CN214442436U

CN214442436U - Positioning column of electronic component processing positioning die

Info

Publication number: CN214442436U
Application number: CN202023140737.3U
Authority: CN
Inventors: 史友发; 史雨彤; 钟墨非
Original assignee: Nantong Ruipo Electromechanical Co ltd
Current assignee: Nantong Ruipo Electromechanical Co ltd
Priority date: 2020-12-24
Filing date: 2020-12-24
Publication date: 2021-10-22
Anticipated expiration: 2030-12-24

Abstract

The utility model provides an electronic component processing positioning die's reference column, including PMKD, lower reference column, first solid fixed ring, go up the solid fixed ring of reference column and second, fixed connection in the middle of lower reference column lower end and PMKD up end, the cover is equipped with first solid fixed ring on the reference column ring surface down, the inside thread groove of having seted up of lower reference column, it inserts and establishes inside the thread groove to go up the reference column, it is equipped with solid fixed ring of second to go up the cover on the reference column ring surface, it is provided with fixed dop to go up the reference column upper end, compares with prior art, the utility model discloses following beneficial effect has: the buffer has high-efficiency buffer performance and good fixed mounting effect.

Description

Positioning column of electronic component processing positioning die

Technical Field

The utility model relates to an electronic component processing positioning die's reference column belongs to the relevant field of electronic component mould auxiliary.

Background

The positioning mould is a tool for making shaped articles, the tool is composed of various parts, different moulds are composed of different parts, the electronic element processing and positioning mould is a mould used in the electronic element processing and positioning technology, and a positioning column is usually arranged on the electronic element processing and positioning mould to connect mould bodies.

When connecting, because the mould divide into top mould and die block, inlay the die body through the reference column and constitute complete structure through the corresponding material body punching press of die-casting in to the shaping intracavity again, nevertheless in the preparation process, reference column itself need bear the weight of partly power effect for reference column itself receives the damage easily owing to be difficult to the high-efficient buffering of counter-force, and the installation fixed effect of corresponding structure is relatively poor on the reference column in the equipment process, is difficult to the high efficiency and installs and drop into the use. Therefore, the utility model provides an electronic component processing positioning die's reference column solves above problem.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a not enough to prior art exists, the utility model aims at providing an electronic component processing positioning die's reference column through increasing PMKD, lower reference column, first solid fixed ring, go up the solid fixed ring of reference column and second to solve the problem that proposes in the above-mentioned background, have high-efficient shock-absorbing capacity, fixed mounting is effectual.

In order to achieve the above purpose, the present invention is realized by the following technical solution: the utility model provides an electronic component processing positioning die's reference column, includes PMKD, lower reference column, first solid fixed ring, goes up the reference column and the solid fixed ring of second, fixed connection in the middle of lower reference column lower end and the PMKD up end, the cover is equipped with first solid fixed ring on the reference column annular face down, the inside thread groove of having seted up of reference column down, it inserts and establishes inside the thread groove to go up the reference column, it is equipped with the solid fixed ring of second to go up the cover on the reference column annular face, it is provided with fixed dop to go up the reference column upper end.

Furthermore, lower positioning column installs inside the lower mould, go up the positioning column and install inside last mould.

Furthermore, the lower positioning column penetrates through the lower die from the lower end face of the lower die and extends upwards, the lower positioning column is in threaded connection with the lower die, a first accommodating cavity is formed in the position, corresponding to the lower end face of the lower die, of the fixing bottom plate, the fixing bottom plate is clamped inside the first accommodating cavity, and a first cushion pad is fixedly arranged on the upper end face of the fixing bottom plate through gluing.

Further, pass through threaded connection between first solid fixed ring and the lower reference column, first solid fixed ring has been seted up the second corresponding lower mould up end position and has been held the chamber, first solid fixed ring card is established and is held intracavity portion at the second, the solid fixed ring of upper and lower both ends face of second is fixed with first pad and the second blotter that compresses tightly through sticky respectively.

Furthermore, a clamping groove is formed in the position, corresponding to the lower end face of the upper die, of the upper end head of the lower positioning column, and the upper end head of the lower positioning column is clamped inside the clamping groove.

Furthermore, the upper end of the upper positioning column is fixedly connected with the middle of the lower end face of the fixing chuck, the upper positioning column penetrates through the upper die from the upper end face of the upper die and is in threaded connection with the thread groove, and the upper positioning column is in threaded connection with the upper die.

