CN214472917U - Test system for comparing thermal conductivity of heat-conducting silica gel - Google Patents
Test system for comparing thermal conductivity of heat-conducting silica gel Download PDFInfo
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- CN214472917U CN214472917U CN202023263372.3U CN202023263372U CN214472917U CN 214472917 U CN214472917 U CN 214472917U CN 202023263372 U CN202023263372 U CN 202023263372U CN 214472917 U CN214472917 U CN 214472917U
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Abstract
The utility model discloses a test system for comparing the thermal conductivity of heat-conducting silica gel, which comprises a test board, a power supply, a temperature tester and a thermocouple; the test board comprises a base, a bottom red copper cushion block, a first cement resistor, a second cement resistor, a first bottom red copper, a second bottom red copper, a lifting sliding table, a top fixing seat, a top red copper cushion block, a first top red copper and a second top red copper; the power supply supplies power to the first cement resistor and the second cement resistor of the test board, the first cement resistor and the second cement resistor are directly contacted with the first red copper and the second red copper at the bottom and conduct heat, the heat is conducted to the first red copper and the second red copper at the top through the first heat-conducting silica gel and the second heat-conducting silica gel to be tested, and meanwhile, the temperature of the first red copper and the second red copper at the bottom and the temperature of the first red copper and the second red copper at the top are monitored through the first thermocouple, the second thermocouple, the third thermocouple and the fourth temperature tester, and the comparison is carried out to determine the difference of the heat-conducting performance of the heat-conducting silica gel. Compared with a traditional test system, the patent system can simultaneously test the heat conductivity of two different types of silica gel, and the difference of the heat conductivity can be visually seen; the manufacturing cost is low, the use is convenient, and the method is very suitable for incoming material verification and comparison test in factories.
Description
Technical Field
The utility model relates to a heat conduction module field specifically is a test system of contrast heat conduction silica gel heat conductivity.
Background
Traditional heat conduction silica gel test system can test out heat conduction silica gel's coefficient of heat conduction, but this equipment is bulky, and the price is on the high side, and especially mill detects time measuring to heat conduction silica gel supplied materials, because lack professional equipment, can't learn the specific heat conductivility of heat conduction silica gel, and more importantly, traditional test system can only test the coefficient of heat conduction of a section of silica gel usually once, because test error and uniformity reason, has certain error when contrasting two sections of silica gel heat conductivities.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a test system of contrast heat conduction silica gel heat conductivity to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme, characterized by:
a test system for comparing the thermal conductivity of heat-conducting silica gel comprises a test board, a power supply, a temperature tester and a thermocouple; the test board comprises a base, a bottom red copper cushion block, a first cement resistor, a second cement resistor, a first bottom red copper, a second bottom red copper, a lifting sliding table, a top fixing seat, a top red copper cushion block, a first top red copper and a second top red copper; the power supply supplies power to the first cement resistor and the second cement resistor of the test board, the first cement resistor and the second cement resistor are directly contacted with the first red copper and the second red copper at the bottom and conduct heat, the heat is conducted to the first red copper and the second red copper at the top through the first heat-conducting silica gel and the second heat-conducting silica gel to be tested, and meanwhile, the temperature of the first red copper and the second red copper at the bottom and the temperature of the first red copper and the second red copper at the top are monitored through the first thermocouple, the second thermocouple, the third thermocouple and the fourth temperature tester, and the comparison is carried out to determine the difference of the heat-conducting performance of the heat-conducting silica gel.
As a further aspect of the present invention: the power supply adopts a direct current stabilized power supply and provides 80W power.
As a further aspect of the present invention: the temperature tester can monitor the temperature of the red copper at four positions and the temperature range is 10-80 ℃.
As a further aspect of the present invention: this patent test system provides two identical test environment, according to hot-conductive principle, through the temperature of monitoring red copper all around, judges heat conduction silica gel's heat conductivility.
Compare traditional test system, this patent system can test the heat conductivility of two kinds of different silica gels simultaneously, can directly perceivedly see the difference of its heat conductivity, low in manufacturing cost, and convenient to use, and very suitable mill comes the material to verify and contrast test.
Drawings
Fig. 1 is a schematic overall structure diagram of a test system for comparing thermal conductivity of a thermal conductive silica gel.
Fig. 2 is a schematic structural diagram of a test bench of a test system for comparing thermal conductivity of thermal conductive silica gel.
FIG. 3 is an exploded view of a testing platform of a testing system for comparing thermal conductivity of thermal conductive silica gel.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described implementations are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1 and 2, in the embodiment of the present invention, a test system for comparing thermal conductivity of heat-conducting silica gel aims at comparing the thermal conductivity of two silica gels with the same size, and according to the thermal conductivity principle, the cement resistor is used as a fixed heat source, the bottom red copper is convenient for detecting the temperature, and the heat is conducted to the top red copper through the silica gel to be detected, and the difference of thermal conductivity of heat-conducting silica gel can be known through the difference of the comparison temperature.
