CN214447681U - Semiconductor tube waste black glue processing apparatus that moulds plastics - Google Patents
Semiconductor tube waste black glue processing apparatus that moulds plastics Download PDFInfo
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- CN214447681U CN214447681U CN202120446504.1U CN202120446504U CN214447681U CN 214447681 U CN214447681 U CN 214447681U CN 202120446504 U CN202120446504 U CN 202120446504U CN 214447681 U CN214447681 U CN 214447681U
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- waste material
- black glue
- waste
- extrusion system
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
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- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
The utility model discloses a semiconductor tube discarded ebonite processing apparatus that moulds plastics, including hopper down, left side transmission extrusion system, right side transmission extrusion system, the guide fill, the thermosol system, waste material solvent pipe and waste material solvent take up the box, left side transmission extrusion system and right side transmission extrusion system set up relatively in the discharge gate department of hopper down, the guide fill is located left transmission extrusion system and right transmission extrusion system below, the thermosol system is located the guide fill below, waste material solvent pipe is linked together with the thermosol system to the export of waste material solvent pipe is towards waste material solvent take up the box. The utility model discloses the waste material black glue that produces after moulding plastics in with the semiconductor tube production handles, makes the effectual compression of waste material black glue to littleer space to possess working area in the reduction production, make things convenient for subsequent processing.
Description
Technical Field
The utility model relates to a semiconductor tube abandonment ebonite processing apparatus that moulds plastics for the epoxy waste material processing apparatus that produces after the semiconductor tube is moulded plastics belongs to two triode production technical field.
Background
In the production process of the triode and diode, a part of black glue (epoxy resin) waste frames are generated after injection molding is finished, and the frames occupy a large space, need manual crushing and are relatively complex.
Disclosure of Invention
The to-be-solved technical problem of the utility model is to provide a semiconductor tube abandonment ebonite processing apparatus that moulds plastics, the waste material ebonite (epoxy) that produces after moulding plastics in with the semiconductor tube production handles, makes the effectual compression of waste material ebonite (epoxy) to littleer space to possess working area in the reduction production, make things convenient for subsequent processing.
In order to solve the technical problem, the utility model discloses a technical scheme is: the utility model provides a semiconductor tube is moulded plastics back abandonment black glue processing apparatus, including hopper down, left side transmission extrusion system, right side transmission extrusion system, the guide fill, the thermosol system, waste material solvent pipe and waste material solvent take over the box, left side transmission extrusion system and right side transmission extrusion system set up relatively in the discharge gate department of hopper down, be used for smashing the abandonment black glue that the hopper was derived down, the guide fill is located left side transmission extrusion system and right side transmission extrusion system below, the thermosol system is located the guide fill below, waste material solvent pipe is linked together with the thermosol system, and the export of waste material solvent pipe is towards waste material solvent take over the box, the abandonment black glue after smashing is conducted to the thermosol system through the guide fill and is carried out the thermosol, abandonment black glue liquid after the thermosol is arranged to waste material solvent take over the box through waste material solvent pipe.
Furthermore, left side transmission extrusion system includes left extrusion wheel, left drive motor, and left extrusion wheel and left drive motor link to each other through left chain, and right transmission extrusion system includes right extrusion wheel, right drive motor, and right extrusion wheel and right drive motor link to each other through right chain, all are equipped with crushing tooth on left extrusion wheel and the right extrusion wheel, and the crushing tooth of left extrusion wheel and right extrusion wheel meshes mutually.
Further, the thermal dissolving system comprises a heating box, a heating wire and a fan, the heating box is located below the material guide hopper, the heating wire is located in the heating box, an air outlet of the fan faces the heating box, and the waste solvent conduit is communicated with the heating box.
Furthermore, the left transmission extrusion system, the right transmission extrusion system and the material guide hopper are positioned in the upper support frame, and the material guide hopper is positioned above the upper support frame.
Further, the thermal dissolving system, the waste solvent conduit and the waste solvent receiving box are located within the lower support frame.
The utility model has the advantages that: the utility model discloses can crush to dissolve the waste material black glue (epoxy) that produces after moulding plastics in the production of two triodes, the abandonment black glue after dissolving is remolded other shapes in waste material solvent holding box, makes the effectual compression of waste material black glue (epoxy) to littleer space to possess working area in the reduction production, make things convenient for subsequent processing, provide solution for the application that has special demand.
Drawings
FIG. 1 is a schematic structural view of example 1;
FIG. 2 is a schematic structural diagram of a left transmission extrusion system and a right transmission extrusion system;
FIG. 3 is a schematic diagram of a thermal dissolution system;
in the figure: 1. hopper down, 2, left transmission extrusion system, 3, right transmission extrusion system, 4, guide hopper, 5, go up braced frame, 6, hot dissolving system, 7, under bracing frame, 8, waste material solvent pipe, 9, waste material solvent take-up box, 10, left extrusion wheel, 11, left chain, 12, left drive motor, 13, right chain, 14, right extrusion wheel, 15, right drive motor, 17, axial fan, 18, heating cabinet, 19, heater strip, 20, crushing tooth.
Detailed Description
The invention will be further described with reference to the accompanying drawings and specific embodiments.
Example 1
The embodiment discloses a waste black glue treatment device after semiconductor injection molding, which comprises a blanking hopper 1, a left transmission extrusion system 2, a right transmission extrusion system 3, a material guide hopper 4, a thermal dissolution system 6, a waste solvent guide pipe 8 and a waste solvent receiving box 9, as shown in fig. 1.
