CN214477346U - Cooling device for vacuum eutectic welding - Google Patents
Cooling device for vacuum eutectic welding Download PDFInfo
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- CN214477346U CN214477346U CN202120456975.0U CN202120456975U CN214477346U CN 214477346 U CN214477346 U CN 214477346U CN 202120456975 U CN202120456975 U CN 202120456975U CN 214477346 U CN214477346 U CN 214477346U
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- longitudinal channel
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- heat transfer
- vacuum eutectic
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Abstract
The utility model discloses a cooling device for vacuum eutectic welding, which is used for cooling a chip on a jig, the cooling device for vacuum eutectic welding comprises a heat transfer plate, a cooling plate and a temperature sensor, wherein the heat transfer plate and the cooling plate are mutually attached, the cooling plate is provided with a plurality of transverse channels and a plurality of longitudinal channels which are mutually vertical, the transverse channels comprise a first transverse channel and a second transverse channel which are mutually parallel, the longitudinal channels comprise a first longitudinal channel, a second longitudinal channel and a third longitudinal channel which are mutually parallel, the first longitudinal channel is provided with a water inlet, the third longitudinal channel is provided with a water outlet, the temperature sensor is arranged between the first longitudinal channel and the second longitudinal channel, the distance between the first longitudinal channel and the second longitudinal channel is L1, the distance between the second longitudinal channel and the third longitudinal channel is L2, and L1 > L2. By setting L1 to be more than L2, the cooling plate is cooled uniformly, and further the chip is cooled uniformly.
Description
Technical Field
The utility model relates to a vacuum eutectic welds technical field, especially, relates to a cooling device for vacuum eutectic welds.
Background
Adopt vacuum eutectic welding technique usually during the welding chip among the prior art, however, current vacuum eutectic welding adopts a vacuum chamber to carry out heating first aftercooling to the chip usually, and this heating device and cooling device set gradually in vacuum chamber below from top to bottom, consequently, adopt in a vacuum chamber earlier to cool off the chip after the chip heating, when cooling the chip, at first need cool off heating device, then just can cool off the chip, and the cooling effect is not good, and process time is longer.
SUMMERY OF THE UTILITY MODEL
Therefore, a cooling device for vacuum eutectic welding with good cooling effect and short processing time is needed.
The utility model provides a technical scheme that its technical problem adopted is: a cooling device for vacuum eutectic welding is used for cooling a chip on a jig, and comprises a heat transfer plate and a cooling plate which are mutually attached, and a temperature sensor arranged on the cooling plate, wherein the jig is movably arranged on the heat transfer plate, a plurality of transverse channels and a plurality of longitudinal channels which are mutually vertical are arranged on the cooling plate, the transverse channels comprise a first transverse channel and a second transverse channel which are mutually parallel, the longitudinal channels comprise a first longitudinal channel, a second longitudinal channel and a third longitudinal channel which are mutually parallel, a water inlet communicated with the first longitudinal channel is arranged on the first longitudinal channel, a water outlet communicated with the third longitudinal channel is arranged on the third longitudinal channel, and the temperature sensor is arranged between the first longitudinal channel and the second longitudinal channel, the distance between the first longitudinal channel and the second longitudinal channel is L1, the distance between the second longitudinal channel and the third longitudinal channel is L2, L1 > L2.
Furthermore, the opening directions of the water inlet and the water outlet are both arranged downwards.
Furthermore, a through hole is formed in the cooling plate, the temperature sensor is arranged in the through hole, and the through hole is arranged in the middle position between the first longitudinal channel and the second longitudinal channel.
Furthermore, a groove is formed in the surface of one side, close to the heat transfer plate, of the cooling plate, and the cross section of the groove is of a U-shaped structure.
Further, the cooling device for vacuum eutectic welding further comprises a connecting plate, the connecting plate is connected with the cooling plate, and the heat transfer plate is connected with the cooling plate and the cooling plate is connected with the connecting plate through bolts.
Furthermore, the heat transfer plate is provided with a through hole, the cooling plate is provided with a threaded hole, and the hole wall of the threaded hole is provided with a thread matched with the bolt.
Further, the water inlet and the water outlet are both connected with a liquid supply part.
Further, the heat transfer plate and the cooling plate are both made of copper material, and the connection plate is made of gray cast iron material.
Further, the surfaces of the heat transfer plate, the cooling plate and the connecting plate are all subjected to chrome plating treatment.
Further, the model of the temperature sensor is PT 100.
The utility model has the advantages that: the utility model provides a cooling device for vacuum eutectic welding, get into the cooling water to first vertical passageway in through the water inlet, then through first transverse channel, the second transverse channel gets into to the vertical passageway of second in, at last through first transverse channel, the second transverse channel gets into to flow from the delivery port behind the vertical passageway of third, through setting up L1 > L2, thereby realize the even cooling of cooling plate, and then on transmitting the chip to the tool through the heat transfer plate, realize evenly cooling the chip.