Furthermore, the second fixing ring is connected with the upper positioning column through threads, a third accommodating cavity is formed in the position, corresponding to the upper end face of the upper die, of the second fixing ring, the second fixing ring is clamped inside the third accommodating cavity, and a second pressing pad and a third cushion pad are arranged on the upper end face and the lower end face of the second fixing ring respectively.

The utility model has the advantages that: the utility model relates to a positioning column of electronic component processing positioning mould, through increasing fixed baseplate, lower positioning column, first solid fixed ring, upper positioning column and second solid fixed ring, fixed baseplate and first solid fixed ring will lower positioning column firm fix inside the lower mould, the upper mould will be through the draw-in groove of lower terminal surface and lower positioning column top butt joint location, and then will go up the positioning column and run through second solid fixed ring and upper mould and thread groove fixed connection inside the lower positioning column in proper order, and then will go up mould and lower mould firm fixed together, the first pressure pad makes the upper mould and lower mould more closely connected, the second pressure pad makes the fixed dop and second solid fixed ring more closely connected, the upper positioning column runs through whole upper mould and is connected with whole upper mould fixed connection, the lower positioning column runs through humming song lower mould and is connected with whole lower mould fixed connection, adding fixed baseplate, first solid fixed ring and second solid fixed ring increase the contact surface between positioning column and upper mould and lower mould, make the even dispersion of power that last reference column and lower reference column received on last mould and lower mould for go up reference column and lower reference column can not the excessive two damages of local atress, first blotter, second blotter and third blotter absorb the vibrations power, make and go up reference column and lower reference column firm in connection can not become flexible, in the time of in-service use, more be fit for being applied to the relevant field of electronic component mould auxiliary.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a structural diagram of a positioning column of the electronic component processing and positioning mold according to the present invention, which is installed inside the mold;

fig. 2 is a front view of a positioning column of the positioning mold for processing electronic components of the present invention;

fig. 3 is a front sectional view of a positioning column of the positioning mold for processing electronic components of the present invention;

in the figure: 1-fixed bottom plate, 2-first cushion pad, 3-lower positioning column, 4-first fixing ring, 5-upper positioning column, 6-second fixing ring, 7-fixed chuck, 8-second pressing pad, 9-third cushion pad, 10-upper die, 11-first pressing pad, 12-second cushion pad, 13-lower die and 14-thread groove.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides an electronic component processing positioning die's reference column, including PMKD 1, lower reference column 3, first solid fixed ring 4, go up reference column 5 and the solid fixed ring 6 of second, fixed connection in the middle of lower 3 lower ends of reference column and the 1 up end of PMKD, the cover is equipped with first solid fixed ring 4 on the 3 toroidal surfaces of lower reference column, threaded groove 14 has been seted up to 3 inside down reference column, it inserts and establishes inside threaded groove 14 to go up reference column 5, the cover is equipped with solid fixed ring 6 of second on the 5 toroidal surfaces of last reference column, it is provided with fixed dop 7 to go up 5 upper ends of reference column.

Lower reference column 3 is installed inside lower mould 13, it installs inside last mould 10 to go up reference column 5, lower reference column 3 runs through lower mould 13 and upwards extends from lower terminal surface under the lower mould 13, lower reference column 3 passes through threaded connection with lower mould 13, fixing plate 1 corresponds 13 lower terminal surface positions of lower mould and has seted up the first chamber that holds, fixing plate 1 card is established at the first intracavity portion that holds, fixing plate 1 up end has first blotter 2 through adhesive fixation, pass through threaded connection between first solid fixed ring 4 and the lower reference column 3, first solid fixed ring 4 corresponds 13 up end positions of lower mould and has seted up the second and hold the chamber, first solid fixed ring 4 card is established at the second and holds intracavity portion, the solid fixed ring 6 upper and lower both ends face of second has first pad 11 and the second blotter 12 that compresses tightly through adhesive fixation respectively.

The draw-in groove has been seted up to the end corresponding last mould 10 lower terminal surface position down on the reference column 3, the end card is established inside the draw-in groove down on the reference column 3, fixed connection in the middle of the end and the terminal surface under fixed dop 7 on the last reference column 5, go up reference column 5 from last mould 10 up end run through last mould 10 and pass through threaded connection with thread groove 14, go up through threaded connection between reference column 5 and the last mould 10, pass through threaded connection between the solid fixed ring of second 6 and the last reference column 5, the solid fixed ring of second 6 corresponds last mould 10 up end position and has seted up the third and hold the chamber, the solid fixed ring of second 6 blocks and establishes and hold intracavity portion at the third, the solid fixed ring of second 6 upper and lower both ends face is provided with the second respectively and compresses tightly pad 8 and third blotter 9.

