CN214429794U

CN214429794U - Through hole matching brazing process device

Info

Publication number: CN214429794U
Application number: CN202120329860.5U
Authority: CN
Inventors: 孟亚丽; 魏俊浩; 张宣力
Original assignee: Shenzhen Zhongruan Xinda Electronics Co ltd
Current assignee: Shenzhen Zhongruan Xinda Electronics Co ltd
Priority date: 2021-02-04
Filing date: 2021-02-04
Publication date: 2021-10-19
Anticipated expiration: 2031-02-04

Abstract

The utility model discloses a through hole collocation soldering process device, which comprises a soldering resistance jig main body (1), a product component (2) and soldering paste (10); the product assembly (2) is arranged above the welding jig main body (1); more than one product element (5) is arranged on the product assembly (2); more than one through hole (6) is arranged on the product element (5); the product element (5) consists of more than one metal layer (7); an insulating layer (8) is arranged between the more than one metal layer (7), the through hole mode is adopted in the embodiment, the BGA through hole Pad is used as a printing ink process, and a soldering process is used for assembling to enable solder paste to be connected through the BGA through hole, so that the manufacture of common equipment is realized.

Description

Through hole matching brazing process device

Technical Field

The utility model relates to a device of brazing, concretely relates to through-hole collocation process units that brazes.

Background

As shown in fig. 1-4, in the BGA field of the FPC industry, at present, blind vias are mostly operated in a blind via matching SMT manner, and a blind via process requires high-end manufacturing equipment and detection testing, and blind via manufacturing requires equipment such as a laser machine, a via filling electroplating machine, a high-definition 3D microscope, and the like, and has high requirements for equipment and technology.

Disclosure of Invention

The utility model aims to solve the technical problem that a through-hole collocation process units that brazes is provided, adopts the through-hole mode operation, and printing ink technology is done to BGA through-hole Pad, and the process of brazing is beaten the piece and is made the tin cream pass through the BGA conducting hole and connect, realizes the preparation of ordinary equipment.

The utility model discloses through-hole collocation brazing process device realizes through following technical scheme: the welding resistance jig comprises a welding resistance jig main body, a product assembly and welding paste; the product assembly is arranged above the welding jig main body; more than one product element is arranged on the product assembly; more than one through hole is arranged on the product element; the product element is composed of more than one metal layer; an insulating layer is arranged between more than one metal layers.

As a preferred technical scheme, more than one positioning hole is arranged on the product assembly; the solder mask jig main body is provided with more than one positioning pin for installing the positioning hole.

As a preferred technical scheme, more than one avoidance groove is arranged on the resistance welding jig main body; the position of the avoiding groove corresponds to the position of the product element.

As a preferred technical scheme, a metal layer is arranged in the through hole; and filling welding paste in the metal layer.

The utility model has the advantages that: and (3) through hole operation, wherein the BGA through hole Pad is used as a printing ink process, and a soldering process is used for printing a piece so that solder paste is connected through the BGA through hole, so that the common equipment is manufactured.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a first drawing of a prior art blind hole brazing process apparatus;

FIG. 2 is a second drawing of a prior art blind hole brazing process apparatus;

FIG. 3 is a third drawing of a prior art blind hole brazing process apparatus;

FIG. 4 is a combination view of a solder resist jig main body and a product component;

FIG. 5 is a schematic view of a product component;

FIG. 6 is a first schematic view of the soldering apparatus for through hole matching of the present invention;

FIG. 7 is a second schematic view of the apparatus for brazing through holes of the present invention;

FIG. 8 is a third schematic view of the soldering apparatus with through hole matching of the present invention;

fig. 9 is a fourth schematic view of the soldering process device matched with through holes of the present invention.

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.

In the description of the present invention, it is to be understood that the terms "one end", "the other end", "the outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The use of terms herein such as "upper," "above," "lower," "below," and the like in describing relative spatial positions is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In the present invention, unless otherwise explicitly specified or limited, the terms "set", "coupled", "connected", "penetrating", "plugging", and the like are to be understood in a broad sense, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

As shown in fig. 4-8, the through hole matching brazing process device of the present invention comprises a solder resist jig main body 1, a product component 2 and a solder paste 10; the product assembly 2 is arranged above the welding jig main body 1; more than one product element 5 is arranged on the product assembly 2; more than one through hole 6 is arranged on the product element 5; the product element 5 consists of more than one metal layer 7; an insulating layer 8 is provided between one or more metal layers 7.

In this embodiment, the product assembly 2 is provided with more than one positioning hole 3; the solder resist jig main body 1 is provided with more than one positioning pin 4 for installing the positioning hole 3.

In the embodiment, more than one avoiding groove 9 is arranged on the solder resist jig main body 1; the position of the avoiding groove 9 corresponds to the position of the product element 5.

In this embodiment, a metal section 12 is disposed in the through hole 6; the metal section 12 is provided with welding paste 10;

as shown in fig. 9, the product component 5 is fixedly connected to the PCB31 by the solder paste layer 30.

The working process is as follows:

1, manufacturing an FPC product: the product is subjected to cutting, via hole drilling, black hole/copper plating/circuit/pressing CVL, impedance manufacturing, and finally gold melting/bonding/electrical testing/punching/FQC inspection, so that the FPC product is manufactured.

2. Brazing processing: the PCB is printed with solder paste firstly, aligned with the FPC, and then the soldering equipment enables the FPC to be connected with the PCB through the molten solder paste through the via hole, so that the product processing is completed.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.

Claims

1. A through hole collocation brazing process device is characterized in that: comprises a solder mask jig main body (1), a product assembly (2) and solder paste (10); the product assembly (2) is arranged above the welding jig main body (1); more than one product element (5) is arranged on the product assembly (2); more than one through hole (6) is arranged on the product element (5); the product element (5) consists of more than one metal layer (7); an insulating layer (8) is arranged between the more than one metal layers (7).

2. The through hole collocation brazing process device according to claim 1, wherein: more than one positioning hole (3) is formed in the product assembly (2); the solder mask jig main body (1) is provided with more than one positioning pin (4) for installing the positioning hole (3).

3. The through hole collocation brazing process device according to claim 1, wherein: more than one avoiding groove (9) is arranged on the solder resist jig main body (1); the position of the avoiding groove (9) corresponds to the position of the product element (5).

4. The through hole collocation brazing process device according to claim 1, wherein: a metal section (12) is arranged in the through hole (6); and the metal section (12) is provided with welding paste (10).