CN214502676U - Non-contact infrared temperature measurement module and temperature measurement equipment - Google Patents

Non-contact infrared temperature measurement module and temperature measurement equipment Download PDF

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Publication number
CN214502676U
CN214502676U CN202023252784.7U CN202023252784U CN214502676U CN 214502676 U CN214502676 U CN 214502676U CN 202023252784 U CN202023252784 U CN 202023252784U CN 214502676 U CN214502676 U CN 214502676U
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lens
infrared temperature
temperature measurement
measurement module
cover
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林文煌
罗潺涛
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Shenzhen Dimi Technology Co Ltd
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Shenzhen Dimi Technology Co Ltd
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Abstract

The application discloses infrared temperature measurement module of non-contact and temperature measurement equipment includes: an infrared temperature sensor; the lens cone structure cover is covered on the infrared temperature sensor; a lens mounted on the barrel structure cover; the lens is a plano-convex silicon lens which is embedded at one end of the lens cone structure cover; the plane of the plano-convex silicon lens faces the upper end of the lens cone structure cover and is flush with the upper end face of the lens cone structure cover. The plano-convex silicon lens of the utility model can play the roles of filtering and converging parallel light, so that the temperature measurement module can better collect light, and a longer test distance is reached; the plane is placed outwards and can be avoided lens to use surface dust accumulation for a long time or by the scratch, influences its performance, and the plane is effectual reduced the shared space of module outwards, beautified the outward appearance, and the utility model discloses an infrared temperature measurement module of non-contact simple structure, it is small.

Description

Non-contact infrared temperature measurement module and temperature measurement equipment
Technical Field
The application relates to the technical field of temperature measurement, in particular to a non-contact infrared temperature measurement module and temperature measurement equipment.
Background
The non-contact infrared temperature measurement module (also called non-contact infrared temperature measurement module) is very wide and convenient in application of life and work, and the non-contact infrared temperature measurement module on the market can obtain a temperature measurement result in a short time.
At present, the application of the infrared temperature measurement technology is more and more extensive, and the infrared temperature measurement technology plays an important role in aspects of product quality control and detection, equipment online fault diagnosis, safety protection, energy conservation and the like. In recent years, the non-contact infrared thermometer is developed rapidly in technology, the performance is improved continuously, the application range is expanded continuously, and the market share is increased year by year. Compared with a contact temperature measurement method, the infrared temperature measurement method has the advantages of fast response time, non-contact, safe use, long service life and the like.
However, the infrared temperature measurement module of non-contact of prior art structure is bulky to be unfavorable for the product miniaturization, and the infrared temperature measurement module lens of non-contact of prior art bulges the module and sets up long-time service surface and accumulates the dust easily or is scratched, influences its performance.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In order to overcome the shortcoming of test distance weak point among the prior art, the utility model provides an infrared temperature measurement module of non-contact and temperature measurement equipment, aim at solving the infrared temperature measurement module structure of non-contact of prior art volume and be unfavorable for the product miniaturization partially, and the infrared temperature measurement module lens of non-contact of prior art bulge the module and set up long-time use surface and accumulate the dust easily or by the scratch, influence the technical problem of its performance.
The technical scheme of the application is as follows:
the utility model provides an infrared temperature measurement module of non-contact, wherein, includes:
the infrared temperature sensor is used for collecting target infrared energy and processing the target infrared energy into a target temperature signal;
the lens cone structure cover is covered on the infrared temperature sensor;
a lens mounted on the lens barrel structure cover for filtering and focusing infrared rays;
the lens is a plano-convex silicon lens which is embedded at one end of the lens barrel structure cover;
plano-convex silicon lens one end is the plane, and the another side is the convex surface, plano-convex silicon lens inlay lens cone structure cover one end, and plano-convex silicon lens's convex surface orientation lens cone structure cover is inboard, plano-convex silicon lens's plane orientation lens cone structure cover upper end, with lens cone structure covers the up end and flushes.
