CN214477373U - Mask plate and silicon wafer alignment device - Google Patents
Mask plate and silicon wafer alignment device Download PDFInfo
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- CN214477373U CN214477373U CN202120549905.XU CN202120549905U CN214477373U CN 214477373 U CN214477373 U CN 214477373U CN 202120549905 U CN202120549905 U CN 202120549905U CN 214477373 U CN214477373 U CN 214477373U
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Abstract
The utility model discloses a mask version and silicon chip alignment device, include: the silicon chip clamping component comprises a lower bottom plate and a lower clamping assembly; the mask plate clamping component can be arranged on the silicon wafer clamping component in a translation mode and comprises an upper bottom plate and an upper clamping assembly; and the adjusting component is used for translating the mask plate clamping component on the silicon wafer clamping component so as to align the mask plate on the mask plate clamping component with the silicon wafer on the silicon wafer clamping component. The utility model can realize the alignment and compaction requirements of the mask plate and the silicon wafer through a simple mechanism, and can obviously reduce the cost and the structural complexity; the utility model can realize the angle adjustment of the mask plate and the fine adjustment in two directions through the adjusting part, and can achieve the accurate alignment requirement; the utility model discloses a mask version clamping part can keep mask version and silicon chip to have certain clearance in the alignment process, can guarantee the compactness of mask version and silicon chip contact again when compressing tightly.
Description
Technical Field
The utility model relates to a receive the processing field a little, in particular to mask version and silicon chip alignment device.
Background
With the continuous development of the semiconductor industry, the research on semiconductors is not limited to large-scale enterprises with great capital strength and technical equipment reserves, more and more small and medium-sized enterprises are also put into the research and development of the semiconductor industry, and the key step in the research and development of semiconductors is the processing of silicon wafers. In the field of silicon wafer processing, it is a common method to process a silicon wafer through a mask. The processing method comprises the first steps of realizing the alignment of the mask plate and the patterns of the silicon wafer, and establishing the correct relation between the position, the direction and the deformation of the patterns on the silicon wafer and the patterns on the mask plate.
The alignment process of the mask plate is performed in a vacuum adsorption mode through a sucker, after the sucker adsorbs the mask plate and a silicon wafer, the mask plate and the silicon wafer are aligned and compressed by means of observation of a three-dimensional precision displacement table and a microscope, and efficient and accurate alignment can be achieved through the method. However, the vacuum adsorption mask alignment mode needs professional equipment, has the problems of high equipment cost and large occupied space, and is difficult to be applied to research and development occasions of laboratories of small and medium-sized enterprises or scientific research institutions.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that to the not enough among the above-mentioned prior art, provide a mask version and silicon chip aligning device.
In order to solve the technical problem, the utility model discloses a technical scheme is: a mask plate and silicon wafer alignment device comprises:
the silicon wafer clamping component comprises a lower base plate and a lower clamping assembly which is arranged on the lower base plate and used for clamping a silicon wafer;
the mask clamping component can be arranged on the silicon wafer clamping component in a translation mode and comprises an upper bottom plate and an upper clamping assembly which is arranged on the upper bottom plate and used for clamping a mask;
and an adjusting component, which is used for translating the mask plate clamping component on the silicon wafer clamping component so as to align the mask plate on the mask plate clamping component with the silicon wafer on the silicon wafer clamping component;
the adjusting component comprises an L-shaped positioning plate rotatably arranged on the lower bottom plate, at least two first adjusting screws arranged on a first positioning plate of the L-shaped positioning plate at intervals and at least two second adjusting screws arranged on a second positioning plate of the L-shaped positioning plate at intervals, the first positioning plate is vertically connected with the second positioning plate, the joint of the first positioning plate and the second positioning plate is rotatably connected with the lower bottom plate, and the first adjusting screws and the second adjusting screws respectively press two mutually vertical surfaces of the upper bottom plate to realize the adjustment of the plane position of the upper bottom plate on the lower bottom plate.