As an embodiment of the present invention: the fixed bottom plate 1 and the first fixed ring 4 firmly fix the lower positioning column 3 in the lower die 13, the upper die 10 is butted and positioned with the upper end of the lower positioning column 3 through the clamping groove of the lower end surface, then the upper positioning column 5 sequentially penetrates through the second fixed ring 6 and the threaded groove 14 in the upper die 10 and the lower positioning column 3 to be fixedly connected, so that the upper die 10 and the lower die 13 are firmly fixed together, the first pressing pad 11 enables the upper die 10 and the lower die 13 to be more tightly connected, the second pressing pad 8 enables the fixed clamping head 7 and the second fixed ring 6 to be more tightly connected, the upper positioning column 5 penetrates through the whole upper die 10 and is fixedly connected with the whole upper die 10, the lower positioning column 3 penetrates through the humming lower die 13 and is fixedly connected with the whole lower die 13, the contact surface between the positioning column and the upper die 10 and the lower die 13 is increased by adding the fixed bottom plate 1, the first fixed ring 4 and the second fixed ring 6, so that the force applied to the upper positioning column 5 and the lower positioning column 3 is uniformly dispersed on the upper die 10 and the lower die 13, make and go up reference column 5 and reference column 3 down can not the excessive two damages of local atress, first blotter 2, second blotter 12 and third blotter 9 absorb the shaking force for go up reference column 5 and reference column 3 firm in connection can not become flexible down, the utility model discloses have high-efficient shock-absorbing capacity, fixed mounting is effectual.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides an electronic component processing positioning die's reference column, includes PMKD, lower reference column, first solid fixed ring, goes up the reference column and the solid fixed ring of second, its characterized in that: fixed connection in the middle of lower reference column lower end and the PMKD up end, the cover is equipped with first solid fixed ring down on the reference column annular face, the thread groove has been seted up to lower reference column inside, it inserts and establishes inside the thread groove to go up the reference column, it is equipped with solid fixed ring of second to go up the cover on the reference column annular face, it is provided with fixed dop to go up the reference column upper end.

2. The positioning post of an electronic component processing and positioning mold as claimed in claim 1, wherein: the lower positioning column is arranged inside the lower die, and the upper positioning column is arranged inside the upper die.

3. The positioning post of an electronic component processing and positioning mold as claimed in claim 1, wherein: the lower positioning column penetrates through the lower die from the lower end face of the lower die and extends upwards, the lower positioning column is in threaded connection with the lower die, a first accommodating cavity is formed in the position, corresponding to the lower end face of the lower die, of the fixing bottom plate, the fixing bottom plate is clamped inside the first accommodating cavity, and a first cushion pad is fixedly arranged on the upper end face of the fixing bottom plate through gluing.

4. The positioning post of an electronic component processing and positioning mold as claimed in claim 1, wherein: first solid fixed ring and pass through threaded connection between the reference column down, first solid fixed ring has seted up the second corresponding lower mould up end position and has held the chamber, first solid fixed ring card is established and is held intracavity portion at the second, the solid fixed ring of second both ends face is fixed with first pressure pad and second blotter through sticky respectively from top to bottom.

5. The positioning post of an electronic component processing and positioning mold as claimed in claim 1, wherein: the upper end of the lower positioning column corresponds to the lower end face of the upper die and is provided with a clamping groove, and the upper end of the lower positioning column is clamped in the clamping groove.

6. The positioning post of an electronic component processing and positioning mold as claimed in claim 1, wherein: the upper end of the upper positioning column is fixedly connected with the middle of the lower end face of the fixing chuck, the upper positioning column penetrates through the upper die from the upper end face of the upper die and is in threaded connection with the thread groove, and the upper positioning column is in threaded connection with the upper die.

7. The positioning post of an electronic component processing and positioning mold as claimed in claim 1, wherein: the second fixing ring is connected with the upper positioning column through threads, a third accommodating cavity is formed in the position, corresponding to the upper end face of the upper die, of the second fixing ring, the second fixing ring is clamped inside the third accommodating cavity, and a second pressing pad and a third cushion pad are arranged on the upper end face and the lower end face of the second fixing ring respectively.