The non-contact infrared temperature measuring module is characterized in that,
the height of the lens barrel structure cover meets the following requirements: enabling the distance between the infrared temperature sensors arranged at the two ends of the lens barrel structure cover and the lens to be smaller than the focal length of the lens; and the transmitted light is covered on four sensing points of the infrared temperature sensor.
The non-contact infrared temperature measuring module is characterized in that,
the lens barrel structure cover includes: the lens barrel comprises a hollow lens barrel body and a cover body integrally arranged at one end of the lens barrel body, the other end of the lens barrel body is used for installing the lens, and the cover body is sleeved on the infrared temperature sensor.
The non-contact infrared temperature measurement module is characterized in that the shape of the cover body is matched with that of the infrared temperature sensor, and the cross section of the lens barrel body is smaller than that of the cover body.
The non-contact infrared temperature measurement module is characterized in that the infrared temperature sensor is of a square structure, and the cover body is of a square hollow structure; the cover body is sleeved on the infrared temperature sensor, and the inner wall of the square hollow structure of the cover body is attached to the outer side edge of the infrared temperature sensor with the square structure.
The non-contact infrared temperature measurement module is characterized in that a convex ring for embedding and installing the lens is arranged at the other end of the lens barrel body, and the height of the convex ring from the upper end surface of the lens barrel body is equal to the thickness of the side edge of the lens;
the lens is a silicon lens which is embedded at one end of the lens cone structure cover;
the lens cone structure cover is an aluminum lens cone structure cover or a copper lens cone structure cover;
the central wire in the lens cone structure cover is aligned with the infrared temperature sensor.
The non-contact infrared temperature measuring module is characterized in that,
the infrared temperature sensor adopts a patch type sensor chip with the model number of MLX 90632; the infrared temperature sensor, the lens barrel structure cover and the lens are sequentially packaged together.
The non-contact infrared temperature measurement module further comprises a substrate, the infrared temperature sensor is mounted on the substrate, and the lens cone structure cover is mounted on the substrate and correspondingly covers the infrared temperature sensor.
The non-contact infrared temperature measurement module is characterized in that the length, width, height and size of the infrared temperature sensor are respectively 3mm x 3mm x 1 mm;
the length, width and height of the lens cone structure cover are respectively 3.9mm x4.5mm x3.2mm aluminum lens cone structure cover;
the length, the width and the height of the non-contact infrared temperature measurement module are respectively 17.7mm x 4.0mm x 3.7 mm.
A thermometric apparatus, comprising: the temperature measuring device comprises a temperature measuring device body and any one non-contact infrared temperature measuring module, wherein the non-contact infrared temperature measuring module is arranged on the temperature measuring device body; the temperature measuring equipment is a temperature measuring gun, a mobile phone, a watch, a bracelet, an earphone, a flat plate or a security door.
The beneficial effect of this application is: the non-contact infrared temperature measurement module and the temperature measurement equipment comprise an infrared temperature sensor, a lens cone structure cover and a lens; the lens is a plano-convex silicon lens which is embedded at one end of the lens barrel structure cover; plano-convex silicon lens one end is the plane, and the another side is the convex surface, plano-convex silicon lens inlay lens cone structure cover one end, and plano-convex silicon lens's convex surface orientation lens cone structure cover is inboard, plano-convex silicon lens's plane orientation lens cone structure cover upper end, with lens cone structure covers the up end and flushes. The plane of the plano-convex silicon lens of the utility model is placed outwards, the convex lens can play the roles of filtering and converging parallel light, and part of light needed is converged on the infrared temperature sensor, so that the temperature measurement module can better collect light, and a longer test distance is achieved; the plane is placed outwards and can be avoided lens long-time use surface dust accumulation or by the scratch, influences its performance, and the plane is effectual reduced the shared space of module outwards, beautified the outward appearance, makes it more be applicable to products such as cell-phone. And the utility model discloses an infrared temperature measurement module of non-contact simple structure, it is small, reduced the volume of the infrared temperature measurement module of non-contact greatly, be the infrared temperature measurement module of miniaturely non-contact so far, can adorn to inlay on small-size equipment such as cell-phone, wrist-watch, bracelet, earphone, use extensively. In addition, the device has good heat dissipation performance, small influence by external environment, high precision and measurement distance of 5-10 cm. Can meet the measurement requirements of different environments, and has simple structure and convenient installation.
