin and the lower end surface of the pin supporting sleeve; the through-hole is still seted up to the downside of riser, is equipped with the handle support pivot in the through-hole, and the electrode lifts the handle middle part and links to each other with the handle support pivot through the shaft hole, and the electrode lifts the bottom contact of handle front end and the inboard pin of riser, and the rear end that the handle was lifted to the electrode is located the riser outside, compared with the prior art, the utility model, satisfied the test under the present mode of production, had the advantage that the dismouting is simple and convenient, electric connection is reliable etc. is showing.

Description

Electrode device for testing surface circuit of ceramic substrate of thermal printing head

The technical field is as follows:

the utility model relates to a thermal print head makes technical field, specific thermal print head ceramic substrate surface circuit test that says so is rational in infrastructure, easy and simple to handle, can guarantee that the part that awaits measuring is quick, reliably is connected with check out test set uses electrode assembly.

Background art:

in the production process of the thermal printing head, a product circuit structure is formed on the surface of the ceramic substrate by a photoetching technology, and the component needs to be subjected to quality testing after molding and before the whole machine is assembled so as to find out a circuit with poor photoetching and repair the circuit. In the traditional photoetching circuit, each unit is provided with a COM electrode loop, a COM electrode does not need to be additionally arranged, along with product miniaturization and technology upgrading, the COM electrode of each testing unit cannot be wired, an original testing tool cannot meet the testing requirements of the components, and the production and testing work is hindered.

The invention content is as follows:

the utility model discloses shortcoming and not enough to exist among the prior art, provide a rational in infrastructure, easy and simple to handle, can guarantee the quick, the reliable electrode assembly for circuit test of temperature sensing printing head ceramic substrate surface that is connected of part to be measured and check out test set.

The utility model discloses a following measure arrives greatly:

an electrode device for testing a circuit on the surface of a ceramic substrate of a thermal printing head is provided with a support mechanism and a common electrode plate, and is characterized in that a vertical plate is arranged in the support mechanism, a pin support sleeve is fixed on the inner side of the vertical plate, a tension spring is sleeved on the outer side of a pin and penetrates along the lower end of the pin support sleeve and is connected with the common electrode plate on the upper part of the pin support sleeve, and the tension spring is tightly pressed between the lower end part of the pin and the lower end face of the pin support sleeve; the lower side of the vertical plate is further provided with a through hole, a handle supporting rotating shaft is arranged in the through hole, the middle part of the electrode lifting handle is connected with the handle supporting rotating shaft through a shaft hole, the front end of the electrode lifting handle is in contact with the bottom end of the pin on the inner side of the vertical plate, and the rear end of the electrode lifting handle is located on the outer side of the vertical plate.

Public electrode slice is including the COM1 electrode slice that is used for accomplishing ceramic substrate surface circuit function test and the COM2 electrode slice that is used for accomplishing the circuit conduction test, and is further, COM1 electrode slice and COM2 electrode slice are connected with two pin one-to-ones respectively, the inboard correspondence of riser is equipped with two pins and supports the cover, a tensioning spring is established to every pin outside cover respectively, thereby accomplish COM1 electrode slice and COM2 electrode slice and compress tightly on the ceramic substrate surface circuit that awaits measuring, and is further, lift up handle front end area or set up two sets of electrodes through the increase electrode and lift up the handle, the completion is to lifting up of COM1 electrode slice downside pin and COM2 electrode slice downside pin.

Riser upside is equipped with the mount, and the mount adopts the level to set up ] form, is convenient for meet with test table face one end, during the use, fixes this device in test table face one end through the mount, and the back that finishes is tested, puts aside this device through demolising the mount.

The thickness range of the public electrode plate is 0.4-0.6mm, so as to ensure that the height of the electrode is not more than 1.0 mm.

The common electrode plate in the utility model comprises a COM1 electrode plate and a COM2 electrode plate, and the common electrode plate is used for being connected with the electrode of the circuit on the surface of the ceramic substrate to form a loop for testing; the electrode plate is provided with a pin hole and connected with the upper end of a pin, the main body of the pin is positioned in a pin support sleeve, a tension spring is arranged between the lower end of the pin and the bottom end face of the pin support sleeve, and the COM electrode plate is in close contact with a circuit on the surface of the ceramic substrate to be tested by utilizing the elasticity of the spring, so that the connection state of the whole test circuit is ensured; the whole device is arranged at one end of a workbench of a ceramic substrate through a fixing frame, and the fixing frame is provided with screw holes or bolt holes according to the connection and fixation requirements; the front end of the electrode lifting handle is in contact with the lower end of the pin, when the ceramic substrate needs to be replaced, the rear end of the handle on the outer side of the vertical plate is pressed down by a hand, the front end of the handle tilts around the shaft, the lower end of the pin is lifted, the COM electrode plate is lifted along with the lifting of the front end of the handle, and is separated from a circuit on the surface of the ceramic substrate which is in contact, so that the ceramic substrate is replaced.

