CN214481529U - Bending device - Google Patents

Abstract

The present disclosure relates to a bending device, including: the object placing table is used for placing electronic components; and the bending pin is positioned above the object placing table and can move downwards to press the flexible circuit board, so that the flexible circuit board is bent at the pressing position. The flexible circuit board of the electronic element can be pre-bent, and interference with other electronic devices when the flexible circuit board is installed on electronic equipment is avoided.

Description

Bending device

Technical Field

The utility model relates to a flexible circuit board processing field especially relates to bending device.

Background

With the continuous update of electronic devices, at present, electronic devices are developing toward being extremely light, thin and miniaturized, and the stacking of internal devices thereof is becoming more and more compact. The device and the mainboard are connected through a Flexible Printed Circuit (FPC) between the device and the device.

However, the flexible circuit board has a certain flexibility, and may arch inside the electronic device to cause interference with other devices.

Currently, workers hold tweezers to insert the arched flexible circuit board into the gap between the devices. On the one hand, the tweezers have the possibility of puncturing the flexible circuit board, and on the other hand, the flexible circuit board still has the possibility of arching from the gap due to the flexibility of the flexible circuit board.

SUMMERY OF THE UTILITY MODEL

To overcome the problems in the related art, the present disclosure provides a bending apparatus.

According to an embodiment of the present disclosure, there is provided a bending apparatus, including: the object placing table is used for placing electronic components; and the bending pin is positioned above the object placing table and can move downwards to press the flexible circuit board, so that the flexible circuit board is bent at the pressing position.

In one embodiment, the method further comprises: the supporting table is arranged on the side surface of the object placing table, a step is formed between the upper surface of the supporting table and the side surface of the object placing table, and the free end of the flexible circuit board is placed on the upper surface of the supporting table.

In one embodiment, the bending apparatus further includes: the pressing plate is positioned above the object placing table, and the bending pin is fixed on the pressing plate; and the pressing component is connected with the pressing plate and used for pressing the pressing plate downwards.

In one embodiment, the bending apparatus further includes: a guide member; the pressing plate is connected with the guide piece in a sliding mode and ascends and descends along the guide piece.

In one embodiment, the bending apparatus further includes: the base body comprises a bottom plate and a side plate connected with the bottom plate, wherein the lower end of the guide piece is fixed on the bottom plate, and the upper end of the guide piece is fixed on the side plate; and the elastic piece is matched with the guide piece and is arranged between the bottom plate and the pressing plate.

In one embodiment, the pressing assembly comprises a handle, a connecting rod and a pressing rod; the upper end part of the handle is hinged with the side plate, and the lower end part of the handle is hinged with the upper end of the connecting rod; the lower end of the pressure lever is fixedly connected with the pressure plate, and the upper end of the pressure lever is hinged with the lower end of the connecting rod.

In one embodiment, the height of the bending pin relative to the step is adjustable; the lower end part of the bending pin is adjacent to the side surface of the object placing table.

In one embodiment, the bending apparatus further includes: the limiting device is positioned below the pressing plate and used for limiting the stroke of the bending pin for pressing the flexible circuit board; the limiting device comprises a bulge arranged at the bottom of the pressing plate, and the bulge is abutted against the bottom plate to limit the stroke of the bending pin for pressing the flexible circuit board.

In an embodiment, the bending device further includes a turning mechanism, the turning mechanism includes a turning motor, and a driving end of the turning motor is connected with the object placing table to drive the object placing table to rotate so as to turn the electronic component with the flexible circuit board.

In one embodiment, the bending device further comprises a pressing component, wherein the pressing component comprises a sliding rod, a pressing rod and a pressing rod, wherein the sliding rod penetrates through the pressing plate and is connected with the pressing plate in a sliding manner; the pressure head is arranged at the lower end of the sliding rod and corresponds to the electronic element; the balancing weight is arranged at the upper end of the sliding rod; the pressing head can be driven to ascend or descend under the condition that the pressing plate abuts against the balancing weight, and the pressing head abuts against the electronic element under the condition that the pressing plate is separated from the balancing weight.