Drawings
Fig. 1 is a schematic perspective view of a non-contact infrared temperature measurement module according to an embodiment of the present application.
Fig. 2 is an exploded view of the non-contact infrared temperature measurement module according to the embodiment of the present application.
Fig. 3 is a schematic cross-sectional structure diagram of a non-contact infrared temperature measurement module according to an embodiment of the present application.
Fig. 4 is a schematic view of an upside-down structure of the non-contact infrared temperature measurement module according to the embodiment of the present application.
Fig. 5 is a schematic view of an optical path structure of the non-contact infrared temperature measurement module according to the embodiment of the present application.
Fig. 6 is a schematic structural diagram of an infrared temperature sensor chip of the non-contact infrared temperature measurement module according to the embodiment of the present application.
Detailed Description
The application provides an infrared temperature measurement module of non-contact and temperature measurement equipment, for making the purpose, technical scheme and the effect of this application clearer, make clear more, the following refers to the attached drawing and exemplifies the example and further explains this application in detail. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The inventor researches and discovers that the infrared temperature measurement sensor is a device for measuring temperature by utilizing infrared rays, and the infrared temperature measurement sensor can be divided into two types, namely a photoelectric infrared temperature sensor and a thermoelectric infrared temperature sensor according to the measurement principle. The pyroelectric infrared temperature sensor measures absorbed infrared radiation by using the thermal effect of infrared radiation through a thermoelectric effect, a pyroelectric effect, a thermistor and the like, and indirectly measures the temperature of a radiated infrared light object.
The infrared temperature measurement principle is as follows: as long as the temperature of any object is higher than absolute zero (-273 ℃), heat radiation is emitted to the outside, the temperature of the object is different, the energy radiated by the object is also different, the wavelength of the radiation wave is also different, but the object always contains infrared radiation, the temperature of the object is below thousand ℃, and strong electromagnetic waves in the heat radiation are infrared waves, so that the surface temperature of the object can be accurately measured by measuring the infrared radiation of the object, and the objective basis of the temperature measurement of the infrared thermometer is provided.
However, the infrared temperature measurement technology in the prior art is more and more widely applied, and especially plays an important role in the aspects of product quality control and detection, online equipment fault diagnosis, safety protection, energy conservation and the like. In recent years, the non-contact infrared thermometer is developed rapidly in technology, the performance is improved continuously, the application range is expanded continuously, and the market share is increased year by year. Compared with a contact temperature measurement method, the infrared temperature measurement method has the advantages of fast response time, non-contact, safe use, long service life and the like.
However, the non-contact infrared temperature measurement module in the prior art has a large structure, a complex structure, and is not beneficial to product miniaturization and cost reduction. Accordingly, the prior art is deficient and needs improvement.
Therefore, embodiment 1 of the present application provides a non-contact infrared temperature measurement module, as shown in fig. 1 and fig. 2, in this embodiment 1, the non-contact infrared temperature measurement module 100 includes:
the infrared temperature sensor 10 is used for collecting target infrared energy and processing the target infrared energy into a target temperature signal;
the lens cone structure cover 20 is covered on the infrared temperature sensor 10;
and a lens 30 mounted on the barrel structure cover 20 for filtering and focusing infrared rays.
In the embodiment of the present invention, the infrared temperature sensor 10 is installed at one end of the lens barrel structure cover 20, and the lens 30 is installed at the other end of the lens barrel structure cover 20; the infrared temperature sensor 10, the lens barrel structure cover 20 and the lens 30 are sequentially packaged together. When the temperature is measured, the target infrared energy light of the measured object is focused to the infrared temperature sensor 10 through the lens and processed into a target temperature signal, so that the temperature of the object is measured. The utility model discloses an infrared temperature measurement module of non-contact simple structure, it is small, it is very convenient to encapsulate the use.