Preferably, the device further comprises two feelers which are detachably connected to the adjusting part and have different thicknesses.
Preferably, the thickness of one of the feelers is greater than the sum of the thicknesses of the silicon wafer and the mask, and the thickness of the other feeler is less than the sum of the thicknesses of the silicon wafer and the mask.
Preferably, a rotating shaft pin connected with the lower bottom plate is arranged at the joint of the first positioning plate and the second positioning plate, and a bearing is sleeved on the rotating shaft pin.
Preferably, a plurality of ball plungers are further arranged on the upper base plate at intervals, and ball heads at the bottoms of the ball plungers are pressed against the upper surface of the lower base plate.
Preferably, the lower clamping assembly comprises two first lower clamping blocks arranged at one end of the lower base plate and symmetrically distributed on two sides of the silicon wafer, and one second lower clamping block arranged on the lower base plate and located at the opposite side of the two first lower clamping blocks.
Preferably, the first lower clamping block is provided with first lower clamping planes tangential to the excircle of the silicon wafer, and the two first lower clamping planes are symmetrically distributed on two sides of the silicon wafer in a V shape.
Preferably, the second lower clamping block is in contact with the cut edge of the silicon wafer through a second lower clamping plane, and the symmetry axes of the two first lower clamping planes are coincident with the perpendicular bisector of the second lower clamping plane.
Preferably, the upper clamping assembly comprises two first upper clamping blocks arranged at one end of the upper base plate and symmetrically distributed on two sides of the mask plate, and a second upper clamping block arranged on the upper base plate and positioned on the opposite side of the two first upper clamping blocks;
the first upper clamping block is provided with first upper clamping planes tangent to the excircle of the mask, and the two first upper clamping planes are symmetrically distributed on two sides of the mask in a V shape.
Preferably, the second upper clamping block is in contact with the cut edge of the reticle through a second upper clamping plane, and a symmetry axis of the two first upper clamping planes coincides with a perpendicular bisector of the second upper clamping plane.
The utility model has the advantages that:
the utility model discloses a mask plate and silicon chip alignment device can realize the alignment and the compaction requirement of mask plate and silicon chip through simple mechanism, can show reduce cost and structural complexity;
the utility model can realize the angle adjustment of the mask plate and the fine adjustment in two directions through the adjusting part, and can achieve the accurate alignment requirement;
the utility model discloses a mask version clamping part can keep mask version and silicon chip to have certain clearance in the alignment process, can guarantee the compactness of mask version and silicon chip contact again when compressing tightly.
Drawings
FIG. 1 is a schematic structural view of a mask plate and silicon wafer alignment apparatus according to the present invention;
FIG. 2 is a schematic structural view of the mask plate and silicon wafer alignment apparatus of the present invention;
FIG. 3 is a schematic structural view of the mask plate and silicon wafer alignment apparatus of the present invention;
FIG. 4 is a schematic structural view of the mask plate and silicon wafer alignment apparatus of the present invention;
fig. 5 is a schematic structural diagram of the mask plate and silicon wafer alignment apparatus of the present invention.
Description of reference numerals:
1-a silicon wafer clamping component; 10-lower bottom plate; 11-a lower clamping assembly; 12-a first lower clamping block; 13-a second lower clamping block; 14 — a first lower clamping plane; 15-a second lower clamping plane; 16-a support portion;
2-reticle clamping member; 20-upper base plate; 21 — an upper clamping assembly; 22 — a first upper clamping block; 23-a second upper clamping block; 24 — a first upper clamping plane; 25-a second upper clamping plane; 26-ball plunger;
3-an adjustment member; 30-an L-shaped positioning plate; 31 — a first positioning plate; 32-a second positioning plate; 33-a first adjusting screw; 34-a second adjusting screw; 35-a pivot pin; 36-a bearing;
4-a silicon wafer; 5, masking a plate; 6-clearance gauge.