In one embodiment, the ram is a silicone block or a rubber block.

In one embodiment, the stand is movable in a horizontal plane relative to the bending pin.

In one embodiment, a sliding groove is formed in the bottom plate along the front-back direction, a sliding rod matched with the sliding groove is arranged at the bottom of the object placing table, and the relative position of the flexible circuit board of the electronic component and the bending pin is changed through the sliding fit of the sliding groove and the sliding rod.

In one embodiment, the object placing table is provided with one or more accommodating grooves for accommodating the electronic components; the shapes of the accommodating groove and the electronic element in the matching area are matched.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects: the flexible circuit board of the electronic element can be pre-bent, and interference with other electronic devices when the flexible circuit board is installed on electronic equipment is avoided.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic structural view illustrating a bending apparatus according to an exemplary embodiment of the present disclosure.

Fig. 2 is another perspective structural view of a bending apparatus according to an exemplary embodiment of the present disclosure.

Fig. 3 is a schematic diagram illustrating a partial structure of a bending apparatus according to an exemplary embodiment of the present disclosure.

Fig. 4 is a schematic cross-sectional view of a bending apparatus shown in accordance with an exemplary embodiment of the present disclosure.

Fig. 5 is a partially enlarged schematic view of fig. 4 shown in accordance with an exemplary embodiment of the present disclosure.

Fig. 6 is a partially enlarged schematic view of fig. 5 shown in accordance with an exemplary embodiment of the present disclosure.

Fig. 7 is a schematic structural diagram illustrating a camera module according to an exemplary embodiment of the present disclosure installed in an electronic device.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

Fig. 1 is a schematic structural view illustrating a bending apparatus according to an exemplary embodiment of the present disclosure. Fig. 2 is another perspective structural view of a bending apparatus according to an exemplary embodiment of the present disclosure. As shown in fig. 1 and 2, the present disclosure provides a bending apparatus 100 for pressing a flexible circuit board of an electronic component to pre-bend the flexible circuit board to release stress of the flexible circuit board.

The electronic component can be, for example, a camera module, an earphone module, a microphone module, a fingerprint module, and the like, which have a flexible circuit board. In the following description, the electronic device is described by taking the image pickup module 200 as an example, but the present disclosure is not limited thereto.

The camera module 200 may include a lens barrel for accommodating a lens, a lens holder for accommodating an image sensor, and a flexible circuit board 210. The flexible circuit board 210 has a connection end connected to the image sensor and a free end away from the connection end, and the free end may be provided with a connector for electrically connecting to a connector on the main board.

The bending apparatus 100 according to the embodiment of the present disclosure may include a stand 20 and a bending pin 60.

The object placing table 20 is used for placing electronic components with flexible circuit boards, and a part of the flexible circuit boards is suspended and extends out of the object placing table 20. The bending pin is located above the object placing table 20 and can move downwards to press the flexible circuit board, so that the flexible circuit board is bent at the pressing position. During the use, can place the module 200 of making a video recording on putting the thing platform 20 earlier to partly unsettled thing platform 20 of putting of stretching out of the flexible circuit board 210 of the module 200 of making a video recording, make the position of pressing of flexible circuit board 210 and bend the round pin 60 and aim at. Thereafter, the bending pin 60 is moved downward to contact the flexible circuit board 210, and presses the flexible circuit board 210 downward, so that the flexible circuit board 210 forms a crease at the pressed position to release the stress, whereby the flexible circuit board 210 can be maintained in a bent state.

The bending apparatus 100 may further include a placing table 20, and the placing table 20 is used for placing electronic components. The stand 20 may include an upper surface 23 and a side surface 24 connected to the upper surface 23. A support stand 30 may be provided at the side surface 24 of the object stand 20 for supporting the flexible circuit board of the electronic component. The upper surface 31 of the support stand 30 forms a step with the side surface 24 of the object stand 20, that is, the lower surface of the support stand 30 is lower than the upper surface 23 of the object stand 20. The bending pin 60 is located above the object placing table 20, and the bending pin 60 can move downwards to press the flexible circuit board of the electronic component, so that the flexible circuit board is bent at the pressing position to release the stress at the pressing position, and the flexible circuit board can keep the bending state. The pressing position of the flexible circuit board may be a position adjacent to the free end.