The utility model adopts the infrared temperature sensor to adopt a paster type sensor chip with the model of MLX 90632; therefore, the chip of the surface mount type sensor adopting the MLX 90632 has very small volume, and the whole temperature measurement module is simple and compact in structure and small in overall volume by matching with the unique lens cone structure cover and the lens.
In the embodiment of the present invention, preferably, the infrared temperature sensor 10 can be installed on a substrate 40 first. As shown in fig. 1 and fig. 2, that is, the utility model discloses an infrared temperature measurement module of non-contact, it still includes base plate 40, infrared temperature sensor 10 is installed on the base plate 40, lens cone structure cover 20 is installed correspond on the base plate 40 and cover infrared temperature sensor 10. The connecting wires of the infrared temperature sensor 10 are conveniently led out through the substrate 40.
Further, the non-contact infrared temperature measurement module adopts the silicon lens 30 as the lens 30, and the silicon lens 30 is embedded at one end of the lens cone structure cover 20. The utility model discloses well preferred, adopt lens 30 is plano-convex silicon lens (lens 30), plano-convex silicon lens (lens 30) are inlayed lens cone structure cover 20 one end, and plano-convex silicon lens (lens 30) light assembles effectually. Namely, a plano-convex silicon lens (lens 30) made of silicon is used.
In the embodiment of the present invention, as shown in fig. 3 and 5, the one end of the plano-convex silicon lens (lens 30) is a plane 31, and the other side is a convex surface 32, the plano-convex silicon lens (lens 30) is embedded in one end of the lens barrel structure cover 20, and the convex surface 32 of the plano-convex silicon lens (lens 30) faces towards the inside of the lens barrel structure cover 20, the plane 31 of the plano-convex silicon lens (lens 30) faces towards the upper end of the lens barrel structure cover 20 and flushes with the upper end surface of the lens barrel structure cover 20. Thus, the embodiment of the utility model provides a plano-convex silicon lens (lens 30) embedding is installed during lens cone structure cover 20 top, plane 31 up, convex surface 32 down, make plano-convex silicon lens (lens 30) up end plane with lens cone structure cover 20 up end flushes, can not occupy more volumes in the outside under the assurance good light assembles the effect condition, more is favorable to the utility model discloses the microminiaturization setting of non-contact infrared temperature measurement module.
In other words, in the embodiment of the present invention, the lens is a plano-convex lens made of silicon, wherein the plane is placed outward, and the convex lens can play a role of filtering and converging parallel light, so as to converge a required part of light on the sensor, so that the temperature measurement module can better collect light, and achieve a longer test distance; the plane is placed outwards and can be avoided lens long-time use surface dust accumulation or by the scratch, influences its performance, and the plane is effectual reduced the shared space of module outwards, beautified the outward appearance, makes it more be applicable to products such as cell-phone.
In an embodiment, the non-contact infrared temperature measurement module according to the embodiment, as shown in fig. 2 and 3, the lens barrel structure cover 20 includes: the lens barrel body 21 is in a hollow shape, the cover body 22 is integrally arranged at one end of the lens barrel body 21, the other end of the lens barrel body 21 is used for installing the lens 30, and the cover body 22 is sleeved on the infrared temperature sensor 10. In the embodiment of the present invention, the lens barrel structure cover 20 adopts a sectional structure, that is, the lens barrel structure cover 20 includes: a lens barrel body 21 in a hollow shape, and a cover body 22; the cover body 22 covers the infrared temperature sensor 10, and the size of the cover body 22 needs to be capable of completely accommodating the infrared temperature sensor 10; and be used for the printing opacity to advance the cross section of the lens cone body 21 of infrared temperature sensor 10 compares the cross section of the cover body 22 is little, as long as do not obstruct light entering infrared temperature sensor 10, like this lens cone structure cover 20 adopts the sectional type structure, and lens cone body 21 volume can be done for a short time, is convenient for make whole non-contact infrared temperature measurement module volume do for a short time, has reduced the volume of non-contact infrared temperature measurement module greatly, is miniaturely non-contact infrared temperature measurement module so far, can install on small-size equipment such as cell-phone, wrist-watch, bracelet, earphone, uses extensively.