Left side transmission extrusion system 2 and right transmission extrusion system 3 set up in the discharge gate department of hopper 1 relatively, and left side transmission extrusion system 2 and right transmission extrusion system 3 cooperate the abandonment black glue of hopper 1 derivation down to smash. Guide hopper 4 is located left side transmission extrusion system 2 and right side transmission extrusion system 3 below, and thermal dissolution system 6 is located guide hopper 4 below, and waste material solvent pipe 8 is linked together with thermal dissolution system 6 to the export of waste material solvent pipe 8 is towards waste material solvent reception box 9, and the abandonment black glue after smashing conducts to thermal dissolution system 6 through guide hopper 4 and carries out the thermal dissolution, and the abandonment black glue liquid after the thermal dissolution is arranged to waste material solvent reception box 9 through waste material solvent pipe 8.
In this embodiment, the left transmission extrusion system 2, the right transmission extrusion system 3 and the material guide hopper 4 are located in the upper support frame 5, and the material guide hopper 1 is disposed above the upper support frame 5. The thermal dissolution system 6, the waste solvent conduit 8 and the waste solvent receiving cassette 9 are located within the lower support frame 7.
As shown in fig. 2, the left transmission extrusion system 2 includes a left extrusion wheel 10 and a left transmission motor 12, and the left extrusion wheel 10 and the left transmission motor 12 are connected by a left chain 11. The right transmission extrusion system 3 comprises a right extrusion wheel 14 and a right transmission motor 15, the right extrusion wheel 14 is connected with the right transmission motor 15 through a right chain 13, the left extrusion wheel 10 and the right extrusion wheel 14 are both provided with crushing teeth 20, and the crushing teeth 20 of the left extrusion wheel 10 are meshed with the crushing teeth 20 of the right extrusion wheel 14.
As shown in fig. 3, the thermal dissolving system 6 includes a heating box 18, a heating wire 19, and an axial flow fan 17, the heating box 18 is a double-layer shell and is located below the material guiding hopper 4, the heating wire 19 is located in the heating box 18, an air outlet of the fan 17 faces the heating box 18, and the waste solvent conduit 8 is communicated with the heating box 18.
The utility model discloses a working process does: the waste black glue frame is placed into the discharging hopper 1, the left transmission motor 12 and the right transmission motor 15 are connected into a 220V power supply, the waste black glue frame is crushed by the left extrusion wheel 12 and the right extrusion wheel 14, powder falls into the guide hopper 4 below and enters the heating box 18 through the guide hopper 4, the black glue powder is heated and dissolved by the thermal dissolving system, and the solution flows into the waste receiving box 9 and is cooled and formed.
The foregoing description is only for the basic principles and preferred embodiments of the present invention, and modifications and substitutions made by those skilled in the art according to the present invention belong to the protection scope of the present invention.
Claims (5)
1. The utility model provides a semiconductor tube discarded black glue processing apparatus that moulds plastics which characterized in that: including hopper down, left side transmission extrusion system, right side transmission extrusion system, the guide fill, the thermal dissolution system, waste material solvent pipe and waste material solvent take over the box, left side transmission extrusion system and right side transmission extrusion system set up relatively in the discharge gate department of hopper down, be used for smashing the abandonment black glue that the hopper was derived down, the guide fill is located left side transmission extrusion system and right side transmission extrusion system below, the thermal dissolution system is located the guide fill below, waste material solvent pipe is linked together with the thermal dissolution system, and the export of waste material solvent pipe is towards waste material solvent take over the box, the abandonment black glue after smashing carries out the thermal dissolution through guide fill conduction to the thermal dissolution system, abandonment black glue liquid after the thermal dissolution is arranged to waste material solvent take over the box through waste material solvent pipe.
2. The semiconductor tube injection molding waste black glue processing device according to claim 1, characterized in that: the left transmission extrusion system comprises a left extrusion wheel and a left transmission motor, the left extrusion wheel and the left transmission motor are connected through a left chain, the right transmission extrusion system comprises a right extrusion wheel and a right transmission motor, the right extrusion wheel and the right transmission motor are connected through a right chain, crushing teeth are arranged on the left extrusion wheel and the right extrusion wheel, and the crushing teeth of the left extrusion wheel and the right extrusion wheel are meshed.
3. The semiconductor tube injection molding waste black glue processing device according to claim 1, characterized in that: the thermal dissolving system comprises a heating box, a heating wire and a fan, wherein the heating box is positioned below the material guide hopper, the heating wire is positioned in the heating box, an air outlet of the fan faces the heating box, and the waste solvent conduit is communicated with the heating box.
4. The semiconductor tube injection molding waste black glue processing device according to claim 1, characterized in that: the left transmission extrusion system, the right transmission extrusion system and the material guide hopper are positioned in the upper support frame, and the material guide hopper is positioned above the upper support frame.
5. The semiconductor tube injection molding waste black glue processing device according to claim 1, characterized in that: the thermal dissolving system, the waste solvent conduit and the waste solvent receiving box are located within the lower support frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120446504.1U CN214447681U (en) | 2021-03-02 | 2021-03-02 | Semiconductor tube waste black glue processing apparatus that moulds plastics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120446504.1U CN214447681U (en) | 2021-03-02 | 2021-03-02 | Semiconductor tube waste black glue processing apparatus that moulds plastics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214447681U true CN214447681U (en) | 2021-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120446504.1U Active CN214447681U (en) | 2021-03-02 | 2021-03-02 | Semiconductor tube waste black glue processing apparatus that moulds plastics |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214447681U (en) |
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2021
- 2021-03-02 CN CN202120446504.1U patent/CN214447681U/en active Active
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