Drawings
The present invention will be further explained with reference to the drawings and examples.
FIG. 1 is a schematic structural view of a cooling device for vacuum eutectic bonding according to the present invention;
FIG. 2 is a front view of the cooling apparatus for vacuum eutectic bonding shown in FIG. 1;
FIG. 3 is a cross-sectional view taken along A-A of the cooling apparatus for vacuum eutectic bonding shown in FIG. 2;
fig. 4 is a schematic structural view of a cooling plate in the cooling apparatus for vacuum eutectic bonding shown in fig. 1.
The names and the numbers of the parts in the figure are respectively as follows:
heat transfer plate 1, cooling plate 2 and connecting plate 3
First transverse channel 211 second transverse channel 212 first longitudinal channel 221
Second longitudinal channel 222 third longitudinal channel 223 inlet 210
Through hole 11 and threaded hole 20
Detailed Description
The present invention will now be described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, and merely illustrates the basic structure of the present invention in a schematic manner, and therefore it shows only the constitution related to the present invention.
Referring to fig. 1 to 4, the present invention provides a cooling device for vacuum eutectic bonding, which cools a chip on a jig, wherein the cooling device for vacuum eutectic bonding comprises a heat transfer plate 1, a cooling plate 2 and a connecting plate 3, which are attached to each other, the cooling plate 2 is disposed between the heat transfer plate 1 and the connecting plate 3, the heat transfer plate 1 is disposed above the cooling plate 2, the connecting plate 3 is disposed below the cooling plate 2, and the jig is movably disposed on the heat transfer plate 1.
In the present embodiment, the heat transfer plate 1 and the cooling plate 2 are each made of copper material, and the connection plate 3 is made of gray cast iron material. Further, the surfaces of the heat transfer plate 1, the cooling plate 2, and the connection plate 3 are each subjected to a chromium plating treatment, so that the hardness and corrosion resistance of the surfaces of the heat transfer plate 1, the cooling plate 2, and the connection plate 3 can be improved. Set up heat transfer plate 1, can pass through heat transfer plate 1 with the heat on the cooling plate 2 and carry out even cooling to the chip on the tool on the one hand, on the other hand can reduce the wearing and tearing to cooling plate 2. In addition, a connecting plate 3 is provided, and the connecting plate 3 can play a role in supporting and connecting.
The heat transfer plate 1 and the cooling plate 2 and the connecting plate 3 are detachably connected, and in the present embodiment, the heat transfer plate 1 and the cooling plate 2 and the connecting plate 3 are connected by bolts 4. It can be understood that the heat transfer plate 1 is provided with a through hole 11, the cooling plate 2 is provided with a threaded hole 20, and the wall of the threaded hole 20 is provided with a thread matching with the bolt 4. When the bolt 4 is installed, the bolt passes through the through hole 11 and then is in threaded connection with the threaded hole 20.
The cooling plate 2 is provided with a transverse channel 21 and a longitudinal channel 22 which are perpendicular to each other, the transverse channel 21 and the longitudinal channel 22 are communicated with each other, the transverse channel 21 and the longitudinal channel 22 are provided with a plurality of channels, the number of the transverse channels 21 is two, the number of the longitudinal channels 22 is three, the transverse channels 21 include a first transverse channel 211 and a second transverse channel 212 which are parallel to each other, the longitudinal channels 22 include a first longitudinal channel 221, a second longitudinal channel 222 and a third longitudinal channel 223 which are parallel to each other, a water inlet 210 is formed in the first longitudinal channel 221, the water inlet 210 is communicated with the first longitudinal channel 221, a water outlet 220 is formed in the third longitudinal channel 223, the water outlet 220 is communicated with the third longitudinal channel 223, the opening directions of the water inlet 210 and the water outlet 220 are both arranged downwards, and the water inlet 210 and the water outlet 220 are both used for being connected with a liquid supply part (not shown in the figure).
In the present embodiment, the transverse channels 21 and the longitudinal channels 22 are both blind-drilled through the side wall of the cooling plate 2 and then plugged with long screws to be closed.
Further, the distance between the first longitudinal channel 221 and the second longitudinal channel 222 is L1, and the distance between the second longitudinal channel 222 and the third longitudinal channel 223 is L2, in this embodiment, L1 > L2. By providing L1 > L2, the cooling plate 2 can be cooled uniformly.
The cooling plate 2 is provided with a through hole 23, and the cooling device for vacuum eutectic bonding further comprises a temperature sensor (not shown) disposed in the through hole 23, wherein the through hole 23 is disposed at an intermediate position between the first longitudinal channel 221 and the second longitudinal channel 222, so that the temperature sensor detects the temperature of the heat transfer plate 1 in real time. In the present embodiment, the temperature sensor has a model number PT 100.
