CN214496539U - Electroplating production is with reinforced mechanism - Google Patents
Electroplating production is with reinforced mechanism Download PDFInfo
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- CN214496539U CN214496539U CN202120428199.3U CN202120428199U CN214496539U CN 214496539 U CN214496539 U CN 214496539U CN 202120428199 U CN202120428199 U CN 202120428199U CN 214496539 U CN214496539 U CN 214496539U
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Abstract
The utility model provides an electroplating production is with reinforced mechanism has solved among the prior art problem that the ratio is wrong, the liquid feeding is unstable easily appears. The utility model provides an electroplating production is with reinforced mechanism, includes plating bath and workstation, is provided with control panel and measuring pump on the workstation, and measuring pump one end links to each other with the storage tank, and the other end passes through the pipe and links to each other with the agitator, is equipped with the valve on the pipe, and the agitator is fixed on the support, and the agitator links to each other with the reservoir through first pipeline, and the reservoir passes through the second pipeline and links to each other with the plating bath, is equipped with flow control valve on first pipeline and the second pipeline, is provided with level sensor in the plating bath. Through the ratio of the additive that the metering pump control storage tank came out, mix in the agitator, level sensor and pipeline cooperation realize supplementing at any time to the plating solution, and the reservoir passes through the pipeline with the plating bath and is connected gently for the liquid feeding is steady, and the fluctuation of liquid level when reducing the liquid feeding has improved electroplating surface's homogeneity and integrality, has guaranteed the quality of electroplating.
Description
Technical Field
The utility model relates to the field of electroplating, in particular to a feeding mechanism for electroplating production.
Background
Electroplating is the process of plating a thin layer of other metals or alloys on the surface of some metals in an electroplating bath by using the principle of electrolysis, the plating solution is reduced along with the increase of the plating time in the plating process, the plating on the surface of a plated part is incomplete because the plated part cannot be plated fully and uniformly, the plating quality is reduced, various plating additives are required to be added into the plating solution, each addition of the existing electroplating additive needs to manually measure the electroplating additive by using a container, so that the amount of the electroplating additive injected each time has errors, when the addition of the electroplating additive needs to be changed, the operator is easy to have misoperation, which causes the wrong proportion of the electroplating additive and influences the electroplating work, fluctuations in the level can affect the settling effect of the metal ions in the bath and thus affect the uniformity and integrity of the plated surface.
SUMMERY OF THE UTILITY MODEL
The utility model provides an electroplating production is with reinforced mechanism has solved among the prior art problem that the ratio is wrong, the liquid feeding is unstable easily appears.
The technical scheme of the utility model is realized like this:
the utility model provides an electroplating production is with reinforced mechanism, includes plating bath and workstation, is provided with control panel and measuring pump on the workstation, and measuring pump one end links to each other with the storage tank, and the other end passes through the pipe and links to each other with the agitator, is equipped with the valve on the pipe, and the agitator is fixed on the support, and the agitator links to each other with the reservoir through first pipeline, and the reservoir passes through the second pipeline and links to each other with the plating bath, is equipped with flow control valve on first pipeline and the second pipeline, is provided with level sensor in the plating bath.
Further, be provided with apron and connecting plate on the agitator, it is porose to open on the connecting plate, is equipped with the stirring rake in the agitator, and the stirring rake tip passes the hole and links to each other with the motor.
Furthermore, the edge of the cover plate is provided with a through hole matched with the conduit, and the cover plate is provided with a handle.
Further, the metering pump is fixed on the workbench through foundation bolts.
Further, an indicator lamp is arranged on the control panel.
The beneficial effect that this technical scheme can produce: through the ratio of the additive that the metering pump control storage tank came out, mix in the agitator, level sensor and pipeline cooperation realize supplementing at any time to the plating solution, and the reservoir passes through the pipeline with the plating bath and is connected gently for the liquid feeding is steady, and the fluctuation of liquid level when reducing the liquid feeding has improved electroplating surface's homogeneity and integrality, has guaranteed the quality of electroplating.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a front view of the present invention;
fig. 2 is a top view of the present invention.
In the figure: the device comprises a workbench 1, a control panel 2, a storage tank 3, a metering pump 4, a conduit 5, a valve 6, a stirring barrel 7, a first pipeline 8, a liquid storage tank 9, a plating tank 10, a liquid level sensor 11, a second pipeline 12, a stirring paddle 13, a flow control valve 14, a motor 15, a cover plate 16, a handle 17 and a connecting plate 18.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without any creative effort belong to the protection scope of the present invention.