Detailed Description
The present invention is further described in detail below with reference to examples so that those skilled in the art can implement the invention with reference to the description.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
As shown in fig. 1 to 5, an alignment apparatus for a reticle and a silicon wafer according to this embodiment includes:
the silicon wafer clamping component 1 comprises a lower base plate 10 and a lower clamping assembly 11 which is arranged on the lower base plate 10 and is used for clamping the silicon wafer 4;
the mask clamping component 2 is arranged on the silicon wafer clamping component 1 in a translation mode, and the mask clamping component 2 comprises an upper base plate 20 and an upper clamping assembly 21 which is arranged on the upper base plate 20 and used for clamping a mask 5;
the adjusting component 3 is used for translating the mask plate clamping component 2 on the silicon wafer clamping component 1 so as to align the mask plate 5 on the mask plate clamping component 2 with the silicon wafer 4 on the silicon wafer clamping component 1;
the adjusting component 3 comprises an L-shaped positioning plate 30 rotatably disposed on the lower base plate 10, at least two first adjusting screws 33 disposed on a first positioning plate 31 of the L-shaped positioning plate 30 at intervals, and at least two second adjusting screws 34 disposed on a second positioning plate 32 of the L-shaped positioning plate 30 at intervals, the first positioning plate 31 and the second positioning plate 32 are vertically connected, a connection part of the first positioning plate 31 and the second positioning plate 32 is rotatably connected with the lower base plate 10, and the first adjusting screws 33 and the second adjusting screws 34 respectively press against two mutually perpendicular surfaces of the upper base plate 20 to adjust the plane position of the upper base plate 20 on the lower base plate 10. In this embodiment, the first adjusting screw 33 and the second adjusting screw 34 each include two screws, and the first adjusting screw 33 and the second adjusting screw 34 apply pushing forces to the upper plate 20 from two directions, so that the position of the upper plate 20 relative to the lower plate 10 in the X direction and the Y direction can be adjusted.
After the mask clamping component 2 is reversely arranged on the silicon wafer clamping component 1, the L-shaped positioning plate 30 can rotate relative to the lower bottom plate 10, so that the upper bottom plate 20 is pushed to rotate by the rotation of the L-shaped positioning plate 30 to adjust the larger angle deviation between the mask 5 and the silicon wafer 4; after the angle of the L-shaped positioning plate 30 is adjusted, the L-shaped positioning plate 30 is connected to the upper base plate 20 through a screw (pre-tightening can be performed firstly, and fastening is performed after subsequent fine adjustment), the L-shaped positioning plate 30 is fixedly connected to the lower base plate 10 through a screw, then the first adjusting screw 33 and the second adjusting screw 34 are adjusted, the upper base plate 20 is subjected to fine adjustment through jacking the upper base plate 20, so that the relative position of the mask plate 5 and the silicon wafer 4 is finely adjusted, and the pattern alignment of the mask plate 5 and the silicon wafer 4 is realized through microscope observation.
In a preferred embodiment, a rotating shaft pin 35 connected with the lower base plate 10 is arranged at the joint of the first positioning plate 31 and the second positioning plate 32, and a bearing 36 is sleeved on the rotating shaft pin 35. The L-shaped positioning plate 30 is engaged with the pivot pin 35 through the bearing 36 so as to be freely rotatable on the lower plate 10.
In a preferred embodiment, a plurality of ball plungers 26 are further provided at intervals on the upper base plate 20, and the ball heads at the bottoms of the ball plungers 26 are pressed against the upper surface of the lower base plate 10. The ball plunger 26 is used for jacking the mask clamping component 2 in the alignment process, so that a gap exists between the mask 5 and the silicon wafer 4, abrasion caused during relative sliding adjustment in the alignment process is avoided, and the ball of the ball plunger 26 shrinks during pressing to realize tight pressing of the mask 5 and the silicon wafer 4.