As shown in fig. 2 and fig. 3, the non-contact infrared temperature measurement module of the present invention preferably has a shape of the cover 22 matching with that of the infrared temperature sensor 10, and the cross section of the lens barrel 21 is smaller than that of the cover 22. Specifically, as shown in fig. 3, the shape of the inner wall of the cover 22 matches the shape of the outer side of the infrared temperature sensor 10, so that the lens barrel structure cover 20 just covers the infrared temperature sensor 10, and the structure is compact. The cross section of the lens barrel body 21 is smaller than that of the cover body 22, so that the volume of the whole temperature measuring module can be reduced.
In a further preferred embodiment, as shown in fig. 2 and 3, the non-contact infrared temperature measurement module 10 has a square structure, and the cover 22 has a square hollow structure; the cover body 22 is sleeved on the infrared temperature sensor 10, and the inner wall of the square hollow structure of the cover body 22 is attached to the outer side edge of the infrared temperature sensor 10 with the square structure. The utility model discloses in, infrared temperature sensor 10 with the cover body 22 all sets up to square structure, and the square hollow structure inner wall of the cover body 22 sets up with the laminating of the infrared temperature sensor 10 outside limit of square structure, does not tightly make the utility model discloses whole temperature measurement module compact structure, it is small, more useful infrared temperature sensor heat conduction is to lens cone structure cover 20, the heat dissipation of being convenient for.
The embodiment of the utility model provides an infrared temperature measurement module of non-contact, as shown in fig. 3, the one end of lens barrel body 21 is used for holding the installation infrared temperature sensor 10, the lens barrel body 21 other end is provided with and is used for the embedding installation lens 30's protruding circle 23. The utility model discloses a lens cone body 20 upper end setting of lens cone structure cover 20 protruding circle 23, protruding circle 23 distance the height of lens cone body 21 up end with the thickness in the edge of lens 30 side equals. This facilitates the lens 30 to be inserted into the upper end of the barrel body 20 mounted on the barrel structure cover 20.
In an embodiment, in the non-contact infrared temperature measurement module of this embodiment, the lens barrel structure cover 20 is an aluminum lens barrel structure cover 20 or a copper lens barrel structure cover 20; the utility model discloses a lens cone structure cover 20 has good heat conductivility for aluminium lens cone structure cover 20 or copper lens cone structure cover 20, can reach better radiating effect.
Preferably, the central wire inside the lens barrel structure cover 20 is aligned with the infrared temperature sensor 10. Therefore, infrared light can be more favorably collected to the infrared temperature sensor 10, and the measurement precision of the infrared temperature sensor 10 is improved.
The embodiment of the utility model provides an in the infrared temperature measurement module of non-contact, as shown in fig. 5, this embodiment lens cone structure cover 20 highly satisfies: making the distance between the infrared temperature sensor 10 mounted at both ends of the barrel structure cover 20 and the lens 30 (i.e. the distance from a1 to a2 shown in fig. 5) less than the focal length F of the lens 30; and the transmitted light is covered on the four sensing points of the infrared temperature sensor 10. Four points of the infrared sensor 10 indicated by b1 shown in fig. 6. Therefore, the infrared temperature sensor can sense the strongest converged light, the temperature measurement precision is improved, and the accuracy is ensured.
The embodiment of the utility model provides an infrared temperature measurement module of non-contact, infrared temperature sensor 10's length, width and height size is 3mm x 3mm x 1mm respectively. In this embodiment, the length, width, height and size ranges of the lens barrel structure cover 20 are preferably 2.9-4.9mm long, 3.5-5.5mm wide and 2.2-4.2mm high, respectively; in the present embodiment, it is preferable to adopt the aluminum barrel structure cover 20 having a length, width, and height of 3.9mm × 4.5mm × 3.2mm.