For example, when the camera module 200 is used, the free end of the flexible circuit board 210 of the camera module 200, i.e., the end to which the connector is attached, may be placed on the upper surface 31 of the support base 30 such that the pressing position of the flexible circuit board 210 is aligned with the bending pin. Thereafter, the bending pin is moved downward to contact the flexible circuit board 210, and the flexible circuit board 210 is pressed downward, so that the flexible circuit board 210 forms a crease at the pressed position to release the stress, thereby allowing the flexible circuit board 210 to maintain the bent state. When the image pickup module 200 is assembled in an electronic device with the flexible circuit board 210 being bent, the flexible circuit board 210 is substantially in a "Z" shape (as shown in fig. 7). As shown in fig. 7, when the camera module 200 is installed in an electronic device (e.g., a mobile phone), the lens holder (base) of the camera module 200 is installed and fixed with the positioning hole of the middle frame, and the connector at the free end of the flexible circuit board 210 is connected to the main board and is located above the connecting end of the flexible circuit board. In the past, after the camera module 200 is mounted on an electronic device, the flexible circuit board 210 has a certain stress, so that the flexible circuit board 210 tilts upward (in the thickness direction of the electronic device), occupies a space in the thickness direction, and interferes with stacking of other devices. The common method is that the flexible circuit board 210 is bent and then plugged into the gap by manually holding the tweezers, and the tweezers are harder to control in strength and are easy to scratch or damage the flexible circuit board 210. And the stress at the bending position adjacent to the free end is concentrated, so that the possibility of tilting still exists, and the stacking of other devices is influenced. This is disclosed carries out pre-bending with flexible circuit board 210 through bending device 100 to release the stress of buckling department, can make flexible circuit board keep the state of buckling like this, with make a video recording module 200 equipment back in electronic equipment under this state, can effectively prevent flexible circuit board 210 perk (hunch), avoid the interference with other devices, be favorable to electronic equipment's ultra-thinness like this. Meanwhile, the flexible circuit board does not need to be bent by manually holding the tweezers, so that the safety of the flexible circuit board is improved, and the mounting efficiency can also be improved.

In one embodiment, the bending apparatus 100 further includes a pressing plate 50 and a pressing assembly. The pressing plate 50 is positioned above the placing table 20, and the bending pin 60 is fixed to the pressing plate 50. The pressing assembly is connected to the pressing plate 50 for pressing down the pressing plate 50.

The bending pin 60 may include an upper end portion and a lower end portion, and the upper end portion 61 may be fixed to the pressure plate 50 by a bolt. The lower end may be wedge-shaped. In an example embodiment, the height of the bending pin 60 relative to the support table 30 is adjustable. The upper end of the bending pin 60 may be formed with a vertical position-limiting groove, and the height of the bending pin 60 may be adjusted by adjusting the position of the position-limiting groove and the fixing hole of the pressing plate 50. The height of the bending pin 60 can be adjusted to ensure the bending effect of the flexible circuit board 210.

In one embodiment, the lower end of the bending pin 60 is adjacent to the side surface of the stand 20. For example, the lower end of the bending pin 60 may be wedge-shaped, and there may be almost no gap from the side surface of the stand 20, so that when the bending pin 60 moves downward to press the flexible circuit board 210, the bending angle at the pressed position may be substantially at a right angle, thereby better relieving the stress at the pressed position.

Illustratively, bending apparatus 100 may include housing 10. The housing 10 may include a bottom plate 11 and a side plate 12 connected to the bottom plate 11, and the side plate 12 may be perpendicular to the bottom plate 11. Wherein the platform 20 can be fixed on the bottom plate 11. For example, the stand 20 may be fastened to the front end of the base plate 11 by bolts.

