CN214474828U

CN214474828U - Split 2U case heat dissipation structure of arranging

Info

Publication number: CN214474828U
Application number: CN202120896057.XU
Authority: CN
Inventors: 唐小景; 黄晶
Original assignee: Wuhan Pansheng Dingcheng Technology Co ltd
Current assignee: Wuhan Pansheng Dingcheng Technology Co ltd
Priority date: 2021-04-27
Filing date: 2021-04-27
Publication date: 2021-10-22
Anticipated expiration: 2031-04-27

Abstract

The utility model discloses a split 2U case heat dissipation arrangement structure, which is suitable for a cabinet working in a vertical air channel; the device comprises a first case and a second case which are arranged side by side from front to back, wherein the back side surface of the first case is detachably connected with the back side surface of the second case through a connecting piece; a first system is arranged in the first case, and a second system is arranged in the second case; a first air outlet is arranged on the front plate of the first case, and a second air outlet is arranged on the front plate of the second case; air inlets are formed in the two sides of the middle connecting part of the first case and the second case; three groups of fans are sequentially arranged from left to right in the middle of the first system and the second system. In such a way, the case is arranged into two detachable cases, and one set of system is independently arranged in each case, so that the case can be split into two cases and is suitable for the cabinet in the vertical air duct, air is fed into the case from the left side and the right side, and air is blown to the front side and the rear side through the action of the fan, and the heat dissipation effect is enhanced.

Description

Split 2U case heat dissipation structure of arranging

Technical Field

The utility model relates to a computer field especially relates to a structure is arranged in heat dissipation of split formula 2U machine case.

Background

From cloud gaming platforms, to cloud enterprise offices, and then to cloud class classrooms, PC Farm has been widely used. The PC Farm product scheme supports Intel core series processor products, and can be widely applied to daily application scenes such as cloud enterprise office and cloud class classrooms after being loaded with an i3/i5 processor. The PC Farm cloud game scheme aims to utilize cloud terminals to construct computer network computing capacity, centralize multi-user, multi-desktop and multi-environment user systems together for unified management, reduce terminal investment, reduce network facility management and maintenance difficulty and achieve the purpose of saving manpower and material resource cost. In the process of high-speed operation of the server, all electronic components in the 2U case can dissipate heat, so that the internal temperature rises, the operation of the server is influenced, the server is severely crashed or even damaged, and therefore, the system which can quickly dissipate heat and cool various components is added in the case.

The 2U chassis is a most commonly used U server chassis, and the cabinet accommodating the 2U chassis is generally located at a horizontal air duct or a vertical air duct, so that the 2U chassis is supplied with air from a front plate or from both sides. The corresponding 2U case is not designed aiming at the air duct of the specific cabinet in the current market, so that the overall heat dissipation effect of the 2U case is better.

The prior art discloses a do benefit to radiating 2U vehicle server of hard disk, including quick-witted case, fix mainboard subassembly, power supply module, the hard disk subassembly in quick-witted case, the left front side angle of quick-witted case is equipped with the square region of being enclosed by the baffle, square region is used for the installation of hard disk subassembly, be equipped with the air intake on the front panel that square region corresponds, with be provided with radiator fan on the baffle that the front panel is relative. Although the technology can radiate the computer to a certain degree, the air duct formed in the computer is unstable in flowing, the whole layout is too crowded, the radiating effect is not good, and the case with the structure can not be detached and can only be used as a whole.

Therefore, it is necessary to design a detachable 2U case heat dissipation arrangement structure with simple structure, stable air duct, good heat dissipation effect, and the case can be detached into two independent systems for independent use.

SUMMERY OF THE UTILITY MODEL

In order to overcome the problems, the utility model provides a split 2U case heat dissipation arrangement structure, which can be split into two cases for use by arranging the cases into two detachable cases and arranging a set of system in each case; the left and right sides of the box body are air inlets, the front and back sides are air outlets, three groups of fans are arranged between the two systems, the box body is suitable for a cabinet in a vertical air channel, air is fed into the box body from the left and right sides, and air is blown to the front and back sides under the action of the fans, and the heat dissipation effect is enhanced.