The embodiment of the utility model adopts a lens cone structure cover of 3.9mm x4.5mm x3.2mm aluminum material (range to be determined), which has good heat-conducting property; the height of which is determined by the focal length of the lens. The lens barrel height satisfies the following conditions: the sensor is located closer to the silicon lens than the focal length of the silicon lens and the transmitted light covers the "four sensing points" on the sensor, as shown in fig. 6. Therefore, the infrared temperature sensor can sense the strongest converged light, the temperature measurement precision is improved, and the accuracy is ensured
In a further preferred embodiment, the substrate 40 is an FPC flexible printed circuit, the infrared temperature sensor 10 is mounted on the FPC flexible printed circuit, and the lens barrel structure cover 20 is mounted on the FPC flexible printed circuit and covers the infrared temperature sensor 10 correspondingly. Preferably, as shown in fig. 1, the FPC flexible printed circuit board is a strip-shaped FPC flexible printed circuit board (40 shown in fig. 1), the infrared temperature sensor 10 is mounted at one end of the FPC flexible printed circuit board and electrically connected to the FPC flexible printed circuit board, and the other end of the FPC flexible printed circuit board is provided with an electrical connection contact 41 for plugging.
The embodiment of the utility model provides an in, adopt non-contact infrared temperature measurement module sets up on the FPC soft board, and the FPC soft board is the flexible circuit board of a simple structure, mainly used and other circuit board's connection. The utility model adopts the FPC soft board which can be freely bent, coiled and folded, can be randomly arranged according to the space layout requirement, and can be freely moved and stretched in the three-dimensional space, thereby achieving the integration of component assembly and wire connection; the FPC flexible board can greatly reduce the volume and the weight of an electronic product and is suitable for the development of the electronic product towards high density, miniaturization and high reliability; the FPC flexible board has the advantages of good heat dissipation and weldability, easiness in assembly and connection, low comprehensive cost and the like, and the design of combining the flexibility and the hardness makes up for slight defects of the flexible base material in element bearing capacity to a certain extent.
Further, as shown in fig. 2, the non-contact infrared temperature measurement module according to this embodiment adopts the infrared temperature sensor 10 installed on the front surface of the FPC flexible printed circuit (40 shown in fig. 2), and the lens barrel structure cover 20 installed on the front surface of the FPC flexible printed circuit correspondingly covers the infrared temperature sensor; as shown in fig. 4, a reinforcing plate 50 is attached to the back of the FPC flexible printed circuit board at a position corresponding to the position where the infrared temperature sensor 10 is mounted. The adoption is in the installation is corresponded at the FPC soft board back the position, the laminating of infrared temperature sensor 10 are provided with a reinforcing plate 50 and can use whole module to guarantee that the FPC soft board can freely be crooked, convolute, folding, according to the space layout requirement random arrangement basis on, strengthen the protection hardness of non-contact infrared temperature measurement module, can effectively protect infrared temperature sensor 10 to can strengthen heat conduction heat dissipation.
The embodiment of the utility model provides a, the whole length of non-contact infrared temperature measurement module is that the scope of length is 12.7-22.7mm (millimeter) respectively, and the wide scope is 3.2-9mm, and high scope is 1.2-8.7 mm. The utility model discloses preferably, adopt the whole length of non-contact infrared temperature measurement module is 17.7mm x 4.0mm x 3.7mm respectively in height size, has reduced the volume of non-contact infrared temperature measurement module greatly, is the infrared temperature measurement module of miniaturely non-contact so far, can adorn to inlay on small-size equipment such as cell-phone, wrist-watch, bracelet, earphone, uses extensively. In addition, the device has good heat dissipation performance, small influence by external environment, high precision and measurement distance of 5-10 cm. Can meet the measurement requirements of different environments.
Based on above-mentioned embodiment's infrared temperature measurement module of non-contact, the embodiment of the utility model provides a temperature measurement equipment is still provided, include: the temperature measuring device comprises a temperature measuring device body and any one non-contact infrared temperature measuring module, wherein the non-contact infrared temperature measuring module is arranged on the temperature measuring device body; the temperature measuring equipment is a temperature measuring gun, a mobile phone, a watch, a bracelet, an earphone, a flat plate or a security door.