Compared with the prior art, the utility model, satisfied test work under the present mode of production, had the advantage that the dismouting is simple and convenient, electrical connection is reliable etc. is showing.

Description of the drawings:

fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is another angular view of fig. 1.

Fig. 3 is a schematic structural diagram of the middle pin and the common electrode plate of the present invention.

Fig. 4 is a schematic diagram of an embodiment of the present invention.

Reference numerals: the electrode plate comprises a COM1 electrode plate 1, a COM2 electrode plate 2, a fixing frame 3, a vertical plate 4, an electrode lifting handle 5, a pin 6, a spring 7, a pin support sleeve 8 and a handle support rotating shaft 9.

The specific implementation mode is as follows:

the present invention will be further described with reference to the accompanying drawings and examples.

As shown in the attached drawings, the utility model provides an electrode device for testing a circuit on the surface of a ceramic substrate of a thermal printing head, which is provided with a supporting mechanism and a common electrode plate, wherein a vertical plate 4 is arranged in the supporting mechanism, a pin supporting sleeve 8 is fixed at the inner side of the vertical plate 4, a tension spring 7 is sleeved at the outer side of a pin 6, and penetrates along the lower end of the pin supporting sleeve 8 and is connected with the common electrode plate at the upper part of the pin supporting sleeve 8, and the tension spring 7 is tightly pressed between the lower end part of the pin 6 and the lower end surface of the pin supporting sleeve 8; the lower side of the vertical plate 4 is further provided with a through hole, a handle supporting rotating shaft 9 is arranged in the through hole, the middle of the electrode lifting handle 5 is connected with the handle supporting rotating shaft 9 through a shaft hole, the front end 5 of the electrode lifting handle is in contact with the bottom end of the pin 6 on the inner side of the vertical plate 4, and the rear end of the electrode lifting handle 5 is located on the outer side of the vertical plate 4.

Public electrode slice is including COM1 electrode slice 1 that is used for accomplishing ceramic substrate surface circuit function test and the COM2 electrode slice 2 that is used for accomplishing the circuit conduction test, it is further, COM1 electrode slice 1 is connected with two 6 one-to-one of pins with COM2 electrode slice 2 respectively, the inboard correspondence of riser 4 is equipped with two pins and supports cover 8, a tensioning spring 7 is established to 6 outside covers respectively of every pin, thereby compress tightly COM1 electrode slice 1 and COM2 electrode slice 2 on the ceramic substrate surface circuit that awaits measuring, it is further, lift up handle 5 front end area or set up two sets of electrodes through the increase electrode and lift up handle 5, accomplish lifting up to COM1 electrode slice 1 downside pin and COM2 electrode slice 2 downside pin.

4 upside of riser is equipped with mount 3, and mount 3 adopts the level to set up ] column structure, is convenient for meet with test table face one end, during the use, fixes this device in test table face one end through mount 3, and the back that finishes in the test, puts aside this device through demolising mount 3.

The thickness range of the public electrode plate is 0.4-0.6mm, so as to ensure that the height of the electrode is not more than 1.0 mm.

Example 1:

as shown in fig. 4, the present example provides an electrode device for testing a circuit on a surface of a ceramic substrate of a thermal printhead, which is provided with a supporting mechanism and a common electrode plate, wherein the supporting mechanism is provided with a vertical plate 4, a pin supporting sleeve 8 is fixed on the inner side of the vertical plate 4, a tension spring 7 is sleeved on the outer side of a pin 6, and penetrates along the lower end of the pin supporting sleeve 8 and is connected with the common electrode plate on the upper part of the pin supporting sleeve 8, and the tension spring 7 is tightly pressed between the lower end of the pin 6 and the lower end surface of the pin supporting sleeve 8; the lower side of the vertical plate 4 is also provided with a through hole, a handle supporting rotating shaft 9 is arranged in the through hole, the middle part of the electrode lifting handle 5 is connected with the handle supporting rotating shaft 9 through a shaft hole, the front end 5 of the electrode lifting handle is contacted with the bottom end of a pin 6 at the inner side of the vertical plate 4, and the rear end of the electrode lifting handle 5 is positioned at the outer side of the vertical plate 4;