In order to achieve the above object, the utility model adopts the following technical scheme:

a split 2U case heat dissipation arrangement structure is suitable for a cabinet working in a vertical air duct; the device comprises a first case and a second case which are arranged side by side from front to back, wherein the back side surface of the first case is detachably connected with the back side surface of the second case through a connecting piece; a first system is arranged in the first case, and a second system is arranged in the second case; a first air outlet is formed in the front plate of the first case, and a second air outlet is formed in the front plate of the second case; air inlets are formed in two sides of the middle connecting part of the first case and the second case; three groups of fans are sequentially arranged in the middle of the first system and the second system from left to right.

Furthermore, the first system comprises a first mainboard fixed in the first chassis and a first power supply assembly arranged above the first mainboard, and a first CPU assembly and a first video card assembly are sequentially arranged on the first mainboard from top to bottom; the second system comprises a second mainboard fixed in the second case and a second power supply assembly arranged below the second mainboard, and a second CPU assembly and a second video card assembly are sequentially arranged on the second mainboard from bottom to top.

Further, the three fans comprise a first fan for radiating the second graphics card assembly, two second fans respectively used for radiating the first CPU assembly and the second CPU assembly, and a third fan for radiating the first graphics card assembly.

Further, a first I/O interface module disposed on the first motherboard passes through the front side of the first chassis and serves as a first I/O interface end.

Further, a first power interface module arranged on the first power supply assembly passes through the front side of the first chassis and serves as a first power interface end.

Further, a second I/O interface module disposed on the second motherboard passes through a rear side of the second chassis and serves as a second I/O interface end.

Further, a second power interface module arranged on the second power supply assembly penetrates through the rear side of the second chassis and serves as a second power interface end.

Furthermore, the first display card assembly is connected with the first main board through a first display card adapter and is arranged in parallel with the first main board.

Furthermore, the second display card assembly is connected with the second mainboard through a second display card adapter and arranged in parallel with the second mainboard.

Furthermore, the first power supply assembly and the second power supply assembly are both provided with a power supply heat dissipation module.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model can be split into two cases for use by arranging the case into two detachable cases and arranging a set of system in each case separately; the left and right sides of the box body are provided with air inlets, the front and back sides of the box body are provided with air outlets, three groups of fans are arranged between the two systems, the box body is suitable for a cabinet in a vertical air channel, air is supplied to the box body from the left and right sides, air is blown to the front and back sides under the action of the fans, heat of each set of systems is dissipated, and the heat dissipation effect is enhanced.

2. The utility model has the advantages that by arranging two sets of independent systems, the applicability to the mainboard and the display card is strong, the configuration is flexible, the MATX mainboard and the latest NV 30 series display card/AMD 58 series display card can be met, and the computing capability is strong; and the interfaces of the two systems are independently arranged, so that the startup and shutdown of one system cannot affect the other system.

3. The utility model discloses a set up PCI-E switching card with display card parallel mount in the top of mainboard, effectively reduced the height of quick-witted case, increased quick-witted incasement space's rate of utilization.

Drawings

Fig. 1 is a schematic structural diagram of the present invention;

fig. 2 is a schematic view of another perspective structure of the present invention;

fig. 3 is an internal structure view of the first casing of the present invention;

fig. 4 is an internal structure view of a second casing of the present invention;

FIG. 5 is an internal structural view of the present invention;

fig. 6 is a schematic right view of the present invention;

fig. 7 is a schematic side view of a first main board according to the present invention;

the parts in the drawings are numbered as follows: 1. the whole case is prepared; 11. an air inlet; 12. an air outlet; 13. a first chassis; 14. a second chassis; 2. a first main board; 21. a first I/O interface module; 22. a first CPU component; 23. a first graphics card assembly; 231. a first graphics card adapter card; 3. a first power supply component; 31. a first power interface end; 4. a second main board; 41. a second I/O interface module; 42. a second CPU component; 43. a second graphics card assembly; 5. a second power supply assembly; 51. a second power interface end; 61. a first fan; 62. a second fan; 63. and a third fan.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

It should be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and/or processing steps closely related to the aspects of the present invention are shown in the drawings, and other details not relevant to the present invention are omitted.