Based on above-mentioned embodiment's infrared temperature measurement module of non-contact, the embodiment of the utility model provides a still provide a handheld temperature measurement rifle, include: the portable temperature measurement gun comprises a handheld temperature measurement gun body and the non-contact infrared temperature measurement module 100, wherein the non-contact infrared temperature measurement module 100 is arranged on the handheld temperature measurement gun body.
Based on above-mentioned embodiment's infrared temperature measurement module of non-contact, the embodiment of the utility model provides a still provide a take cell-phone of temperature measurement function, including the cell-phone body, and above-mentioned arbitrary non-contact infrared temperature measurement module 100, the miniature infrared temperature measurement module of non-contact 100 group sets up on the cell-phone body.
Based on above-mentioned embodiment's infrared temperature measurement module of non-contact, the embodiment of the utility model provides a still provide a take wrist-watch of temperature measurement function, including the wrist-watch body, and above-mentioned arbitrary non-contact infrared temperature measurement module 100, non-contact infrared temperature measurement module 100 sets up on the wrist-watch body.
Based on above-mentioned embodiment's infrared temperature measurement module of non-contact, the embodiment of the utility model provides a bracelet of area temperature measurement function is still provided, including bracelet body, and arbitrary the infrared temperature measurement module 100 of non-contact, the infrared temperature measurement module 100 of non-contact sets up on the bracelet body.
Based on above-mentioned embodiment's infrared temperature measurement module of non-contact, the embodiment of the utility model provides a still provide an earphone of taking temperature measurement function, including the earphone body to and any one of the above-mentioned embodiment infrared temperature measurement module of non-contact 100, infrared temperature measurement module of non-contact 100 sets up on the earphone body.
Based on above-mentioned embodiment's infrared temperature measurement module of non-contact, the embodiment of the utility model provides a still provide a take flat board of temperature measurement function, including dull and stereotyped body to and any item of above-mentioned embodiment the infrared temperature measurement module of non-contact 100, the infrared temperature measurement module of non-contact 100 sets up on the dull and stereotyped body.
Based on above-mentioned embodiment's infrared temperature measurement module of non-contact, the embodiment of the utility model provides a security check door is still provided, including security check door body to and any one of the above-mentioned embodiment infrared temperature measurement module of non-contact 100, infrared temperature measurement module of non-contact 100 sets up on the security check door body.
The beneficial effect of this application is: the non-contact infrared temperature measurement module and the temperature measurement equipment comprise an infrared temperature sensor, a lens cone structure cover and a lens; the lens is a plano-convex silicon lens which is embedded at one end of the lens barrel structure cover; plano-convex silicon lens one end is the plane, and the another side is the convex surface, plano-convex silicon lens inlay lens cone structure cover one end, and plano-convex silicon lens's convex surface orientation lens cone structure cover is inboard, plano-convex silicon lens's plane orientation lens cone structure cover upper end, with lens cone structure covers the up end and flushes. The plane of the plano-convex silicon lens of the utility model is placed outwards, the convex lens can play the roles of filtering and converging parallel light, and part of light needed is converged on the infrared temperature sensor, so that the temperature measurement module can better collect light, and a longer test distance is achieved; the plane is placed outwards and can be avoided lens long-time use surface dust accumulation or by the scratch, influences its performance, and the plane is effectual reduced the shared space of module outwards, beautified the outward appearance, makes it more be applicable to products such as cell-phone. And the utility model discloses an infrared temperature measurement module of non-contact simple structure, it is small, reduced the volume of the infrared temperature measurement module of non-contact greatly, be the infrared temperature measurement module of miniaturely non-contact so far, can adorn to inlay on small-size equipment such as cell-phone, wrist-watch, bracelet, earphone, use extensively. In addition, the device has good heat dissipation performance, small influence by external environment, high precision and measurement distance of 5-10 cm. Can meet the measurement requirements of different environments, and has simple structure and convenient installation.