the common electrode plate comprises a COM1 electrode plate 1 for completing a circuit function test of the surface of the ceramic substrate and a COM2 electrode plate 2 for completing a circuit conduction test, further, the COM1 electrode plate 1 and the COM2 electrode plate 2 are respectively connected with two pins 6 in a one-to-one correspondence manner, two pin support sleeves 8 are correspondingly arranged on the inner side of a vertical plate 4, a tensioning spring 7 is respectively sleeved on the outer side of each pin 6, so that the COM1 electrode plate 1 and the COM2 electrode plate 2 are pressed on the surface circuit of the ceramic substrate to be tested, and the lifting of the pins on the lower side of the COM1 electrode plate 1 and the pins on the lower side of the COM2 electrode plate 2 is completed by arranging two groups of electrode lifting handles 5; 4 upside of riser is equipped with mount 3, and mount 3 adopts the level to set up ] column structure, is convenient for meet with test table face one end, during the use, fixes this device in test table face one end through mount 3, and the back that finishes in the test, puts aside this device through demolising mount 3.

The COM electrodes 1 and 2 are connected with the COM electrodes of the circuit on the surface of the ceramic substrate to form a loop for testing; an M3 screw hole is arranged on the COM electrode plate and connected through a pin, and a spring 7 is sleeved outside the pin 6, so that the COM electrode can be in contact with a circuit on the surface of the ceramic substrate, and the connection state of the whole test circuit is ensured; the COM electrode is fixed on a workbench for placing the ceramic substrate by a fixing frame 3, so that the electrode can work normally; the electrode lifting handle 5 is convenient for workers to operate, the electrode lifting handle 5 is in contact with the lower end of the tensioning pin 6, when the ceramic substrate needs to be replaced, the lifting handle 5 is pressed down by a hand, the lifting handle 5 is rotationally acted on the lower end of the tensioning pin 6 through a rotating pin, the COM electrode rises along with the lifting handle 5 after acting on the COM electrode, and therefore the COM electrode can be lifted to be separated from a circuit in the contacted ceramic substrate, and then the replacement of the ceramic substrate is realized; the device's use has satisfied test work under the present mode of production, and is convenient succinct, the safety and stability the utility model discloses compare with prior art, satisfied test work under the present mode of production, have the advantage that the dismouting is simple and convenient, electric connection is showing such as reliable.

Claims (5)

1. An electrode device for testing a circuit on the surface of a ceramic substrate of a thermal printing head is provided with a support mechanism and a common electrode plate, and is characterized in that a vertical plate is arranged in the support mechanism, a pin support sleeve is fixed on the inner side of the vertical plate, a tension spring is sleeved on the outer side of a pin and penetrates along the lower end of the pin support sleeve and is connected with the common electrode plate on the upper part of the pin support sleeve, and the tension spring is tightly pressed between the lower end part of the pin and the lower end face of the pin support sleeve; the lower side of the vertical plate is further provided with a through hole, a handle supporting rotating shaft is arranged in the through hole, the middle part of the electrode lifting handle is connected with the handle supporting rotating shaft through a shaft hole, the front end of the electrode lifting handle is in contact with the bottom end of the pin on the inner side of the vertical plate, and the rear end of the electrode lifting handle is located on the outer side of the vertical plate.

2. The electrode assembly for testing the surface circuit of the ceramic substrate of the thermal printing head according to claim 1, wherein the common electrode plate comprises a COM1 electrode plate for completing the functional test of the surface circuit of the ceramic substrate and a COM2 electrode plate for completing the circuit conduction test.

3. The electrode device for testing the circuit on the surface of the ceramic substrate of the thermal printing head according to claim 2, wherein the COM1 electrode plate and the COM2 electrode plate are respectively connected with two pins in a one-to-one correspondence manner, two pin support sleeves are correspondingly arranged on the inner sides of the vertical plates, a tension spring is respectively sleeved on the outer side of each pin, so that the COM1 electrode plate and the COM2 electrode plate are pressed on the circuit on the surface of the ceramic substrate to be tested, and the lifting of the pins on the lower side of the COM1 electrode plate and the pins on the lower side of the COM2 electrode plate is completed by increasing the area of the front end of the electrode lifting handles or arranging two groups of electrode lifting handles.

4. The electrode assembly for testing the circuit on the surface of the ceramic substrate of the thermal printing head according to claim 1, wherein the vertical plate is provided with a fixing frame on the upper side, and the fixing frame is horizontally arranged.

5. The electrode assembly for testing the surface circuit of the ceramic substrate of the thermal printing head according to claim 1, wherein the thickness of the common electrode plate is in a range of 0.4-0.6mm so as to ensure that the height of the electrode is not more than 1.0 mm.

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