The hold-down assembly may include a handle 83, a connecting rod 84, a sleeve 81, and a plunger 82. The sleeve 81 is fixed to the side plate 12. The handle 83 is located above the sleeve 81, the upper end of the handle is hinged with the side plate 12, the lower end of the handle is hinged with the upper end of the connecting rod 84, the lower end of the connecting rod 84 is hinged with the upper end of the pressing rod 82, and the lower end of the pressing rod 82 penetrates through the sleeve 81 to be fixedly connected with the pressing plate 50.

When the flexible circuit board bending device is used, the handle 83 is held by hand and is pressed downwards, the handle 83 drives the pressing rod 82 to slide downwards in the sleeve 81 through the connecting rod 84, and the pressing rod 82 drives the pressing plate 50 and the bending pin 60 to move downwards together, so that the bending pin 60 presses the flexible circuit board 210 on the supporting table 30 to bend the flexible circuit board 20. After the bending is completed, the handle 83 is lifted upwards, the handle 83 drives the pressing rod 82 to slide upwards in the sleeve 81 through the connecting rod 84, and the pressing rod 82 drives the pressing plate 50 and the bending pin 60 to move upwards together to be separated from the flexible circuit board 20. Then, the bent flexible circuit board 210 and the image pickup module 200 are taken out.

The sleeve 81 can limit the pressure lever 82, so that the stability of the flexible circuit board 210 pressed downwards by the bending pin 60 connected with the pressure plate 50 can be improved, the accuracy of the pressing position is ensured, and the pre-bending precision is improved.

The pressing assembly in the embodiment of the present disclosure is not limited to the above structure, and other power members may drive the platen 50 and the bending pin 60 to move up and down. For example, the press plate 50 may be driven by an air cylinder to move the bending pin 60 up and down to press the flexible circuit board 210, so that the flexible circuit board 210 is bent. The bending pin 60 may be directly driven by the air cylinder to move up and down to press the flexible circuit board 210, so that the flexible circuit board 210 is bent.

In one embodiment, bending apparatus 100 further includes a guide 40, guide 40 being vertically disposed. The pressing plate 50 is slidably coupled to the guide 40. The guide member 40 can improve the smoothness of the pressing movement of the pressing plate 50, so that the bending accuracy of the bending pin 60 to the flexible circuit board 210 can be ensured.

The lower end of the guide 40 may be fixed to the bottom plate 11, and the upper end of the guide 40 may be fixed to the side plate 12 by a connection block. The pressing plate 50 can slide up and down along the vertically arranged guide 40 between the bottom plate 11 and the connecting blocks of the side plates 12.

Specifically, the guide member 40 may include a pair of guide posts slidably coupled to both side portions of the pressing plate 50, respectively. The lower end of the guide upright post can be fixed on the bottom plate 11, and the upper end of the guide upright post can be fixed on the side plate through a connecting piece. The pressure plate 50 is slidable along the guide posts between the base plate 11 and the connecting members.

In an embodiment, the bending apparatus 100 further includes a limiting device located below the pressing plate 50, and configured to limit a stroke of the bending pin 60 when the flexible circuit board is pressed down, so as to prevent the flexible circuit board from being excessively bent and broken due to an excessive stroke when the bending pin 60 presses down the flexible circuit board.

In one example, the limiting device includes a protrusion disposed at the bottom of the pressing plate 50, and the protrusion abuts against the bottom plate 11 to limit the stroke of the bending pin pressing down the flexible circuit board. When the bending pin 60 is pressed down to bend the flexible circuit board, the protrusion abuts against the bottom plate 11, and at this time, the bending pin 60 cannot continuously press down and bend the flexible circuit board, so that excessive bending is prevented, and the bending reliability is ensured.

In one embodiment, the object placing table 20 is movable along a horizontal plane relative to the bending pin 60 to change the relative positions of the electronic components and the flexible circuit board and the bending pin 60, so as to bend the flexible circuit board in multiple sections.