In a preferred embodiment, the lower clamping assembly 11 includes two first lower clamping blocks 12 disposed at one end of the lower base plate 10 and symmetrically distributed on both sides of the silicon wafer 4, and one second lower clamping block 13 disposed on the lower base plate 10 at an opposite side of the two first lower clamping blocks 12. The first lower clamping block 12 is provided with a first lower clamping plane 14 tangent to the excircle of the silicon wafer 4, and the two first lower clamping planes 14 are symmetrically distributed on two sides of the silicon wafer 4 in a V shape. The second lower clamping block 13 is contacted with the cut edge of the silicon wafer 4 through a second lower clamping plane 15, and the symmetry axes of the two first lower clamping planes are superposed with the perpendicular bisector of the second lower clamping plane 15. The silicon chip 4 is clamped by applying extrusion force through the two first lower clamping blocks 12 and the second lower clamping block 13, and the height of the surface of the clamped silicon chip 4 slightly protrudes out of the surfaces of the first lower clamping blocks 12 and the second lower clamping block 13.
In a preferred embodiment, the upper clamp assembly 21 includes two first upper clamp blocks 22 disposed at one end of the upper base plate 20 and symmetrically distributed on both sides of the reticle 5, and one second upper clamp block 23 disposed on the upper base plate 20 at an opposite side of the two first upper clamp blocks 22; the first upper clamping block 22 is provided with first upper clamping planes 24 tangent to the excircle of the mask 5, and the two first upper clamping planes 24 are symmetrically distributed on two sides of the mask 5 in a V shape. The second upper clamping block 23 is in contact with the cut edge of the reticle 5 through a second upper clamping plane 25, and the symmetry axes of the two first upper clamping planes 24 coincide with the perpendicular bisector of the second upper clamping plane 25. The clamping of the mask plate 5 is realized by applying a pressing force through the two first upper clamping blocks 22 and the second upper clamping block 23, and the surface of the clamped mask plate 5 slightly protrudes out of the surfaces of the first upper clamping blocks 22 and the second upper clamping block 23.
In a preferred embodiment, the lower plate 10 is further provided with a support portion 16, and the support portion 16 is provided with a hole for the L-shaped positioning plate 30 to be connected and fixed.
In a preferred embodiment, the reticle 5 and silicon wafer 4 alignment apparatus further comprises two feelers 6 having different thicknesses removably attached to the adjustment member 3. One of the feelers 6 (thick feeler 6) is thicker than the sum of the thicknesses of the silicon chip 4 and the mask 5, and the other feeler 6 (thin feeler 6) is thinner than the sum of the thicknesses of the silicon chip 4 and the mask 5. The two feelers 6 can be used to determine whether the upper plate 20 and the lower plate 10 are pressed properly (the pressing between the upper plate 20 and the lower plate 10 is achieved by screw fastening): in the pressing process, the thick feeler 6 cannot be plugged into the gap between the upper base plate 20 and the lower base plate 10, and when the thin feeler 6 can be plugged, the pressing force is proper, so that the contact tightness of the mask 5 and the silicon wafer 4 can be ensured.
While the embodiments of the invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments, which are fully applicable in all kinds of fields where the invention is suitable, and further modifications may readily be made by those skilled in the art, and the invention is therefore not limited to the specific details without departing from the general concept defined by the claims and the scope of equivalents.
Claims (10)
1. A mask and silicon wafer alignment device is characterized by comprising:
the silicon wafer clamping component comprises a lower base plate and a lower clamping assembly which is arranged on the lower base plate and used for clamping a silicon wafer;
the mask clamping component can be arranged on the silicon wafer clamping component in a translation mode and comprises an upper bottom plate and an upper clamping assembly which is arranged on the upper bottom plate and used for clamping a mask;
and an adjusting component, which is used for translating the mask plate clamping component on the silicon wafer clamping component so as to align the mask plate on the mask plate clamping component with the silicon wafer on the silicon wafer clamping component;
the adjusting component comprises an L-shaped positioning plate rotatably arranged on the lower bottom plate, at least two first adjusting screws arranged on a first positioning plate of the L-shaped positioning plate at intervals and at least two second adjusting screws arranged on a second positioning plate of the L-shaped positioning plate at intervals, the first positioning plate is vertically connected with the second positioning plate, the joint of the first positioning plate and the second positioning plate is rotatably connected with the lower bottom plate, and the first adjusting screws and the second adjusting screws respectively press two mutually vertical surfaces of the upper bottom plate to realize the adjustment of the plane position of the upper bottom plate on the lower bottom plate.