It should be understood that the application of the present application is not limited to the above examples, and that modifications or changes may be made by those skilled in the art based on the above description, and all such modifications and changes are intended to fall within the scope of the appended claims.

Claims (10)

1. The utility model provides an infrared temperature measurement module of non-contact which characterized in that includes:
the infrared temperature sensor is used for collecting target infrared energy and processing the target infrared energy into a target temperature signal;
the lens cone structure cover is covered on the infrared temperature sensor;
a lens mounted on the lens barrel structure cover for filtering and focusing infrared rays;
the lens is a plano-convex silicon lens which is embedded at one end of the lens barrel structure cover;
plano-convex silicon lens one end is the plane, and the another side is the convex surface, plano-convex silicon lens inlay lens cone structure cover one end, and plano-convex silicon lens's convex surface orientation lens cone structure cover is inboard, plano-convex silicon lens's plane orientation lens cone structure cover upper end, with lens cone structure covers the up end and flushes.
2. The non-contact infrared temperature measurement module of claim 1,
the height of the lens barrel structure cover meets the following requirements: enabling the distance between the infrared temperature sensors arranged at the two ends of the lens barrel structure cover and the lens to be smaller than the focal length of the lens; and the transmitted light is covered on four sensing points of the infrared temperature sensor.
3. The non-contact infrared temperature measurement module of claim 1,
the lens barrel structure cover includes: the lens barrel comprises a hollow lens barrel body and a cover body integrally arranged at one end of the lens barrel body, the other end of the lens barrel body is used for installing the lens, and the cover body is sleeved on the infrared temperature sensor.
4. The non-contact infrared temperature measurement module according to claim 3, wherein the shape of the cover body matches the shape of the infrared temperature sensor, and the cross section of the lens barrel body is smaller than that of the cover body.
5. The non-contact infrared temperature measurement module according to claim 3, wherein the infrared temperature sensor is of a square structure, and the cover body is of a square hollow structure; the cover body is sleeved on the infrared temperature sensor, and the inner wall of the square hollow structure of the cover body is attached to the outer side edge of the infrared temperature sensor with the square structure.
6. The non-contact infrared temperature measurement module according to claim 3, wherein a convex ring for embedding and mounting the lens is arranged at the other end of the lens barrel body, and the height of the convex ring from the upper end surface of the lens barrel body is equal to the thickness of the side edge of the lens;
the lens is a silicon lens which is embedded at one end of the lens cone structure cover;
the lens cone structure cover is an aluminum lens cone structure cover or a copper lens cone structure cover;
the central wire in the lens cone structure cover is aligned with the infrared temperature sensor.
7. The non-contact infrared temperature measurement module of claim 1,
the infrared temperature sensor adopts a patch type sensor chip with the model number of MLX 90632; the infrared temperature sensor, the lens barrel structure cover and the lens are sequentially packaged together.
8. The module according to claim 1, further comprising a substrate, wherein the infrared temperature sensor is mounted on the substrate, and the lens barrel structure is mounted on the substrate and covers the infrared temperature sensor.
9. The non-contact infrared temperature measurement module according to claim 1, wherein the infrared temperature sensor has a length, a width, and a height of 3mm x 3mm x 1 mm;
the length, width and height of the lens cone structure cover are respectively 3.9mm x4.5mm x3.2mm aluminum lens cone structure cover;
the length, the width and the height of the non-contact infrared temperature measurement module are respectively 17.7mm x 4.0mm x 3.7 mm.
10. A thermometric apparatus, comprising: the temperature measuring equipment comprises a temperature measuring equipment body and the non-contact infrared temperature measuring module set according to any one of claims 1 to 8, wherein the non-contact infrared temperature measuring module set is arranged on the temperature measuring equipment body; the temperature measuring equipment is a temperature measuring gun, a mobile phone, a watch, a bracelet, an earphone, a flat plate or a security door.
CN202023252784.7U 2020-12-29 2020-12-29 Non-contact infrared temperature measurement module and temperature measurement equipment Active CN214502676U (en)

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