In one example, a slide rail is disposed on the bottom plate 11 along the front-back direction, a slide groove is disposed at the bottom of the object placing table 20, and the slide groove and the slide rail are slidably engaged to change the relative position of the flexible circuit board of the electronic component and the bending pin 60, so that the bending pin 60 bends the flexible circuit board in multiple sections.

The article placing table 20 may be provided with a through threaded hole, and when the relative position between the article placing table 20 and the bending pin 60 is adjusted, that is, when the position of the flexible circuit board of the electronic component to be bent is aligned with the bending pin 60, the threaded hole on the article placing table 20 may be matched with a bolt, so that the bolt abuts against the bottom plate 11, and the article placing table 20 is fixed.

The movement of the object placing table 20 with respect to the bending pin 60 is not limited to the above-mentioned way of engaging the sliding groove with the sliding rail, but in another example, a plurality of threaded holes may be provided on the bottom plate 11, which are sequentially arranged in the front-rear direction, and a through hole corresponding to the position of the threaded hole may be provided on the object placing table 20, and the front-rear position of the object placing table 20 may be adjusted by corresponding the through hole on the object placing table 20 to the threaded hole at a different position, and then the object placing table 20 may be fastened by sequentially passing a bolt through the through hole on the object placing table 20 and the corresponding threaded hole.

The position of the flexible circuit board of the electronic element on the object placing table 20 close to the free end can be aligned to the bending pin 60, the bending pin 60 is pressed to the position to perform primary pre-bending, then the position of the flexible circuit board of the electronic element on the object placing table 20 close to the fixed end (the end connected with the electronic element) is aligned to the bending pin 60 by moving the object placing table, and the bending pin is pressed to the position of the flexible circuit board close to the fixed end to perform secondary pre-bending so as to avoid the flexible circuit board from tilting and interfering with other electronic elements. In addition, before the flexible circuit board is bent for the second time near the fixed end, the object placing table 20 can be turned over by the turning mechanism to turn over the electronic element thereon. For example, the turnover mechanism may include a turnover motor, the driving end of the turnover motor is connected with the object placing table 20, the object placing table 20 is driven to rotate by the rotation of the turnover motor, the object placing table 20 is turned over by 180 degrees, and as a result, the flexible circuit board of the electronic component on the object placing table is also turned over by 180 degrees, and then the bending pin 60 is pressed down to bend the flexible circuit board for secondary bending, so as to release the stress at the fixing end, the flexible circuit board after the secondary bending is finally in a "Z" shape (as shown in fig. 7), the flexible circuit board in the "Z" shape can be stably maintained in the space between the electronic component and the main board, and cannot tilt, so that the occupation of extra space is avoided, and the interference with other electronic devices is also avoided.

Fig. 5 is a partially enlarged schematic view of fig. 4 shown in accordance with an exemplary embodiment of the present disclosure.

As shown in fig. 5, in some embodiments, bending device 100 further includes a compression assembly 70 for compressing camera module 200. The pressing assembly 70 may include a sliding rod 71, a pressing head 72, and a weight 73. The sliding rod 71 penetrates through the pressure plate 50 and is connected with the pressure plate 50 in a sliding manner. A sliding sleeve 74 can be fixed on the pressure plate 50, and is slidably connected with the sliding rod 71 through the sliding sleeve 74. The pressing head 72 is disposed at the lower end of the sliding rod 71 and corresponds to an electronic component (e.g., the camera module 200). The counterweight 73 is arranged at the upper end of the sliding rod 71. Wherein, under the state that the pressing plate 50 supports against the counter weight 73, the pressing head 72 can be driven to ascend or descend, and under the state that the pressing plate 50 is separated from the counter weight 73, the pressing head 72 supports against the electronic component (such as the camera module 200).