2. The reticle and silicon wafer alignment device of claim 1, further comprising two feelers having different thicknesses removably attached to the adjustment member.
3. The reticle and silicon wafer alignment device of claim 2, wherein one of the feelers has a thickness greater than the sum of the thicknesses of the silicon wafer and the reticle and the other feeler has a thickness less than the sum of the thicknesses of the silicon wafer and the reticle.
4. The alignment device for the mask and the silicon wafer according to claim 1, wherein a rotating shaft pin connected with the lower base plate is arranged at the joint of the first positioning plate and the second positioning plate, and a bearing is sleeved on the rotating shaft pin.
5. The mask and silicon wafer alignment device according to claim 1, wherein a plurality of ball plungers are further arranged on the upper base plate at intervals, and balls at the bottoms of the ball plungers are pressed against the upper surface of the lower base plate.
6. The reticle and wafer alignment device of claim 5, wherein the lower clamping assembly comprises two first lower clamping blocks disposed at one end of the lower base plate and symmetrically distributed on both sides of the wafer and one second lower clamping block disposed on the lower base plate and on opposite sides of the two first lower clamping blocks.
7. The mask and silicon wafer alignment device according to claim 6, wherein the first lower clamping block has a first lower clamping plane tangent to the outer circle of the silicon wafer, and the two first lower clamping planes are symmetrically distributed on two sides of the silicon wafer in a V shape.
8. The reticle and wafer alignment device of claim 7, wherein the second lower clamping block contacts the cut edge of the wafer through a second lower clamping plane, and the symmetry axes of the two first lower clamping planes coincide with the perpendicular bisector of the second lower clamping plane.
9. The reticle and silicon wafer alignment device of claim 5, wherein the upper clamping assembly comprises two first upper clamping blocks disposed at one end of the upper base plate and symmetrically distributed on both sides of the reticle and one second upper clamping block disposed on the upper base plate and on opposite sides of the two first upper clamping blocks;
the first upper clamping block is provided with first upper clamping planes tangent to the excircle of the mask, and the two first upper clamping planes are symmetrically distributed on two sides of the mask in a V shape.
10. The reticle and silicon wafer alignment device of claim 9, wherein the second upper clamping block contacts the cut edge of the reticle through a second upper clamping plane, and the symmetry axes of the two first upper clamping planes coincide with the perpendicular bisector of the second upper clamping plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120549905.XU CN214477373U (en) | 2021-03-17 | 2021-03-17 | Mask plate and silicon wafer alignment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120549905.XU CN214477373U (en) | 2021-03-17 | 2021-03-17 | Mask plate and silicon wafer alignment device |
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| Publication Number | Publication Date |
|---|---|
| CN214477373U true CN214477373U (en) | 2021-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120549905.XU Active CN214477373U (en) | 2021-03-17 | 2021-03-17 | Mask plate and silicon wafer alignment device |
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| CN (1) | CN214477373U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113066747A (en) * | 2021-03-17 | 2021-07-02 | 中国科学院苏州生物医学工程技术研究所 | Mask plate and silicon wafer alignment device |
| CN113066747B (en) * | 2021-03-17 | 2024-05-17 | 中国科学院苏州生物医学工程技术研究所 | Mask and silicon wafer alignment device |
-
2021
- 2021-03-17 CN CN202120549905.XU patent/CN214477373U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113066747A (en) * | 2021-03-17 | 2021-07-02 | 中国科学院苏州生物医学工程技术研究所 | Mask plate and silicon wafer alignment device |
| CN113066747B (en) * | 2021-03-17 | 2024-05-17 | 中国科学院苏州生物医学工程技术研究所 | Mask and silicon wafer alignment device |
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