Referring to fig. 3, when the test platform is assembled, the first cement resistor 3 and the second cement resistor 4 are fixed on the base 1 through the bottom red copper cushion block 2 and are respectively in contact with the first bottom red copper 5 and the second bottom red copper 6; a10, two 11 of top red copper are fixed on top fixing base 13 through top red copper cushion 12 respectively to the monolithic stationary ladle is fixed on lift slip table 9, finally fixes the lift slip table on base 1 again, needs to pay attention to the distance of top fixed work platform apart from the bottom extraordinarily, can use the scale to measure, and the error is controlled as far as possible within 0.1 mm.
When in test, firstly, a power supply is used for electrifying a first cement resistor 3 and a second cement resistor 4, a temperature tester is used, the temperatures of a first bottom red copper 5 and a second bottom red copper 6 are measured through a first thermocouple and a second thermocouple, the temperatures of the two red copper sheets are consistent, if the temperatures of the two red copper sheets are different, the power supply voltage can be finely adjusted to make the temperatures consistent, then a first heat conduction silica gel 7 and a second heat conduction silica gel 8 which need to be compared are respectively placed on the first bottom red copper 5 and the second bottom red copper 6, then a lifting sliding table 9 is adjusted to make the first top red copper 10 and the second top red copper 11 respectively pressed on the first heat conduction silica gel 7 and the second heat conduction silica gel 8, the height can be controlled through a scale, at the moment, the temperatures of the two bottom red copper sheets can be rapidly transmitted to the two top red copper sheets through the heat conduction silica gel, at the moment, the temperature tester is used for measuring the temperatures of the first top red copper 10 and the second top red copper 11 through the third thermocouple and the fourth thermocouple, and judging the heat-conducting property of the heat-conducting silica gel through temperature comparison.
In the whole testing process, the temperature of the two pieces of bottom red copper and the temperature of the two pieces of top red copper can be monitored in real time. The temperature of the red copper on the top is higher, and the thermal conductivity of the corresponding heat-conducting silica gel is better; the smaller the temperature difference between the top red copper corresponding to the bottom red copper is, the better the heat-conducting property of the corresponding heat-conducting silica gel is.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (4)
1. The utility model provides a test system of contrast heat conduction silica gel thermal conductivity which characterized by: the device comprises a test board, a power supply, a temperature tester and a thermocouple; the test board comprises a base, a bottom red copper cushion block, a first cement resistor, a second cement resistor, a first bottom red copper, a second bottom red copper, a lifting sliding table, a top fixing seat, a top red copper cushion block, a first top red copper and a second top red copper; the power supply supplies power to the first cement resistor and the second cement resistor of the test board, the first cement resistor and the second cement resistor are directly contacted with the first red copper and the second red copper at the bottom and conduct heat, the heat is conducted to the first red copper and the second red copper at the top through the first heat-conducting silica gel and the second heat-conducting silica gel to be tested, and meanwhile, the temperature of the first red copper and the second red copper at the bottom and the temperature of the first red copper and the second red copper at the top are monitored through the first thermocouple, the second thermocouple, the third thermocouple and the fourth temperature tester, and the comparison is carried out to determine the difference of the heat-conducting performance of the heat-conducting silica gel.
2. The system of claim 1, wherein the test system comprises: the first cement resistor and the second cement resistor are respectively fixed on the bottom fixing seat and are in contact with the red copper at the bottom of the test board, the first red copper resistor and the second red copper resistor are respectively fixed on the top fixing seat and are fixed on the lifting sliding table, and finally the lifting sliding table is fixed on the base.
3. The system of claim 1, wherein the test system comprises: the power supply is a direct current stabilized power supply and provides 80W power for the test system.
4. The system of claim 1, wherein the test system comprises: the temperature tester can monitor the temperature of the red copper at 4 positions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023263372.3U CN214472917U (en) | 2020-12-29 | 2020-12-29 | Test system for comparing thermal conductivity of heat-conducting silica gel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023263372.3U CN214472917U (en) | 2020-12-29 | 2020-12-29 | Test system for comparing thermal conductivity of heat-conducting silica gel |
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| CN214472917U true CN214472917U (en) | 2021-10-22 |
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| CN202023263372.3U Active CN214472917U (en) | 2020-12-29 | 2020-12-29 | Test system for comparing thermal conductivity of heat-conducting silica gel |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117110370A (en) * | 2023-10-20 | 2023-11-24 | 江苏矽时代材料科技有限公司 | Low-error silica gel heat conductivity testing device |
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2020
- 2020-12-29 CN CN202023263372.3U patent/CN214472917U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117110370A (en) * | 2023-10-20 | 2023-11-24 | 江苏矽时代材料科技有限公司 | Low-error silica gel heat conductivity testing device |
| CN117110370B (en) * | 2023-10-20 | 2023-12-29 | 江苏矽时代材料科技有限公司 | Low-error silica gel heat conductivity testing device |
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