The cooling plate 2 is provided with a groove 24 on the surface of one side close to the heat transfer plate 1, the cross section of the groove 24 is of a U-shaped structure, the number of the grooves 24 is two, and the two grooves 24 are used for detecting the threading temperature of the sensor.
During the use, with cooling water through water inlet 210 entering to first longitudinal channel 221 in, then enter into second longitudinal channel 222 via first transverse channel 211, second transverse channel 212 in, enter into third longitudinal channel 223 through first transverse channel 211, second transverse channel 212 at last and flow out from delivery port 220 to realize cooling plate 2 even cooling, and then transmit to the chip on the tool through heat transfer plate 1, realize cooling the chip.
The utility model provides a cooling device for vacuum eutectic soldering, get into the cooling water to first vertical passageway 221 in through water inlet 210, then via first transverse channel 211, second transverse channel 212 gets into to the vertical passageway 222 of second in, at last through first transverse channel 211, second transverse channel 212 gets into to flow from delivery port 220 behind the vertical passageway 223 of third, through setting up L1 > L2, thereby realize 2 even coolings of cooling plate, and then on transmitting the chip to the tool through heat transfer plate 1, realize evenly cooling the chip.
In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. The utility model provides a cooling device for vacuum eutectic welds for cool off the chip on the tool, its characterized in that: the cooling device for vacuum eutectic welding comprises a heat transfer plate, a cooling plate and a temperature sensor, wherein the heat transfer plate and the cooling plate are attached to each other, the temperature sensor is arranged on the cooling plate, the jig is movably arranged on the heat transfer plate, the cooling plate is provided with a plurality of transverse channels and a plurality of longitudinal channels which are perpendicular to each other, the transverse channels comprise a first transverse channel and a second transverse channel which are parallel to each other, the longitudinal channels comprise a first longitudinal channel, a second longitudinal channel and a third longitudinal channel which are parallel to each other, the first longitudinal channel is provided with a water inlet communicated with the first longitudinal channel, the third longitudinal channel is provided with a water outlet communicated with the third longitudinal channel, the temperature sensor is arranged between the first longitudinal channel and the second longitudinal channel, and the distance between the first longitudinal channel and the second longitudinal channel is L1, the distance between the second longitudinal channel and the third longitudinal channel is L2, L1 > L2.
2. The cooling apparatus for vacuum eutectic soldering of claim 1, wherein: the opening directions of the water inlet and the water outlet are both arranged downwards.
3. The cooling apparatus for vacuum eutectic soldering of claim 2, wherein: the cooling plate is provided with a through hole, the temperature sensor is arranged in the through hole, and the through hole is arranged in the middle position between the first longitudinal channel and the second longitudinal channel.
4. A cooling apparatus for vacuum eutectic soldering as set forth in claim 3, wherein: the surface of one side of the cooling plate, which is close to the heat transfer plate, is provided with a groove, and the section of the groove is of a U-shaped structure.
5. The cooling apparatus for vacuum eutectic soldering of claim 1, wherein: the cooling device for vacuum eutectic welding further comprises a connecting plate, the connecting plate is connected with the cooling plate, and the heat transfer plate is connected with the cooling plate and the cooling plate is connected with the connecting plate through bolts.
6. The cooling apparatus for vacuum eutectic soldering of claim 5, wherein: the heat transfer plate is provided with a through hole, the cooling plate is provided with a threaded hole, and the hole wall of the threaded hole is provided with threads matched with the bolt.
7. The cooling apparatus for vacuum eutectic soldering of claim 2, wherein: the water inlet and the water outlet are both connected with a liquid supply part.
8. The cooling apparatus for vacuum eutectic soldering of claim 6, wherein: the heat transfer plate and the cooling plate are both made of copper material, and the connecting plate is made of gray cast iron material.
9. The cooling apparatus for vacuum eutectic soldering of claim 8, wherein: the surfaces of the heat transfer plate, the cooling plate and the connecting plate are all subjected to chromium plating treatment.
10. The cooling apparatus for vacuum eutectic soldering of claim 1, wherein: the model of the temperature sensor is PT 100.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120456975.0U CN214477346U (en) | 2021-03-02 | 2021-03-02 | Cooling device for vacuum eutectic welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120456975.0U CN214477346U (en) | 2021-03-02 | 2021-03-02 | Cooling device for vacuum eutectic welding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214477346U true CN214477346U (en) | 2021-10-22 |
Family
ID=78152222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120456975.0U Active CN214477346U (en) | 2021-03-02 | 2021-03-02 | Cooling device for vacuum eutectic welding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214477346U (en) |
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2021
- 2021-03-02 CN CN202120456975.0U patent/CN214477346U/en active Active
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