In addition, it is also to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Examples

As shown in fig. 1 to 4, a split 2U chassis heat dissipation arrangement structure is suitable for a cabinet working in a vertical air duct. The split 2U case arrangement structure comprises a whole case 1 consisting of a first case 13 and a second case 14 which are arranged side by side from front to back, and the rear side surface of the first case 13 is detachably connected with the rear side surface of the second case 14 through a connecting piece. A first system is arranged in the first chassis 13, and a second system is arranged in the second chassis 14. Particularly, the connection surfaces of the first chassis 13 and the second chassis 14 are both arranged in an open structure. The connecting piece is preferably of a clamping structure, so that the left side surface and the right side surface of the first case 13 and the second case 14 are clamped, and when the first case 13 and the second case 14 are split into two cases, panels can be correspondingly arranged on the connecting surfaces of the first case 13 and the second case to form an independent case body.

As shown in fig. 3 to 5, in some embodiments, the first system includes a first motherboard 2 fixed in the first chassis 13 and a first power supply component 3 disposed above the first motherboard 2, and a first CPU component 22 and a first graphics card component 23 are disposed on the first motherboard 2 from top to bottom; the second system includes a second main board 4 fixed in the second chassis 14 and a second power supply module 5 disposed below the second main board 4, and a second CPU module 42 and a second graphics card module 43 are sequentially disposed on the second main board 4 from bottom to top.

So set up, the mainboard, CPU subassembly, display card subassembly and the arranging diverse of power supply module of two sets of systems, and be the interval setting each other. The applicability to the mainboard and the display card is enhanced, the configuration is flexible, the MATX mainboard and the latest NV 30 series display card/AMD 58 series display card can be met, and the strong computing capability is achieved.

As shown in fig. 6 and referring to fig. 1 to 2, in other embodiments, a first air outlet 12 is disposed on a front plate of the first chassis 13, and a second air outlet 12 is disposed on a front plate of the second chassis 14. And air inlets 11 are formed in two sides of the middle connecting part of the first case 13 and the second case 14. Three groups of fans are sequentially arranged at the middle position of the first system and the second system from top to bottom (specifically shown in fig. 4).

The three sets of fans include a first fan 61 for dissipating heat of the second graphics card assembly 43, two second fans 62 for dissipating heat of the first CPU assembly 22 and the second CPU assembly 42, respectively, and a third fan 63 for dissipating heat of the first graphics card assembly 23 (specifically, as shown in fig. 2 to 3).

So set up, applicable in the rack in perpendicular wind channel to three wind channels have been formed in the box, dispel the heat to different subassemblies respectively. The box body is enabled to intake air from the left side and the right side and blow air to the front side and the rear side under the action of the fan, so that the first system and the second system are respectively cooled, and the cooling effect is enhanced; and the heat dissipation air channels of the first system and the second system are independent and do not influence each other. Particularly, when the box body is split into two box bodies, the first chassis 13 and the second chassis 14 respectively include two fans therein. The first chassis 13 includes a second fan 62 and a third fan 63; the second chassis 14 includes a first fan 61 and a second fan 62, so that when the chassis is split into two boxes, when the systems work independently, the heat dissipation of the respective systems can be ensured.

In other embodiments, the first power module 3 and the second power module 5 are both provided with a power heat sink. So set up for first power supply module 3 and second power supply module 5 all can dispel the heat through respective power heat dissipation module, have guaranteed the radiating effect of power.

As shown in fig. 1 to 2, and referring to the drawings, in some embodiments, a first I/O interface module 21 disposed on the first motherboard 2 passes through the front side of the first chassis 13 and serves as a first I/O interface port. The first power interface module disposed on the first power module 3 passes through the front side of the first chassis 13 and serves as a first power interface end 31.