When the pressing plate 50 is in use, the upper end of the sliding sleeve 74 on the pressing plate 50 is in contact with the weight 73, and in this state, the pressing plate 50 supports the weight 73, the sliding rod 71 and the pressing head 72. Afterwards, press downwards through handheld handle 83, handle 83 drives depression bar 82 through connecting rod 84 and slides downwards in sleeve 81, and along the steady downstream of guide 40 of both sides, balancing weight 73, slide bar 71 and pressure head 72 are along with clamp plate 50 downstream, when moving to pressure head 72 and support and press in module 200 of making a video recording, when pressure head 72 and module 200 of making a video recording contact promptly, clamp plate 50 continues the downstream relative slide bar 71, clamp plate 50 will break away from balancing weight 73, module 200 of making a video recording at this moment compresses tightly through the gravity of balancing weight 73, slide bar 71 and pressure head 72, promptly not receive the holding-down force of clamp plate 50. With such an arrangement, the possibility of damage to the camera module 200 due to excessive downward pressure from the platen 50 can be effectively prevented. The handle 83 is further pressed downward, so that the bending pin 60 presses the flexible circuit board 210 on the supporting stage 30 to bend the flexible circuit board 20. After the bending is completed, the handle 83 is lifted upwards, the handle 83 drives the pressing rod 82 to slide upwards in the sleeve 81 through the connecting rod 84, and the pressing rod 82 drives the pressing plate 50 and the bending pin 60 to move upwards together, so that the bending pin 60 leaves the flexible circuit board 20. Meanwhile, the pressing plate 50 moves upward relative to the sliding rod 71 close to the weight 73, and when the pressing plate 50 abuts against the weight 73 through the sliding sleeve 74, the sliding rod 71 supporting the weight 73 and the pressing head 72 move upward together, so that the pressing head 72 is separated from the lens base of the camera module 200. Then, the bent flexible circuit board 210 and the image pickup module 200 are taken out. In addition, the pressing force required for the camera module 200 can be matched by adapting the weight of the weight block 73 so that the camera module 200 is fastened to the stand 20. The weight 73 can be a weight, and can adapt to the pressing force of the camera module 200 according to the weight of different weights. The pressing head 72 can be made of flexible materials such as a silicon rubber block and a rubber block, so that the camera module 200 is prevented from being gouged and scratched by the hard materials.

In an embodiment, bending apparatus 100 may further include elastic member 90. The elastic member 90 is engaged with the guide and disposed between the bottom plate 11 and the pressing plate 50, for example, the elastic member 90 may be a spring, and the spring is sleeved on the guide and disposed between the bottom plate 11 and the pressing plate 50. The elastic member 90 may also be an elastic rubber member connected between the base plate 11 and the pressure plate 50.

The camera module 200 may be placed on the object mount 20, and then the flexible circuit board 210 extending from the mirror base may be mounted on the upper surface 31 of the support base 30. Then, the handle 83 is held and pressed downward, and the handle 83 drives the pressing rod 82 to slide downward in the sleeve 81 through the connecting rod 84 and move downward smoothly along the guide members 40 on both sides. In the process of downward movement of the pressing plate 50, the spring sleeved on the guide member 40 slowly moves at a constant speed, the pressing rod 82 drives the pressing plate 50 and the bending pin 60 to move downward together, meanwhile, the balancing weight 73, the sliding rod 71 and the pressing head 72 move downward along with the pressing plate 50, when the pressing head 72 is moved to abut against the camera module 200, namely, the pressing head 72 contacts with the camera module 200, because the pressing plate 50 moves downward, the pressing plate 50 can slowly move downward at a constant speed through the reaction force of the spring sleeved on the guide member 40, and thus the impact force on the camera module 200 can be reduced, in the process of downward movement of the pressing plate 50, the spring is compressed, and through the reaction force of the spring, the pressing plate 50 can slowly move downward at a constant speed, and thus the impact force on the camera module 200 can be reduced.

Fig. 3 is a schematic diagram illustrating a partial structure of a bending apparatus according to an exemplary embodiment of the present disclosure. As shown in fig. 3, in an embodiment, the object stage 20 is provided with one or more accommodating grooves 21 for accommodating electronic components. The shape of the receiving groove 21 can match with the shape of the electronic component to adapt to different electronic components. The containing groove 21 may have a gap with the electronic component, so as to protect the electronic component and prevent scratching on the one hand, and facilitate taking and placing on the other hand.