As shown in fig. 1-2, this embodiment provides a feeding mechanism for electroplating production, including plating bath 10 and workstation 1, be provided with control panel 2 and measuring pump 4 on the workstation 1, 4 one ends of measuring pump link to each other with storage tank 3, the other end passes through pipe 5 and links to each other with agitator 7, be equipped with valve 6 on the pipe 5, agitator 7 fixes on the support, the support plays the effect of support, agitator 7 links to each other with reservoir 9 through first pipeline 8, reservoir 9 passes through second pipeline 12 and links to each other with plating bath 10, be equipped with flow control valve 14 on first pipeline 8 and the second pipeline 12, be provided with level sensor 11 in the plating bath 10, be used for detecting inside liquid level.
Be provided with apron 16 and connecting plate 18 on the agitator 7, it has the hole to open on the connecting plate 18, is equipped with stirring rake 13 in the agitator 7, and stirring rake 13 tip passes the hole and links to each other with motor 15. The motor 15 drives the stirring paddle 13 to rotate, and the solution in the stirring barrel 7 is mixed.
The edge of the cover plate 16 is provided with a through hole matched with the conduit 5, and the cover plate 16 is provided with a handle 17. The cover plate 16 covers the stirring barrel 7 to prevent dust in the air from polluting the solution after the batching is finished.
The metering pump 4 is fixed on the workbench 1 through foundation bolts. During installation, the foundation bolt is screwed down so as to avoid the influence of vibration on the performance of the pump during starting.
An indicator light is arranged on the control panel 2. When the solution in the plating tank 10 decreases to a predetermined value, the indicator lamp turns on the red light to remind the user of charging.
The working process of the embodiment: according to the additive ratio of the required electroplating solution, the dosage of the additive flowing out of the material storage tank 3 is controlled by adjusting the metering pump 4, the valve 6 is opened, the additive is conveyed out by the metering pump 4, the additive flows into the stirring barrel 7 through the conduit 5, the valve 6 is closed, the motor 15 is started to drive the stirring paddle 13 to rotate to stir the prepared solution, the solution after stirring is well mixed, the flow control valve 14 on the first pipeline 8 is opened, the solution is conveyed to the liquid storage tank 9 through the first pipeline 8, when the solution of the electroplating tank 10 drops to a certain value, the liquid level sensor 11 transmits a signal to the control panel 2, the indicator lamp on the control panel 2 lights a red light, the flow control valve 14 on the second pipeline 12 is opened, and the solution in the liquid storage tank 9 flows into the electroplating tank 10.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides an electroplating production is with reinforced mechanism, includes plating bath (10) and workstation (1), its characterized in that: be provided with control panel (2) and measuring pump (4) on workstation (1), measuring pump (4) one end links to each other with storage tank (3), the other end passes through pipe (5) and links to each other with agitator (7), be equipped with valve (6) on pipe (5), agitator (7) are fixed on the support, agitator (7) link to each other with reservoir (9) through first pipeline (8), reservoir (9) link to each other with plating bath (10) through second pipeline (12), be equipped with flow control valve (14) on first pipeline (8) and second pipeline (12), be provided with level sensor (11) in plating bath (10).
2. The feeding mechanism for electroplating production according to claim 1, characterized in that: be provided with apron (16) and connecting plate (18) on agitator (7), it has the hole to open on connecting plate (18), is equipped with stirring rake (13) in agitator (7), and stirring rake (13) tip passes the hole and links to each other with motor (15).
3. The feeding mechanism for electroplating production according to claim 2, characterized in that: the edge of the cover plate (16) is provided with a through hole matched with the conduit (5), and the cover plate (16) is provided with a handle (17).
4. The feeding mechanism for electroplating production according to claim 1, characterized in that: the metering pump (4) is fixed on the workbench (1) through foundation bolts.
5. The feeding mechanism for electroplating production according to claim 1, characterized in that: an indicator light is arranged on the control panel (2).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202120428199.3U CN214496539U (en) | 2021-02-26 | 2021-02-26 | Electroplating production is with reinforced mechanism |
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CN202120428199.3U CN214496539U (en) | 2021-02-26 | 2021-02-26 | Electroplating production is with reinforced mechanism |
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CN214496539U true CN214496539U (en) | 2021-10-26 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117166035A (en) * | 2023-11-02 | 2023-12-05 | 宁波惠金理化电子有限公司 | Additive quantitative adding device for electroplating of new energy automobile parts |
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2021
- 2021-02-26 CN CN202120428199.3U patent/CN214496539U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117166035A (en) * | 2023-11-02 | 2023-12-05 | 宁波惠金理化电子有限公司 | Additive quantitative adding device for electroplating of new energy automobile parts |
CN117166035B (en) * | 2023-11-02 | 2024-01-26 | 宁波惠金理化电子有限公司 | Additive quantitative adding device for electroplating of new energy automobile parts |
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