As shown in fig. 6, the second I/O interface module 41 disposed on the second motherboard 4 passes through the rear side of the second enclosure 14 and serves as a second I/O interface end. The second power interface module disposed on the second power module 5 passes through the rear side of the second casing 14 and serves as a second power interface terminal 51.

By the arrangement, the I/O interfaces and the power supply interfaces of the two sets of systems are independently arranged, so that the startup and shutdown of one set of system cannot influence the other set of system.

As shown in fig. 7, in some embodiments, the first graphics card assembly 23 is connected to the first main board 2 through a first graphics card adapter 231, and is disposed parallel to the first main board 2.

The second graphics card assembly 43 is connected to the second motherboard 4 through a second graphics card adapter, and is arranged in parallel with the second motherboard 4.

Specifically, the first graphics card adapter 231 and the second graphics card adapter are PCI-E adapters. So set up for the display card is installed in the top of mainboard, and the face of display card is parallel with the mainboard, has effectively reduced the height of box, increases the box inner space rate of utilization.

The above description is only intended to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings of the utility model, or the direct or indirect application in other related technical fields, are included in the patent protection scope of the utility model.

Claims

1. A split 2U case heat dissipation arrangement structure is suitable for a cabinet working in a vertical air duct; the device is characterized by comprising a first case (13) and a second case (14) which are arranged side by side front and back, wherein the back side surface of the first case (13) is detachably connected with the back side surface of the second case (14) through a connecting piece; a first system is arranged in the first case (13), and a second system is arranged in the second case (14); a first air outlet (12) is formed in the front plate of the first case (13), and a second air outlet (12) is formed in the front plate of the second case (14); air inlets (11) are formed in two sides of the middle connecting part of the first case (13) and the second case (14); three groups of fans are sequentially arranged in the middle of the first system and the second system from left to right.

2. The split 2U chassis heat dissipation arrangement according to claim 1, wherein the first system includes a first motherboard (2) fixed in the first chassis (13) and a first power supply module (3) disposed above the first motherboard (2), and the first CPU module (22) and the first graphics card module (23) are sequentially disposed on the first motherboard (2) from top to bottom; the second system comprises a second main board (4) fixed in the second case (14) and a second power supply assembly (5) arranged below the second main board (4), and a second CPU assembly (42) and a second video card assembly (43) are sequentially arranged on the second main board (4) from bottom to top.

3. The split 2U chassis heat dissipation arrangement of claim 2, wherein the three sets of fans include a first fan (61) for dissipating heat from the second graphics card assembly (43), two second fans (62) for dissipating heat from the first CPU assembly (22) and the second CPU assembly (42), respectively, and a third fan (63) for dissipating heat from the first graphics card assembly (23).

4. The split 2U chassis heat dissipation arrangement according to claim 2, wherein a first I/O interface module (21) disposed on the first motherboard (2) passes through a front side of the first chassis (13) and serves as a first I/O interface port.

5. The split 2U chassis heat dissipation arrangement of claim 2, wherein a first power interface module provided on the first power module (3) passes through a front side of the first chassis (13) and serves as a first power interface port (31).

6. The split 2U chassis heat dissipation arrangement of claim 2, wherein a second I/O interface module (41) disposed on the second motherboard (4) passes through a rear side of the second chassis (14) and serves as a second I/O interface port.

7. The split 2U chassis heat dissipation arrangement of claim 2, wherein a second power interface module provided on the second power module (5) passes through a rear side of the second chassis (14) and serves as a second power interface port (51).

8. The split 2U chassis heat dissipation arrangement according to claim 2, wherein the first graphics card assembly (23) is connected to the first motherboard (2) via a first graphics card adapter (231) and is disposed parallel to the first motherboard (2).

9. The split 2U chassis heat dissipation arrangement according to claim 2, wherein the second graphics card assembly (43) is connected to the second motherboard (4) via a second graphics card adapter card and is disposed parallel to the second motherboard (4).

10. The split 2U chassis heat dissipation arrangement according to any of claims 2-9, wherein the first power supply component (3) and the second power supply component (5) are each provided with a power heat dissipation module.