The plurality of receiving grooves 21 may be arranged side by side in the lateral direction. Correspondingly, a plurality of pressing assemblies 70 may be provided corresponding to the plurality of receiving grooves 21. For example, three receiving grooves 21 and three corresponding pressing assemblies 70 are shown in the figure. The accommodating groove 21 can improve the stability of the electronic component, and prevent the electronic component from moving when the bending pin bends the flexible circuit board 210, which affects the bending position accuracy.

In one example, the bottom of the receiving groove 21 is provided with a tapered pin 22 protruding upward. The taper pin 22 can play a role in positioning the camera module 200, and prevent the camera module 200 from shaking.

In summary, in the bending apparatus 100 of the present disclosure, when in use, the lens barrel of the camera module 200 can be placed downward in the accommodating slot on the object stage 20 and positioned by the tapered pin 22, and at this time, the lens base of the camera module 200 faces the direction of the pressing assembly 70. Then, the flexible circuit board 210 protruding from the mirror base is mounted on the upper surface 31 of the support stage 30. Then, the handle 83 is held and pressed downward, and the handle 83 drives the pressing rod 82 to slide downward in the sleeve 81 through the connecting rod 84 and move downward smoothly along the guide members 40 on both sides. In the process of downward movement of the pressing plate 50, the spring sleeved on the guide member 40 slowly moves at a constant speed, the pressing rod 82 drives the pressing plate 50 and the bending pin 60 to move downward together, meanwhile, the counterweight block 73, the sliding rod 71 and the pressing head 72 move downward along with the pressing plate 50, when the pressing head 72 moves to abut against the camera module 200, namely the pressing head 72 contacts with the camera module 200, because the pressing plate 50 moves downward, the pressing plate 50 can slowly move downward at a constant speed through the reaction force of the spring sleeved on the guide member 40, so that the impact force on the camera module 200 can be reduced, the pressing plate 50 continuously slides downward relative to the sliding rod 71, the pressing plate 50 is separated from the counterweight block 73, and the camera module 200 at the moment is pressed by the gravity of the counterweight block 73, the sliding rod 71 and the pressing head 72, namely is not pressed by the downward pressure of the pressing plate 50. The handle 83 is further pressed downward, so that the bending pin 60 presses the flexible circuit board 210 on the supporting stage 30 to bend the flexible circuit board 20. After the bending is completed, the handle 83 is lifted upwards, the handle 83 drives the pressing rod 82 to slide upwards in the sleeve 81 through the connecting rod 84, and the pressing rod 82 drives the pressing plate 50 and the bending pin 60 to move upwards together, so that the bending pin 60 leaves the flexible circuit board 20. Meanwhile, the pressing plate 50 moves upward relative to the sliding rod 71 close to the weight 73, and when the pressing plate 50 abuts against the weight 73 through the sliding sleeve 74, the sliding rod 71 supporting the weight 73 and the pressing head 72 move upward together, so that the pressing head 72 is separated from the lens base of the camera module 200. Then, the bent flexible circuit board 210 and the image pickup module 200 are taken out. The flexible circuit board 210 of the camera module 200 taken out has a folding line near the free end, and is bent. Then, the bent flexible circuit board 210 is mounted in the electronic device, so that the flexible circuit board 210 is effectively prevented from being tilted (arched), and interference with other devices is avoided, which is beneficial to ultra-thinning of the electronic device. Meanwhile, the flexible circuit board does not need to be bent by manually holding the tweezers, so that the safety of the flexible circuit board is improved, and the mounting efficiency can also be improved.

It is understood that "a plurality" in this disclosure means two or more, and other words are analogous. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. The singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It will be further understood that the terms "first," "second," and the like are used to describe various information and that such information should not be limited by these terms. These terms are only used to distinguish one type of information from another and do not denote a particular order or importance. Indeed, the terms "first," "second," and the like are fully interchangeable. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure.

It will be further understood that the terms "central," "longitudinal," "lateral," "front," "rear," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the present embodiment and to simplify the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation.

It will be further understood that, unless otherwise specified, "connected" includes direct connections between the two without the presence of other elements, as well as indirect connections between the two with the presence of other elements.

It is further to be understood that while operations are depicted in the drawings in a particular order, this is not to be understood as requiring that such operations be performed in the particular order shown or in serial order, or that all illustrated operations be performed, to achieve desirable results. In certain environments, multitasking and parallel processing may be advantageous.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (13)

1. A bending device, comprising:

the object placing table is used for placing an electronic element with a flexible circuit board, and one part of the flexible circuit board is suspended and extends out of the object placing table;

and the bending pin is positioned above the object placing table and can move downwards to press the flexible circuit board, so that the flexible circuit board is bent at the pressing position.

2. The bending device according to claim 1, further comprising:

the supporting table is arranged on the side surface of the object placing table, a step is formed between the upper surface of the supporting table and the side surface of the object placing table, and the free end of the flexible circuit board is placed on the upper surface of the supporting table.

3. The bending device according to claim 2, further comprising:

the pressing plate is positioned above the object placing table, and the bending pin is fixed on the pressing plate;

and the pressing component is connected with the pressing plate and used for pressing the pressing plate downwards.

4. The bending device according to claim 3, further comprising:

a guide member vertically disposed;

the pressing plate is connected with the guide piece in a sliding mode and ascends and descends along the guide piece.

5. The bending device according to claim 4, further comprising:

the base body comprises a bottom plate and a side plate connected with the bottom plate, wherein the lower end of the guide piece is fixed on the bottom plate, and the upper end of the guide piece is fixed on the side plate;

and the elastic piece is matched with the guide piece and is arranged between the bottom plate and the pressing plate.

6. The bending device according to claim 5,

the pressing component comprises a handle, a connecting rod and a pressing rod;

the upper end part of the handle is hinged with the side plate, and the lower end part of the handle is hinged with the upper end of the connecting rod;

the lower end of the pressure lever is fixedly connected with the pressure plate, and the upper end of the pressure lever is hinged with the lower end of the connecting rod.

7. The bending device according to claim 2,

the height of the bending pin relative to the step is adjustable; the lower end part of the bending pin is adjacent to the side surface of the object placing table.

8. The bending device according to claim 5, further comprising:

the limiting device is positioned below the pressing plate and used for limiting the stroke of the bending pin for pressing the flexible circuit board; the limiting device comprises a bulge arranged at the bottom of the pressing plate, and the bulge is abutted against the bottom plate to limit the stroke of the bending pin for pressing the flexible circuit board.

9. The bending device according to any one of claims 1 to 8, further comprising:

the turnover mechanism comprises a turnover motor, a driving end of the turnover motor is connected with the object placing table and drives the object placing table to rotate so as to turn over the electronic element with the flexible circuit board.

10. The bending device according to any one of claims 3 to 6, further comprising

A compression assembly, the compression assembly comprising:

the sliding rod penetrates through the pressing plate and is in sliding connection with the pressing plate;

the pressure head is arranged at the lower end of the sliding rod and corresponds to the electronic element;

the balancing weight is arranged at the upper end of the sliding rod;

the pressing head can be driven to ascend or descend under the condition that the pressing plate abuts against the balancing weight, and the pressing head abuts against the electronic element under the condition that the pressing plate is separated from the balancing weight.

11. The bending device according to claim 5,

the object placing table can move along the horizontal plane relative to the bending pin.

12. The bending device according to claim 11,

the bottom plate is provided with a sliding rail along the front-back direction, the bottom of the object placing table is provided with a sliding groove matched with the sliding rail, and the relative position of a flexible circuit board of the electronic element and the bending pin is changed through the sliding fit of the sliding groove and the sliding rail.

13. The bending device according to claim 1,

the object placing table is provided with one or more accommodating grooves for accommodating the electronic components;

the shapes of the accommodating groove and the electronic element in the matching area are matched.

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